CN205584639U - Microstrip encapsulates chip capacitor shaping device - Google Patents

Microstrip encapsulates chip capacitor shaping device Download PDF

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Publication number
CN205584639U
CN205584639U CN201620311774.0U CN201620311774U CN205584639U CN 205584639 U CN205584639 U CN 205584639U CN 201620311774 U CN201620311774 U CN 201620311774U CN 205584639 U CN205584639 U CN 205584639U
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China
Prior art keywords
shaping
pin
microstrip
hopper
patch capacitor
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Active
Application number
CN201620311774.0U
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Chinese (zh)
Inventor
曹剑峰
孙杰
何国松
唐伟仁
方超
凌超
李文山
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Shanghai Railway Communication Co Ltd
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Shanghai Railway Communication Co Ltd
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Priority to CN201620311774.0U priority Critical patent/CN205584639U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

The utility model relates to a microstrip encapsulates chip capacitor shaping device for make microstrip encapsulation chip capacitor's (5) pin (6) level, mould (1), shaping lower mould (2) in the shaping, shaping lower mould (2) go up to open and to have first silo (3) and second silo (4) that are used for placing microstrip encapsulation chip capacitor (5), the shaping on be equipped with on mould (1) with pin (6) convex surface of each other mating, mould when the shaping in (1) during with shaping lower mould (2) mutual pressfitting, the convex surface to pin (6) effect, make pin (6) level. Compared with the prior art, the utility model has the advantages of the practicality is good, convenient to use.

Description

A kind of Microstrip encapsulates patch capacitor apparatus for shaping
Technical field
This utility model relates to a kind of electric capacity apparatus for shaping, especially relates to a kind of Microstrip and encapsulates patch capacitor Apparatus for shaping.
Background technology
Microstrip line (microstrip line) be a kind of one side the most exposed inside air (can to around formed radiation or Radiation interference by surrounding), and another side is attached to the mounting technology on the insulation dielectric of PCB, it is formed An electric field part is distributed in the air, and another part is distributed in the dielectric of PCB.In Microstrip line Signaling rate is faster than the signaling rate in Stripline, so being widely used in radio frequency products.
Radio-frequency antenna plate, needs to use a large amount of Microstrip to encapsulate patch capacitor, owing to these encapsulation electric capacity both sides have Strip pin, long 6.35mm, wide 2.36mm, thick 0.1mm, and pin and softness thereof, in transport, store During be easily deformed.Microstrip encapsulation electric capacity after pin deformation can cause scolding tin after being installed on PCB Point floats, and can interfere radio frequency model, processes so all pins must do before attachment leveling.Previously In small lot advanced development, make to be smoothed out with the fingers by pin by hand flat always, but flatness and concordance can not be guaranteed, and make PCBA welding quality reduces, and directly influences the debugging qualification rate in later stage.And along with yield constantly increases, people The yield of work operation also cannot meet Production requirement, the production capacity of whole product and quality and have too many difficulties to cope with.
Utility model content
Defect that the purpose of this utility model is contemplated to overcome above-mentioned prior art to exist and a kind of user is provided Just the Microstrip that, efficiency is high encapsulates patch capacitor apparatus for shaping.
The purpose of this utility model can be achieved through the following technical solutions: a kind of Microstrip encapsulation paster electricity Hold apparatus for shaping, smooth, including under shaping upper, molding for the pin making Microstrip encapsulation patch capacitor Mould, described molding lower mold has the first hopper for placing Microstrip encapsulation patch capacitor and the second material Groove, described shaping upper is provided with the convex surface being mutually matched with described pin, when shaping upper and molding lower mold When being laminated, described convex surface, to pin effect, makes pin smooth.
The first described hopper and the width of the second hopper are 4mm ± 0.5mm.
The first described hopper and the degree of depth of the second hopper are 3mm ± 0.5mm.
The first described hopper and the second hopper are parallel to each other.
The first described hopper side is provided with the first pin for padded pin being parallel to each other with it and supports platform.
The second described hopper side is provided with the second pin for padded pin being parallel to each other with it and supports platform.
It is 8mm ± 0.1mm that the first described pin supports the height of platform.
It is 8mm ± 0.1mm that the second described pin supports the height of platform.
Described shaping upper is that stone synthesizes the shaping upper of one-tenth made of stones without fibre.
Described molding lower mold is that stone synthesizes the molding lower mold of one-tenth made of stones without fibre.
Compared with prior art, this utility model has the advantage that
(1) make, by hand to single Microstrip electric capacity shaping, once to process one before using apparatus for shaping Electric capacity, yield is extremely low.After using apparatus for shaping, the most at most 20 electric capacity can be carried out shaping, greatly Increase production capacity, improve production efficiency;
(2) when making shaping by hand, capacitor pin flatness and concordance extreme difference, after being installed on PCB still There will be bump to float, radio frequency model is interfered.Use apparatus for shaping that pin surface can be made substantially flat, Pin and electric capacity body can arrive 90 ° of right angles, and it is qualified that planarization and concordance reach 100%;
(3) capacitor pin only has 0.1mm thick, and side can form the sharp edge of a knife, and producers are in offhand During easily hands is cut, and use apparatus for shaping employee can be avoided completely to come to harm, reach safety in production, The purpose of protection employee;
(4) material of shaping upper and molding lower mold uses stone to synthesize stone without fibre, has electrostatic-proof function, prevents Components and parts interior keys plying is by electrostatic breakdown.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Figure is designated: 1 shaping upper, 2 molding lower molds, 3 first hoppers, 4 second hoppers, 5Microstrip Encapsulation patch capacitor, 6 pins, 7 first pin support platforms, 8 second pin support platforms.
Detailed description of the invention
With specific embodiment, this utility model is described in detail below in conjunction with the accompanying drawings.
Embodiment 1
As it is shown in figure 1, a kind of Microstrip encapsulates patch capacitor apparatus for shaping, it is used for making Microstrip encapsulate The pin 6 of patch capacitor 5 is smooth, including shaping upper 1, molding lower mold 2, molding lower mold 2 has for Place the first hopper 3 and the second hopper 4 of Microstrip encapsulation patch capacitor 5, the first hopper 3 and the second material Groove 4 is parallel to each other, and the width of the first hopper 3 and the second hopper 4 is 4mm, and the degree of depth is 3mm.First hopper 3 sides are provided with the first pin 6 for padded pin 6 being parallel to each other with it and support platform 7.Second hopper 4 one Side is provided with the second pin 6 for padded pin 6 being parallel to each other with it and supports platform 8.First pin 6 supports platform 7 and second pin 6 to support the height of platform 8 be 8mm.Shaping upper 1 is provided with and is mutually matched with pin 6 Convex surface, when shaping upper 1 is laminated with molding lower mold 2, pin 6 is acted on by convex surface, makes pin 6 flat Whole.Shaping upper 1 and molding lower mold 2 by stone without fibre synthesis made of stones become, there is electrostatic-proof function, prevent unit's device Part interior keys plying is by electrostatic breakdown.
During use, Microstrip is encapsulated patch capacitor 5 and puts in the first hopper 3 and the second hopper 4, each Can place 10 electric capacity in hopper, pin 6 is placed on the first pin support platform 7 accordingly and the second pin props up simultaneously On support platform 8, by 1 time pressure of shaping upper and fitting tightly with molding lower mold 2, now, pin 6 is in the pressure of convex surface It is shaped to plane under power, and makes Microstrip encapsulation patch capacitor body and pin 6 shape right angle in 90 °.
Embodiment 2
In the present embodiment, the width of the first hopper 3 and the second hopper 4 is 4.5mm, and the degree of depth is 3.5mm, first Pin 6 supports platform 7 and the second pin 6 to support the height of platform 8 be 8.1mm.Remaining is with embodiment 1.
Embodiment 3
In the present embodiment, the width of the first hopper 3 and the second hopper 4 is 3.5mm, and the degree of depth is 2.5mm, first Pin 6 supports platform 7 and the second pin 6 to support the height of platform 8 be 7.9mm.Remaining is with embodiment 1.

Claims (10)

1. Microstrip encapsulates a patch capacitor apparatus for shaping, is used for making Microstrip encapsulate patch capacitor (5) pin (6) is smooth, it is characterised in that include shaping upper (1), molding lower mold (2), described The first hopper (3) for placing Microstrip encapsulation patch capacitor (5) and the is had in molding lower mold (2) Two hoppers (4), described shaping upper (1) is provided with the convex surface being mutually matched with described pin (6), when When shaping upper (1) and molding lower mold (2) are laminated, pin (6) is acted on by described convex surface, makes to draw Foot (6) is smooth.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described the first hopper (3) and the width of the second hopper (4) they are 4mm ± 0.5mm.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described the first hopper (3) and the degree of depth of the second hopper (4) they are 3mm ± 0.5mm.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described the first hopper (3) and the second hopper (4) are parallel to each other.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described the first hopper (3) side is provided with the first pin for padded pin (6) being parallel to each other with it Support platform (7).
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described the second hopper (4) side is provided with the second pin for padded pin (6) being parallel to each other with it Support platform (8).
A kind of Microstrip the most according to claim 5 encapsulates patch capacitor apparatus for shaping, and its feature exists In, it is 8mm ± 0.1mm that the first described pin supports the height of platform (7).
A kind of Microstrip the most according to claim 6 encapsulates patch capacitor apparatus for shaping, and its feature exists In, it is 8mm ± 0.1mm that the second described pin supports the height of platform (8).
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described shaping upper (1) is that stone synthesizes the shaping upper of one-tenth made of stones without fibre.
A kind of Microstrip the most according to claim 1 encapsulates patch capacitor apparatus for shaping, and its feature exists In, described molding lower mold (2) is that stone synthesizes the molding lower mold of one-tenth made of stones without fibre.
CN201620311774.0U 2016-04-14 2016-04-14 Microstrip encapsulates chip capacitor shaping device Active CN205584639U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620311774.0U CN205584639U (en) 2016-04-14 2016-04-14 Microstrip encapsulates chip capacitor shaping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620311774.0U CN205584639U (en) 2016-04-14 2016-04-14 Microstrip encapsulates chip capacitor shaping device

Publications (1)

Publication Number Publication Date
CN205584639U true CN205584639U (en) 2016-09-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111014508A (en) * 2019-11-26 2020-04-17 山东航天电子技术研究所 Process method and device for shaping lead of axial electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111014508A (en) * 2019-11-26 2020-04-17 山东航天电子技术研究所 Process method and device for shaping lead of axial electronic component

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