CN101667552A - Front open type silicon wafer box provided with limiting piece module of silicon wafer - Google Patents
Front open type silicon wafer box provided with limiting piece module of silicon wafer Download PDFInfo
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- CN101667552A CN101667552A CN200810215129A CN200810215129A CN101667552A CN 101667552 A CN101667552 A CN 101667552A CN 200810215129 A CN200810215129 A CN 200810215129A CN 200810215129 A CN200810215129 A CN 200810215129A CN 101667552 A CN101667552 A CN 101667552A
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Abstract
The invention discloses a front open type silicon wafer box, which mainly comprises a box body and a door body. The inside of the wafer box is provided with a plurality of slots for accommodating a plurality of silicon wafers, and one side surface of the box body is provided with an opening for inputting and outputting the plurality of silicon wafers; and the door body is provided with an outer surface and an inner surface, is combined with the opening of the box body through the inner surface and is used for protecting the plurality of silicon wafers in the box body. The front open type silicon wafer box is characterized in that a concave area is arranged in the inner surface of the door body to divide the inner surface into two convex platforms which are provided with a limiting piece module respectively.
Description
Technical field
The present invention relates to a kind of front open type silicon box, particularly on the protrusion platform about a kind of sunk area both sides that the silicon chip limited part is disposed at a body inner surface, except making silicon chip can fall into sunk area in the body with the size that shortens the front open type silicon box, also can firmly hold silicon chip, move to avoid silicon chip in transportation, to produce by the silicon chip limited part.
Background technology
Therefore semi-conductor silicon chip can be moved to different work stations owing to need the processing of the various different flow processs of process and need to cooperate process equipment.The carrying of silicon chip for convenience and avoid being subjected to external pollution, regular meeting utilizes an airtight container to carry for automation equipment.Please refer to shown in Figure 1ly, is the silicon box schematic diagram of prior art.This silicon box is a kind of front open type silicon box (Front Opening UnifiedPod; FOUP); have a box body 10 and a body 20; but box body 10 inside are provided with the ccontaining a plurality of silicon chips of a plurality of slot 11 levels; and have an opening 12 in a side of this box body 10 and can supply carrying and loading of silicon chip; and door body 20 has an outer surface 21 and an inner surface 22, and door body 20 is to combine with the opening 12 of box body 10 by inner surface 22, in order to a plurality of silicon chips of protection box body 10 inside.In addition, at least one bolt perforate 23 of configuration on the outer surface 21 of door body 20 is in order to open or sealing front open type silicon box.In above-mentioned front open type silicon box, because semi-conductor silicon chip is flatly to place box body 10 inside, therefore, in front open type silicon box handling process, a silicon chip limited part need be arranged, move because of opening 12 directions that vibrations produce dystopy or past box body 10 to avoid silicon chip.Please refer to shown in Figure 2ly, is door body 20 schematic diagrames of U.S. bulletin patent 6,736,268 disclosed a kind of front open type silicon box.As shown in Figure 2, the medial surface 22 of door body 20 disposes a sunk area 24, this sunk area 24 be the top 221 from medial surface 22 extend to bottom 222 and be about between two latch mechanisms 230 (in door body inside), and in sunk area 24, further dispose the silicon chip limiting piece module again, this silicon chip limiting piece module by about two silicon chip limited parts 100 formed, and on each silicon chip limited part 100, have a plurality of silicon chip contact heads 110, to utilize this silicon chip contact head 110 to hold its relative silicon chip, avoid silicon chip in transport process, to move because of the opening direction of vibrations dystopy or past box body.Yet, above-mentioned silicon chip limiting piece module is arranged among the sunk area 24 of a body 20 inner surfaces 22, this makes silicon chip only can develop a body 20 its inner surfaces 22 or only can fall into sunk area 24 a little, can't allow silicon chip fall into sunk area 24 to shorten the size of front open type silicon box anteroposterior diameter effectively.In addition, the particle dust that silicon chip limiting piece module and silicon chip friction are produced is accumulated in the sunk area 24 easily, on cleaning, need earlier the sunk area 24 of silicon chip limiting piece module with door body 20 inner surfaces 22 to be separated, so separation and assembling repeatedly causes getting loose of silicon chip limiting piece module easily.
Summary of the invention
Its silicon chip limited part of silicon box according to prior art causes problems such as the silicon box size can't be dwindled, particle dust cleans difficult and get loose easily, a main purpose of the present invention is to provide a kind of front open type silicon box with silicon chip limiting piece module, the silicon chip limiting piece module is disposed on the protrusion platform of sunk area both sides of a body inner surface, make the effective ccontaining silicon chip of sunk area energy, can shorten the size of front open type silicon box anteroposterior diameter.
A main purpose more of the present invention is to provide a kind of front open type silicon box with silicon chip limiting piece module, the silicon chip limiting piece module is disposed on the protrusion platform of sunk area both sides of a body inner surface, so silicon chip is shortened by the distance that the silicon chip limiting piece module holds playback, the closure that can be smooth-going except feasible door, can also reduce silicon chip and in the playback process, produce particulate (particle).
Another main purpose of the present invention is to provide a kind of front open type silicon box with silicon chip limiting piece module, the silicon chip limiting piece module is disposed on the protrusion platform of sunk area both sides of a body inner surface, therefore, the particle dust that silicon chip limited part and silicon chip friction are produced can be gathered in the sunk area corner, and when wanting the clean silicon film magazine, can easily particle dust be removed, not need the silicon chip limiting piece module is removed.
For reaching above-mentioned projects; the present invention discloses a kind of front open type silicon box; mainly comprise a box body; box body inside is provided with a plurality of slots with ccontaining a plurality of silicon chips; and forming an opening in a side of box body can be for the input and the output of a plurality of silicon chips; and body; have an outer surface and an inner surface; the door body combines with the opening of box body with inner surface; a plurality of silicon chips in order to protection box body inside; wherein the front open type silicon box is characterised in that: configuration one sunk area in the inner surface of door body, and this inner surface be divided into two protrusion platforms and on two protrusion platforms, respectively dispose a limiting piece module.
Description of drawings
Fig. 1 is the schematic diagram of existing a kind of front open type silicon box;
Fig. 2 is the door body schematic diagram of existing a kind of front open type silicon box;
Fig. 3 is the schematic diagram of a kind of front open type silicon box of the present invention;
Fig. 4 is the schematic diagram of a kind of its silicon chip limiting piece module of front open type silicon box of the present invention;
Fig. 5 is that its silicon chip limiting piece module of a kind of front open type silicon box of the present invention is fixed in the schematic diagram on the body; And
Fig. 6 is the schematic diagram that its silicon chip limiting piece module of a kind of front open type silicon box of the present invention contacts with silicon chip.
[primary clustering symbol description]
10 box bodys
11 slots
12 openings
20 bodies
21 outer surfaces
22 inner surfaces
24 sunk areas
25 protrude platform
30 limiting piece modules
31 limited parts
311 base portions
313 support arms
315 withstanding parts
317 guide grooves
Embodiment
For technology contents, goal of the invention that the present invention is used and the effect reached thereof have more complete and clearly disclose,, and see also the diagram and the figure number of being taken off now in describing in detail down:
At first, seeing also shown in Figure 3ly, is the schematic diagram of a kind of front open type silicon box of the present invention.This silicon box is a kind of front open type silicon box, mainly be to comprise a box body 10 and a body 20, in the inside of box body 10 is to be provided with a plurality of slots 11 with ccontaining a plurality of silicon chips, and have an opening 12 that the input and the output of silicon chip can be provided in one of them side of box body 10, door body 20 then is to have an outer surface 21 and an inner surface 22.Middle approximately place then disposes a sunk area 24 at the inner surface 22 of door body 20, so sunk area 24 can be divided into the inner surface 22 of door body 20 two protrusion platforms 25.Owing to do not dispose other assembly in the sunk area 24,, that is to say that the part of silicon chip can stretch in the sunk area 24 so it can be used to take in a plurality of silicon chips of box body 10 inside; Therefore, by the design of this sunk area 24, can reduce the size of whole silicon wafer box.And for can be effectively fixing silicon chip, the present invention is protruded on the platform 25 at two of door body 20 and is respectively disposed a silicon chip limiting piece module 30, make in the process that a body 20 closes, each silicon chip in the box body 10 can be pushed into fixed position and fixing, its advantage, except limiting silicon chip toward opening direction moves, also can be used to control the amount that silicon chip enters sunk area 24.In addition, protrude in the platform 25, all dispose a door latch apparatus (not being shown among the figure), and each door latch apparatus forms the bolt perforate on respective outer surfaces 21 of the present invention two.
The length of sunk area 24 that is arranged in the inner surface 22 of a body 20 is relevant with slot 11 spacings and the silicon chip quantity of box body 10 inside.With 12 o'clock or 18 o'clock silicon chip, for the spacing between the silicon chip, existing standard code between industry in the hope of reaching maximum silicon chip carrying density, can be held robotic arm simultaneously and stretch into and carry out silicon chip input and output; And at present common silicon box approximately can ccontaining 25 silicon chips, and therefore, the length of sunk area 24 is fixed.Yet the width of sunk area 24 of the present invention and the degree of depth can be more flexible, when the thickness of door body 20 remains unchanged, with the degree of depth of sunk area 24 establish bigger, then can allow silicon chip to enter sunk area 24, and this moment sunk area 24 width also need to increase thereupon.
Secondly, seeing also Fig. 4 and shown in Figure 5, is its silicon chip limiting piece module of a kind of front open type silicon box of the present invention and the schematic diagram that is fixed in a body thereof.Silicon chip limiting piece module 30 of the present invention is arranged institute by a plurality of limited parts 31 and is formed and can fix on protrusion platform 25, each limited part 31 then can align with another limited part 31 that protrudes each the silicon chip product module 30 on the platform 25, so that each corresponding limited part 31 can contact with a silicon chip, in transportation, move toward opening direction with the silicon chip that limits box body 10 inside.In addition, limited part 31 of the present invention is formed with a support arm 313 that is connected with base portion 311 1 ends and bends to sunk area 24 directions by a base portion 311, and on the free end of support arm 313, form a reclinate withstanding part 315 again, contact with silicon chip by these withstanding parts 315.In a preferred embodiment of the present invention, the formed angles of 313 of base portion 311 and support arms bending are acute angle, and its angle can be configured in according to silicon chip limiting piece module 30 to be protruded the position on the platform 25 and decide, and for example: angle is about the 10-60 degree.In addition, in another preferred embodiment of the present invention, can further form the guide groove 317 of approximate " V " type on the withstanding part 315 so that silicon chip with the withstanding part 315 of limited part 31 when contacting, can be fed in the guide groove 317, to avoid moving up and down of silicon chip very smooth-goingly.In addition, for silicon chip can be fed in the guide groove 317 very smooth-goingly, the medial surface of this approximate " V " type forms a level and smooth or surface of arc, and can coat a kind of wear-resisting consumptive material on the surface of guide groove 317 its contact silicon chips, for example: the PEEK material, to reduce friction to silicon chip.
In addition, in another embodiment of the present invention, silicon chip limiting piece module 30 can be to adopt integrated manufacture to form, for example: the base portion 311 of silicon chip limiting piece module 30 is joined together to form a common base portion (not being shown among the figure), and allows a plurality of support arms 313 arrange at interval.Then, fix with protrusion platform 25 by the common base portion that connects together.Owing to the silicon chip product module on the protrusion platform 25 30 can be alignd with another silicon chip product module of protruding on platform 25 30, so being positioned at the limited part 31 that protrudes platform 25 both sides just can aim at, so can contact with each sheet silicon chip, in transportation, move toward opening direction with silicon chip in the restriction box body 10.Clearly, the bending angle between each support arm 313 in the silicon chip product module 30 in the present embodiment and common base portion can be between the 10-60 degree.In addition, silicon chip limiting piece module 30 in the present embodiment can be made up of a kind of material, for example: high molecule plastic; Or further make by two kinds of different materials, for example: base portion 311 and support arm 313 are made with high molecule plastic, then formed at withstanding part 315, for example: polyether-ether-ketone (polyetheretherketone, plastics PEEK) with another kind of material.At above-mentioned high molecule plastic can be following material then: comprise polynary carbonic ether (PC), acrylonitrilebutadienestryrene (acrylonitrile butadienestyrene, ABS), polypropylene (PP), polyethylene (PE) and cross Fluoroalkyloxy (perfluoroalkoxy, PFA) etc.Then, please refer to Fig. 6, is the schematic diagram that its silicon chip limiting piece module of a kind of front open type silicon box of the present invention contacts with silicon chip.Because the silicon chip limiting piece module 30 that protrude on the platform 25 sunk area 24 both sides is symmetrical, therefore, when silicon chip limiting piece module 30 contact with silicon chip, can produce that an only past silicon chip central point direction pushes away with joint efforts, can not cause rocking about silicon chip.And, owing to do not dispose other assembly in the sunk area 24, so the part of silicon chip can stretch in the sunk area 24; Therefore, by the design of this sunk area 24, can reduce the anteroposterior diameter size of whole silicon wafer box, and its center of gravity of front open type silicon box can be very near the heart among the whole front open type silicon box, so in the process of mechanical arm carrying front open type silicon box, be difficult for producing.In addition, the present invention also can control the distance that silicon chip enters sunk area 24 by base portion 311 and 313 formed angles of bending of support arm, and therefore the size of silicon box of the present invention can be done fine setting.Again because silicon chip limiting piece module 30 of the present invention is to be disposed on the protrusion platform 25 of sunk area 24 both sides of inner surface 22 of a body 20, so silicon chip is shortened by the distance that silicon chip limiting piece module 30 holds playback, except make the door can be smooth-going closure, can also reduce the particulate (particle) that is produced in the silicon chip playback process.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; anyly have the knack of alike skill person; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, therefore scope of patent protection of the present invention must be looked the appended claim person of defining of this specification and is as the criterion.
Claims (14)
1; a kind of front open type silicon box that disposes the silicon chip limiting piece module; mainly comprise a box body; this box body inside is provided with a plurality of slots with ccontaining a plurality of silicon chips; and forming an opening in a side of this box body can be for the input and the output of these a plurality of silicon chips; and body; have an outer surface and an inner surface; this body combines with this opening of this box body with this inner surface; and it is characterized in that in order to these a plurality of silicon chips of protecting this box body inside: configuration one sunk area is to be divided into this inner surface on two protrusion platforms and two to protrude each affixed limiting piece module on platform in this in this inner surface of this body of described front open type silicon box; this limiting piece module on each this protrusion platform is arranged institute by a plurality of limited parts and is formed; and each this limited part aligns with the limited part that another protrudes in the limiting piece module on platform; wherein each this limited part has that a base portion and is connected with an end of this base portion and to the support arm of this sunk area bending and on the free end of this support arm; form a reclinate withstanding part again, contact with those silicon chips by those withstanding parts.
2, front open type silicon box as claimed in claim 1 is characterized in that: the guide barrel construction that further forms an approximate V-arrangement on each this withstanding part.
3, front open type silicon box as claimed in claim 1 is characterized in that: each this limiting piece module is integrally formed structure.
4, front open type silicon box as claimed in claim 1 is characterized in that: the surface in the zone that this withstanding part contacts with silicon chip coats a wear-resisting consumptive material.
5, front open type silicon box as claimed in claim 1 is characterized in that: this withstanding part is a wear-resisting consumptive material.
6, front open type silicon box as claimed in claim 1 is characterized in that: form an acute angle between this base portion and this support arm.
7, front open type silicon box as claimed in claim 1 is characterized in that: all dispose a door latch apparatus in this two protrusions platform.
8; a kind of front open type silicon box that disposes the silicon chip limiting piece module; comprise a box body; this box body inside is provided with a plurality of slots with ccontaining a plurality of silicon chips; and forming an opening in a side of this box body can be for the input and the output of these a plurality of silicon chips; and body; have an outer surface and an inner surface; this body is to combine with this opening of this box body with this inner surface; and in order to protect these a plurality of silicon chips of this box body inside; it is characterized in that: in this inner surface of this body of this front open type silicon box, dispose a sunk area this inner surface be divided into two protrusion platforms and on this two protrusions platform, respectively dispose a limiting piece module.
9, front open type silicon box as claimed in claim 8 is characterized in that: all dispose a door latch apparatus in this two protrusions platform.
10; a kind of front open type silicon box that disposes the silicon chip limiting piece module; comprise a box body; this box body inside is provided with a plurality of slots with ccontaining a plurality of silicon chips; and forming an opening in a side of this box body can be for the input and the output of these a plurality of silicon chips; and body; have an outer surface and an inner surface; this body is to combine with this opening of this box body with this inner surface; and in order to protect these a plurality of silicon chips of this box body inside; it is characterized in that: in this inner surface of this body of this front open type silicon box; dispose a sunk area this inner surface is divided into two protrusion platforms and each affixed limiting piece module on this two protrusions platform; this limiting piece module on each this protrusion platform is affixed with this protrusion platform and be connected a plurality of spaced support arms on this common base portion via a common base portion; wherein each this support arm is to this sunk area bending; and on the free end of this support arm; form a reclinate withstanding part again, contact with those silicon chips by those withstanding parts.
11, front open type silicon box as claimed in claim 10 is characterized in that: the guide barrel construction that further forms an approximate V-arrangement on each this withstanding part.
12, front open type silicon box as claimed in claim 10 is characterized in that: the region surface that this withstanding part contacts with silicon chip coats a wear-resisting consumptive material.
13, front open type silicon box as claimed in claim 13 is characterized in that: this withstanding part is a wear-resisting consumptive material.
14, front open type silicon box as claimed in claim 10 is characterized in that: all dispose a door latch apparatus in this two protrusions platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102151299A CN101667552B (en) | 2008-09-01 | 2008-09-01 | Front open type silicon wafer box provided with limiting piece module of silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102151299A CN101667552B (en) | 2008-09-01 | 2008-09-01 | Front open type silicon wafer box provided with limiting piece module of silicon wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101667552A true CN101667552A (en) | 2010-03-10 |
| CN101667552B CN101667552B (en) | 2012-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008102151299A Active CN101667552B (en) | 2008-09-01 | 2008-09-01 | Front open type silicon wafer box provided with limiting piece module of silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI833637B (en) * | 2022-06-01 | 2024-02-21 | 家登精密工業股份有限公司 | Substrate retaining assembly and door device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6082540A (en) * | 1999-01-06 | 2000-07-04 | Fluoroware, Inc. | Cushion system for wafer carriers |
| JP3193026B2 (en) * | 1999-11-25 | 2001-07-30 | 株式会社半導体先端テクノロジーズ | Load port system for substrate processing apparatus and substrate processing method |
| KR100909748B1 (en) * | 2001-11-14 | 2009-07-29 | 엔테그리스, 아이엔씨. | Wafer Enclosure Sealing Device for Wafer Container |
| US6951284B2 (en) * | 2001-11-14 | 2005-10-04 | Entegris, Inc. | Wafer carrier with wafer retaining system |
| US6644477B2 (en) * | 2002-02-26 | 2003-11-11 | Entegris, Inc. | Wafer container cushion system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI833637B (en) * | 2022-06-01 | 2024-02-21 | 家登精密工業股份有限公司 | Substrate retaining assembly and door device |
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| CN101667552B (en) | 2012-05-30 |
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