CN101666973A - 晶圆级压印方法 - Google Patents

晶圆级压印方法 Download PDF

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Publication number
CN101666973A
CN101666973A CN200810304348A CN200810304348A CN101666973A CN 101666973 A CN101666973 A CN 101666973A CN 200810304348 A CN200810304348 A CN 200810304348A CN 200810304348 A CN200810304348 A CN 200810304348A CN 101666973 A CN101666973 A CN 101666973A
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wafer
substrate
stamping method
board
imprinting area
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CN200810304348A
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English (en)
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李汉隆
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200810304348A priority Critical patent/CN101666973A/zh
Priority to US12/424,822 priority patent/US7988889B2/en
Publication of CN101666973A publication Critical patent/CN101666973A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3697—Moulds for making articles of definite length, i.e. discrete articles comprising rollers or belts cooperating with non-rotating mould parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B29C43/06—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds continuously movable in one direction, e.g. mounted on chains, belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/808—Lens mold

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本发明提供一种晶圆级压印方法，其包括以下步骤：(1)待压印的基板置于机台，该基板上具有第一压印区域，第二压印区域……第N压印区域，N为自然数；(2)涂布装置和该机台相对移动以使该涂布装置对准一待处理的压印区域，应用该涂布装置在该压印区域涂布压印材料；(3)使用滚轮压印该压印材料，该滚轮具有一中心和围绕该中心的外表面，若干压印模仁设于该外表面，固化该压印材料；(4)重复步骤(2)(3)，直至该待压印的基板的第N压印区域压印完毕。

Description

晶圆级压印方法
技术领域
本发明涉及一种晶圆级(wafer level)的压印方法。
背景技术
目前，轻薄短小化的消费性电子产品越来越受到人们的青睐，低线宽的光电结构的制造方法成为研究人员的研究课题。
受半导体制程的启发，研究人员将光学结构、光电结构等也在半导体晶圆上进行加工，由此产生晶圆级加工方法以及对应的各种晶圆级(wafer level)的产品。
一种晶圆级加工方法是采用黄光蚀刻法，但黄光蚀刻法需要根据周遭环境精确控制蚀刻参数，需要调整的参数过多，因此该法的稳定性不足，而且蚀刻技术在晶圆上加工出的微结构的线宽很难更低，已经不能进一步满足人们对“小型化”的要求。
发明内容
有鉴于此，有必要提供一种稳定性好的晶圆级压印方法。
一种晶圆级压印方法，其包括以下步骤：(1)待压印的基板置于机台，该基板上具有第一压印区域，第二压印区域……第N压印区域，N为自然数；(2)涂布装置和该机台相对移动以使该涂布装置对准一待处理的压印区域，应用该涂布装置在该压印区域涂布压印材料；(3)使用滚轮压印该压印材料，该滚轮具有一中心和围绕该中心的外表面，若干压印模仁设于该外表面，固化该压印材料；(4)重复步骤(2)(3)，直至该待压印的基板的第N压印区域压印完毕。
与现有技术相比，本发明提供的晶圆级压印方法是利用压印模仁和承载有待压印基板的机台之间的精确的相对移动进行压印作业，和采用化学方法不同，此方法不需要考虑外界环境参数，稳定性高。
附图说明
图1是本发明实施例提供的晶圆级压印方法的准备状态示意图。
图2是本发明实施例提供的晶圆级压印方法的涂布状态示意图。
图3是本发明实施例提供的晶圆级压印方法的压印状态示意图。
图4是本发明实施例提供的晶圆级压印方法的涂布状态示意图。
具体实施方式
下面将结合附图对本发明作进一步详细说明。
请参阅图1，本发明实施例提供的晶圆级压印方法首先提供一待压印的基板100和一机台20，该基板100具有一工作表面101，该工作表面101具有第一压印区域，第二压印区域……第N压印区域，N为自然数；机台20具有一表面201。该机台20可实现在一个平面内的精确平移。工作表面101的N个压印区域根据实际需要设计。
将该基板100固定于机台20的表面201。
一般地，如果基板100是一个透明的圆对称结构，为了将基板100准确而迅速地放置在机台20上，可在机台表面201设置一个定位点，也在基板100的工作表面101的中心上设置一定位点102，安放基板100时，将定位点102对准机台上的定位点即可。
定位点102可利用激光加工的方式或化学蚀刻的方式制作。
基板100可采用真空吸附法固定于该机台表面201；或者，在该机台表面201设置若干夹具，将该基板100夹持固定在该机台表面201。
请参阅图2，接着，本实施例提供一涂布头30和控制涂布头30移动的控制结构(图未示)。
将该涂布头30对准基板100上的第一压印区域并向该第一压印区域涂布压印材料。
优选地，若待压印区域的面积较大，则可对应设置多个涂布头30，以便一次性完成一个压印区域的涂布作业。
基板100固定之后，一种涂布方式是涂布头30精确移动并能上下移动涂布压印材料，机台20静止。第二种工作方式是机台20移动，其移动距离被精确控制，涂布头30上下移动进行涂布作业。
请参阅图3，本发明实施例提供一滚轮40，该滚轮40具有一中心和围绕该中心的外表面401，若干压印模仁301设于该外表面401。
压印模仁301的结构根据需要压印的图案或结构设计。外表面401可设置多个凹槽将压印模仁301嵌入，也可以直接在外表面401制作出压印模仁301。滚动该滚轮40使该若干压印模仁301逐一与第一压印区域对准并压印该压印材料，再根据压印材料性质的不同选择不同的固化装置固化该压印材料。
当该压印材料为热压印材料时，该固化装置为热固化装置，且热固化某个区域时不能影响其他不需要固化的区域。
当该压印材料为紫外光固化材料时，该固化装置为紫外光光源，例如是光纤紫外光光源，且该紫外光源照射面积设为一个压印区域的面积，以免影响其他不需要固化的区域。
该固化装置可设在机台20的上方，也可设置在机台20的下方。当一个紫外光源设置在机台20的下方时，机台20应该是采用紫外光可穿透的材料制成。
请参阅图4，接下来使涂布头30和该机台20相对移动，涂布头30对准第二压印区域，重复涂布、压印、固化的步骤直至该待压印的基板的第N区域压印完毕。
完成了压印的基板100既可以作为半成品进行进一步的加工、堆积、电器连接、封装等，也可以作为模仁去压印或制作与其结构相反的产品。此压印装置和压印方法不需要考虑外界环境参数，稳定性高。
另外，本领域技术人员还可以在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (6)

1.一种晶圆级压印方法，其包括以下步骤：
(1)待压印的基板置于机台，该基板上具有第一压印区域，第二压印区域……第N压印区域，N为自然数；
(2)涂布装置和该机台相对移动以使该涂布装置对准一待处理的压印区域，应用该涂布装置在该压印区域涂布压印材料；
(3)使用滚轮压印该压印材料，该滚轮具有一中心和围绕该中心的外表面，若干压印模仁设于该外表面，固化该压印材料；
(4)重复步骤(2)(3)，直至该待压印的基板的第N压印区域压印完毕。
2.如权利要求1所述的晶圆级压印方法，其特征在于：在进行步骤
(1)之前，在该待压印的基板和该机台上分别制作定位点，该定位点用于确定该待压印基板在该机台的位置。
3.如权利要求2所述的晶圆级压印方法，其特征在于：利用激光加工的方式制作定位点。
4.如权利要求2所述的晶圆级压印方法，其特征在于：利用化学蚀刻的方式制作定位点。
5.如权利要求1所述的晶圆级压印方法，其特征在于：该压印材料为热压印材料，该固化装置为热固化装置。
6.如权利要求1所述的晶圆级压印方法，其特征在于：该压印材料为紫外光固化材料，该固化装置为紫外光固化装置。
CN200810304348A 2008-09-03 2008-09-03 晶圆级压印方法 Pending CN101666973A (zh)

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Application Number Priority Date Filing Date Title
CN200810304348A CN101666973A (zh) 2008-09-03 2008-09-03 晶圆级压印方法
US12/424,822 US7988889B2 (en) 2008-09-03 2009-04-16 Mold for molding lenses and method for making the mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810304348A CN101666973A (zh) 2008-09-03 2008-09-03 晶圆级压印方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2369515T3 (es) * 2005-02-23 2011-12-01 Flooring Industries Ltd. Método para la fabricación de paneles de suelo, así como panel de suelo obtenido por medio de dicho método.

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* Cited by examiner, † Cited by third party
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US1143895A (en) * 1914-01-19 1915-06-22 William W Essick Mold for lens-mounting blocks.
US6799963B1 (en) * 2000-10-31 2004-10-05 Eastman Kodak Company Microlens array mold
CN101576713B (zh) * 2008-05-06 2012-10-10 鸿富锦精密工业（深圳）有限公司 非球面模仁的制造方法

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Application publication date: 20100310