CN101681322B - 支持命令数据复制的高容量存储子系统的存储芯片 - Google Patents

支持命令数据复制的高容量存储子系统的存储芯片 Download PDF

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Publication number
CN101681322B
CN101681322B CN2008800155062A CN200880015506A CN101681322B CN 101681322 B CN101681322 B CN 101681322B CN 2008800155062 A CN2008800155062 A CN 2008800155062A CN 200880015506 A CN200880015506 A CN 200880015506A CN 101681322 B CN101681322 B CN 101681322B
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China
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data
memory module
chip
group
port
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CN2008800155062A
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Chinese (zh)
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CN101681322A (zh
Inventor
G·K·巴特利
J·M·博肯哈根
P·R·格尔曼
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Lenovo International Ltd
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International Business Machines Corp
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668—Details of memory controller
    • G06F13/1684—Details of memory controller using multiple buses
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/16—Handling requests for interconnection or transfer for access to memory bus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
    • G06F12/0802—Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
    • G06F12/0806—Multiuser, multiprocessor or multiprocessing cache systems
    • G06F12/084—Multiuser, multiprocessor or multiprocessing cache systems with a shared cache
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Multi Processors (AREA)
  • Bus Control (AREA)
  • Memory System Of A Hierarchy Structure (AREA)
CN2008800155062A 2007-06-27 2008-06-25 支持命令数据复制的高容量存储子系统的存储芯片 Active CN101681322B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/769,001 2007-06-27
US11/769,001 US7822936B2 (en) 2007-06-27 2007-06-27 Memory chip for high capacity memory subsystem supporting replication of command data
PCT/EP2008/058082 WO2009000857A1 (en) 2007-06-27 2008-06-25 Memory chip for high capacity memory subsystem supporting replication of command data

Publications (2)

Publication Number Publication Date
CN101681322A CN101681322A (zh) 2010-03-24
CN101681322B true CN101681322B (zh) 2012-09-05

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CN2008800155062A Active CN101681322B (zh) 2007-06-27 2008-06-25 支持命令数据复制的高容量存储子系统的存储芯片

Country Status (8)

Country Link
US (1) US7822936B2 (enExample)
EP (1) EP2160687B1 (enExample)
JP (1) JP4824126B2 (enExample)
KR (1) KR101107349B1 (enExample)
CN (1) CN101681322B (enExample)
AT (1) ATE479947T1 (enExample)
DE (1) DE602008002436D1 (enExample)
WO (1) WO2009000857A1 (enExample)

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US9123409B2 (en) 2009-06-11 2015-09-01 Micron Technology, Inc. Memory device for a hierarchical memory architecture
US9117496B2 (en) 2012-01-30 2015-08-25 Rambus Inc. Memory device comprising programmable command-and-address and/or data interfaces
US8788748B2 (en) 2012-03-22 2014-07-22 International Business Machines Corporation Implementing memory interface with configurable bandwidth
CN103150006A (zh) * 2013-03-25 2013-06-12 西安华芯半导体有限公司 Dram存储器的省电方法
US9324389B2 (en) * 2013-05-29 2016-04-26 Sandisk Technologies Inc. High performance system topology for NAND memory systems
US9728526B2 (en) 2013-05-29 2017-08-08 Sandisk Technologies Llc Packaging of high performance system topology for NAND memory systems
WO2014193592A2 (en) * 2013-05-29 2014-12-04 Sandisk Technologies Inc. High performance system topology for nand memory systems
US9703702B2 (en) * 2013-12-23 2017-07-11 Sandisk Technologies Llc Addressing auto address assignment and auto-routing in NAND memory network
CN104268121B (zh) * 2014-09-23 2017-08-11 浪潮(北京)电子信息产业有限公司 超大规模芯片中访问寄存器的方法及系统
TWI588658B (zh) 2015-10-20 2017-06-21 旺宏電子股份有限公司 I/o匯流排共用記憶體系統
US9841922B2 (en) * 2016-02-03 2017-12-12 SK Hynix Inc. Memory system includes a memory controller

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US5893927A (en) * 1996-09-13 1999-04-13 International Business Machines Corporation Memory device having programmable device width, method of programming, and method of setting device width for memory device
US6502161B1 (en) * 2000-01-05 2002-12-31 Rambus Inc. Memory system including a point-to-point linked memory subsystem
US7356639B2 (en) * 2000-01-05 2008-04-08 Rambus Inc. Configurable width buffered module having a bypass circuit
JP2002063791A (ja) * 2000-08-21 2002-02-28 Mitsubishi Electric Corp 半導体記憶装置およびメモリシステム
US6493250B2 (en) * 2000-12-28 2002-12-10 Intel Corporation Multi-tier point-to-point buffered memory interface
US7085866B1 (en) * 2002-02-19 2006-08-01 Hobson Richard F Hierarchical bus structure and memory access protocol for multiprocessor systems
DE10318603B4 (de) * 2003-04-24 2005-03-10 Infineon Technologies Ag Eingangsempfängerschaltung
US20040243769A1 (en) * 2003-05-30 2004-12-02 Frame David W. Tree based memory structure
US7120727B2 (en) * 2003-06-19 2006-10-10 Micron Technology, Inc. Reconfigurable memory module and method
US7136958B2 (en) * 2003-08-28 2006-11-14 Micron Technology, Inc. Multiple processor system and method including multiple memory hub modules
JP4741226B2 (ja) * 2003-12-25 2011-08-03 株式会社日立製作所 半導体メモリモジュール、およびメモリシステム
US7216196B2 (en) * 2003-12-29 2007-05-08 Micron Technology, Inc. Memory hub and method for memory system performance monitoring
US7188219B2 (en) * 2004-01-30 2007-03-06 Micron Technology, Inc. Buffer control system and method for a memory system having outstanding read and write request buffers
US7366864B2 (en) * 2004-03-08 2008-04-29 Micron Technology, Inc. Memory hub architecture having programmable lane widths
US7120723B2 (en) * 2004-03-25 2006-10-10 Micron Technology, Inc. System and method for memory hub-based expansion bus
US20060036826A1 (en) 2004-07-30 2006-02-16 International Business Machines Corporation System, method and storage medium for providing a bus speed multiplier
EP2383661A1 (en) * 2005-04-21 2011-11-02 Violin Memory, Inc. Interconnection system
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US20060245226A1 (en) * 2005-05-02 2006-11-02 Inphi Corporation Fully buffered DIMM architecture and protocol
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US7397684B2 (en) * 2005-09-15 2008-07-08 Infineon Technologies, Ag Semiconductor memory array with serial control/address bus
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Also Published As

Publication number Publication date
KR101107349B1 (ko) 2012-01-19
ATE479947T1 (de) 2010-09-15
US20090006772A1 (en) 2009-01-01
DE602008002436D1 (de) 2010-10-14
EP2160687B1 (en) 2010-09-01
JP4824126B2 (ja) 2011-11-30
JP2010531501A (ja) 2010-09-24
CN101681322A (zh) 2010-03-24
EP2160687A1 (en) 2010-03-10
WO2009000857A1 (en) 2008-12-31
US7822936B2 (en) 2010-10-26
KR20090115130A (ko) 2009-11-04

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Effective date of registration: 20160302

Address after: China Hongkong No. 979 King's road, Quarry Bay Taikoo Place Lincoln building 23 floor

Patentee after: Lenovo International Ltd

Address before: American New York

Patentee before: International Business Machines Corp.