CN101715274B - Circuit board and process thereof - Google Patents
Circuit board and process thereof Download PDFInfo
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- CN101715274B CN101715274B CN2008101698104A CN200810169810A CN101715274B CN 101715274 B CN101715274 B CN 101715274B CN 2008101698104 A CN2008101698104 A CN 2008101698104A CN 200810169810 A CN200810169810 A CN 200810169810A CN 101715274 B CN101715274 B CN 101715274B
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- bearing substrate
- line layer
- blind hole
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Abstract
The invention discloses a circuit board and a process thereof. The process of the circuit board comprises the steps of: firstly, forming a circuit bearing substrate comprising a bearing substrate and circuit layers; secondly, forming at least one blind hole on the circuit bearing substrate; thirdly, laminating the circuit bearing substrate to another circuit bearing substrate through insulating layers; fourthly, arranging the insulating layers among the circuit layers of the circuit bearing substrates, and filling the blind holes; fifthly, removing part of the bearing substrates to expose the insulating layers positioned in the blind holes; sixthly, forming conducting cylinders connected among the circuit layers; and finally, removing the rest bearing substrates.
Description
Technical field
The present invention relates to a kind of wiring board and technology thereof, and particularly relate to a kind of buried circuit board (embedded circuit board) and technology thereof.
Background technology
Wiring board technology has now developed and buried circuit board (embedded circuit board), and this wiring board is embedded in the dielectric layer at its surperficial circuit, is not the surface that protrudes in dielectric layer.
Figure 1A to Fig. 1 E is the flow process generalized section of the manufacture method of known a kind of buried circuit board.Please consult Figure 1A earlier, the manufacture method of known buried circuit board may further comprise the steps.At first, on bearing substrate 112a, form copper metal layer 114a and copper wire layer 116a in regular turn, to form circuit bearing substrate 110a.
See also Figure 1B, then, by film (prepreg), circuit bearing substrate 110a is pressed on another circuit bearing substrate 110b, wherein the structure of circuit bearing substrate 110b is identical with circuit bearing substrate 110a.In detail, circuit bearing substrate 110b equally also comprises bearing substrate 112b, copper wire layer 116b and the copper metal layer 114b between copper wire layer 116b and bearing substrate 112b.After circuit bearing substrate 110a was pressed on the circuit bearing substrate 110b, film can be solidified to form dielectric layer 120.
See also Figure 1B and Fig. 1 C, then, remove bearing substrate 112a and bearing substrate 112b, and stay copper metal layer 114a, 114b and copper wire layer 116a, 116b.Afterwards, carry out in regular turn machine drilling and the electroplates in hole (Plating Through Hole, PTH), to form conductivity through-hole structure (conductive through hole structure) T1.When forming conductivity through-hole structure T1, on copper metal layer 114a and copper metal layer 114b, can form copper electrodeposited coating 130a and copper electrodeposited coating 130b respectively.
See also Fig. 1 C and Fig. 1 D, then, carry out etching, to remove copper electrodeposited coating 130a, 130b and copper metal layer 114a, 114b.Afterwards, fill ink material 140 in conductivity through-hole structure T1.
See also Fig. 1 D and Fig. 1 E, after filling ink material 140, form welding resisting layer 150a on copper wire layer 116a, form welding resisting layer 150b on copper wire layer 116b.So, known a kind of buried circuit board 100 has been made and has been finished.
In present wiring board technology, buried circuit board is mostly towards the trend development of high wiring density (high density layout) with graph thinning.Yet conducting transmission line bearing substrate 110a is pressed in the process on the circuit bearing substrate 110b (seeing also Figure 1B), and film can pressurized and produce deformation, and the address that industry is general is a harmomegathus.And this deformation can change the overall dimensions of buried circuit board 100 usually, also may can change the wiring of copper wire layer 116a, 116b and the relative position of conductivity through-hole structure T1 simultaneously.
In present wiring board technology, in the deformation that process for pressing produced, still there is a kind of deformation meeting to change relative position (it is the interlayer skew that general address is also arranged in the industry) between the wiring of copper wire layer 116a, 116b, but see through the positioner of press equipment, deformation for the skew of this kind interlayer has obtained suitable control, and relative displacement can be below 25 μ m.Therefore, the interlayer skew deformation influence that aforesaid process for pressing caused significantly reduces.
When the wiring density of copper wire layer 116a, 116b was high more, the position relative extent that this harmomegathus deformation influences the wiring of copper wire layer 116a, 116b and conductivity through-hole structure T1 was big more.When carrying out machine drilling, because the wiring of original copper wire layer 116a, 116b changes, therefore utilize under a kind of Muraki alignment system (tooling system), carrying out the formed through hole of machine drilling technology can be offset, produce broken (break out) phenomenon (for example conductivity through-hole structure T2 among Fig. 1 C～Fig. 1 E) in hole what is more, this can cause buried circuit board 100 beyond economic repair situations, and has reduced the yield of buried circuit board 100.
Aforesaid known technology is to be the example explanation with mechanical via process, but for the conductive blind hole technology of utilizing the laser drill technology, the broken situation in hole takes place and the positioner that is utilized, contraposition principle and mechanical via process duplicate, even, the broken phenomenon of scrapping in hole is also very similar to occurrence cause, need not repeat to give unnecessary details at this.
Summary of the invention
The invention provides a kind of technology of making wiring board, to improve yield.
The invention provides a kind of making wiring board, its technology can improve yield.
The present invention proposes a kind of technology of making wiring board, and this technology comprises, at first, forms the first circuit bearing substrate, and it comprises first bearing substrate and first line layer that is disposed on first bearing substrate.Then, form at least one first blind hole on the first circuit bearing substrate, wherein first blind hole extends in first bearing substrate from first line layer.Then, by insulating barrier, the pressing first circuit bearing substrate is on the second circuit bearing substrate, and wherein the second circuit bearing substrate comprises second bearing substrate and second line layer that is disposed on second bearing substrate.Insulating barrier is disposed between first line layer and second line layer, and insulating barrier fills up first blind hole.Then, remove part first bearing substrate and part second bearing substrate, with the exposed insulating barrier that is positioned at first blind hole.Then, remove the partial insulative layer that is positioned at first blind hole, to form the hole that extends to second line layer from first line layer.Then, form conductive pole in hole, wherein conductive pole is connected between first line layer and second line layer.Then, remove remaining first bearing substrate and remaining second bearing substrate.
In an embodiment of the present invention, the method for above-mentioned formation hole comprises the partial insulative layer that utilizes laser beam, scorification to be positioned at first blind hole.
In an embodiment of the present invention, above-mentioned laser beam is that (Yttrium Aluminum Garnet, YAG) laser aid provides by carbon dioxide laser device, ultraviolet laser device or garnet.
In an embodiment of the present invention, the method for above-mentioned formation hole comprises and carries out machine drilling technology.
In an embodiment of the present invention, the above-mentioned second circuit bearing substrate has at least one second blind hole that extends to second bearing substrate from second line layer.When the pressing first circuit bearing substrate was on the second circuit bearing substrate, insulating barrier more filled up second blind hole, and after removing part second bearing substrate, the insulating barrier that is positioned at second blind hole exposes out.
In an embodiment of the present invention, above-mentioned second blind hole is with respect to first blind hole.When removing the partial insulative layer that is positioned at first blind hole, also comprise removing the partial insulative layer that is positioned at second blind hole, so that first blind hole communicates with second blind hole.
In an embodiment of the present invention, the method for the above-mentioned formation first circuit bearing substrate comprises, forms mask layer on first bearing substrate, wherein the local surface that covers first bearing substrate of mask layer.Then, form first line layer and barrier layer, wherein first line layer and barrier layer be positioned at mask layer the surface of local first bearing substrate that exposes, and first line layer is between the barrier layer and first bearing substrate.
In an embodiment of the present invention, the method for above-mentioned formation first blind hole comprises, removes the part mask layer, to form at least one local opening that exposes first bearing substrate.Then, remove interior part first bearing substrate of opening.
In an embodiment of the present invention, the above-mentioned method that removes the part mask layer comprises and utilizes laser beam to remove the part mask layer.
In an embodiment of the present invention, the above-mentioned method that removes this first bearing substrate of part in this opening comprises part first bearing substrate in this opening of etching.
In an embodiment of the present invention, after forming first blind hole, also comprise removing barrier layer and remaining mask layer.
In an embodiment of the present invention, the method for above-mentioned formation first blind hole comprises utilizes laser beam, scorification part first bearing substrate.
In an embodiment of the present invention, above-mentioned insulating barrier is resin bed or film.
The present invention proposes a kind of wiring board in addition, and it has at least one hole.This wiring board comprises first line layer, second line layer, insulating barrier and at least one conductive pole.Insulating barrier is disposed between first line layer and second line layer, and wherein hole extends to second line layer from first line layer.Conductive pole is disposed in the hole, and conductive pole is connected between first line layer and second line layer, and wherein conductive pole has end face and bottom surface with respect to end face.Conductive pole from the junction between first line layer and the insulating barrier towards the end face convergent.
In an embodiment of the present invention, above-mentioned conductive pole fills up hole.
In an embodiment of the present invention, all there is the interface between the above-mentioned conductive pole and first line layer and second line layer.
In an embodiment of the present invention, above-mentioned hole is a blind hole, and conductive pole from the junction between first line layer and the insulating barrier towards the bottom surface convergent.
In an embodiment of the present invention, above-mentioned hole is a perforation, and conductive pole from the junction between second line layer and the insulating barrier towards the bottom surface convergent.
The present invention forms at least one blind hole (for example first blind hole) because of going up at circuit bearing substrate (for example first circuit bearing substrate) in advance, and insulating barrier fills up this blind hole.Therefore, after removing the part bearing substrate, the insulating barrier that is positioned at blind hole can expose out, and can be as the mark that indicates follow-up formation hole location.So, the present invention can reduce the probability that the hole skew takes place, to improve the yield of wiring board.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment more cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A to Fig. 1 E is the flow process generalized section of the manufacture method of known a kind of buried circuit board.
Fig. 2 A to Fig. 2 G is the flow process generalized section of technology of the wiring board of the embodiment of the invention.
Fig. 3 A to Fig. 3 G is the flow process generalized section of technology of the wiring board of another embodiment of the present invention.
Description of reference numerals
100: buried circuit board
110a, 110b: circuit bearing substrate
112a, 112b: bearing substrate
114a, 114b: copper metal layer
116a, 116b: copper wire layer
120: dielectric layer
130a, 130b: copper electrodeposited coating
140: ink material
150a, 150b: welding resisting layer
200a, 400a: the first circuit bearing substrate
200b, 400b: the second circuit bearing substrate
210a, 410a: first bearing substrate
210b, 410b: second bearing substrate
212a, 212b, 214a, 214a ', 214b: metal level
220a, 420a: first line layer
220b, 420b: second line layer
300: wiring board
310: insulating barrier
320a, 320b: conductive pole
322a, 322b: end face
324a, 324b: bottom surface
412a, 414a, 416a: metal level
430: mask layer
440: barrier layer
B1, B1 ', B3: first blind hole
B2: the second blind hole L: thickness
D1, D2: degree of depth O: opening
I: interface S1: surface
H1, H2: hole T1, T2: conductive through hole knot
Embodiment
Fig. 2 A to Fig. 2 G is the flow process generalized section of technology of the wiring board of the embodiment of the invention.See also Fig. 2 A, the technology about the wiring board of present embodiment at first, forms the first circuit bearing substrate 200a, and it comprises the first bearing substrate 210a and the first line layer 220a, and wherein the first line layer 220a is disposed on the first bearing substrate 210a.
The first bearing substrate 210a can be a kind of sheet metal, and the first bearing substrate 210a can be by the formed sheet material of single metal material, or by the formed composite board of multiple layer metal layer.In the embodiment shown in Fig. 2 A, the first bearing substrate 210a comprises two metal level 212a and 214a, wherein the material of metal level 212a for example is aluminium, nickel or tin, has the metal material of high perveance and the material of metal level 214a for example is copper, aluminium, aluminium, zinc, nickel or other.
The first line layer 220a can form via plating.Specifically, can be earlier on the first bearing substrate 210a, form one deck mask layer, the surface of the local exposing metal layer of mask layer 214a wherein, and mask layer for example is dry film (dry film) or wet type photoresist after photoetching process.Then, the first bearing substrate 210a is electroplated, to form the first line layer 220a.After forming the first line layer 220a, this mask layer is removed comprehensively.
See also Fig. 2 B, then, form a plurality of first blind hole B1, B1 ' on the first circuit bearing substrate 200a, wherein these first blind holes B1, B1 ' extend in the first bearing substrate 210a from the first line layer 220a.In addition, the aperture area of these first blind holes B1, B1 ' can be greater than the bottom area of these first blind holes B1, B1 ', shown in Fig. 2 B.The formation method of these first blind holes B1, B1 ' can be to utilize laser beam to come the scorification part first bearing substrate 210a, and wherein this laser beam is provided by the ultraviolet laser device.
The first blind hole B1 is that with the first blind hole B1 ' difference degree of depth of the two is different.In detail, the depth D 1 of the first blind hole B1 is greater than the depth D 2 of the first blind hole B1 ', and depth D 1 is especially greater than the thickness L of metal level 214a.The depth D 2 of the first blind hole B1 ' is less than the thickness L of metal level 214a, and depth D 2 can be more than or equal to 4/5ths thickness L.
What must illustrate is that though Fig. 2 B illustrates a plurality of first blind hole B1, B1 ', Fig. 2 B is only for illustrating.In other embodiments, can only form one first blind hole B1 or one first blind hole B1 '.That is to say that the total quantity of formed first blind hole B1 of present embodiment and B1 ' can be one.Therefore, the quantity of first blind hole B1 of these shown in Fig. 2 B and B1 ' and non-limiting the present invention.
See also Fig. 2 C, then, by insulating barrier 310, the pressing first circuit bearing substrate 200a is on the second circuit bearing substrate 200b, and promptly insulating barrier 310 is disposed between the first line layer 220a and the second line layer 220b.In addition, the first line layer 220a and the second line layer 220b all are embedded in the insulating barrier 310, shown in Fig. 2 C.
The second circuit bearing substrate 200b comprises the second bearing substrate 210b and the second line layer 220b, and wherein the second line layer 220b is disposed on the second bearing substrate 210b.Therefore, the two structure broadly similar of the first circuit bearing substrate 200a and the second circuit bearing substrate 200b.
The second bearing substrate 210b can be by the formed sheet material of single metal material, or by the formed composite board of multiple layer metal layer, and the structure of the second bearing substrate 210b can be identical with the first bearing substrate 210a.Specifically, the second bearing substrate 210b can comprise two metal level 212b and 214b, and wherein the material of metal level 212b can be identical with metal level 212a, and the material of metal level 214b can be identical with metal level 214a.
In the present embodiment, the second circuit bearing substrate 200b can have at least one second blind hole B2, and wherein the second blind hole B2 extends in the second bearing substrate 210b from the second line layer 220b.The degree of depth of the second blind hole B2 can be greater than the thickness of metal level 214b, shown in Fig. 2 C.Certainly, in the embodiment that other do not illustrate, the degree of depth of the second blind hole B2 can also be less than the thickness of metal level 214b.
The second blind hole B2 can corresponding one of them first blind hole B1, and promptly the second blind hole B2 can be with respect to one of them first blind hole B1.In the embodiment that other do not illustrate, the second blind hole B2 also can corresponding one of them first blind hole B1 '.That is to say that the second blind hole B2 can be with respect to one of them first blind hole B1 or one of them first blind hole B1 '.Certain second blind hole B2 can also be not relative with any first blind hole B1, B1 '.In addition, the formation method of the second blind hole B2 is identical with the formation method of the first blind hole B1, B1 ', therefore below repeated description no longer.
What deserves to be mentioned is that in the present embodiment, the second blind hole B2 is not an essential features of the present invention.That is to say that the second circuit bearing substrate 200b is any second blind hole B2 of tool not.Certainly, the second circuit bearing substrate 200b also can have a plurality of second blind hole B2.Therefore, the quantity of the second blind hole B2 shown in Fig. 2 C only supplies to illustrate, and non-limiting the present invention.
When the pressing first circuit bearing substrate 200a was on the second circuit bearing substrate 200b, insulating barrier 310 can fill up these first blind holes B1, B1 ' and the second blind hole B2.Specifically, insulating barrier 310 can be to have viscosity and mobile material, for example resin sheet or film.So, in the process of carrying out above-mentioned pressing, insulating barrier 310 is filled up these first blind holes B1, B1 ' and the second blind hole B2.
See also Fig. 2 C and Fig. 2 D, then, remove part first bearing substrate 210a and the part second bearing substrate 210b, with the exposed insulating barrier 310 that is positioned at these first blind holes B1.Particularly, the method that removes part first bearing substrate 210a and the part second bearing substrate 210b can be to remove metal level 212a and metal level 212b.Because the degree of depth of these first blind holes B1 is greater than the thickness of metal level 214a, and the degree of depth of the second blind hole B2 is greater than the thickness of metal level 214b, therefore after removing metal level 212a and metal level 212b, the insulating barrier 310 that is positioned at these the first blind hole B1 and the second blind hole B2 can be exposed out.
The method that removes metal level 212a and metal level 212b can be etch metal layers 212a and metal level 212b.In addition, the first bearing substrate 210a and the second bearing substrate 210b can adopt the composition metal plate that contains polymer material layer.So, metal level 212a and metal level 212b can adopt the mode of peeling off to remove.
See also Fig. 2 D and Fig. 2 E, then, can remove the thickness of part metals layer 214a, to form metal level 214a ', the exposed simultaneously insulating barrier 310 that is positioned at the first blind hole B1 '.The above-mentioned method that removes part metals layer 214a can be that metal level 214a is carried out etching, for example metal level 214a is soaked the etching soup and carries out microetch (micro-etching).
Must it should be noted that in the disclosed method that removes part first bearing substrate 210a and the part second bearing substrate 210b of Fig. 2 C to Fig. 2 E, present embodiment can omit the step shown in Fig. 2 D, just removes the thickness of part metals layer 214a.Specifically, present embodiment can only form the degree of depth greater than the first blind hole B1 of metal level 214a thickness and the degree of depth second blind hole B2 greater than metal level 214b thickness, and with this understanding, after removing metal level 212a and metal level 212b, the insulating barrier 310 that is positioned at the first blind hole B1 and the second blind hole B2 can be exposed out.Therefore, emphasize that the method that removes part first bearing substrate 210a and the part second bearing substrate 210b that Fig. 2 C to Fig. 2 E is disclosed only supplies to illustrate, and non-limiting the present invention at this.
See also Fig. 2 E and Fig. 2 F, after the insulating barrier 310 that is positioned at these first blind holes B1, B1 ' and the second blind hole B2 is exposed out, remove the partial insulative layer 310 that is positioned at these first blind holes B1, B1 ', to form a plurality of hole H1, H2.These holes H1, H2 can communicate with the first blind hole B1, B1 '.In addition, these holes H1, H2 extend to the second line layer 220b from the first line layer 220a.
Structurally, hole H1 is a blind hole, and promptly hole H1 is not to be to run through the second line layer 220b and metal level 214b forms.Hole H2 not only communicates with one of them first blind hole B1, more communicates with the second blind hole B2.Therefore, with regard to structure, hole H2 is a perforation, promptly hole H2 for run through the second line layer 220b with and metal level 214b form.Specifically, when removing the partial insulative layer 310 that is positioned at these first blind holes B1, B1 ', can also remove the partial insulative layer 310 that is positioned at the second blind hole B2, to form hole H2.So, one of them first blind hole B1 can communicate with the second blind hole B2.In addition, in the embodiment that other do not illustrate, the first blind hole B1 ' can also communicate with the second blind hole B2.
Since partial insulative layer 310 can be exposed in these first blind holes B1, the B1 ' with the second blind hole B2 in, so these partial insulative layers 310 that exposed out can be used as the mark of the position that is used for indicating pre-formation hole H1, H2.Can reduce like this situation that hole H1, H2 are formed on errors present takes place, avoid hole H1, H2 skew, and then improve the yield of wiring board.
In addition, the method that forms these holes H1, H2 can be to utilize laser beam to come scorification to be positioned at the partial insulative layer 310 of these first blind holes B1, B1 ' and the second blind hole B2, or carries out machine drilling technology.Utilize in the method that laser beam comes scorification partial insulative layer 310 above-mentioned, present embodiment can adopt easy scorification insulating barrier 310, and the laser beam of survivable first line layer 220a and metal level 214a ', for example laser beam that provided of carbon dioxide laser device.Can remove the partial insulative layer 310 that is positioned at these first blind holes B1, B1 ' and the second blind hole B2 so comparatively exactly, to increase the probability that hole H1, H2 are formed on the tram.Except the carbon dioxide laser device, the laser beam of present embodiment is provided by ultraviolet laser device or garnet laser aid.
See also Fig. 2 F and Fig. 2 G, then, form a plurality of conductive pole 320a, 320b in these holes H1, H2, wherein these conductive poles 320a, 320b all are connected between the first line layer 220a and the second line layer 220b.That is to say that the first line layer 220a can see through these conductive poles 320a, 320b and electrically conduct with the second line layer 220b.These conductive poles 320a, 320b are disposed in these holes H1, the H2.Each conductive pole 320a has end face 322a and bottom surface 324a, and conductive pole 320b has end face 322b and bottom surface 324b.End face 322a is with respect to bottom surface 324a, and end face 322b is with respect to bottom surface 324b.
Because the aperture area of the first blind hole B1, B1 ' is greater than the bottom area of these first blind holes B1, B1 ' (can with reference to figure 2B), therefore be subjected to the structure influence of the above-mentioned first blind hole B1, B1 ', these conductive poles 320a, 320b can be from the junction between the first line layer 220a and the insulating barrier 310 towards end face 322a, 322b convergents.In addition, conductive pole 320a in hole H1 can be from the junction between the first line layer 220a and the insulating barrier 310 towards bottom surface 324a convergent, and the conductive pole 320b in hole H2 can be from the junction between the second line layer 220b and the insulating barrier 310 towards bottom surface 324b convergent, shown in Fig. 2 G.
In the embodiment shown in Fig. 2 G, these conductive poles 320a, 320b fill up these holes H1, H2, and these conductive poles 320a, 320b are all solid cylinder.Yet in the embodiment that other do not illustrate, these conductive poles 320a, 320b can also not fill up these holes H1, H2.That is to say that these conductive poles 320a, 320b can be hollow cylinders.
The method that forms these conductive poles 320a, 320b has various embodiments.In the present embodiment, the formation method of these conductive poles 320a, 320b can be to carry out electroless-plating technology and electric electroplating technology is arranged.In addition, these conductive poles 320a, 320b are not to be to form in same technology with the first line layer 220a and the second line layer 220b, so, even these conductive poles 320a, 320b, the first line layer 220a and the second line layer 220b are formed by identical materials, all there is interface I between these conductive poles 320a, 320b and the first line layer 220a and the second line layer 220b, and see through little microtomy and cooperate general magnifying glass or light microscope, can see these interface I.
Please be stressed that especially the formed quantity of these conductive poles 320b is relevant with the quantity of the second blind hole B2 simultaneously with reference to Fig. 2 F and Fig. 2 G, and the formed quantity of conductive pole 320a is simultaneously relevant with the quantity of the first blind hole B1, B1 ' and the second blind hole B2.For example, when the total quantity of the second blind hole B2 was one, the quantity of formed conductive pole 320b also was one.And when the total quantity of the first blind hole B1, B1 ' is M, and the total quantity of the second blind hole B2 is when being N, the quantity of formed conductive pole 320a then is that (M-N) is individual.Therefore, the quantity of conductive pole 320a, the 320b shown in Fig. 2 G only supplies to illustrate, and non-limiting the present invention.
After forming these conductive poles 320a, 320b, remove remaining first bearing substrate 210a (for example metal level 214a ' shown in Fig. 2 F) and the remaining second bearing substrate 210b (for example metal level 214b shown in Fig. 2 F), the method that wherein removes metal level 214a ' and metal level 214b can be etch metal layers 214a ' and metal level 214b.So far, a kind of wiring board 300 that comprises the first line layer 220a, the second line layer 220b, insulating barrier 310 and a plurality of conductive pole 320a, 320b has been made basically and has been finished.In addition, after finishing wiring board 300, can on the first line layer 220a and the second line layer 220b, form welding resisting layer, to protect the first line layer 220a and the second line layer 220b.
Fig. 3 A to Fig. 3 G is the flow process generalized section of technology of the wiring board of another embodiment of the present invention.Present embodiment is similar to previous embodiment, and the difference part mainly is the technology of wiring board.Therefore, Fig. 3 A to Fig. 3 G and following word content will highlight the difference part of present embodiment and previous embodiment.
Fig. 3 A to Fig. 3 B discloses the method that present embodiment forms the first circuit bearing substrate 400a.Please consult Fig. 3 A earlier, at first, form mask layer 430 on the first bearing substrate 410a, wherein the mask layer 430 local surperficial S1 that cover the first bearing substrate 410a.
The material of metal level 412a can be aluminium, copper, tin or have high strength and the metal material of high tenacity, has the metal material of high perveance and the material of metal level 414a can be copper, aluminium, zinc, nickel or other.When the material of metal level 412a was aluminium, the material of metal level 416a can be selected the low metal material of specific activity aluminium, for example zinc, nickel or tin for use.Can protect metal level 416a in the technology of wiring board, can not be subjected to the destruction of chemical agents such as etching soup for example like this, more can prevent to be destroyed by chemical agent simultaneously, and influence some process environments, cause yield to reduce because of metal level 416a.
See also Fig. 3 B, then, form the first line layer 420a and barrier layer 440, wherein the first line layer 420a and barrier layer 440 are positioned at the surperficial S1 of 430 local first bearing substrate 410a that expose of mask layer, and the first line layer 420a is between the barrier layer 440 and the first bearing substrate 410a.Shown in Fig. 3 B.After forming the first line layer 420a and barrier layer 440, the first circuit bearing substrate 400a ' forms in fact.
The material of the first line layer 420a is different from barrier layer 440, and wherein the material of the first line layer 420a for example is a copper, and the material of barrier layer 440 for example is a nickel.In addition, it is identical to form the method that forms the first line layer 220a in the method for the first line layer 420a and barrier layer 440 and the previous embodiment, so repeated description no longer.
Fig. 3 B to Fig. 3 D discloses the method that present embodiment forms a plurality of first blind hole B3.Please consult Fig. 3 B and Fig. 3 C earlier, after forming the first line layer 420a and barrier layer 440, remove part mask layer 430, to form a plurality of opening O, wherein these openings O part exposes the surperficial S1 of the first bearing substrate 410a.
The method that removes part mask layer 430 can be to utilize laser beam to remove part mask layer 430, and this laser beam is provided by carbon dioxide laser device, ultraviolet laser device or garnet laser aid.
See also Fig. 3 C and Fig. 3 D, then, remove the part first bearing substrate 410a in these openings O, to form a plurality of first blind hole B3.The degree of depth of these first blind holes B3 can be greater than the thickness of metal level 414a, shown in Fig. 3 D.Certainly, the first blind hole B1 ' disclosed according to earlier figures 2B, the degree of depth of the first blind hole B3 of present embodiment can also be less than the thickness of metal level 414a.
The method that removes the part first bearing substrate 410a can be the etching first bearing substrate 410a.Specifically, after these openings O formed, mask layer 430 can be used as a kind of etching mask with barrier layer 440.When carrying out the etching first bearing substrate 410a, can select for use and can not injure mask layer 430 and barrier layer 440, and the etching soup of energy etch metal layers 414a.So, under the condition of not destroying the first line layer 420a, these first blind holes B3 is formed.
What must illustrate is, the quantity of the opening O shown in Fig. 3 C and Fig. 3 D and the first blind hole B3 is all a plurality of, but in the embodiment that other do not illustrate, the quantity of the opening O and the first blind hole B3 all can be one, so the quantity of the opening O shown in Fig. 3 C and Fig. 3 D and the first blind hole B3 and non-limiting the present invention.
See also Fig. 3 D and Fig. 3 E, after forming these first blind holes B3, remove barrier layer 440 and remaining mask layer 430, so that the first line layer 420a exposes out.So far, the first circuit bearing substrate 400a has made and has finished.
See also Fig. 3 F, then, by insulating barrier 310, the pressing first circuit bearing substrate 400a is on the second circuit bearing substrate 400b, and wherein insulating barrier 310 can fill up these first blind holes B3.The second circuit bearing substrate 400b comprises the second bearing substrate 410b and the second line layer 420b, and wherein the second line layer 420b is disposed on the second bearing substrate 410b.So the two structure broadly similar of the first circuit bearing substrate 400a and the second circuit bearing substrate 400b, and the second bearing substrate 410b is identical with the structure of the first bearing substrate 410a is at this repeated description no longer.
See also Fig. 3 F and Fig. 3 G, then, remove part first bearing substrate 410a and the part second bearing substrate 410b, with the exposed insulating barrier 310 that is positioned at these first blind holes B3.The method that removes part first bearing substrate 210a and the part second bearing substrate 210b in the method that removes part first bearing substrate 410a and the part second bearing substrate 410b and the previous embodiment is identical, so repeated description no longer.
After removing part first bearing substrate 410a and the part second bearing substrate 210b, follow-up flow process of carrying out shown in Fig. 2 F to Fig. 2 G.Because the flow process shown in Fig. 2 F to Fig. 2 G described in detail, the therefore relevant ensuing flow process of Fig. 3 G is at this repeated description no longer.
In sum, the present invention before insulating barrier, forms at least one blind hole at pressing circuit bearing substrate (i.e. the first circuit bearing substrate) in advance on the circuit bearing substrate.When pressing circuit bearing substrate, insulating barrier can fill up blind hole.After removing the part bearing substrate, the insulating barrier that is positioned at blind hole can expose out.
Though insulating barrier can produce deformation in the process of pressing circuit bearing substrate, and the relative position (that is interlayer skew) of this deformation between line layer (i.e. first line layer and second line layer) wiring is controlled under lower skew level, only can change the overall dimensions performance of wiring board, be offset as for the relative position between the wiring of position, hole (comprising conductive through hole and conductive blind hole) and line layer, the insulating barrier that has exposed out in blind hole can indicate under the tram situation of follow-up pre-formation hole, should obtain relative improvement.
In addition, in forming the forming process of above-mentioned hole, the present invention can adopt easy scorification insulating barrier, and the laser beam of survivable bearing substrate and line layer, for example the laser beam that provided of carbon dioxide laser device.Therefore, the present invention can also form hole exactly in blind hole.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; those of ordinary skill in the technical field under any; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (18)
1. technology of making wiring board comprises:
Form the first circuit bearing substrate, it comprises first bearing substrate and first line layer that is disposed on this first bearing substrate;
Form at least one first blind hole on this first circuit bearing substrate, wherein this first blind hole extends in this first bearing substrate from this first line layer;
Pass through insulating barrier, this first circuit bearing substrate of pressing is on the second circuit bearing substrate, wherein this second circuit bearing substrate comprises second bearing substrate and second line layer that is disposed on this second bearing substrate, this insulating barrier is disposed between this first line layer and this second line layer, and this insulating barrier fills up this first blind hole;
Remove this first bearing substrate of part and this second bearing substrate of part, with exposed this insulating barrier that is positioned at this first blind hole;
Remove this insulating barrier of part that is positioned at this first blind hole, to form the hole that extends to this second line layer from this first line layer;
Form conductive pole in this hole, wherein this conductive pole is connected between this first line layer and this second line layer; And
Remove remaining this first bearing substrate and remaining this second bearing substrate.
2. the technology of making wiring board as claimed in claim 1, the method that wherein forms this hole comprise this insulating barrier of part that utilizes laser beam, scorification to be positioned at this first blind hole.
3. the technology of making wiring board as claimed in claim 2, wherein this laser beam is provided by carbon dioxide laser device, ultraviolet laser device or garnet laser aid.
4. the technology of making wiring board as claimed in claim 1, the method that wherein forms this hole comprise carries out machine drilling technology.
5. the technology of making wiring board as claimed in claim 1, wherein this second circuit bearing substrate has at least one second blind hole that extends to this second bearing substrate from this second line layer, when this first circuit bearing substrate of pressing is on the second circuit bearing substrate, this insulating barrier also fills up this second blind hole, and after removing this second bearing substrate of part, this insulating barrier that is positioned at this second blind hole exposes out.
6. the technology of making wiring board as claimed in claim 5, wherein this second blind hole is with respect to this first blind hole, when removing this insulating barrier of part that is positioned at this first blind hole, also comprise removing this insulating barrier of part that is positioned at this second blind hole, so that this first blind hole communicates with this second blind hole.
7. the technology of making wiring board as claimed in claim 1, the method that wherein forms this first circuit bearing substrate comprises:
Form mask layer on this first bearing substrate, wherein the local surface that covers this first bearing substrate of this mask layer; And
Form this first line layer and barrier layer, wherein this first line layer and this barrier layer be positioned at this mask layer the surface of local this first bearing substrate that exposes, and this first line layer is between this barrier layer and this first bearing substrate.
8. the technology of making wiring board as claimed in claim 7, the method that wherein forms this first blind hole comprises:
Remove this mask layer of part, to form at least one local opening that exposes this first bearing substrate; And
Remove this first bearing substrate of part in this opening.
9. the technology of making wiring board as claimed in claim 8, the method that wherein removes the part mask layer comprise utilizes laser beam to remove this mask layer of part.
10. the technology of making wiring board as claimed in claim 8, the method that wherein removes this first bearing substrate of part in this opening comprises this first bearing substrate of part that this opening of etching is interior.
11. the technology of making wiring board as claimed in claim 8 after forming this first blind hole, also comprises removing this barrier layer and remaining this mask layer.
12. comprising, the technology of making wiring board as claimed in claim 1, the method that wherein forms this first blind hole utilizes laser beam, this first bearing substrate of scorification part.
13. the technology of making wiring board as claimed in claim 1, wherein this insulating barrier is resin bed or film.
14. a wiring board has at least one hole, this wiring board comprises:
First line layer;
Second line layer;
Insulating barrier is disposed between this first line layer and this second line layer, and wherein this hole extends to this second line layer from this first line layer; And
At least one conductive pole, be disposed in this hole, and this conductive pole is connected between this first line layer and this second line layer, wherein this conductive pole have end face with respect to the bottom surface of this end face, and this conductive pole from the junction between this first line layer and this insulating barrier towards this end face convergent.
15. wiring board as claimed in claim 14, wherein this conductive pole fills up this hole.
16. wiring board as claimed in claim 14 wherein all has the interface between this conductive pole and this first line layer and this second line layer.
17. wiring board as claimed in claim 14, wherein this hole is a blind hole, and this conductive pole from the junction between this first line layer and this insulating barrier towards this bottom surface convergent.
18. wiring board as claimed in claim 14, wherein this hole is a perforation, and this conductive pole from the junction between this second line layer and this insulating barrier towards this bottom surface convergent.
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| CN2008101698104A CN101715274B (en) | 2008-10-07 | 2008-10-07 | Circuit board and process thereof |
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| CN2008101698104A CN101715274B (en) | 2008-10-07 | 2008-10-07 | Circuit board and process thereof |
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| CN101715274B true CN101715274B (en) | 2011-11-16 |
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| CN105704906B (en) * | 2014-11-27 | 2018-08-07 | 深南电路有限公司 | A kind of method and circuit board substrate of circuit board substrate interlayer conduction |
| TW201916180A (en) * | 2017-09-29 | 2019-04-16 | 矽品精密工業股份有限公司 | Substrate structure and the manufacture thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1792126A (en) * | 2003-05-19 | 2006-06-21 | 大日本印刷株式会社 | Double-sided wiring board and manufacturing method of double-sided wiring board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1792126A (en) * | 2003-05-19 | 2006-06-21 | 大日本印刷株式会社 | Double-sided wiring board and manufacturing method of double-sided wiring board |
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