CN101654217A - 一种制作微元件的方法 - Google Patents
一种制作微元件的方法 Download PDFInfo
- Publication number
- CN101654217A CN101654217A CN200810118652A CN200810118652A CN101654217A CN 101654217 A CN101654217 A CN 101654217A CN 200810118652 A CN200810118652 A CN 200810118652A CN 200810118652 A CN200810118652 A CN 200810118652A CN 101654217 A CN101654217 A CN 101654217A
- Authority
- CN
- China
- Prior art keywords
- negative photoresist
- thermoprene
- photoresist layer
- layer
- photoetching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 178
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 229920001486 SU-8 photoresist Polymers 0.000 claims abstract description 61
- 238000001259 photo etching Methods 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims description 50
- 239000011521 glass Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001080 W alloy Inorganic materials 0.000 claims description 2
- LMHKOBXLQXJSOU-UHFFFAOYSA-N [Co].[Ni].[Pt] Chemical compound [Co].[Ni].[Pt] LMHKOBXLQXJSOU-UHFFFAOYSA-N 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 230000001235 sensitizing effect Effects 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 101
- 150000003254 radicals Chemical class 0.000 description 42
- 238000004528 spin coating Methods 0.000 description 19
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 239000003292 glue Substances 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000001459 lithography Methods 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000004377 microelectronic Methods 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000000018 DNA microarray Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007761 roller coating Methods 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 206010015150 Erythema Diseases 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001464887 Parvimonas micra Species 0.000 description 1
- 150000001723 carbon free-radicals Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Images
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- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810118652XA CN101654217B (zh) | 2008-08-21 | 2008-08-21 | 一种制作微元件的方法 |
Applications Claiming Priority (1)
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---|---|---|---|
CN200810118652XA CN101654217B (zh) | 2008-08-21 | 2008-08-21 | 一种制作微元件的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101654217A true CN101654217A (zh) | 2010-02-24 |
CN101654217B CN101654217B (zh) | 2011-09-14 |
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Family Applications (1)
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CN200810118652XA Active CN101654217B (zh) | 2008-08-21 | 2008-08-21 | 一种制作微元件的方法 |
Country Status (1)
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CN (1) | CN101654217B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102769200A (zh) * | 2012-06-29 | 2012-11-07 | 深圳光启创新技术有限公司 | 一种三维超材料及其制备方法 |
CN107758607A (zh) * | 2017-09-29 | 2018-03-06 | 湖南大学 | 一种高深宽比高保形纳米级正型结构的制备方法 |
CN107857236A (zh) * | 2017-09-29 | 2018-03-30 | 湖南大学 | 一种高深宽比高保形纳米级负型结构的制备方法 |
CN110854005A (zh) * | 2019-11-22 | 2020-02-28 | 广西民族大学 | 一种具有微米结构的电极的制作方法 |
CN111115563A (zh) * | 2019-12-23 | 2020-05-08 | 湖南大学 | 一种全干法功能材料剥离的方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITTO20020793A1 (it) * | 2002-09-12 | 2004-03-13 | Olivetti Jet Spa | Metodo per ricoprire selettivamente una superficie microlavorata. |
CN1307486C (zh) * | 2004-12-20 | 2007-03-28 | 西安交通大学 | 聚二甲基硅氧烷微流控芯片复型光固化树脂模具制作方法 |
-
2008
- 2008-08-21 CN CN200810118652XA patent/CN101654217B/zh active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102769200A (zh) * | 2012-06-29 | 2012-11-07 | 深圳光启创新技术有限公司 | 一种三维超材料及其制备方法 |
CN102769200B (zh) * | 2012-06-29 | 2015-11-18 | 深圳光启创新技术有限公司 | 一种三维超材料及其制备方法 |
CN107758607A (zh) * | 2017-09-29 | 2018-03-06 | 湖南大学 | 一种高深宽比高保形纳米级正型结构的制备方法 |
CN107857236A (zh) * | 2017-09-29 | 2018-03-30 | 湖南大学 | 一种高深宽比高保形纳米级负型结构的制备方法 |
CN110854005A (zh) * | 2019-11-22 | 2020-02-28 | 广西民族大学 | 一种具有微米结构的电极的制作方法 |
CN111115563A (zh) * | 2019-12-23 | 2020-05-08 | 湖南大学 | 一种全干法功能材料剥离的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101654217B (zh) | 2011-09-14 |
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Owner name: CAPITALBIO CORPORATION CO., LTD. Free format text: FORMER NAME: CAPITALBIO CORPORATION |
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Address after: 102206 Beijing City, Changping District Life Science Park Road No. 18 Patentee after: CAPITALBIO CORPORATION Patentee after: Tsinghua University Address before: 102206 Beijing City, Changping District Life Science Park Road No. 18 Patentee before: Capitalbio Corporation Patentee before: Tsinghua University |