CN101719759B - Method for adhering components and parts to packaging surface - Google Patents
Method for adhering components and parts to packaging surface Download PDFInfo
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- CN101719759B CN101719759B CN2009102503269A CN200910250326A CN101719759B CN 101719759 B CN101719759 B CN 101719759B CN 2009102503269 A CN2009102503269 A CN 2009102503269A CN 200910250326 A CN200910250326 A CN 200910250326A CN 101719759 B CN101719759 B CN 101719759B
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Abstract
The invention discloses a method for adhering components and parts to a packaging surface. A filling solder or filling epoxy resin is in advance printed on a base or a basal plate, the surface of which is provided with components and parts to fill most of clearances between the base and the basal plate, and only a little plastic sealing material flows into the clearances between the base and the basal plate in the process of injection molding, so that the base can not be destroyed by the pressure of injection molding any longer, the cracking of the base is effectively prevented, the rate of finished products is enhanced, and the mass production of the components and the parts adhered to molding packaging surfaces is guaranteed.
Description
Technical field
The present invention relates to the packaging technology of integrated circuit, be specifically related to the method for adhering components and parts to packaging surface, be specially adapted to molded packages SMT crystal resonator or oscillator.
Background technology
Surface mounting technology (Surface Mounting Technology is called for short SMT) is an electronics packaging technology of new generation, it is collapsed into volume with traditional electronic devices and components and has only 1/tens device, thereby realized the automation of the high density of electronic product assembling, highly reliable, miniaturization, low cost and production, at present, its employed components and parts are called Surface Mount Component, SMD.SMT is widely used in the electronic product dress connection of every field as circuit assembly technology of new generation.Its range of application relates to industries such as space flight, aviation, communication, computer, medical electronics, automobile, office automation, household electrical appliance.
In the overwhelming majority SMT electronic product, the IC device all adopts Plastic Package, and its reason is can to produce in enormous quantities and reduce cost like this.And in the process of injection moulding, because the influence of each factor such as injection pressure, device architecture, coefficient of expansion coupling causes the inefficacy of device easily.With crystal resonator shown in Figure 3 or oscillator is example, and the workpiece quartz plate 4 that it comprises pedestal 2, metal shell 3 and is positioned at metal shell, crystal resonator have two electrodes 1 that are positioned on pedestal 2 bottom surfaces, as shown in Figure 1; Crystal oscillator has four electrodes 1 that are positioned on pedestal 2 bottom surfaces, as shown in Figure 2.At present, transfer modling technology is the most general packaging technology of SMT integrated circuit, with the thickness state thermosets pressurization after the heating in the feed compartment, is filled in the die cavity of mould closure components and parts are encapsulated on the substrate.Yet, when utilizing traditional transfer modling technology that crystal resonator or oscillator are encapsulated, often have following problem.(1) since in the injection moulding process plastic packaging material in regular meeting flow into space between substrate and the pedestal, under the effect of injection pressure, cause its cracking thereby these plastic packaging materials can push pedestal; (2) thickness of metal shell is 0.15 ± 0.02mm in existing crystal resonator or the oscillator, injection pressure acts on after the plastic packaging material transmission and causes it that strain and plastic deformation take place on the metal shell, and the metal shell after the distortion can contact and damage internal components; (3) after plastic packaging is finished the demoulding, the external force that acts on the metal shell reduces, a part of sprung back of metal shell, and the masterpiece that strain recover to discharge is used on the plastic packaging material of metal shell top and causes its upper surface projection.As seen, when adopting transfer modling technology that Surface Mount Component, is carried out molded packages, rate of finished products is lower, therefore, has seriously hindered the mass production of product.
Summary of the invention
Technical problem to be solved by this invention is to solve the lower problem of rate of finished products when adopting molded packages technology adhering components and parts to packaging surface.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention provides a kind of method of adhering components and parts to packaging surface, may further comprise the steps:
Print one deck scolder on the position corresponding on the solder joint of the pedestal of A10, Surface Mount Component, or on the substrate with solder joint, other parts on pedestal or the substrate are printed one deck filling scolder or the filling epoxy resin identical with solder thickness again, be provided with the gap between described filling scolder or filling epoxy resin and the described scolder, screen painting is all adopted in above-mentioned printing;
A20, solder joint on the Surface Mount Component, pedestal and substrate are welded as a whole by Reflow Soldering;
A30, the Surface Mount Component, that will weld substrate place mould, the thermosetting build epoxy resin of enhancing perfusion 160 degree-180 degree in die cavity, and injection pressure is 2MPa-4MPa;
A40, after 90 seconds curing times, the demoulding obtains adhering components and parts to packaging surface.
In the such scheme, fill scolder or filling epoxy resin and be printed to rectangle or ellipse.
The area of described filling scolder or filling epoxy resin accounts for 70%～90% of substrate or crystal oscillator base bottom surface area.
In steps A 30, before Surface Mount Component, was put into mould, its end face was pasted layer of plastic film, and after Surface Mount Component, was put into mould, plastic film contacted fully with mold.
Described Surface Mount Component, is crystal resonator or oscillator, and the thickness of described plastic film is 25～50 μ m.
The present invention, fill scolder or filling epoxy resin owing on the pedestal of Surface Mount Component, or substrate, printed one deck in advance, filled the most of space between the two, like this in injection moulding process, have only a spot of plastic packaging material to flow in the gap between the two, therefore, pedestal no longer is subjected to injection pressure and damages, and has effectively prevented the cracking of pedestal.
Description of drawings
Fig. 1 is the crystal resonator schematic bottom view;
Fig. 2 is the crystal oscillator schematic bottom view;
Fig. 3 is the structural representation of crystal resonator or oscillator;
Fig. 4 preprints scolder or epoxy resin schematic diagram on substrate;
Fig. 5 preprints scolder or epoxy resin schematic diagram on pedestal;
Fig. 6 is a laminating material film schematic diagram on metal shell;
Fig. 7 is that surface mount does not have device and is welded on schematic diagram on the substrate;
Fig. 8 is a mould plastic packaging schematic diagram;
Fig. 9 is the crystal oscillator schematic diagram after envelope is moulded.
Embodiment
Below in conjunction with accompanying drawing the present invention is made detailed explanation.
Referring to Fig. 7, Fig. 8 and Fig. 9, the present invention includes following steps:
Solder joint on the pedestal 2 of A10, Surface Mount Component, (being electrode 1) go up or substrate 7 on print one deck scolder 5 earlier on the position corresponding with solder joint, other positions are printed one deck filling scolder or the filling epoxy resin 6 identical with scolder 5 thickness again, described filling scolder or filling epoxy resin 6 are provided with gap 15 with above-mentioned scolder 5, the two can not contact with each other, fill between scolder or the filling epoxy resin 6 non-conductive to guarantee scolder 5, prevent the solder joint short circuit of the pedestal 2 of Surface Mount Component,, screen painting is all adopted in above-mentioned printing; Fill scolder or filling epoxy resin 6 and be printed to rectangle or ellipse, and area accounts for 70%～90% of substrate 7 or pedestal 2 base areas, referring to Fig. 4, Fig. 5.
A20, solder joint on the Surface Mount Component, pedestal 2 and substrate 7 are welded as a whole by Reflow Soldering;
A30, the Surface Mount Component, 9 that will weld substrate 7 place within mold 10 and the bed die 11, by watering the road junction, and the thermosetting build epoxy resin of 160 ℃～180 ℃ of enhancing perfusions in die cavity, injection pressure is 2MPa～4MPa;
A40, after 90 seconds curing times, the demoulding obtains adhering components and parts to packaging surface, 3 is metal shell among Fig. 9,4 is the quartz plate of crystal oscillator inside, 13 are the epoxy resin after solidifying.
Above-mentioned process, because pre-printed filling scolder or filling epoxy resin 6 on the pedestal 2 of Surface Mount Component, or substrate 7, filled the most of space between pedestal 2 and the substrate 7, in the injection moulding process, plastic packaging material has only in the gap between a small amount of inflow substrate 7 and the pedestal 2, therefore, pedestal 2 no longer is subjected to injection pressure and destroys, and has effectively prevented the cracking of pedestal 2.
The problem that in injection moulding process, deforms for the metal shell 3 that solves crystal resonator or oscillator class Surface Mount Component,, before Surface Mount Component, is put into mould, paste layer of plastic film 8 on the end face of its metal shell 3, referring to Fig. 6, Fig. 9, the thickness of plastic film 8 is 25～50 μ m, after Surface Mount Component, is put into mould, plastic film 8 contacts fully with the roof of mold 10, like this, the moulding compound that injects does not cover the end face of metal shell, thereby prevent the phenomenon that metal shell 3 raises up after the metal shell deformation failure internal components 4 and the demoulding, after encapsulation is finished, tear plastic film.This processing technology has improved the rate of finished products of product, for the batch process of crystal oscillator molding envelope provides guarantee.
Above-mentioned specific embodiment only is to be the example explanation with the crystal oscillator, and still, technical scheme provided by the invention is equally applicable to for example Chip-R, electric capacity and other various paster IC.
The present invention is not limited to above-mentioned preferred forms, and anyone should learn the structural change of making under enlightenment of the present invention, and every have identical or close technical scheme with the present invention, all falls within protection scope of the present invention.
Claims (5)
1. the method for adhering components and parts to packaging surface is characterized in that may further comprise the steps:
Print one deck scolder on the position corresponding on the solder joint of the pedestal of A10, Surface Mount Component, or on the substrate with solder joint, other parts on pedestal or the substrate are printed one deck filling scolder or the filling epoxy resin identical with solder thickness again, be provided with the gap between described filling scolder or filling epoxy resin and the described scolder, screen painting is all adopted in above-mentioned printing;
A20, solder joint on the Surface Mount Component, pedestal and substrate are welded as a whole by Reflow Soldering;
A30, the Surface Mount Component, that will weld substrate place mould, the thermosetting build resin of 160 ℃～180 ℃ of enhancing perfusions in die cavity, and injection pressure is 2MPa-4MPa;
A40, after 90 seconds curing times, the demoulding obtains adhering components and parts to packaging surface.
2. the method for adhering components and parts to packaging surface as claimed in claim 1 is characterized in that filling scolder or filling epoxy resin and is printed to rectangle or ellipse.
3. the method for adhering components and parts to packaging surface as claimed in claim 2 is characterized in that the area of described filling scolder or filling epoxy resin accounts for 70%～90% of substrate or crystal oscillator base bottom surface area.
4. as the method for claim 1,2 or 3 described adhering components and parts to packaging surface, it is characterized in that in steps A 30 before Surface Mount Component, was put into mould, its end face was pasted layer of plastic film, after Surface Mount Component, was put into mould, plastic film contacted fully with mold.
5. the method for adhering components and parts to packaging surface as claimed in claim 4 is characterized in that described Surface Mount Component, is crystal resonator or oscillator, and the thickness of described plastic film is 25～50 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102503269A CN101719759B (en) | 2009-12-04 | 2009-12-04 | Method for adhering components and parts to packaging surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102503269A CN101719759B (en) | 2009-12-04 | 2009-12-04 | Method for adhering components and parts to packaging surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101719759A CN101719759A (en) | 2010-06-02 |
| CN101719759B true CN101719759B (en) | 2011-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102503269A Expired - Fee Related CN101719759B (en) | 2009-12-04 | 2009-12-04 | Method for adhering components and parts to packaging surface |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006031A (en) * | 2010-11-11 | 2011-04-06 | 应达利电子(深圳)有限公司 | Plastic packaged surface-mount quartz crystal oscillator and manufacturing method thereof |
| CN103188863B (en) * | 2011-12-30 | 2016-08-03 | 深南电路有限公司 | Printed circuit board (PCB) plate, manufacture method, printed circuit board (PCB) and method for packing thereof |
| JP5285819B1 (en) * | 2012-11-07 | 2013-09-11 | 太陽誘電株式会社 | Electronic circuit module |
| US9576932B2 (en) | 2013-03-09 | 2017-02-21 | Adventive Ipbank | Universal surface-mount semiconductor package |
| US11469205B2 (en) | 2013-03-09 | 2022-10-11 | Adventive International Ltd. | Universal surface-mount semiconductor package |
| CN103441745A (en) * | 2013-08-28 | 2013-12-11 | 广东合微集成电路技术有限公司 | Packaging structure and packaging method of crystal oscillator |
| MY186501A (en) * | 2015-07-10 | 2021-07-22 | Richard K Williams | Universal surface-mount semiconductor package |
| CN108900174A (en) * | 2018-08-23 | 2018-11-27 | 应达利电子股份有限公司 | A kind of quartz oscillator and the method for manufacturing the quartz oscillator |
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2009
- 2009-12-04 CN CN2009102503269A patent/CN101719759B/en not_active Expired - Fee Related
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| CN101719759A (en) | 2010-06-02 |
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Denomination of invention: Method for adhering components and parts to packaging surface Effective date of registration: 20130913 Granted publication date: 20111214 Pledgee: Optics Valley Wuhan venture capital fund Co., Ltd. Pledgor: Wuhan Winningchina Microsystem Technologies Co., Ltd. Registration number: 2013420000016 |
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Granted publication date: 20111214 Termination date: 20171204 |
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