CN101673352B - Card provided with double card bodies and manufacturing method thereof - Google Patents
Card provided with double card bodies and manufacturing method thereof Download PDFInfo
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- CN101673352B CN101673352B CN 200910090258 CN200910090258A CN101673352B CN 101673352 B CN101673352 B CN 101673352B CN 200910090258 CN200910090258 CN 200910090258 CN 200910090258 A CN200910090258 A CN 200910090258A CN 101673352 B CN101673352 B CN 101673352B
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- card
- kaka
- nei
- groove position
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000005538 encapsulation Methods 0.000 claims description 13
- 238000004806 packaging method and process Methods 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- Injection Moulding Of Plastics Or The Like (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention discloses a card provided with double card bodies and a manufacturing method thereof, aiming at solving the problem of complicated manufacturing technique of the card provided with the double card bodies in the prior art. The method comprises the steps: an outer bard body 11 provided with slot positions 15 and 16 can be made by injecting material in a mould; the outer bard body 11 is internally surrounded with an inner card body 12 with external contour 17 and an inner card body 13 with the external contour 17, wherein the slot positions 15 and 16 are respectively surrounded by the inner card body 12 and the inner card body 13; and electronic modules 14 are encapsulated at the slot position 15 and the slot position 16. As the two inner card bodies are molded on the outer card body at a time by injection molding process, and the slot positions of the two inner card bodies are encapsulated with electronic modules, therefor, the manufacturing technique can be simplified, and simultaneously the residual outer card body is less, and the pollution to the environment is less.
Description
Technical field
The present invention relates to a kind of intelligent cards and preparation method thereof, particularly a kind of card and preparation method thereof with double card bodies.
Background technology
Smart card is to comprise a kind of electronic portable devices that in the card body, embeds electronic module, and electronic module comprises integrated circuit and the hard contact that is used to be connected to electronic installation (the for example terminal of mobile phone).
In the manufacturing process of card; Comprise: the step that cuts out wild card card body through blunderbuss cutting process blunderbuss; Mill out a groove in the corresponding position of wild card card body, and locate the packaging electronic module, on wild card card body, carry out blunderbuss and cut in the groove position; Blunderbuss cuts out the step of a Nei Kaka body, and the Nei Kaka body surrounds the groove position of packaging electronic module.
In the process of making card, need mill out a groove in the corresponding position of wild card card body, and on wild card card body, carry out blunderbuss and cut; Blunderbuss cuts out a Nei Kaka body, but this two procedures could obtain the card of packaging electronic module, through above-mentioned analysis; Be not difficult to find; In the prior art, adopt the blunderbuss incision technology, complex process.
Summary of the invention
In order to solve the problem of double card bodies card complex process in the prior art, the embodiment of the invention provides a kind of method for making with double card bodies card, comprising:
Through injected plastics material in mould; Manufacturing has the wild card card body 11 of groove position 15 and groove position 16; Be surrounded by Nei Kaka body 12 with outline 17 and Nei Kaka body 13 in the wild card card body 11 with outline 17; Wild card card body 11 surrounds Nei Kaka body 12 and Nei Kaka body 13, and Nei Kaka body 12 surrounds groove position 15, and Nei Kaka body 13 surrounds groove position 16;
In the groove position 15 with groove position 16 place's packaging electronic modules 14.
The embodiment of the invention also provides a kind of card with double card bodies; Comprise: wild card card body 11 with groove position 15 and groove position 16; Be surrounded by Nei Kaka body 12 with outline 17 and Nei Kaka body 13 in the wild card card body 11 with outline 17; Nei Kaka body 12 surrounds groove position 15, and Nei Kaka body 13 surrounds groove position 16, and said card forms through injection moulding.
The embodiment of the invention also provides a kind of card with double card bodies; Comprise: wild card card body 11 with groove position (15) and groove position 16; Be surrounded by the Nei Kaka body 12 with outline 17 in the wild card card body 11 and be surrounded by the Nei Kaka body 13 with outline 17, Nei Kaka body 12 surrounds groove positions 15, and Nei Kaka body 13 surrounds groove positions 16; Said card forms through injection moulding, is packaged with electronic module 14 on groove position 15 and the groove position 16.
Specific embodiments by the invention described above provides can be found out; Just because of through Shooting Technique two Nei Kaka bodies of moulding once on wild card card body; And on the groove position of two Nei Kaka bodies the packaging electronic module; Therefore simplified manufacturing process, made that simultaneously remaining wild card card body is less, also just less to the pollution of environment.
Description of drawings
Fig. 1 is the first embodiment method flow diagram provided by the invention;
Fig. 2 is positioned at the structural drawing of same surperficial card for groove position among first embodiment provided by the invention;
Fig. 3 is positioned at the structural drawing of different surfaces card for groove position among first embodiment provided by the invention;
Fig. 4 is the external profile synoptic diagram of Nei Kaka provided by the invention.
Embodiment
A kind of method for making of first embodiment provided by the invention with double card bodies card; This wild card card body with card of double card bodies uses Shooting Technique to be processed into, and when processing wild card card body, two Nei Kaka bodies are molded; And two groove positions that two Nei Kaka bodies surround respectively are also molded; The groove position can be used for the packaging electronic module, and concrete method flow is as shown in Figure 1, comprising:
Step 101: single injection-molded card, card comprise wild card body body 11, and wild card card body 11 surrounds first Nei Kaka body 12 and 13, the first Nei Kaka bodies of second Nei Kaka body 12 surround 15, the second the Nei Kaka bodies in groove position, 13 encirclement groove positions 16.
Step 102: the groove position 16 place's packaging electronic modules 14 on 15 places, groove position on first Nei Kaka body 12 and second Nei Kaka body 13.
Step 103: on the personalization device to first Nei Kaka body 12 on the encapsulation electronic module 14 issue test, then on second Nei Kaka body 13 encapsulation electronic module 14 issue test.
Wherein in step 101; The card of single injection-molded is as shown in Figure 2; Comprise: comprise second the Nei Kaka body 13 that injects first Nei Kaka body 12 with outline 17 on wild card body body 11, the wild card card body 11 and have outline 17, this outline 17 can be between first Nei Kaka body 12 and the wild card card body 11, or seam or otch between second Nei Kaka body 13 and the wild card card body 11; Have groove position 15 and groove position 16 on the wild card card body 11; This groove position 15 can be used for packaging electronic module 14 with groove position 16 in subsequent step, and concrete groove position 15 is surrounded by Nei Kaka body 12, and groove position 16 is surrounded by Nei Kaka body 13.
In the present embodiment; A preferred scheme is: the position of first Nei Kaka body 12 does; Obtain a position with respect to second Nei Kaka body 13 along the mid point line mirror image symmetry on 11 two long limits of wild card card body; Again with this position along position that the mid point line mirror image symmetry of two minor faces of wild card card body obtains; Promptly for a surface of wild card card body 11; If the position of first Nei Kaka body 12 is the upper left corner of wild card card body 11, the position that obtains along the mid point line mirror image symmetry on 11 two long limits of wild card card body is the upper right corner of wild card card body 11, then the position in the upper right corner is obtained the position in the lower right corner of wild card card body 11 along the mid point line mirror image symmetry of 11 two minor faces of wild card card body again.Groove position 15 by first Nei Kaka body 12 surrounds with the groove position 16 that is surrounded by second Nei Kaka body 13, is positioned at the same surface of wild card card body 11.
Wherein in step 102; The card of single injection-molded is as shown in Figure 3, and the 15 pairs of electronic modules 14 in groove position that surround at first Nei Kaka body 12 encapsulate, after the encapsulation; With wild card card body 11 in the plane; Along groove position that first Nei Kaka body 12 surrounds 15 near the angle counterclockwise or the dextrorotation turnback, carry out the encapsulation of electronic module 14 in the groove position 16 that second Nei Kaka body 13 surrounds, for example; The encapsulation that carry out electronic module 14 the groove position 15 of adopting first the Nei Kaka body 12 of sealed in unit in the upper left corner that is positioned at wild card card body 11 to surround; Clockwise or be rotated counterclockwise 180 degree 15 lower right corner that are positioned at wild card card body 11, pit position, the groove position 16 that this moment, second Nei Kaka body 13 surrounded is positioned at the upper left corner of wild card card body 11, adopts sealed in unit 16 to carry out the encapsulation of electronic module 14 in the groove position.Adopt the scheme in the present embodiment, sealed in unit only needs to carry out sealed in unit being required lower to the encapsulation of electronic module 14 in the groove position that is positioned at the wild card card body upper left corner.
In the present embodiment; Another preferred scheme is: wherein in step 101; The position of the position of first Nei Kaka body 12 and second Nei Kaka body 13 is along the mid point line mirror image symmetry on two long limits of wild card card body; And the groove position 15 by first Nei Kaka body 12 surrounds with the groove position 16 that is surrounded by second Nei Kaka body 13, is positioned at the different surfaces of wild card card body 11.Promptly for a surface of wild card card body 11; If the position of first Nei Kaka body 12 is the upper left corner of wild card card body 11; The position that obtains along the mid point line mirror image symmetry on 11 two long limits of wild card card body is the upper right corner of wild card card body 11, and groove position 15 and groove position 16 are positioned at the different surfaces of wild card card body 11.
Wherein in step 102; The groove position 15 packaging electronic modules 14 that adopt sealed in unit to surround at first Nei Kaka body 12; With the counterclockwise or dextrorotation turnback of mid point line on two long limits, wild card card body 11 edges, carry out electronic module 14 encapsulation in the groove position 16 that second Nei Kaka body 13 surrounds.Adopt the scheme in the present embodiment, sealed in unit only needs to carry out sealed in unit being required lower to the encapsulation of electronic module 14 in the groove position that is positioned at the wild card card body upper left corner.
First Nei Kaka body 12 and second Nei Kaka body 13 all have outline 17, and outline 17 can be foregoing seam or otch, and outline 17 can also be as shown in Figure 4, comprise dead slot part 27 and coupling part 37.
In the present embodiment; When different mining was planted with the blunderbuss miller, the material of the material selection unlike material of card body was a composite material, in the card production run, adopts Shooting Technique; The preferred pure injected plastics material of the material of injection moulding in the mould is like 100%ABS, 100%PP or 100%PC.
Wherein in step 103, electronic module is issued and tested, can comprise preparatory individualized distribution, testing current, individualized distribution and printing successively, individualize and detect the making of just having accomplished card like this, these steps also can be deleted as required.
Interior card in the present embodiment can be to be SIM, UIM card, usim card or PIM card.
Second embodiment of the invention provides a kind of card with double card bodies; Comprise: wild card card body 11 with groove position 15 and groove position 16; Be surrounded by Nei Kaka body 12 with outline 17 and Nei Kaka body 13 in the wild card card body 11 with outline 17; Nei Kaka body 12 surrounds groove position 15, and Nei Kaka body 13 surrounds groove position 16, and said card forms through injection moulding.
Third embodiment of the invention provides a kind of card with double card bodies; Comprise: wild card card body 11 with groove position 15 and groove position 16; Be surrounded by Nei Kaka body 12 in the wild card card body 11 and be surrounded by Nei Kaka body 13 with outline 17 with outline 17; Nei Kaka body 12 surrounds groove position 15, and Nei Kaka body 13 surrounds groove position 16, and said card forms through injection moulding; Be packaged with electronic module 14 on groove position 15 and the groove position 16.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. method for making with double card bodies card; It is characterized in that; Comprise: through injected plastics material in mould; Manufacturing has the wild card card body (11) of the first groove position (15) and the second groove position (16); Be surrounded by in the wild card card body (11) have outline (17) first Nei Kaka body (12) and have second Nei Kaka body (13) of outline (17), first Nei Kaka body (12) surrounds the first groove position (15), second Nei Kaka body (13) surrounds the second groove position (16);
Locate packaging electronic module (14) in the first groove position (15) and the second groove position (16).
2. the method for making with double card bodies card as claimed in claim 1; It is characterized in that; The position of first Nei Kaka body (12) does; Obtain a position with respect to second Nei Kaka body (13) along the mid point line mirror image symmetry on (11) two long limits of wild card card body, again with this position along the position that the mid point line mirror image symmetry of (11) two minor faces of wild card card body obtains, the first groove position (15) and the second groove position (16) are positioned at the same surface of wild card card body (11).
3. the method for making with double card bodies card as claimed in claim 2; It is characterized in that; The encapsulation of electronic module (14) is located to carry out in groove position (15) in that first Nei Kaka body (12) surrounds; With wild card card body (11) in the plane along the first groove position (15) institute that first Nei Kaka body (12) surrounds near the angle counterclockwise or the dextrorotation turnback, locate to carry out the encapsulation of electronic module (14) in the second groove position (16) of second Nei Kaka body (13) encirclement.
4. the method for making with double card bodies card as claimed in claim 1; It is characterized in that; The position of the position of first Nei Kaka body (12) and second Nei Kaka body (13) is along the mid point line mirror image on (11) two long limits of wild card card body symmetry, and the first groove position (15) and the second groove position (16) lay respectively at two surfaces of the different directions of wild card card body (11).
5. the method for making with double card bodies card as claimed in claim 4; It is characterized in that; The encapsulation of electronic module (14) is located to carry out in the first groove position (15) in that first Nei Kaka body (12) surrounds; With the counterclockwise or dextrorotation turnback of mid point line on two long limits, wild card card body (11) edge, locate to carry out the encapsulation of electronic module (14) in the second groove position (16) that second Nei Kaka body (13) surrounds.
6. the method for making with double card bodies card as claimed in claim 1 is characterized in that, injection moulding is pure injected plastics material in mould.
7. the method for making with double card bodies card as claimed in claim 1; It is characterized in that, also comprise: the step that electronic module (14) interior to first Nei Kaka body (12) successively and that second Nei Kaka body (13) is interior is issued and tested after the packaging electronic module (14).
8. the method for making with double card bodies card as claimed in claim 1 is characterized in that, having the double card bodies card is SIM, usim card, UIM card or PIM card.
9. card with double card bodies; It is characterized in that; Comprise: have the wild card card body (11) of the first groove position (15) and the second groove position (16), be surrounded by in the wild card card body (11) have outline (17) first Nei Kaka body (12) and have second Nei Kaka body (13) of outline (17), first Nei Kaka body (12) surrounds the first groove position (15); Second Nei Kaka body (13) surrounds the second groove position (16), and said card forms through injection moulding.
10. card with double card bodies; It is characterized in that; Comprise: have the wild card card body (11) of the first groove position (15) and the second groove position (16), be surrounded by in the wild card card body (11) have outline (17) first Nei Kaka body (12) and be surrounded by have outline second Nei Kaka body (13) of (17), first Nei Kaka body (12) surrounds the first groove position (15); Second Nei Kaka body (13) surrounds the second groove position (16), and said card forms through injection moulding; Be packaged with electronic module (14) on the first groove position (15) and the second groove position (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910090258 CN101673352B (en) | 2009-08-04 | 2009-08-04 | Card provided with double card bodies and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910090258 CN101673352B (en) | 2009-08-04 | 2009-08-04 | Card provided with double card bodies and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101673352A CN101673352A (en) | 2010-03-17 |
| CN101673352B true CN101673352B (en) | 2012-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910090258 Expired - Fee Related CN101673352B (en) | 2009-08-04 | 2009-08-04 | Card provided with double card bodies and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101673352B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952958A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN201041837Y (en) * | 2007-02-26 | 2008-03-26 | 实盈电子(东莞)有限公司 | SIM card connector terminal clamping device |
-
2009
- 2009-08-04 CN CN 200910090258 patent/CN101673352B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1952958A (en) * | 2006-11-22 | 2007-04-25 | 凤凰微电子（中国）有限公司 | Method for fabricating and packaging chips and elements to smart card with plastic package technique |
| CN201041837Y (en) * | 2007-02-26 | 2008-03-26 | 实盈电子(东莞)有限公司 | SIM card connector terminal clamping device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101673352A (en) | 2010-03-17 |
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| C14 | Grant of patent or utility model | ||
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| CP01 | Change in the name or title of a patent holder |
Address after: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee after: BEIJING WATCHDATA Co.,Ltd. Address before: 100015 Beijing city Chaoyang District Dongzhimen West eight Street No. 2 room Wanhong Yan Dong Business Garden Patentee before: BEIJING WATCH DATA SYSTEM Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 |
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| CF01 | Termination of patent right due to non-payment of annual fee |