CN101659843A - Formula of conductive adhesive with weldability and production process thereof - Google Patents
Formula of conductive adhesive with weldability and production process thereof Download PDFInfo
- Publication number
- CN101659843A CN101659843A CN 200810119061 CN200810119061A CN101659843A CN 101659843 A CN101659843 A CN 101659843A CN 200810119061 CN200810119061 CN 200810119061 CN 200810119061 A CN200810119061 A CN 200810119061A CN 101659843 A CN101659843 A CN 101659843A
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- Prior art keywords
- conductive adhesive
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- portions
- weldability
- conductive
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Abstract
The invention relates to a conductive adhesive. The formula of the conductive adhesive comprises the following components in portion by weight: (1) 100 portions of conductive metal powder (which can be gold, silver, copper, palladium, nickel and alloy thereof), (2) 5 to 30 portions of acrylate copolymer basic bonding agent, (3) 5 to 40 portions of solvent type adhesion promoter, (4) 5 to 10 portions of metal oxide material (titanium dioxide, aluminum oxide, nickel oxide and the like), and (5) 60 to 80 portions of organic solvent (aliphatic alcohol, ester of the aliphatic alcohol, terpene, acetic ester and the like). A process of the conductive adhesive comprises the following steps: firstly, preparing the components according to the formula; secondly, adding the raw material of the component (3) into the material (5), and mixing the two materials evenly to ensure that the material (3) is in netlike distribution in the material (5) to strengthen the bonding strength and action of the bonding agent to obtain an adhesive solution; and thirdly, adding the components (2), (1) and (4) into the adhesive solution in turn, and mixing and stirring the components evenly to obtain the finishedproduct of the conductive adhesive. The conductive adhesive has the following advantages of having good conductivity and weldability, and replacing a large number of consumptions of the gold, the silver and noble metals in the electronics industry.
Description
One, technical field
A kind of prescription and manufacturing process thereof with conductive resin of weldability belongs to the conductive thick-film resin technical field of compositions.
Two, technical background
In the hyundai electronics process industry, often need the thick membrane electrode by mode of printing manufacturing conduction and have the circuit or the element of weldability, therefore need come the substituted chemistry corrosion to make copper and even gold and silver matter with this electro-conductive adhesive with weldability be circuit card and the technology that can weld first device, to reduce manufacturing cost significantly, but common conducting electrode glue does not have weldability or weldability is relatively poor, can not satisfy the manufacturing needs of hyundai electronics, so background technology there is improved necessity.
Three, summary of the invention
1. goal of the invention
The present invention will invent a kind of electro-conductive adhesive with weldability, it not only has good electrical conductivity, simultaneously under welding temperature, have bonding strength and chemical stability preferably, product itself wants to have good mobility under the standard state, to satisfy the construction needs of printed circuit board (PCB) etc., its electroconductibility should be able to satisfy the needs of board circuit to guarantee the practicality in electronic industry.
2. technical problem to be solved by this invention
The present invention need solve the good problem of the circulation application property of product own, product keeps the problem of the stability of physics and chemistry under welding temperature, the application of product in circuit can be satisfied the problem of circuit electroconductibility etc., and the material technology cost is low simultaneously, and using value is just arranged.
3. designing technique measure
The present invention selects favorable conductive material and suitable basic tackiness agent for use, and collocation such as bonding agent solve above-mentioned problem to be solved, realizes the purpose of invention.
4. design technology project
A kind of prescription of the conductive resin with weldability and the technical field that method of manufacturing technology belongs to the thick film resin combination thereof is characterized in that its prescription (weight/part) is:
(1) 100 parts in conductive metal powder (can be gold and silver, copper, palladium, nickel and alloy thereof)
(2) the basic tackiness agent of acrylate copolymer is 6～30 parts
(3) the solvent-borne type adhesion promotor is 5～40 parts
(4) 5～10 parts of metal oxide materials (titanium dioxide, aluminium sesquioxide, nickel oxide etc.)
(5) 60～80 parts of organic solvents (fatty alcohol, this pure ester, terpenes, acetic ester etc.)
Technology
Earlier above-listed each component is got the raw materials ready in accordance with regulations, mix in raw material adding (5) number material with (3) component then, make (3) number material in (5) number material, present net distribution, so that strengthen the cohesive strength of tackiness agent and act on glue, again (2), (1), (4) are added the glue mixing and stirring successively, then conductive resin finished product of the present invention.
5. advantage of the present invention
Conductive resin of the present invention not only has good electrical conductivity, have weldability simultaneously and under welding temperature, have the stability of good physical machinery and chemistry, good flowability and impressionability with construction, reasonable recipe of the present invention, the product performance price is than high, at electricity produce the consumption that application can replace or save a large amount of gold and silver and precious metal in the industry.
Four, embodiment
Now invention is described further as follows by embodiment:
According to above-mentioned prescription along number getting the raw materials ready with 100 parts, 6 parts, 20 parts, 10 parts, 50 parts respectively, get final product by the technology finished product in top three then.
Claims (2)
1. the prescription of the conductive resin with weldability and the technical field that method of manufacturing technology belongs to the thick film resin combination thereof is characterized in that its prescription (weight/part) is:
(1) 100 parts in conductive metal powder (can be gold and silver, copper, palladium, nickel and alloy thereof)
(2) the basic tackiness agent of acrylate copolymer is 6～30 parts
(3) the solvent-borne type adhesion promotor is 5～40 parts
(4) 5～10 parts of metal oxide materials (titanium dioxide, aluminium sesquioxide, nickel oxide etc.)
(5) 60～80 parts of organic solvents (fatty alcohol, this pure ester, terpenes, acetic ester etc.).
2. a kind of prescription and the method for manufacturing technology thereof with conductive resin of weldability according to claim 1 is characterized in that technology is:
Earlier above-listed each component is got the raw materials ready in accordance with regulations, mix in raw material adding (5) number material with (3) component then, make (3) number material in (5) number material, present net distribution, so that strengthen the cohesive strength of tackiness agent and act on glue, again (2), (1), (4) are added the glue mixing and stirring successively, then conductive resin finished product of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810119061 CN101659843A (en) | 2008-08-28 | 2008-08-28 | Formula of conductive adhesive with weldability and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810119061 CN101659843A (en) | 2008-08-28 | 2008-08-28 | Formula of conductive adhesive with weldability and production process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101659843A true CN101659843A (en) | 2010-03-03 |
Family
ID=41788100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810119061 Pending CN101659843A (en) | 2008-08-28 | 2008-08-28 | Formula of conductive adhesive with weldability and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101659843A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103013400A (en) * | 2012-12-26 | 2013-04-03 | 天津市新森焊材有限公司 | Environment-friendly bonding agent |
| CN103632742A (en) * | 2012-08-22 | 2014-03-12 | 三星电机株式会社 | Conductive paste for internal electrodes, multilayer ceramic electronic component using the same, and method of manufacturing the same |
| CN109929490A (en) * | 2019-02-24 | 2019-06-25 | 北京氦舶科技有限责任公司 | A kind of normal temperature cure conducting resinl and preparation method thereof |
| CN116765677A (en) * | 2023-06-30 | 2023-09-19 | 广州市永隆新材料研究院有限公司 | Organic adhesive for copper powder welding |
-
2008
- 2008-08-28 CN CN 200810119061 patent/CN101659843A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632742A (en) * | 2012-08-22 | 2014-03-12 | 三星电机株式会社 | Conductive paste for internal electrodes, multilayer ceramic electronic component using the same, and method of manufacturing the same |
| CN103632742B (en) * | 2012-08-22 | 2017-09-01 | 三星电机株式会社 | Conducting resinl for internal electrode and laminated ceramic electronic component and its manufacture method using the conducting resinl |
| KR101792275B1 (en) * | 2012-08-22 | 2017-11-01 | 삼성전기주식회사 | Conductive paste for internal electrode, multilayer ceramic components using the same and manufacturing method of the same |
| CN103013400A (en) * | 2012-12-26 | 2013-04-03 | 天津市新森焊材有限公司 | Environment-friendly bonding agent |
| CN103013400B (en) * | 2012-12-26 | 2015-12-02 | 天津市新森焊材有限公司 | Welding wire tackiness agent |
| CN109929490A (en) * | 2019-02-24 | 2019-06-25 | 北京氦舶科技有限责任公司 | A kind of normal temperature cure conducting resinl and preparation method thereof |
| CN116765677A (en) * | 2023-06-30 | 2023-09-19 | 广州市永隆新材料研究院有限公司 | Organic adhesive for copper powder welding |
| CN116765677B (en) * | 2023-06-30 | 2024-02-09 | 广州市永隆新材料研究院有限公司 | Organic adhesive for copper powder welding |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100303 |