201008018 九、發明說明： 【發明所屬之技術領域】 本發明係有一種天線，尤指一種可表面黏著的平板天 線。 【先前技術】 無線通訊產品已經成為生活型態中的一部份、這此無 線通訊產品可以置於車上、可以是公共通訊設備，也可以 ❹是隨身攜帶的裝置。而這些無線電波的傳遞 線發射以及接收，天線基本功能是竊合(C。二 與導引裝置（Guiding Device)間的電磁能量。也因此為了搭 配不同的通訊設備也研發出有多種天線，例如偶極二線。 (Dipole)、平板天線以及微帶板天線等。 然而，目前的插針式平板天線，如第一圖a、b所 不。该天線10上具有一陶瓷材料的基體1〇1 ，該基體忉1 表面具有一輻射金屬片102，該基體101的底面具有一接 地金屬片103，該基體101 、輻射金屬片1〇2及接地金屬 片103上開設有一穿孔1〇4，該穿孔1〇4係以提供一 τ形 狀的訊號饋入體1〇5穿過，以形（成）可組装於主機板上 的平板天線結構。但是，此種的插針天線安裝於主機板要 貼膠手焊，無法機器打件。 此另-種表面黏著型PATCH，如第二圖a、b所示，為 目前仿間發表的表©黏著型PATGH ’該天線3()具有一陶竟 材料的基體3〇1，該基體301表面具有一輕射金屬片 3〇2，该基體301的底面具有一接地金屬片删，該基體 201008018 301的四邊各有一金屬電極期。此種表面黏著（ 線不需貼膠手焊，直接機器打件即可。但是，由於天線的 陶究基體301的體積較大，在表面黏著時可能因溫度曲線 無法滿足讓體積較大的陶兗基體加！達到足以焊接的均勾 溫度’造成表面黏著加工上的困擾。 【發明内容】 本發明之主要目的，在於提供一種透過電路板與平板 ❹天線組合成表面黏著的平板天線，使該平板天線以表面黏 者的方式電性連結在電子裝置的主機板上，可大幅度降低 組裝的人力提昇效率及使用上的簡便性。 為達上述之目的，本發明提供一種表面黏著的平板天 線，包括：-天線及-電路板。該天線上具有一基體，該 基體表面具有-輻射金屬片，該基體的底面具有一接地金 属片，該基體、輻射金屬片及接地金屬片上開設有一穿 孔’該穿孔係以提供一訊號饋入體穿過，該訊號饋入體在 籲穿過後的末端不與接地金屬片電性連結。該電路板上具有 -正面及-背面’該正面具有一黏合區，該黏合區可佈設 黏膠或雙面膠等之任一種，使電路板貼合於該基體底面， 該正面中央處具有-環形接點，該環形接點與該訊號饋入 體電性連結，該環接點上設有一貫穿電路板之穿孔，以供 該訊號饋入體末端穿過，背面上設的複數個第一焊點，在 基體底面貼合於該電路板正面時，該基體上的接地金屬片 與》亥第肖點形成接地狀態，在該電路板與電子裝置之主 機板電性連結時’該第-焊點形成固接及接地作用再於 201008018 該電路板的背面上設有一訊號饋入導線，該訊號饋入導線 的第一端環設於該穿孔上，該第二端形成一第二焊點，在 訊號饋入體末端穿過穿孔後與第—端電性連結，該第二端 與該主機板的訊號饋入端呈電性連結。 【實施方式】 茲有關本發明之技術内容及詳細說明，現在配合圖式 說明如下： ❹ 明參閱第二、四、五圖，係本發明之平板天線與電路 板刀解另角度为解及組合示意圖。如圖所示：本發明 之表面黏著的平板天線，包括：—天線電路板2。 忒天線1，係為一立方體，其上具有一陶瓷介質基體 11，該基體11表面具有一輻射金屬片12，該基體丨丨的底面 具有一接地金屬片13 ’該基體U、輻射金屬片12及接地金 屬片13上開設有-穿孔14，該穿孔14係以提供一 τ形狀的 訊號饋入體15穿過，該訊號饋入體15的半圓形端頭151與 該輻射金屬片12呈電性連結，使該輕射金屬片12形成訊號 接收端，該訊號饋入體15形成一訊號的饋入端。在該訊號 饋入體15的桿身152穿過該穿孔14後，該桿身152的末端 153不與接地金屬片13電性連結，僅與電路板2電性連 結。 忒電路板2，其上具有一正面μ及一背面汊，該正面 21具有一黏合區23，該黏合區23可佈設黏膠或雙面膠等之 任一種，該正面21中央處具有一環形接點24，該環形接點 24與該訊號饋入體丨5電性連結，該環形接點24上設有一貫 201008018 穿電路板2之穿孔25，以供該訊號饋入體15末端153穿 過。該背面22上設的複數個第一焊點26，在基體11底面貼 合於該電路板2正面21時，該基體11上的接地金屬片13與 該第一焊點26形成接地狀態（在高頻範圍下），或者可以 將在正面21上增設一接地焊點（圖中未示）與該背面22的 第一焊點26電性連結後，在基體11貼合在電路板2正面 時’該基體11的接地金屬片13與該接地焊點電性接觸，在 ❹該電路板2與電子裝置之主機板（圖ψ未示）電性連結 時’該第一焊點26形成固接及接地作用。且，再於該電路 板2的背面22上設有一訊號饋入導線27，該訊號饋入導線 27的第一端2Ή環設於該穿孔25上，該第二端272形成一 第二焊點，在訊號饋入體15的末端153穿過穿孔25後與第 一端271電性連結，該第二端272與該主機板的訊號饋入 端呈電性連結。在本圖式中，該訊號饋入導線27為平面微 帶線。 Ο 凊參閱第六圖，係本發明之平板天線與電路板組合咅 視示意圖。如圖所示：在天線i的基底Μ面係透過黏毫 劑、黏膠或雙面膠貼覆於該電路板2的正面21時，該基磨 底面的接地金屬片13與該電路板2正面21的接點23呈電 性連結。同時’該天線i的訊號饋入體15的桿身152末端 Z穿過該電路板2的穿孔25，並與該訊號饋入導線㈣ 3 271電性連結，以形成可供表黏著的平板天線。 用狀雜第七、^圖，係本發明之平板天線與電路板使 心及，且㈣。當本發明的平板天W與該電 201008018 路板2組合成表面黏著的平板天線後，以該電路板2背面 的第一焊點26與電子裝置的主機板3上的導電接點31呈電 性連結，該訊號饋入導線27的第二端272的第二焊點與該 讯號馈接點32電性連結。使該平板天線以表面黏著的方式 電性連結在電子裝置的主機板3上，可大幅度降低組裝的 人力提昇效率及使用上的簡便性。 ❹ 上述僅為本發明之較佳實施例而已，並非用來限定本 f明實施之範圍。即凡依本發Μ請專利範圍所做的均等 ‘，化與修飾，皆為本發明專利範圍所涵蓋。 • 【圖式簡單說明】 =二圖a，錢插針式的平板天線外觀立體示意圖。 、n ’為第一圖之平板天線與電子裝置的主機板電性 連結示意圖。 a:b ’為另一種表面黏著的非插針式天線。 ©第:圖，’lit明之平板天線與電路板分解示意圖。 圖。、#明之平板天線與電路板另-角度分解示意 第六圖，：:::之:板天線與電路板組合示意圖。 第七圖，係本發天線與電路板組合剖視示意圖。 第八圖，係本發明之平板路板使用狀態示意圖。 【主要元件㈣說明】u路板組合剖視示意圖。 習知： 天線10 基體101 201008018 輻射金屬片102 接地金屬片103 穿孔104 訊號饋入體105 主機板20 天線30 基體301 輻射金屬片302 接地金屬片303 金屬電極304 本發明： ^ 天線1 陶瓷介質基體11 輻射金屬片12 接地金屬片13 穿孔14 訊號饋入體15 端頭151 桿身152 末端153 電路板2 正面21 背面22 黏合區23 環形接點24 穿孔25 第一焊點26 參訊號饋入導線27 第一端271 第二端272 主機板3 導電接點31 訊號饋接點32201008018 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an antenna, and more particularly to a surface antenna that can be surface-attached. [Prior Art] Wireless communication products have become part of the lifestyle. This wireless communication product can be placed in a car, can be a public communication device, or it can be a portable device. The transmission line of these radio waves is transmitted and received. The basic function of the antenna is to steal electromagnetic energy between the C. and the Guiding Device. Therefore, various antennas have been developed to match different communication devices, for example. Dipole, Dipole, Slab Antenna, Microstrip Antenna, etc. However, the current pin type planar antenna is not shown in the first figures a and b. The antenna 10 has a base material of a ceramic material. The surface of the substrate 具有1 has a radiant metal sheet 102. The bottom surface of the substrate 101 has a grounding metal piece 103. The base body 101, the radiant metal piece 1〇2 and the grounding metal piece 103 have a through hole 1 〇4. The through hole 1〇4 is provided to provide a τ-shaped signal feeding body 1〇5 through to form a planar antenna structure that can be assembled on the motherboard. However, the pin antenna is mounted on the motherboard. This is a kind of surface-adhesive PATCH, as shown in the second figure a and b. It is a table published by the current imitation. The adhesive type PATGH 'The antenna 3() has a pottery The base of the material is 3〇1, and the base 301 is There is a light-emitting metal piece 3〇2, the bottom surface of the base body 301 has a grounded metal piece, and the four sides of the base body 201008018 301 each have a metal electrode period. The surface is adhered (the wire does not need to be glued by hand welding, directly machined However, due to the large volume of the base 301 of the antenna, the surface temperature may not be satisfied due to the temperature curve, so that the larger the size of the ceramic substrate can be added! The main object of the present invention is to provide a panel antenna that is surface-bonded through a circuit board and a flat-panel antenna, and the panel antenna is electrically connected to the host of the electronic device in a surface-adhesive manner. On the board, the manpower improvement efficiency and the ease of use of the assembly can be greatly reduced. To achieve the above object, the present invention provides a surface-attached panel antenna comprising: an antenna and a circuit board. The antenna has a substrate The surface of the substrate has a radiation metal sheet, and the bottom surface of the substrate has a grounded metal piece, and the substrate, the radiation metal piece and the connection A through hole is formed in the metal piece to provide a signal feeding body, and the signal feeding body is not electrically connected to the grounding metal piece at the end after the sounding. The circuit board has a front surface and a back surface. The front side has an adhesive area, and the adhesive area can be disposed with any one of adhesive or double-sided tape, so that the circuit board is attached to the bottom surface of the base body, and the center of the front surface has a ring contact, the ring contact and the signal Feeding a body electrical connection, the ring contact is provided with a through hole penetrating through the circuit board for the end of the signal feed body to pass through, and a plurality of first solder joints disposed on the back surface are attached to the circuit on the bottom surface of the base body When the front side of the board is formed, the grounding metal piece on the base body forms a grounding state with the "Hai Xiaoxiao point", and when the circuit board is electrically connected to the main board of the electronic device, the first solder joint is fixed and grounded to be further in 201008018. a signal feeding wire is disposed on the back surface of the circuit board, and the first end ring of the signal feeding wire is disposed on the through hole, and the second end forms a second soldering point, and the through end of the signal feeding body passes through the through hole Connected with the first end The second end is electrically connected to the signal feeding end of the motherboard. [Embodiment] The technical content and detailed description of the present invention will now be described as follows: ❹ See the second, fourth, and fifth figures, which are the solution and combination of the planar antenna and the circuit board of the present invention. schematic diagram. As shown in the figure: the surface-attached panel antenna of the present invention comprises: an antenna circuit board 2. The 忒 antenna 1 is a cube having a ceramic dielectric substrate 11 having a radiant metal sheet 12 on the surface thereof. The bottom surface of the substrate 具有 has a grounded metal sheet 13'. The substrate U and the radiant metal sheet 12 And the grounding metal piece 13 is provided with a through hole 14 for passing through a signal feeding body 15 for providing a τ shape, and the semicircular end 151 of the signal feeding body 15 and the radiant metal piece 12 are Electrically connected, the light-emitting metal piece 12 forms a signal receiving end, and the signal feeding body 15 forms a signal feeding end. After the shaft 152 of the signal feeding body 15 passes through the through hole 14, the end 153 of the shaft 152 is not electrically connected to the grounding metal piece 13, and is only electrically connected to the circuit board 2. The circuit board 2 has a front surface and a back surface. The front surface 21 has an adhesive area 23, and the adhesive area 23 can be provided with any one of adhesive or double-sided tape. The front surface 21 has a ring shape at the center. The contact point 24 is electrically connected to the signal feeding body 5, and the annular contact 24 is provided with a through hole 25 of the 201008018 wearing circuit board 2 for the end 153 of the signal feeding body 15 to be worn. Over. A plurality of first solder joints 26 are disposed on the back surface 22, and when the bottom surface of the base 11 is attached to the front surface 21 of the circuit board 2, the grounding metal sheet 13 on the base 11 and the first solder joint 26 are grounded. In the high frequency range, a grounding solder joint (not shown) may be electrically connected to the first solder joint 26 of the back surface 22, and then the base 11 is attached to the front surface of the circuit board 2 The grounding metal piece 13 of the base 11 is in electrical contact with the grounding pad, and the first soldering point 26 is fixed when the circuit board 2 is electrically connected to a motherboard (not shown) of the electronic device. And grounding. Further, a signal feeding wire 27 is disposed on the back surface 22 of the circuit board 2. The first end 2 of the signal feeding wire 27 is disposed on the through hole 25, and the second end 272 forms a second solder joint. After the end 153 of the signal feeding body 15 passes through the through hole 25, it is electrically connected to the first end 271, and the second end 272 is electrically connected to the signal feeding end of the motherboard. In the figure, the signal feed line 27 is a planar microstrip line.第六 凊 Refer to the sixth figure, which is a schematic diagram of a combination of the panel antenna and the circuit board of the present invention. As shown in the figure: when the base surface of the antenna i is pasted on the front surface 21 of the circuit board 2 through a bonding agent, adhesive or double-sided tape, the grounding metal piece 13 of the base grinding surface and the circuit board 2 The contacts 23 on the front side 21 are electrically connected. At the same time, the end Z of the shaft 152 of the signal feeding body 15 of the antenna i passes through the through hole 25 of the circuit board 2, and is electrically connected with the signal feeding wire (4) 3 271 to form a panel antenna for adhesion to the surface. . The seventh embodiment and the circuit diagram of the present invention are used for the panel antenna and the circuit board of the present invention, and (4). When the flat panel W of the present invention is combined with the electric 201008018 road board 2 to form a surface-attached panel antenna, the first solder joint 26 on the back surface of the circuit board 2 is electrically connected to the conductive contact 31 on the motherboard 3 of the electronic device. The second solder joint of the second end 272 of the signal feed wire 27 is electrically connected to the signal feed point 32. By electrically attaching the panel antenna to the motherboard 3 of the electronic device by surface adhesion, the human lifting efficiency of the assembly and the ease of use can be greatly reduced. The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equalization, modification and modification of the patent scope according to this application are covered by the scope of the invention. • [Simple description of the diagram] = two diagrams a, a three-dimensional schematic diagram of the appearance of the money pin type flat panel antenna. , n ' is a schematic diagram of the electrical connection between the panel antenna of the first figure and the motherboard of the electronic device. a:b ’ is another non-pinned antenna with a surface adhesion. ©Picture: Figure, 'litted panel antenna and circuit board decomposition diagram. Figure. , #明的平板天线和电路板别- angle decomposition diagram 6th, ::::: board antenna and circuit board combination diagram. The seventh figure is a schematic cross-sectional view of the combination of the present antenna and the circuit board. The eighth figure is a schematic view showing the state of use of the flat road plate of the present invention. [Main components (four) description] u road board combination sectional view. Conventional: Antenna 10 Base 101 201008018 Radiation metal sheet 102 Ground metal sheet 103 Perforation 104 Signal feed body 105 Mother board 20 Antenna 30 Base 301 Radiation metal sheet 302 Ground metal sheet 303 Metal electrode 304 The present invention: ^ Antenna 1 Ceramic dielectric substrate 11 Radiation metal sheet 12 Grounding metal sheet 13 Perforation 14 Signal feeding body 15 End 151 Shaft 152 End 153 Circuit board 2 Front 21 Back 22 Bonding area 23 Ring contact 24 Perforation 25 First solder joint 26 Signal feed wire 27 First end 271 Second end 272 Motherboard 3 Conductive contact 31 Signal feed point 32