CN101651254A - Surface mount panel antenna - Google Patents
Surface mount panel antenna Download PDFInfo
- Publication number
- CN101651254A CN101651254A CN 200810134637 CN200810134637A CN101651254A CN 101651254 A CN101651254 A CN 101651254A CN 200810134637 CN200810134637 CN 200810134637 CN 200810134637 A CN200810134637 A CN 200810134637A CN 101651254 A CN101651254 A CN 101651254A
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- signal
- surface mount
- matrix
- perforation
- sheet metal
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Abstract
The invention discloses a surface mount panel antenna, which comprises an antenna and a circuit board, wherein the antenna is provided with a substrate; the surface of the substrate is provided with aradiating sheet metal, while the bottom surface is provided with a grounded sheet metal; the substrate, the radiating sheet metal and the grounded sheet metal are provided with a perforation throughwhich a signal feeder runs; the tip of the signal feeder is electrically connected with the radiating sheet metal, while the tail end is not electrically connected with the grounded sheet metal; and the circuit board is pasted on the bottom surface of the substrate and provided with a front, a back and a perforation, wherein the front is provided with at least one bonding area which is attached tothe grounded sheet metal on the bottom surface of the substrate; and the back is provided with at least one first welding spot and a signal feeding lead wire electrically connected with the signal feeder. The surface mount panel antenna has the following advantages that: the panel antenna is electrically connected to a mainboard of an electronic device in a surface mount way, so labor for assembly is greatly reduced, and the efficiency and the convenience in use are improved.
Description
Technical field
The present invention relates to a kind of antenna, but particularly relate to a kind of plate aerial of surface mount.
Background technology
Some, these radio communication products that radio communication product has become in the life can place on the car, can be public communication apparatus, also can be the devices of carrying.The transmission of these radio waves then must and receive by the antenna emission, and the antenna basic function is that lotus root is closed the electromagnetic energy between (Couple) free space and guiding device (Guiding Device).Also therefore also developed multiple antenna, for example dipole antenna (Dipole), plate aerial and little band plate antenna etc. for the different communication apparatus of arranging in pairs or groups.
Yet present contact pin type plate aerial is shown in Fig. 1 a, 1b.The matrix 101 that has a ceramic material on this antenna 10, these matrix 101 surfaces have a radiation sheet metal 102, the bottom surface of this matrix 101 has a grounded metal sheet 103, offer a perforation 104 on this matrix 101, radiation sheet metal 102 and the grounded metal sheet 103, this perforation 104 is passed in order to the signal feeding body 105 that a T shape is provided, and can be assembled in flat plate antenna structure on the motherboard with shape (one-tenth).But the contact pin antenna of this kind is installed on motherboard and wants the weldering of rubberizing hand, can't the machine piece.
Another kind of SMD LED surface-mount device LED PATCH, shown in Fig. 2 a, 2b, be the SMD LED surface-mount device LED PATCH that delivers at present, this antenna 30 has the matrix 301 of a ceramic material, these matrix 301 surfaces have a radiation sheet metal 302, the bottom surface of this matrix 301 has a grounded metal sheet 303, and respectively there is a metal electrode 304 on four limits of this matrix 301.This kind surface mount (SMD) antenna does not need the weldering of rubberizing hand, and directly the machine piece gets final product.But, because the volume of the ceramic matrix 301 of antenna is bigger, when surface mount, may allow the bigger ceramic matrix 301 of volume reach the uniform temperature that is enough to weld because of temperature curve can't satisfy, cause the puzzlement in the surface mount processing.
Summary of the invention
The subject matter that institute of the present invention desire solves is, a kind of plate aerial of surface mount is provided, promptly, be combined into the plate aerial of surface mount by circuit board and plate aerial, make this plate aerial with the mode electrically connect of surface mount on the motherboard of electronic installation, can reduce the manpower of assembling significantly, the simplicity that promotes efficient and use.
For reaching above-mentioned purpose, the invention provides a kind of plate aerial of surface mount, comprising:
One antenna, this antenna has a matrix, this matrix surface has a radiation sheet metal, this matrix bottom surface is provided with a grounded metal sheet, this matrix, radiation sheet metal and grounded metal sheet are provided with a perforation, this perforation is passed for a signal feeding body, the termination of this signal feeding body and radiation sheet metal electrically connect, the end of this signal feeding body not with this grounded metal sheet electrically connect;
One circuit board, be covered on this matrix bottom surface, this circuit board has a front, the back side and a perforation, this front has at least one bonding zone, the grounded metal sheet of this bonding zone and this matrix bottom surface is fitted, at least one first solder joint is established at this back side, and one and the signal feed-in lead of signal feeding body electrically connect.
This matrix is a ceramic material.
This signal feeding body is the T shape, has half button-head on it, and this termination is extended with a shaft, this shaft penetrates in the perforation of matrix, make termination and this radiation sheet metal be electrically connect, make this radiation sheet metal form signal receiving end, this signal feeding body forms the feed side of a signal.
This bonding zone is laid viscose or double faced adhesive tape.
The perforation periphery in this front has an annular contact, this annular contact and this signal feeding body electrically connect.
Set up the first solder joint electrically connect at a ground connection solder joint and this back side on this front.
This back of circuit board is provided with a signal feed-in lead, this signal feed-in lead is provided with one first end and one second end, this first end ring is located at this perforation periphery, this second end forms one second solder joint, this perforation is passed back and this first end electrically connect for the end of signal feeding body, and the signal feed side of this second end and a motherboard is electrically connect.
This signal feed-in lead is the planar microstrip line.
The effect that the present invention realizes is, make this plate aerial with the mode electrically connect of surface mount on the motherboard of electronic installation, reduce the manpower of assembling significantly, the simplicity that promotes efficient and use.
Description of drawings
Fig. 1 a is the plate aerial stereoscopic schematic diagram of traditional contact pin type;
Fig. 1 b is the plate aerial of Fig. 1 a and the motherboard electrically connect schematic diagram of electronic installation;
Fig. 2 a, 2b are the schematic diagram of the non-contact pin type antenna of another kind of surface mount in the prior art;
Fig. 3 is plate aerial of the present invention and circuit board decomposing schematic representation;
Fig. 4 is plate aerial of the present invention and another angle decomposing schematic representation of circuit board;
Fig. 5 is plate aerial of the present invention and circuit board combination schematic diagram;
Fig. 6 is plate aerial of the present invention and circuit board combination generalized section;
Fig. 7 is plate aerial of the present invention and circuit board user mode schematic diagram;
Fig. 8 is plate aerial of the present invention and circuit board combination generalized section.
Wherein, Reference numeral:
The 104 signal feeding bodies 105 of boring a hole
Motherboard 20 antennas 30
Grounded metal sheet 303 metal electrodes 304
The 14 signal feeding bodies 15 of boring a hole
Positive 21 back sides 22
25 first solder joints 26 of boring a hole
Signal feed-in lead 27 first ends 271
Second end, 272 motherboards 3
Conductive junction point 31 signals feedback contact 32
Embodiment
Relevant technology contents of the present invention and detailed description, existing conjunction with figs. is described as follows:
See also shown in Fig. 3,4,5, be plate aerial of the present invention and circuit board decomposition, another angle decomposition and combination schematic diagram.As shown in the figure: the plate aerial of surface mount of the present invention comprises: an antenna 1 and a circuit board 2.
This antenna 1, it is a cube, it has a ceramic dielectric matrix 11, these matrix 11 surfaces have a radiation sheet metal 12, the bottom surface of this matrix 11 has a grounded metal sheet 13, offer a perforation 14 on this matrix 11, radiation sheet metal 12 and the grounded metal sheet 13, this perforation 14 is passed in order to the signal feeding body 15 that a T shape is provided, semicircle termination 151 and this radiation sheet metal 12 of this signal feeding body 15 are electrically connect, make this radiation sheet metal 12 form signal receiving end, this signal feeding body 15 forms the feed side of a signal.After the shaft 152 of this signal feeding body 15 passes this perforation 14, the end 153 of this shaft 152 not with grounded metal sheet 13 electrically connects, only with circuit board 2 electrically connects.
This circuit board 2, has positive 21 and one back side 22 on it, this front 21 has a bonding zone 23, this bonding zone 23 can be laid any of viscose or double faced adhesive tape etc., these front 21 centre have an annular contact 24, this annular contact 24 and these signal feeding body 15 electrically connects, this annular contact 24 are provided with a perforation 25 that runs through circuit board 2, pass for these signal feeding body 15 ends 153.This back side 22 is provided with a plurality of first solder joints 26, fit in this circuit board in matrix 11 bottom surfaces 2 positive 21 o'clock, grounded metal sheet 13 on this matrix 11 forms ground state (under high-frequency range) with this first solder joint 26, perhaps can be with after setting up first solder joint, 26 electrically connects at a ground connection solder joint (not shown) and this back side 22 on positive 21, when matrix 11 is fitted in circuit board 2 fronts, the grounded metal sheet 13 of this matrix 11 electrically contacts with this ground connection solder joint, when the motherboard (not shown) electrically connect of this circuit board 2 and electronic installation, this first solder joint 26 forms affixed and the ground connection effect.And, be provided with a signal feed-in lead 27 again in the back side 22 of this circuit board 2, first end 271 of this signal feed-in lead 27 is located in this perforation 25, this second end 272 forms one second solder joint, end 153 at signal feeding body 15 passes perforation 25 backs and first end, 271 electrically connects, and this second end 272 is electrically connect with the signal feed side of this motherboard.In the present embodiment, this signal feed-in lead 27 is the planar microstrip line.
See also and Figure 6 shows that plate aerial of the present invention and circuit board combination generalized section.As shown in the figure: when substrate 11 underrun adhesive agents, viscose or the double faced adhesive tape of antenna 1 were covered on the front 21 of this circuit board 2, the grounded metal sheet 13 of these matrix 11 bottom surfaces was electrically connect with the contact 23 in these circuit board 2 fronts 21.Simultaneously, the perforation 25 that shaft 152 ends 153 of the signal feeding body 15 of this antenna 1 pass this circuit board 2, and with first end, 271 electrically connects of this signal feed-in lead 27, to form the plate aerial that can stick together for table.
See also Fig. 7,8 and be depicted as plate aerial of the present invention and circuit board user mode and combination generalized section.After plate aerial 1 of the present invention is combined into the plate aerial of surface mount with this circuit board 2, be electrically connect with the conductive junction point 31 on the motherboard 3 of first solder joint 26 at these circuit board 2 back sides and electronic installation, second solder joint of second end 272 of this signal feed-in lead 27 is presented contact 32 electrically connects with this signal.Make this plate aerial with the mode electrically connect of surface mount on the motherboard 3 of electronic installation, can reduce the manpower of assembling significantly, the simplicity that promotes efficient and use.
Above-mentioned is preferred embodiment of the present invention only, is not to be used for limiting scope of the invention process.Be that all equivalences of making according to claims of the present invention change and modification, be all claim of the present invention and contain.
Claims (8)
1, a kind of plate aerial of surface mount is characterized in that, comprising:
One antenna, this antenna has a matrix, this matrix surface has a radiation sheet metal, this matrix bottom surface is provided with a grounded metal sheet, this matrix, radiation sheet metal and grounded metal sheet are provided with a perforation, this perforation is passed for a signal feeding body, the termination of this signal feeding body and radiation sheet metal electrically connect, the end of this signal feeding body not with this grounded metal sheet electrically connect;
One circuit board, be covered on this matrix bottom surface, this circuit board has a front, the back side and a perforation, this front has at least one bonding zone, the grounded metal sheet of this bonding zone and this matrix bottom surface is fitted, at least one first solder joint is established at this back side, and one and the signal feed-in lead of signal feeding body electrically connect.
2, the plate aerial of surface mount as claimed in claim 1 is characterized in that, this matrix is a ceramic material.
3, the plate aerial of surface mount as claimed in claim 1, it is characterized in that, this signal feeding body is the T shape, has half button-head on it, this termination is extended with a shaft, and this shaft penetrates in the perforation of matrix, makes termination and this radiation sheet metal be electrically connect, make this radiation sheet metal form signal receiving end, this signal feeding body forms the feed side of a signal.
4, the plate aerial of surface mount as claimed in claim 1 is characterized in that, this bonding zone is laid viscose or double faced adhesive tape.
5, the plate aerial of surface mount as claimed in claim 1 is characterized in that, the perforation periphery in this front has an annular contact, this annular contact and this signal feeding body electrically connect.
6, the plate aerial of surface mount as claimed in claim 1 is characterized in that, sets up the first solder joint electrically connect at a ground connection solder joint and this back side on this front.
7, the plate aerial of surface mount as claimed in claim 1, it is characterized in that, this back of circuit board is provided with a signal feed-in lead, this signal feed-in lead is provided with one first end and one second end, this first end ring is located at this perforation periphery, this second end forms one second solder joint, and this perforation is passed back and this first end electrically connect for the end of signal feeding body, and the signal feed side of this second end and a motherboard is electrically connect.
8, the plate aerial of surface mount as claimed in claim 7 is characterized in that, this signal feed-in lead is the planar microstrip line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810134637 CN101651254B (en) | 2008-08-12 | 2008-08-12 | Surface mount panel antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810134637 CN101651254B (en) | 2008-08-12 | 2008-08-12 | Surface mount panel antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101651254A true CN101651254A (en) | 2010-02-17 |
| CN101651254B CN101651254B (en) | 2013-01-23 |
Family
ID=41673420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810134637 Active CN101651254B (en) | 2008-08-12 | 2008-08-12 | Surface mount panel antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101651254B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386481A (en) * | 2010-09-01 | 2012-03-21 | 太盟光电科技股份有限公司 | Capacitive antenna structure |
| CN102386475A (en) * | 2010-08-31 | 2012-03-21 | 太盟光电科技股份有限公司 | Radio frequency identification device (RFID) electronic tag type panel antenna |
| CN102868417A (en) * | 2011-07-05 | 2013-01-09 | 太盟光电科技股份有限公司 | Surface-mounted signal transceiver module |
| CN108232429A (en) * | 2016-12-14 | 2018-06-29 | 太盟光电科技股份有限公司 | Stacking-type circular polarization aerial structure |
| CN109980351A (en) * | 2017-12-14 | 2019-07-05 | 太盟光电科技股份有限公司 | The signal transmitting and receiving module of multi signal feed-in surface adhesive type |
| TWI685144B (en) * | 2017-11-30 | 2020-02-11 | 太盟光電科技股份有限公司 | Surface-mount signal transceiver module with multi-signal feed-in |
| TWI689130B (en) * | 2017-08-02 | 2020-03-21 | 佳邦科技股份有限公司 | Portable electronic device and stacked antenna module thereof |
| CN111934086A (en) * | 2019-05-13 | 2020-11-13 | 启碁科技股份有限公司 | Antenna structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI644480B (en) * | 2016-12-06 | 2018-12-11 | 太盟光電科技股份有限公司 | Stacked-circularly-polarized antenna structure |
| US10312569B1 (en) | 2018-01-05 | 2019-06-04 | Cirocomm Technology Corp. | Surface-mounted signal transceiver module with multi-signal feed-in |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3255403B2 (en) * | 1998-12-24 | 2002-02-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Patch antenna and electronic device using the same |
| JP4507445B2 (en) * | 2001-04-25 | 2010-07-21 | パナソニック株式会社 | Surface mount antenna and electronic device using the same |
| JP2005260875A (en) * | 2004-03-15 | 2005-09-22 | Yokowo Co Ltd | Surface mounted patch antenna and its mounting method |
-
2008
- 2008-08-12 CN CN 200810134637 patent/CN101651254B/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102386475A (en) * | 2010-08-31 | 2012-03-21 | 太盟光电科技股份有限公司 | Radio frequency identification device (RFID) electronic tag type panel antenna |
| CN102386481A (en) * | 2010-09-01 | 2012-03-21 | 太盟光电科技股份有限公司 | Capacitive antenna structure |
| CN102386481B (en) * | 2010-09-01 | 2014-01-22 | 太盟光电科技股份有限公司 | Capacitive antenna structure |
| CN102868417A (en) * | 2011-07-05 | 2013-01-09 | 太盟光电科技股份有限公司 | Surface-mounted signal transceiver module |
| CN108232429A (en) * | 2016-12-14 | 2018-06-29 | 太盟光电科技股份有限公司 | Stacking-type circular polarization aerial structure |
| CN113764903A (en) * | 2016-12-14 | 2021-12-07 | 太盟光电科技股份有限公司 | Stack type circular polarized antenna structure |
| TWI689130B (en) * | 2017-08-02 | 2020-03-21 | 佳邦科技股份有限公司 | Portable electronic device and stacked antenna module thereof |
| TWI685144B (en) * | 2017-11-30 | 2020-02-11 | 太盟光電科技股份有限公司 | Surface-mount signal transceiver module with multi-signal feed-in |
| CN109980351A (en) * | 2017-12-14 | 2019-07-05 | 太盟光电科技股份有限公司 | The signal transmitting and receiving module of multi signal feed-in surface adhesive type |
| CN109980351B (en) * | 2017-12-14 | 2021-05-18 | 太盟光电科技股份有限公司 | Multiple signal feed-in surface adhesive signal receiving-transmitting module |
| CN111934086A (en) * | 2019-05-13 | 2020-11-13 | 启碁科技股份有限公司 | Antenna structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101651254B (en) | 2013-01-23 |
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