CN101726641B - Manufacture method of conducting elastic body - Google Patents
Manufacture method of conducting elastic body Download PDFInfo
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- CN101726641B CN101726641B CN2008101704247A CN200810170424A CN101726641B CN 101726641 B CN101726641 B CN 101726641B CN 2008101704247 A CN2008101704247 A CN 2008101704247A CN 200810170424 A CN200810170424 A CN 200810170424A CN 101726641 B CN101726641 B CN 101726641B
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- elastic body
- manufacture method
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- conducting elastic
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Abstract
The invention relates to a manufacture method of a conducting elastic body. The method comprises the following steps of: cladding a first metal sacrificial layer on a substrate with a plurality of grooves, and then forming a first photoresist layer on the first metal sacrificial layer; providing a plurality of first openings on the first photoresist layer and respectively corresponding the first openings to the grooves; then filling gel containing conducting particles into the first openings and curing the gel to form a plurality of first elastic columns; repeating the steps so as to form a second metal sacrificial layer, a second photoresist layer and a plurality of second openings, and forming a plurality of second elastic columns so as to correspond the second elastic columns above the first elastic columns; and finally, removing the second photoresist layer, the second metal sacrificial layer, the first metal sacrificial layer and the substrate to only remain the first photoresist layer and the first elastic columns as well as the second elastic columns, which are dispersed in the first photoresist layer and mutually overlapped up and down.
Description
Technical field
The invention relates to a kind of manufacture method of conducting elastic body, refer in particular to the micro electronmechanical technology of a kind of employing and make manufacture method of conducting elastic body.
Background technology
In the Chip Packaging test technology, once test a plurality of chips to be measured situation of (Device Under Test is called for short DUT), the especially tin ball of ball bar array arrays such as (BGA) test in order to save the test duration, to reach cost, often needing.The means that known technology is adopted all use probe (Pogo pin) to cooperate the design of test bench (Socket) to reach the purpose of test again.Yet along with the continuous evolution of technology, under the more and more littler situation of packed tin ball spacing (Pitch), known test mode is subjected to the restriction in many designs and the assembling, can't satisfy existing demand.
Therefore, just develop the mode that conductive elastomer replaces known probe collocation test bench.Its principle of work is to use conductive elastomer to be used as the interconnection body (Interposer) or the connector (Connector) of a conduction, and is a kind of can the use under the situation of fine pitch, particularly arranges at asymmetrical tin ball.
In addition, compared to general traditional probe, conductive elastomer is fit to high-frequency test owing to path short, low inductance, Low ESR and high life very much.Yet the conductive elastomer price of testing usefulness at present is very expensive, and manufacturing course is quite complicated.So test in the production line because of actual conductive elastomer is imported in a large number of many testing factories that cost consideration makes, just test at the specific products of minority.
Hence one can see that, and it is simple how to develop a kind of low cost, efficient height, technology, more can produce manufacture method of conducting elastic body in a large number, is a kind of the pressing on the industry really.
Summary of the invention
The object of the present invention is to provide a kind of manufacture method of conducting elastic body, to adapt to the needs of modernized industry.
For achieving the above object, manufacture method of conducting elastic body provided by the invention may further comprise the steps: (A) provide substrate, and the upper surface of substrate is provided with plurality of grooves.(B) again coating one first sacrificial metal layer on the upper surface of substrate, and plurality of grooves in.(C) form one first photoresist layer again on the upper surface of first sacrificial metal layer.Then, (D) remove first photoresist layer to form a plurality of first openings, wherein a plurality of first openings correspond respectively to the plurality of grooves of substrate.(E) and insert contain conducting particles gel in a plurality of first openings, then solidify to form a plurality of first elasticity posts.
Then, (F) coating one second sacrificial metal layer on the upper surface of first photoresist layer, and a plurality of the one the first elasticity posts on.(G) form one second photoresist layer again on the upper surface of second sacrificial metal layer.(H) remove second photoresist layer again to form a plurality of second openings, wherein a plurality of second openings correspond respectively to a plurality of first elasticity posts.
Then, (I) insert contain conducting particles gel in a plurality of second openings, and solidify to form a plurality of second elasticity posts.(J) and remove second photoresist layer, and second sacrificial metal layer, remove first sacrificial metal layer, and substrate again.In view of the above, manufacture method of conducting elastic body of the present invention can significantly reduce manufacturing cost, simultaneously can manufacture and simplify whole manufacturing course, and the demand of process equipment again in a large number, is easier to according to different demands and elasticity adjusting process variable.
Wherein, step of the present invention (E) can be scraped the gel that is doped with metal conductive particles into a plurality of first openings, and step (I) can scrape the gel that is doped with metal conductive particles in a plurality of second openings, this that is so-called gel technique.In addition, coating first sacrificial metal layer in the step of the present invention (B), and step (F) in the method for coating second sacrificial metal layer can be following one of at least: vacuum splashing and plating, plating, chemogenic deposit, electroless plating or other equivalent process or technology are all applicable among the present invention.In addition, form in the step of the present invention (C) first photoresist layer, and step (G) in form second photoresist layer method can be following one of at least: printing, roller coating, spray coating, curtain type coating, rotary coating or other equivalent process or technology.
Moreover, form in the step of the present invention (D) a plurality of first openings, and step (H) in form a plurality of second openings method can utilize the exposure imaging mode, or other definable openings of sizes and the equivalent process that removes the opening photoresistance all can.Again, a plurality of first elasticity posts in the step of the present invention (E), and a plurality of second elasticity posts of step (I) in the doping metals particulate material can be following one of at least: the particle of gold, copper, nickel, aluminium, silver or other tool conduction property all can.
Preferably, first sacrificial metal layer in the step of the present invention (B), and step (F) in the material that uses of second sacrificial metal layer can be following one of at least: copper, nickel, chromium, titanium or other equivalent metal material.In addition, a plurality of first elasticity posts in the step of the present invention (E), and step (I) in a plurality of second elasticity posts can be right cylinder, rectangular column even trapezoidal or tapered pole or other how much polygon posts and all can.In view of the above, the thickness of first photoresist layer in the step of the present invention (C) can be 150 to 200 microns (μ m) and the thickness of first sacrificial metal layer in the step (B) can be 0.2 to 0.5 micron (μ m).
Description of drawings
Figure 1A to Fig. 1 J is the diagrammatic cross-section of the conductive elastomer of a preferred embodiment of the present invention.
Fig. 2 is the schematic perspective view of the conductive elastomer of a preferred embodiment of the present invention.
Fig. 3 is that a preferred embodiment of the present invention is in a large amount of synoptic diagram of making of same base material.
Primary clustering symbol description in the accompanying drawing
1 substrate, 11 upper surfaces, 12 grooves
2 first sacrificial metal layer, 21 upper surfaces, 3 first photoresist layers
31 first openings, 32 first elasticity posts, 33 upper surfaces
4 second sacrificial metal layer, 41 upper surfaces, 5 second photoresist layers
51 second openings, 52 second elasticity posts, 6 conductive elastomers
Embodiment
See also Figure 1A to Fig. 1 J, be the diagrammatic cross-section of a kind of manufacture method of conducting elastic body preferred embodiment of the present invention.Only the present invention be adopt micro electronmechanical technology with reach low cost, high-level efficiency is made conductive elastomer.Right the present invention is non-to be confined to micro electronmechanical technology fully, can utilize semiconductor technology or other equivalent process to finish the present invention again.To be that preferred embodiment describes below at micro electronmechanical technology.
Please consult Figure 1A and shown in Figure 3 simultaneously, a substrate 1 at first is provided, be provided with plurality of grooves 12 in advance at the upper surface 11 of substrate 1.Its plurality of grooves 12 can machine in advance by the CNC machine tool.And substrate 1 can be reused, and reaches the purpose that reduces cost.Again as shown in Figure 3, Fig. 3 is that a preferred embodiment of the present invention is in a large amount of synoptic diagram of making of same base material.Present embodiment uses micro-electromechanical technology it can reach the processing mode of array as shown in the figure, mean on the same plate substrate conductive elastomer that can process several pieces even tens of according to the size of the size of elastic body design and base material simultaneously, can reduce cost by a large amount of productions.
Shown in Figure 1B, again on the upper surface 11 of substrate 1, and plurality of grooves 12 in coating one first sacrificial metal layer 2.Be to adopt the vacuum splashing and plating mode to carry out coating in the present embodiment, also can adopt evaporation, plating, chemogenic deposit and electroless plating to carry out certainly.And the material of first sacrificial metal layer 2 of institute's coating is a nickel in the present embodiment, also can be chromium, copper, titanium or other metal material certainly, and its thickness is 0.2 to 0.5 micron (μ m).
Shown in Fig. 1 C, on the upper surface 21 of first sacrificial metal layer 2, form one first photoresist layer 3 again.The method of its formation is to adopt rotary coating (Spin coating) mode, also can utilize printing (Printing), roller coating (Roller coating), spray coating (Spray coating), curtain type coating modes such as (Curtain coating) certainly.The thickness of its first photoresist layer 3 is 150 to 200 microns (μ m) in the present embodiment, certainly changes according to the different demand of actual electrically conductive elastic body thickness.Yet first photoresist layer 3 of present embodiment adopts the photoresist of tool elastic propertys, the following AZ-4620 of its model commonly used, JSR-120N, JSR-151N, S1813, and SU8.
Shown in Fig. 1 D, then utilize exposure and the mode of developing removes first photoresist layer 3 forming a plurality of first openings 31, and wherein a plurality of first opening 31 corresponds respectively to the plurality of grooves 12 of substrate 1.Use the advantage of photoresistance coating method and Exposure mode to be with little shadow technology in the present embodiment: to control elastomeric thickness easily, especially can cooperate the design of light shield, the elastomer structure of Any shape all can produce easily, as cylinder, rectangular column or other how much polygon posts.Or even the body of different-thickness up and down, also can control by the degree of depth of adjusting the plural groove 12 on the base material 1 and the thickness of first photoresist layer 3.In addition, more can utilize different characteristic of photoresistance and the technology that cooperates the exposure machine exposure imaging, the cylinder that two end cross-sectional areas are different about making is as awl Like or trapezoidal structure, to meet the test of specific demand.
Shown in Fig. 1 E, in a plurality of first openings 31, insert the gel that contains conducting particles, and solidify to form a plurality of first elasticity posts 32.Present embodiment is to adopt gel technique (Sol-GelProcess), and the gel that also is about to be doped with metallics is scraped and inserted in a plurality of first openings 31, and treats that it is solidified to form a plurality of first elasticity posts 32.Yet the gel of being adopted in the present embodiment is the thermosetting macromolecule material, thus it possess elasticity again can be in normal operation under the hot environment.
In view of the above, industry heat curing-type gel commonly used is to be base material with silicon rubber at present, and can add different modification agents because of the heterogeneity demand, reach different effects, as common interpolation ethylene-propylene-diene rubber (EPDM), ACM (ACM), fluororubber (FKM), urethane rubber (PU) or polydiene etc.And the material of its doping metals particle is a gold, also can be the metallics of nickel, aluminium, silver, copper or other tool conduction property certainly, also can sneak into the particle of different materials simultaneously, makes the first elasticity post 32 have character such as better conduction or elasticity and presents.
Shown in Fig. 1 F, then on the upper surface 33 of first photoresist layer 3, and a plurality of first elasticity posts 32 on coating one second sacrificial metal layer 4.Second sacrificial metal layer 4 is with aforementioned coating first sacrificial metal layer 2, and present embodiment is to adopt vacuum splashing and plating, can adopt evaporation, plating, chemogenic deposit and electroless plating to carry out equally.And its material is similarly nickel, also can be chromium, copper, titanium or other metal material certainly.
Shown in Fig. 1 G, on the upper surface 41 of second sacrificial metal layer 4, form one second photoresist layer 5.As first photoresist layer 3, the method for its formation adopts rotary coating to second photoresist layer 5 equally at this, also can utilize modes such as printing, roller coating, spray coating, curtain type coating certainly.
Shown in Fig. 1 H, then equally remove second photoresist layer 5 forming a plurality of second openings 51, and a plurality of second opening 51 corresponds respectively to the plurality of grooves 12 of a plurality of first elasticity posts 32 and substrate 1 with the exposure and the mode of developing.
Shown in Fig. 1 I, in a plurality of second openings 51, insert the gel that contains conducting particles equally, and solidify to form a plurality of second elasticity posts 52.Its second elasticity post 52 same gel techniques (Sol-Gel Process) that adopt, the gel that also is about to be doped with metallics scrape into and insert a plurality of second openings 51, and treat that it is solidified to form a plurality of second elasticity posts 52.The material of its metallics is a gold, can be the metallics of nickel, aluminium, silver, copper or other tool conduction property equally, also can sneak into the particle of different materials simultaneously.
Please consult Fig. 1 J and Fig. 2 simultaneously, remove second photoresist layer 5 and second sacrificial metal layer 4 at last, and remove first sacrificial metal layer 2 and substrate 1.Also being about to first photoresist layer 3 and a plurality of first elasticity post 32 lifts from (Strip or Lift off) from first sacrificial metal layer 2.So final product conductive elastomer 6 is just as Fig. 1 J and shown in Figure 2, comprising the main elastic body that resiliency supported is provided that is first photoresist layer 3 that specially stays, a plurality of first elasticity post 32, a plurality of second elasticity post 52 and second sacrificial metal layer 4 between the first elasticity post 32 and the second elasticity post 52.
The foregoing description is only given an example for convenience of description, and the interest field that the present invention advocated is from should but not only limiting to the foregoing description with described being as the criterion of claim scope of application.
Claims (17)
1. manufacture method of conducting elastic body may further comprise the steps:
(A) provide a substrate, the upper surface of this substrate is provided with plurality of grooves;
(B) coating one first sacrificial metal layer on the upper surface of this substrate, and this plurality of grooves in;
(C) form one first photoresist layer on the upper surface of this first sacrificial metal layer;
(D) remove this first photoresist layer to form a plurality of first openings, these a plurality of first openings correspond respectively to this plurality of grooves of this substrate;
(E) insert contain conducting particles gel in these a plurality of first openings, and solidify to form a plurality of first elasticity posts;
(F) coating one second sacrificial metal layer on the upper surface of this first photoresist layer, and these a plurality of first elasticity posts on;
(G) form one second photoresist layer on the upper surface of this second sacrificial metal layer;
(H) remove this second photoresist layer to form a plurality of second openings, these a plurality of second openings correspond respectively to this a plurality of first elasticity posts;
(I) insert contain conducting particles gel in these a plurality of second openings, and solidify to form a plurality of second elasticity posts; And
(J) remove this second photoresist layer, and this second sacrificial metal layer, and remove this first sacrificial metal layer and this substrate.
2. manufacture method of conducting elastic body as claimed in claim 1, wherein, this step (E) is that the gel that is doped with conductive metal particles is scraped in these a plurality of first openings, and solidify to form this a plurality of first elasticity posts after drying.
3. manufacture method of conducting elastic body as claimed in claim 1, wherein, this step (I) is that the gel that is doped with conductive metal particles is scraped in these a plurality of second openings, and solidify to form this a plurality of second elasticity posts after drying.
4. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method for this first sacrificial metal layer of coating is selected from a kind of in vacuum splashing and plating, plating, chemogenic deposit and the electroless plating in this step (B).
5. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method for this second sacrificial metal layer of coating is selected from a kind of in vacuum splashing and plating, plating, chemogenic deposit and the electroless plating in this step (F).
6. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method that forms this first photoresist layer in this step (C) is selected from printing, roller coating, spray coating, curtain type is coated with and rotary coating in a kind of.
7. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method that forms this second photoresist layer in this step (G) is selected from printing, roller coating, spray coating, curtain type is coated with and rotary coating in a kind of.
8. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method that forms these a plurality of first openings in this step (D) is to utilize the exposure imaging mode.
9. manufacture method of conducting elastic body as claimed in claim 1, wherein, the method that forms these a plurality of second openings in this step (H) is to utilize the exposure imaging mode.
10. manufacture method of conducting elastic body as claimed in claim 1, wherein, the material of this plural conductive particle is that to be selected from the group that is made up of gold, copper, nickel, aluminium and silver wherein a kind of in this step (E).
11. manufacture method of conducting elastic body as claimed in claim 1, wherein, the material of this plural conductive particle is that to be selected from the group that is made up of gold, copper, nickel, aluminium and silver wherein a kind of in this step (I).
12. manufacture method of conducting elastic body as claimed in claim 1, wherein, the material that this first sacrificial metal layer is used in this step (B) be selected from by copper, nickel, chromium, and the group that forms of titanium wherein a kind of.
13. manufacture method of conducting elastic body as claimed in claim 1, wherein, the material that this second sacrificial metal layer is used in this step (F) be selected from by copper, nickel, chromium, and the group that forms of titanium wherein a kind of.
14. manufacture method of conducting elastic body as claimed in claim 1, wherein, these a plurality of first elasticity posts are right cylinder in this step (E).
15. manufacture method of conducting elastic body as claimed in claim 1, wherein, these a plurality of second elasticity posts are right cylinder in this step (I).
16. manufacture method of conducting elastic body as claimed in claim 1, wherein, the thickness of this first photoresist layer is 150 to 200 microns in this step (C).
17. manufacture method of conducting elastic body as claimed in claim 1, wherein, the thickness of this first sacrificial metal layer is 0.2 to 0.5 micron in this step (B).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101704247A CN101726641B (en) | 2008-11-03 | 2008-11-03 | Manufacture method of conducting elastic body |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101704247A CN101726641B (en) | 2008-11-03 | 2008-11-03 | Manufacture method of conducting elastic body |
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| CN101726641A CN101726641A (en) | 2010-06-09 |
| CN101726641B true CN101726641B (en) | 2011-05-18 |
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| CN2008101704247A Expired - Fee Related CN101726641B (en) | 2008-11-03 | 2008-11-03 | Manufacture method of conducting elastic body |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1106580A (en) * | 1993-11-10 | 1995-08-09 | 惠特克公司 | Anisotropic conductive film, manufacturing method and connector using the same |
| EP1976007A2 (en) * | 2007-03-27 | 2008-10-01 | Fujifilm Corporation | Anisotropically conductive member and method of manufacture |
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2008
- 2008-11-03 CN CN2008101704247A patent/CN101726641B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1106580A (en) * | 1993-11-10 | 1995-08-09 | 惠特克公司 | Anisotropic conductive film, manufacturing method and connector using the same |
| EP1976007A2 (en) * | 2007-03-27 | 2008-10-01 | Fujifilm Corporation | Anisotropically conductive member and method of manufacture |
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| Publication number | Publication date |
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| CN101726641A (en) | 2010-06-09 |
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Granted publication date: 20110518 Termination date: 20121103 |