CN101667056A - Electronic device - Google Patents
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- CN101667056A CN101667056A CN200810215848A CN200810215848A CN101667056A CN 101667056 A CN101667056 A CN 101667056A CN 200810215848 A CN200810215848 A CN 200810215848A CN 200810215848 A CN200810215848 A CN 200810215848A CN 101667056 A CN101667056 A CN 101667056A
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Abstract
The invention discloses an electronic device which comprises a sealing shell, a heat conducting element and a fan, wherein the heat conducting element penetrates the sealing shell, and the fan is arranged in the sealing shell. The fan generates an air flow which flows in the sealing shell and flows through the heat conducting element. Air in the sealing shell is driven to flow by the fan arrangedin the sealing shell so as to conduct heat out of the shell through the heat conducting element which penetrates the sealing shell, thus local accumulation of the heat in the sealing shell can be avoided. Moreover, heat convection is also reinforced so as to improve the efficiency of heat exchange with outside cold air, thus the invention provides a more effective heat exchange mechanism which enables the electronic device with the sealing shell to operate more stably.
Description
Technical field
The present invention relates to a kind of electronic installation, and be particularly related to a kind of electronic installation with closure casing.
Background technology
Industrial computer (industrial computer) is meant not to be the computer that is used in general consumer or commercial purposes, owing to not only be applied to industrial circle, therefore the someone is referred to as the industry computer again.Along with the prosperity of 3C development with the Internet, the industrial computer industry is combining information, communication, consumer electronics, photoelectricity, semiconductor and software, enlarges its application continuously, also extends to the daily life from industrial application gradually.In addition, the environment for use of industrial computer product is relatively poor usually, so product often needs characteristics such as anti-high temperature, low temperature resistant, good heat dissipation, dustproof, waterproof.
Because it is higher that industrial computer reaches waterproof requirement for preventing dust, so the air vent of housing is less also less.Even housing do not open the hole, enters internal body to avoid dust or aqueous vapor, so the enclosure interior heat is not easy to discharge.Generally speaking, computer is in order to reach the dustproof and waterproof requirement, the design of housing certainly with number of through-holes more less and clear size of opening more little be good.The dustproof and waterproof standard adds that with IP two digits indicates it usually, and for example: the first digit of IP65 " 6 " expression prevents that fully dust from entering, the no any injury of second digit " 5 " expression water flushing.With the dustproof and waterproof standard of IP65, closure casing is preferred case design scheme.But closure casing also causes dispelling the heat bad and rising enclosure interior temperature easily, and then causes the total system instability.
Moreover, the inner member because industrial computer seldom expands or upgrades, thus also comparatively tight in the design of the inner member of industrial computer, to make full use of the enclosure interior space.Therefore, the heats that internal electronic element produced such as central processing unit, north bridge chips, internal memory and hard disk accumulate on enclosure interior easily.And because the inner space is comparatively crowded, the air current flow space is little, and therefore inner thermal convection is not obvious, is easy to generate the excessive situation of amount of localized heat accumulation.Accumulation of heat is many more, the easy more System Operation instability that allows, even crash.
The traditional industry computer does not use fan, makes passive heat radiation by surface of shell merely.Perhaps, main pyrotoxin can constitute heat exchanger by heat pipe and fin, runs through system and carries out the dustproof and waterproof measure, and fan is isolated in the system outside, and heat exchanger is dispelled the heat.
See also Fig. 1, Figure 1 shows that synoptic diagram according to the industrial computer 1 of prior art.As shown in Figure 1, the main heater element of industrial computer 1, for example: central processing unit 13 and north bridge chips 15, can derive heat by the heat pipe 14 that attaches thereon.Heat pipe 14 is derived heat outside the closure casing 10, and carries out heat interchange with cool exterior air.Thus, electronic component such as central processing unit 13 and north bridge chips 15 just can reach the effect of heat radiation.
But such design still has shortcoming, because the heater element in the industrial computer not only central processing unit and north bridge chips though other element the degree of heat are lower, are accumulated for a long time, still can increase the temperature of enclosure interior.It is the most direct practice that each heater element all is provided with a heat conducting element, but does not meet economic benefit.
Therefore, (for example: industrial computer), how providing a kind of preferred heat conduction design, is the problem to be solved in the present invention having the electronic installation of closure casing.
Summary of the invention
The object of the present invention is to provide a kind of electronic installation, this electronic installation has closure casing and can discharge the enclosure interior heat effectively, to reduce internal temperature.
According to a specific embodiment, electronic installation of the present invention comprises closure casing, first heat conducting element and first fan.First heat conducting element penetrates this closure casing, and first fan is arranged in this closure casing.This first fan produces one first air-flow, and this first air-flow flows and this first heat conducting element of flowing through in this closure casing.
This first heat conducting element comprises one first heat-conducting part and one second heat-conducting part, and this first heat-conducting part is arranged in this closure casing, and this second heat-conducting part is arranged at outside this closure casing.This first fan is adjacent to this first heat-conducting part, and this first air-flow that causes this first fan to be produced can directly blow to this first heat-conducting part.
Electronic installation further comprises one second fan, and this second fan is positioned at outside this closure casing and is adjacent to this second heat-conducting part, and this second fan produces one second air-flow with this second heat-conducting part of flowing through.
In addition, electronic installation further comprises one second heat conducting element, this second heat conducting element penetrates this closure casing, this second heat conducting element comprises one the 3rd heat-conducting part and one the 4th heat-conducting part, the 3rd heat-conducting part is positioned at this closure casing and contacts an electronic component of this electronic installation, and the 4th heat-conducting part is positioned at outside this closure casing.This electronic component can be central processing unit, north bridge chips, South Bridge chip and internal memory.This second airflow passes the 4th heat-conducting part that this second fan is produced.
In sum, the present invention drives the air flow of enclosure by being arranged at fan in the closure casing, and then by the heat conducting element that penetrates closure casing heat is derived outside.Therefore, can avoid the localized accumulated of enclosure heat, also strengthen thermal convection with the efficient of enhancement with the cool exterior air heat interchange.Therefore, the invention provides more effective heat exchange mechanism, the electronic installation with closure casing can more stably be moved.
Can be further understood by the following detailed description and accompanying drawings about the advantages and spirit of the present invention.
Description of drawings
Figure 1 shows that synoptic diagram according to the industrial computer of prior art.
Figure 2 shows that the synoptic diagram of the industrial computer of first specific embodiment according to the present invention.
Figure 3 shows that the synoptic diagram of the industrial computer of second specific embodiment according to the present invention.
Figure 4 shows that the synoptic diagram of the industrial computer of the 3rd specific embodiment according to the present invention.
Embodiment
Generally speaking, industrial computer that electronic installation with closure casing is dustproof and waterproof requirement is higher and inserted computer etc., international degree of protection standard (International Protection Code, IP Code) is the International Electrotechnical Commi (International Electrotechnical Commission, IEC) the dustproof and classification of waterproof specification of the electronic installation of Zhi Dinging.IP Code back first figure place is represented dustproof grade, and second order digit is then represented classification of waterproof, and numeral is big more, and degree of protection is high more.The closure casing of the embodiment of the invention is defined as and makes the electronic installation degree of protection is the above closure casing of IP45.Below in the explanation, electronic installation of the present invention will be example with the industrial computer.
See also Fig. 2, Figure 2 shows that the synoptic diagram of the industrial computer 3 of first specific embodiment according to the present invention.As shown in Figure 2, industrial computer 3 comprises closure casing 30, first heat conducting element 32, second heat conducting element 34 and first fan 36.The internal heat convection efficiency that the 36 main effects of first fan are improvement closure casings 30 allows the less electronic component of thermal value take away heat by cross-ventilation, and then is directed to outside the closure casing 30 by the heat of first heat conducting element 32 with internal gas flow.The 34 main effects of second heat conducting element are heat transfer efficiencies of strengthening the higher electronic component of thermal value, by conduction of heat, most heat are directed to outside the closure casing 30.
As shown in Figure 2, first fan 36 is arranged in the closure casing 30, and first heat conducting element 32 penetrates the side 300 of closure casing 30.First heat conducting element 32 comprises first heat-conducting part 320 and second heat-conducting part, 322, the first heat-conducting parts 320 are arranged in the closure casing 30, and second heat-conducting part 322 is arranged at outside the closure casing 30.First fan 36 is adjacent to first heat-conducting part 320, and the internal gas flow (shown in the dotted arrow) that causes first fan 36 to be produced can directly blow to first heat-conducting part 320.
First heat conducting element 32 can be heat pipe, because the characteristic of heat pipe, the heat of first heat-conducting part 320 can be directed to second heat-conducting part 322 fast.First heat conducting element 32 is roughly as follows with the flow process that the internal heat guiding is distributed to extraneous air.At first, internal gas flow can carry out heat interchange with first heat-conducting part 320; Then, heat conducts to second heat-conducting part 322 from first heat-conducting part 320; At last, second heat-conducting part 322 and cool exterior air heat interchange.In addition, second heat-conducting part 322 can comprise first fin, 3220, the first fins 3220 in addition can increase heat exchange area, and then increases the radiating efficiency of second heat-conducting part 322.
For the air-flow of closure casing 30 internal flows, because the temperature of first heat-conducting part 320 can be lower than closure casing 30 temperature inside, therefore near the gas first heat-conducting part 320 can carry out heat interchange with first heat-conducting part 320, thereby reduced gas temperature, that is taken away the heat that thermal convection brings.Gas backstreaming after the cooling is carried out heat interchange once again behind heat-generating electronic elements.Thus, internal gas flow (shown in the dotted arrow) just can repeatedly be guided the effect of heat to the first heat conducting element 32.
Moreover as shown in Figure 2, side 300, the second heat conducting elements 34 that second heat conducting element 34 of industrial computer 3 penetrates closure casing 30 comprise the 3rd heat-conducting part 340 and the 4th heat-conducting part 342.The 4th heat-conducting part 342 is positioned at outside the closure casing 30, and the 3rd heat-conducting part 340 is positioned at closure casing 30 and contacts the central processing unit 33 and the north bridge chips 35 of industrial computer 3, also can contact the bigger electronic component of South Bridge chip and internal memory and so on thermal value in addition.
The 3rd heat-conducting part 340 contacts with the tight of central processing unit 33, can directly heat be directed to the 4th heat-conducting part 342, and then carries out heat interchange by the 4th heat-conducting part 342 with cool exterior air.Generally speaking, second heat conducting element 34 can be a heat pipe, and the 4th heat-conducting part 342 can comprise second fin, 3420, the second fins in addition and can increase heat exchange area, and then increases the radiating efficiency of the 4th heat-conducting part 342.
As shown in Figure 2, industrial computer 3 further comprises second fan 38, and it is outer and be adjacent to second heat-conducting part 322 to be positioned at closure casing 30.Second fan 38 produces outer gas streams (shown in the dotted line), outer gas stream flow through second heat-conducting part 322 and the 4th heat-conducting part 342.The purpose that second fan 38 is set is to strengthen the heat exchanger effectiveness of second heat-conducting part 322 and the 4th heat-conducting part 342 and cool exterior air.If second fan 38 is not set, then second heat-conducting part 322 outside closure casing 30 and the interval between the 4th heat-conducting part 342 need increase, avoid the space of accumulation of heat between second heat-conducting part 322 and the 4th heat-conducting part 342, enough low to guarantee near the air themperature the heat conducting element.
Other is noted that, because industrial computer has relatively high expectations for dustproof and waterproof, so heat conducting element penetrates the closure casing part and do not have the slit.Yet the closure casing 30 shown in Fig. 2 does not comprise external shell 31, and external shell 31 has a plurality of through holes.The existence of through hole is can flow out in external shell 31 for the outer gas stream (shown in the dotted line) that allows second fan 38 be produced.
Except the above embodiments, industrial computer of the present invention also has other modification, as shown in Figures 3 and 4.See also Fig. 3, Figure 3 shows that the synoptic diagram of the industrial computer 5 of second specific embodiment according to the present invention.Compare with Fig. 2, it is other that first fan 56 of industrial computer 5 shown in Figure 3 is not positioned at first heat-conducting part 520, and it is other to be positioned at CD-ROM drive shown in Figure 3 570.Certainly, first fan 56 also can be positioned at other electronic components (for example hard disk 572 and power supply unit 574) side.Compared to Figure 1, the setting of first fan 56 among Fig. 3 more can increase near the flowability of air-flow the electronic component that is not coated with heat conducting element.Certainly, the setting of first fan 56 of Fig. 2 does not conflict with being provided with mutually of first fan 36 of Fig. 3, can exist simultaneously to strengthen the thermal convection effect.
See also Fig. 4, Figure 4 shows that the synoptic diagram of the industrial computer 7 of the 3rd specific embodiment according to the present invention.Compare with Fig. 2 or Fig. 3, first heat conducting element 72 of industrial computer 7 shown in Figure 4 is not a heat pipe, but a plurality of fin.Described a plurality of fin reaches inwardly from the side 700 of housing 70 and extends outwardly, and therefore first fan 76 and second fan 78 directly blow to described a plurality of fin respectively, carry out the effect of heat conduction and heat radiation.
Except by the mechanism design of mentioning in the above-mentioned explanation (fan and heat conducting element), also can in the mechanism of industrial computer, install a temperature sensor, and on circuit, increase a temperature-control circuit newly.Thus, first fan and second fan can start or change rotating speed according to the different temperatures situation.For example: when the temperature of enclosure is low, first fan and second fan can be closed or reduce rotating speed; When internal temperature is higher, can or increase rotating speed with first fan and the unlatching of second fan.Temperature controlled design can average out between energy resource consumption and heat radiation function.
Compared with prior art, the present invention drives the air flow of enclosure by being arranged at fan in the closure casing, and then by the heat conducting element that penetrates closure casing heat is derived outside.Therefore, can avoid the localized accumulated of enclosure heat, also strengthen thermal convection with the efficient of enhancement with the cool exterior air heat interchange.Therefore, the invention provides more effective heat exchange mechanism, the electronic installation with closure casing can more stably be moved.
By the detailed description of above preferred specific embodiment, hope can be known description feature of the present invention and spirit more, and is not to come category of the present invention is limited with above-mentioned disclosed preferred specific embodiment.On the contrary, its objective is that hope can be contained various changes in the category of claims of the present invention and equivalence is provided with.Therefore, the category of claims of the present invention should be done the broadest explanation according to above-mentioned explanation, contains all possible change and equivalence setting to cause it.
Claims (12)
1. an electronic installation is characterized in that, above-mentioned electronic installation comprises:
Closure casing;
First heat conducting element penetrates above-mentioned closure casing; And
First fan is arranged in the above-mentioned closure casing, and above-mentioned first fan produces first air-flow, and above-mentioned first air-flow flows and above-mentioned first heat conducting element of flowing through in above-mentioned closure casing.
2. electronic installation according to claim 1 is characterized in that, above-mentioned first heat conducting element comprises first heat-conducting part and second heat-conducting part, and above-mentioned first heat-conducting part is arranged in the above-mentioned closure casing, and above-mentioned second heat-conducting part is arranged at outside the above-mentioned closure casing.
3. electronic installation according to claim 2 is characterized in that, above-mentioned first fan is adjacent to above-mentioned first heat-conducting part, and above-mentioned first air-flow that causes above-mentioned first fan to be produced directly blows to above-mentioned first heat-conducting part.
4. electronic installation according to claim 2, it is characterized in that, above-mentioned electronic installation further comprises second fan, and this second fan is positioned at outside the above-mentioned closure casing and is adjacent to above-mentioned second heat-conducting part, and above-mentioned second fan produces second air-flow with above-mentioned second heat-conducting part of flowing through.
5. electronic installation according to claim 4, it is characterized in that, above-mentioned electronic installation further comprises second heat conducting element, this second heat conducting element penetrates above-mentioned closure casing, above-mentioned second heat conducting element comprises the 3rd heat-conducting part and the 4th heat-conducting part, above-mentioned the 3rd heat-conducting part is positioned at above-mentioned closure casing and contacts the electronic component of above-mentioned electronic installation, and above-mentioned the 4th heat-conducting part is positioned at outside the above-mentioned closure casing.
6. electronic installation according to claim 5 is characterized in that, above-mentioned electronic component is central processing unit, north bridge chips or South Bridge chip.
7. electronic installation according to claim 5 is characterized in that, above-mentioned the 4th heat-conducting part of above-mentioned second airflow passes that above-mentioned second fan is produced.
8. electronic installation according to claim 2 is characterized in that, above-mentioned first heat-conducting part comprises fin.
9. electronic installation according to claim 2 is characterized in that, above-mentioned first heat-conducting part is suspended in the above-mentioned closure casing.
10. electronic installation according to claim 1 is characterized in that, above-mentioned first heat conducting element comprises heat pipe.
11. electronic installation according to claim 1 is characterized in that, above-mentioned first heat conducting element comprises fin.
12. electronic installation according to claim 1 is characterized in that, it is more than the IP45 that above-mentioned closure casing makes the degree of protection of above-mentioned electronic installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810215848A CN101667056A (en) | 2008-09-05 | 2008-09-05 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810215848A CN101667056A (en) | 2008-09-05 | 2008-09-05 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101667056A true CN101667056A (en) | 2010-03-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810215848A Pending CN101667056A (en) | 2008-09-05 | 2008-09-05 | Electronic device |
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| Country | Link |
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| CN (1) | CN101667056A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056465A (en) * | 2009-10-29 | 2011-05-11 | Abb股份公司 | Electric installation device with at least one electric component which generates heat |
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2008
- 2008-09-05 CN CN200810215848A patent/CN101667056A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056465A (en) * | 2009-10-29 | 2011-05-11 | Abb股份公司 | Electric installation device with at least one electric component which generates heat |
| CN102056465B (en) * | 2009-10-29 | 2015-03-25 | Abb股份公司 | Electric installation device with at least one electric component which generates heat |
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Open date: 20100310 |