CN205584639U - Microstrip encapsulates chip capacitor shaping device - Google Patents
Microstrip encapsulates chip capacitor shaping device Download PDFInfo
- Publication number
- CN205584639U CN205584639U CN201620311774.0U CN201620311774U CN205584639U CN 205584639 U CN205584639 U CN 205584639U CN 201620311774 U CN201620311774 U CN 201620311774U CN 205584639 U CN205584639 U CN 205584639U
- Authority
- CN
- China
- Prior art keywords
- shaping
- pin
- microstrip
- hopper
- patch capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007493 shaping process Methods 0.000 title claims abstract description 48
- 239000003990 capacitor Substances 0.000 title claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims description 17
- 239000004575 stone Substances 0.000 claims description 12
- 239000000835 fiber Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 2
- 241001438449 Silo Species 0.000 abstract 2
- 230000023298 conjugation with cellular fusion Effects 0.000 abstract 1
- 230000013011 mating Effects 0.000 abstract 1
- 230000021037 unidirectional conjugation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000011664 signaling Effects 0.000 description 2
- XRHGYUZYPHTUJZ-UHFFFAOYSA-N 4-chlorobenzoic acid Chemical compound 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- 230000002194 synthesizing Effects 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N tin hydride Chemical compound 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[Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model relates to a microstrip encapsulates chip capacitor shaping device for make microstrip encapsulation chip capacitor's (5) pin (6) level, mould (1), shaping lower mould (2) in the shaping, shaping lower mould (2) go up to open and to have first silo (3) and second silo (4) that are used for placing microstrip encapsulation chip capacitor (5), the shaping on be equipped with on mould (1) with pin (6) convex surface of each other mating, mould when the shaping in (1) during with shaping lower mould (2) mutual pressfitting, the convex surface to pin (6) effect, make pin (6) level. Compared with the prior art, the utility model has the advantages of the practicality is good, convenient to use.
Description
Technical field
This utility model relates to a kind of electric capacity apparatus for shaping, especially relates to a kind of Microstrip and encapsulates patch capacitor
Apparatus for shaping.
Background technology
Microstrip line (microstrip line) be a kind of one side the most exposed inside air (can to around formed radiation or
Radiation interference by surrounding), and another side is attached to the mounting technology on the insulation dielectric of PCB, it is formed
An electric field part is distributed in the air, and another part is distributed in the dielectric of PCB.In Microstrip line
Signaling rate is faster than the signaling rate in Stripline, so being widely used in radio frequency products.
Radio-frequency antenna plate, needs to use a large amount of Microstrip to encapsulate patch capacitor, owing to these encapsulation electric capacity both sides have
Strip pin, long 6.35mm, wide 2.36mm, thick 0.1mm, and pin and softness thereof, in transport, store
During be easily deformed.Microstrip encapsulation electric capacity after pin deformation can cause scolding tin after being installed on PCB
Point floats, and can interfere radio frequency model, processes so all pins must do before attachment leveling.Previously
In small lot advanced development, make to be smoothed out with the fingers by pin by hand flat always, but flatness and concordance can not be guaranteed, and make
PCBA welding quality reduces, and directly influences the debugging qualification rate in later stage.And along with yield constantly increases, people
The yield of work operation also cannot meet Production requirement, the production capacity of whole product and quality and have too many difficulties to cope with.
Utility model content
Defect that the purpose of this utility model is contemplated to overcome above-mentioned prior art to exist and a kind of user is provided
Just the Microstrip that, efficiency is high encapsulates patch capacitor apparatus for shaping.
The purpose of this utility model can be achieved through the following technical solutions: a kind of Microstrip encapsulation paster electricity
Hold apparatus for shaping, smooth, including under shaping upper, molding for the pin making Microstrip encapsulation patch capacitor
Mould, described molding lower mold has the first hopper for placing Microstrip encapsulation patch capacitor and the second material
Groove, described shaping upper is provided with the convex surface being mutually matched with described pin, when shaping upper and molding lower mold
When being laminated, described convex surface, to pin effect, makes pin smooth.
The first described hopper and the width of the second hopper are 4mm ± 0.5mm.
The first described hopper and the degree of depth of the second hopper are 3mm ± 0.5mm.
The first described hopper and the second hopper are parallel to each other.
The first described hopper side is provided with the first pin for padded pin being parallel to each other with it and supports platform.
The second described hopper side is provided with the second pin for padded pin being parallel to each other with it and supports platform.
It is 8mm ± 0.1mm that the first described pin supports the height of platform.
It is 8mm ± 0.1mm that the second described pin supports the height of platform.
Described shaping upper is that stone synthesizes the shaping upper of one-tenth made of stones without fibre.
Described molding lower mold is that stone synthesizes the molding lower mold of one-tenth made of stones without fibre.
Compared with prior art, this utility model has the advantage that
(1) make, by hand to single Microstrip electric capacity shaping, once to process one before using apparatus for shaping
Electric capacity, yield is extremely low.After using apparatus for shaping, the most at most 20 electric capacity can be carried out shaping, greatly
Increase production capacity, improve production efficiency；
(2) when making shaping by hand, capacitor pin flatness and concordance extreme difference, after being installed on PCB still
There will be bump to float, radio frequency model is interfered.Use apparatus for shaping that pin surface can be made substantially flat,
Pin and electric capacity body can arrive 90 ° of right angles, and it is qualified that planarization and concordance reach 100%；
(3) capacitor pin only has 0.1mm thick, and side can form the sharp edge of a knife, and producers are in offhand
During easily hands is cut, and use apparatus for shaping employee can be avoided completely to come to harm, reach safety in production,
The purpose of protection employee；
(4) material of shaping upper and molding lower mold uses stone to synthesize stone without fibre, has electrostatic-proof function, prevents
Components and parts interior keys plying is by electrostatic breakdown.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model；
Figure is designated: 1 shaping upper, 2 molding lower molds, 3 first hoppers, 4 second hoppers, 5Microstrip
Encapsulation patch capacitor, 6 pins, 7 first pin support platforms, 8 second pin support platforms.
Detailed description of the invention
With specific embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
Embodiment 1
As it is shown in figure 1, a kind of Microstrip encapsulates patch capacitor apparatus for shaping, it is used for making Microstrip encapsulate
The pin 6 of patch capacitor 5 is smooth, including shaping upper 1, molding lower mold 2, molding lower mold 2 has for
Place the first hopper 3 and the second hopper 4 of Microstrip encapsulation patch capacitor 5, the first hopper 3 and the second material
Groove 4 is parallel to each other, and the width of the first hopper 3 and the second hopper 4 is 4mm, and the degree of depth is 3mm.First hopper
3 sides are provided with the first pin 6 for padded pin 6 being parallel to each other with it and support platform 7.Second hopper 4 one
Side is provided with the second pin 6 for padded pin 6 being parallel to each other with it and supports platform 8.First pin 6 supports platform
7 and second pin 6 to support the height of platform 8 be 8mm.Shaping upper 1 is provided with and is mutually matched with pin 6
Convex surface, when shaping upper 1 is laminated with molding lower mold 2, pin 6 is acted on by convex surface, makes pin 6 flat
Whole.Shaping upper 1 and molding lower mold 2 by stone without fibre synthesis made of stones become, there is electrostatic-proof function, prevent unit's device
Part interior keys plying is by electrostatic breakdown.
During use, Microstrip is encapsulated patch capacitor 5 and puts in the first hopper 3 and the second hopper 4, each
Can place 10 electric capacity in hopper, pin 6 is placed on the first pin support platform 7 accordingly and the second pin props up simultaneously
On support platform 8, by 1 time pressure of shaping upper and fitting tightly with molding lower mold 2, now, pin 6 is in the pressure of convex surface
It is shaped to plane under power, and makes Microstrip encapsulation patch capacitor body and pin 6 shape right angle in 90 °.
Embodiment 2
In the present embodiment, the width of the first hopper 3 and the second hopper 4 is 4.5mm, and the degree of depth is 3.5mm, first
Pin 6 supports platform 7 and the second pin 6 to support the height of platform 8 be 8.1mm.Remaining is with embodiment 1.
Embodiment 3
In the present embodiment, the width of the first hopper 3 and the second hopper 4 is 3.5mm, and the degree of depth is 2.5mm, first
Pin 6 supports platform 7 and the second pin 6 to support the height of platform 8 be 7.9mm.Remaining is with embodiment 1.
Claims (10)
1. Microstrip encapsulates a patch capacitor apparatus for shaping, is used for making Microstrip encapsulate patch capacitor
(5) pin (6) is smooth, it is characterised in that include shaping upper (1), molding lower mold (2), described
The first hopper (3) for placing Microstrip encapsulation patch capacitor (5) and the is had in molding lower mold (2)
Two hoppers (4), described shaping upper (1) is provided with the convex surface being mutually matched with described pin (6), when
When shaping upper (1) and molding lower mold (2) are laminated, pin (6) is acted on by described convex surface, makes to draw
Foot (6) is smooth.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described the first hopper (3) and the width of the second hopper (4) they are 4mm ± 0.5mm.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described the first hopper (3) and the degree of depth of the second hopper (4) they are 3mm ± 0.5mm.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described the first hopper (3) and the second hopper (4) are parallel to each other.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described the first hopper (3) side is provided with the first pin for padded pin (6) being parallel to each other with it
Support platform (7).
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described the second hopper (4) side is provided with the second pin for padded pin (6) being parallel to each other with it
Support platform (8).
A kind of Microstrip the most according to claim 5 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, it is 8mm ± 0.1mm that the first described pin supports the height of platform (7).
A kind of Microstrip the most according to claim 6 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, it is 8mm ± 0.1mm that the second described pin supports the height of platform (8).
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described shaping upper (1) is that stone synthesizes the shaping upper of one-tenth made of stones without fibre.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists
In, described molding lower mold (2) is that stone synthesizes the molding lower mold of one-tenth made of stones without fibre.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620311774.0U CN205584639U (en) | 2016-04-14 | 2016-04-14 | Microstrip encapsulates chip capacitor shaping device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620311774.0U CN205584639U (en) | 2016-04-14 | 2016-04-14 | Microstrip encapsulates chip capacitor shaping device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014508A (en) * | 2019-11-26 | 2020-04-17 | 山东航天电子技术研究所 | Process method and device for shaping lead of axial electronic component |
-
2016
- 2016-04-14 CN CN201620311774.0U patent/CN205584639U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014508A (en) * | 2019-11-26 | 2020-04-17 | 山东航天电子技术研究所 | Process method and device for shaping lead of axial electronic component |
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