CN101649972A - Novel LED encapsulating structure - Google Patents
Novel LED encapsulating structure Download PDFInfo
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- CN101649972A CN101649972A CN200910187255A CN200910187255A CN101649972A CN 101649972 A CN101649972 A CN 101649972A CN 200910187255 A CN200910187255 A CN 200910187255A CN 200910187255 A CN200910187255 A CN 200910187255A CN 101649972 A CN101649972 A CN 101649972A
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- encapsulating structure
- recessed cup
- cup
- novel led
- led encapsulating
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Abstract
The invention discloses a novel LED encapsulating structure which comprises a ceramic substrate, at least one concave cup arranged on the ceramic substrate, at least one LED chip arranged in the recess of the concave cup, and lines for connecting the LED chip. The specific angle of the inner side of the concave cup of the novel LED encapsulating structure can refract the light emitted by the chipto improve the light-emitting efficiency; the specific angle of the outer side of the concave cup can decrease the mutual interference of lights in a multi-chip encapsulating structure to improve thelight-emitting efficiency; and the concave cup is connected with a heat radiating substrate so that the heat of the chip can be conducted out more easily to realize the separation of light, electricity and heat.
Description
[technical field]
The present invention relates to the LED encapsulation field, particularly a kind of Novel LED encapsulating structure.
[background technology]
The encapsulating structure of traditional LED is: led chip directly is set on ceramic substrate, and like this, there is serious phase mutual interference in the light between a plurality of led chips, and light extraction efficiency is poor; Led chip directly is connected with ceramic substrate, and the heat that produces during led chip work can not in time be derived, and causes led chip to damage easily, job insecurity.
[summary of the invention]
The objective of the invention is to, a kind of Novel LED encapsulating structure is provided,, improve light extraction efficiency to reduce the phase mutual interference between the led chip.
Another object of the present invention is, a kind of Novel LED encapsulating structure is provided, so that the heat that led chip produces is in time derived, accomplishes the separation of light, electricity, heat.
In order to achieve the above object, the technical solution adopted in the present invention is: a kind of Novel LED encapsulating structure is provided.Described Novel LED encapsulating structure comprises: ceramic substrate, at least one the recessed cup that is provided with on the ceramic substrate, at least one led chip that is provided with in described recessed cup depression and the circuit of connection led chip.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: described recessed cup outer cup wall surface is spent more than or equal to 90 with the angle of ceramic substrate.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: the wall of cup surface and the angle at the recessed cup cup end are more than or equal to 90 degree in the described recessed cup.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: the height H of the interior wall of cup of described recessed cup satisfies: 1/2H
LED≤ H≤H
LED, wherein, H
LEDIt is the height of led chip.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: described recessed cup is circle or multiaspect shape.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: described recessed cup is positive tetrahedron, positive six shapes or positive octahedral shape.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: described recessed cup bottom is connected by the heat-radiating substrate of heating column with the ceramic substrate back side.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: described recessed cup adopts highly heat-conductive material to make.Recessed cup can be any high heat-conducting, comprises " copper " " aluminium " etc.
According to Novel LED encapsulating structure one optimal technical scheme of the present invention be: polishing is done on described recessed cup surface, improves reflective function.
Beneficial technical effects of the present invention is: the anaclasis that the inboard special angle of recessed cup of Novel LED encapsulating structure of the present invention can make chip send is gone out, and improves light extraction efficiency; The special angle in the recessed cup outside can reduce the phase mutual interference of the light in the multichip packaging structure, improves light extraction efficiency; Separating of light, electricity, heat accomplished in be connected with the heat-radiating substrate easier derivation of heat that makes chip of recessed cup.
[description of drawings]
Fig. 1 is the structure chart of the recessed cup of single led chip list of embodiment of the invention Novel LED encapsulating structure;
Fig. 2 is the structure chart of the recessed cup of many led chips list of embodiment of the invention Novel LED encapsulating structure;
Fig. 3 is the structure chart of the how recessed cup of many led chips of embodiment of the invention Novel LED encapsulating structure;
Fig. 4 is the recessed cup and heat-radiating substrate johning knot composition of embodiment of the invention Novel LED encapsulating structure;
Fig. 5 is the circular recessed cup vertical view of embodiment of the invention Novel LED encapsulating structure;
Fig. 6 is the circular recessed cup side view of embodiment of the invention Novel LED encapsulating structure;
Fig. 7 is the recessed cup of the positive tetrahedron of an embodiment of the invention Novel LED encapsulating structure vertical view;
Fig. 8 is the recessed cup of the positive tetrahedron of an embodiment of the invention Novel LED encapsulating structure side view;
Fig. 9 is the recessed cup of positive six shapes of an embodiment of the invention Novel LED encapsulating structure vertical view;
Figure 10 is the recessed cup of positive six shapes of an embodiment of the invention Novel LED encapsulating structure side view;
Figure 11 is the recessed cup of the positive octahedral shape of an embodiment of the invention Novel LED encapsulating structure vertical view;
Figure 12 is the recessed cup of the positive octahedral shape of an embodiment of the invention Novel LED encapsulating structure side view.
[specific embodiment]
The present invention is described in detail below in conjunction with drawings and Examples.
The Novel LED encapsulating structure of present embodiment comprises: ceramic substrate 3, at least one the recessed cup 2 in setting on the ceramic substrate 3, at least one led chip 1 that is provided with in described recessed cup 2 depressions and the circuit of connection led chip.Described recessed cup outer cup wall surface is spent more than or equal to 90 with the angle of ceramic substrate.The wall of cup surface and the angle at the recessed cup cup end are more than or equal to 90 degree in the described recessed cup.The height H of the interior wall of cup of described recessed cup satisfies: 1/2H
LED≤ H≤H
LED, wherein, H
LEDIt is the height of led chip.
Please refer to Fig. 1 to Fig. 3, Fig. 1 is the structure chart of the recessed cup of single led chip list of embodiment of the invention Novel LED encapsulating structure; Fig. 2 is the structure chart of the recessed cup of many led chips list of embodiment of the invention Novel LED encapsulating structure; Fig. 3 is the structure chart of the how recessed cup of many led chips of embodiment of the invention Novel LED encapsulating structure.
In the present embodiment, the encapsulating structure of LED can comprise a recessed cup, in each recessed cup a led chip is set; Also can comprise a recessed cup, each recessed cup is provided with a plurality of led chips; Also can comprise a plurality of recessed cups, each recessed cup comprises one or more led chips, by that analogy.
Please refer to Fig. 4, Fig. 4 is the recessed cup and heat-radiating substrate johning knot composition of embodiment of the invention Novel LED encapsulating structure.In the present embodiment, described recessed cup bottom is connected with the heat-radiating substrate 4 at the ceramic substrate back side by heating column.Heat-radiating substrate 4 can not be connected with recessed cup bottom yet, only is connected with ceramic substrate (as Fig. 1 to Fig. 3).
Please refer to Fig. 5 to Figure 12, Fig. 5 is the circular recessed cup vertical view of embodiment of the invention Novel LED encapsulating structure; Fig. 6 is the circular recessed cup side view of embodiment of the invention Novel LED encapsulating structure; Fig. 7 is the recessed cup of the positive tetrahedron of an embodiment of the invention Novel LED encapsulating structure vertical view; Fig. 8 is the recessed cup of the positive tetrahedron of an embodiment of the invention Novel LED encapsulating structure side view; Fig. 9 is the recessed cup of positive six shapes of an embodiment of the invention Novel LED encapsulating structure vertical view; Figure 10 is the recessed cup of positive six shapes of an embodiment of the invention Novel LED encapsulating structure side view; Figure 11 is the recessed cup of the positive octahedral shape of an embodiment of the invention Novel LED encapsulating structure vertical view; Figure 12 is the recessed cup of the positive octahedral shape of an embodiment of the invention Novel LED encapsulating structure side view.Described recessed cup is circle or multiaspect shape.
In the present embodiment, described recessed cup can be circular (as Fig. 5, Fig. 6), positive tetrahedron (as Fig. 7, Fig. 8), positive six shapes (Fig. 9, Figure 10) or positive octahedral shape (as Figure 11, Figure 12) but be not restricted to above-mentioned shape.
Described recessed cup adopts highly heat-conductive material to make, and comprises " copper " " aluminium ", but is not limited to this kind material.
Polishing is done on described recessed cup surface, improves reflective function.
Above content be in conjunction with concrete optimal technical scheme to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (9)
1, a kind of Novel LED encapsulating structure is characterized in that: described New LED structure comprises: ceramic substrate, at least one the recessed cup that is provided with on the ceramic substrate, at least one led chip that is provided with in described recessed cup depression and the circuit of connection led chip.
2, Novel LED encapsulating structure according to claim 1 is characterized in that: described recessed cup outer cup wall surface is spent more than or equal to 90 with the angle of ceramic substrate.
3, Novel LED encapsulating structure according to claim 1 is characterized in that: the wall of cup surface and the angle at the recessed cup cup end are more than or equal to 90 degree in the described recessed cup.
4, Novel LED encapsulating structure according to claim 1 is characterized in that: the height H of the interior wall of cup of described recessed cup satisfies: 1/2H
LED≤ H≤H
LED, wherein, H
LEDIt is the height of led chip.
5, Novel LED encapsulating structure according to claim 1 is characterized in that: described recessed cup is circle or multiaspect shape.
6, Novel LED encapsulating structure according to claim 5 is characterized in that: described recessed cup is positive tetrahedron, positive six shapes or positive octahedral shape.
7, according to each described Novel LED encapsulating structure of claim 1 to 6, it is characterized in that: described recessed cup bottom is connected by the heat-radiating substrate of heating column with the ceramic substrate back side.
8, Novel LED encapsulating structure according to claim 7 is characterized in that: described recessed cup adopts highly heat-conductive material to make.
9, Novel LED encapsulating structure according to claim 8 is characterized in that: polishing is done on described recessed cup surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910187255A CN101649972A (en) | 2009-09-04 | 2009-09-04 | Novel LED encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910187255A CN101649972A (en) | 2009-09-04 | 2009-09-04 | Novel LED encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101649972A true CN101649972A (en) | 2010-02-17 |
Family
ID=41672265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910187255A Pending CN101649972A (en) | 2009-09-04 | 2009-09-04 | Novel LED encapsulating structure |
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| CN (1) | CN101649972A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261573A (en) * | 2010-05-28 | 2011-11-30 | 景德镇正宇奈米科技有限公司 | Far infrared ray ceramic bulb structure |
| CN103644549A (en) * | 2013-11-29 | 2014-03-19 | 中国科学院半导体研究所 | LED (Light-emitting diode) heat dissipation structure |
-
2009
- 2009-09-04 CN CN200910187255A patent/CN101649972A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102261573A (en) * | 2010-05-28 | 2011-11-30 | 景德镇正宇奈米科技有限公司 | Far infrared ray ceramic bulb structure |
| CN103644549A (en) * | 2013-11-29 | 2014-03-19 | 中国科学院半导体研究所 | LED (Light-emitting diode) heat dissipation structure |
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Owner name: DALIAN NINEO-NINE TECHNOLOGY CO.,LTD. Free format text: FORMER OWNER: DALIAN NINEO-NINE TECHNOLOGY CO., LTD. Effective date: 20100803 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Effective date of registration: 20100803 Address after: 116300 Liaoning city in Dalian Province, the western suburbs of Wafangdian City City Industrial Park nineo-nine Park Applicant after: Dalian Nineo-Nine Manufacture Co., Ltd. Address before: 116300 Liaoning city in Dalian Province, the western suburbs of Wafangdian City City Industrial Park nineo-nine Park Applicant before: Dalian Nineo-Nine Technology Co., Ltd. |
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Open date: 20100217 |