CN101646331A - Radiating device - Google Patents
Radiating device Download PDFInfo
- Publication number
- CN101646331A CN101646331A CN200810303613A CN200810303613A CN101646331A CN 101646331 A CN101646331 A CN 101646331A CN 200810303613 A CN200810303613 A CN 200810303613A CN 200810303613 A CN200810303613 A CN 200810303613A CN 101646331 A CN101646331 A CN 101646331A
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- fins
- groups
- heat abstractor
- substrate
- fan
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Abstract
The invention relates to a radiating device which is used for the radiation of electronic elements on a circuit board. The radiating device comprises a substrate contacted with the electronic elements, a radiating fin set arranged above the substrate and a fan positioned at one side of the radiating fin set. The radiating device also comprises an all-in-one-shaped fixing frame which comprises a base connected with the substrate and two side walls which are integrally extended from both opposite sides of the base and enclose the radiating fin set, and the fan is fixed on the fixing frame through the two side walls. Compared with the prior art, the fixing frame of the radiating device is integrally punched and formed and has simple manufacture and working procedure saving, thereby reducing the manufacturing cost of the radiating device, and the fan is directly fixed on the fixing frame, thus when the radiating device works, the deformation of radiating fins of the radiating fin set because of the vibration of the fan is avoided, thereby guaranteeing the radiating efficiency of the radiating device.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly to the heat abstractor of electronic element radiating.
Background technology
As everyone knows, electronic component such as central processing unit produces a large amount of heat in running.For preventing that thereby this electronic component from making its temperature rising cause its fluctuation of service, this electronic component need install a heat abstractor usually additional with auxiliary its heat radiation because of the accumulation of heat.
Traditional heat abstractor comprise a base that is sticked with electronic component, a groups of fins that is connected with base, sheathed described groups of fins in it a wind scooper and be installed in a fan of wind scooper one side.The relative both sides of described wind scooper are provided with installation portion.Some screws pass the installation portion of fan and wind scooper and cooperate with fin, thereby fan and wind scooper are installed on the radiator.Owing to frequently shake during fan work, screw is got loose from groups of fins, thereby make wind scooper fixing unstable, make fin produce deformation simultaneously, and then influence the stability and the radiating efficiency of heat abstractor.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor of making simple and good heat dispersion performance.
A kind of heat abstractor, be used for the electronic element radiating on the circuit board, comprise a substrate that contacts with electronic component, be arranged at a groups of fins of substrate top and be positioned at a fan of groups of fins one side, described heat abstractor also comprises an integrally formed fixed mount, described fixed mount comprises that one connects the base of substrate and extends from the relative both sides of base one described groups of fins is enclosed therebetween two sidewalls, and described fan is fixed on the described fixed mount by described two sidewalls.
Compared with prior art, the fixed mount of heat abstractor of the present invention is that integrated punching forms, make simple, save operation, thereby reduced the manufacturing cost of heat abstractor, and fan is directly fixed on the fixed mount, during heat abstractor work, avoided causing the fin distortion of groups of fins, thereby guaranteed the radiating efficiency of heat abstractor because of the fan vibrations.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the inversion figure of heat abstractor among Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of heat abstractor among Fig. 1.
Fig. 4 is the inversion figure of Fig. 3.
Embodiment
As shown in Figures 1 and 2, heat abstractor of the present invention is used for being fixed in heat-generating electronic elements (figure does not show) heat radiation on the circuit board (figure does not show).This heat abstractor comprise with a substrate 20 of this heat-generating electronic elements contact, be positioned at substrate 20 tops a groups of fins 50, be connected four U-shaped heat pipes 30 of groups of fins 50 and substrate 20, a fan 60 that is positioned at substrate 20 tops and this groups of fins 50 is enclosed its a fixed mount 10 and is fixed in fixed mount 10 1 sides.
These fixed mount 10 integrated punchings form, and comprise a base 11 and the two mutual parallel sidewalls 13 that extend vertically upward from base 11 relative both sides.This base 11 comprise a middle part offer the rectangular base plate 110 of rectangular aperture 1101, under base plate 110 4 angles, outward extending four fixed arms 112 and two linking arms 114 that extend from base plate 110 relative two lateral bucklings.Four locking parts 70 pass four fixed arms 112 respectively and cooperate with circuit board and this fixed mount 10 is fixed on the circuit board.Each linking arm 114 is roughly L-shaped, comprises that a plate 1141 that extends vertically upward from base plate 110 1 sides reaches from the vertical outward extending extension board 1143 of connecting plate 1141 upper end-face edges.Each sidewall 13 extends upward formation from the edge-perpendicular of corresponding extension board 1143.Each sidewall 13 comprise with the vertical rectangle transition parts 131 that link to each other of extension board 1143 of linking arm 114 and from transition part 131 tops a upwardly extending rectangle installation portion 133.This transition part 131 is positioned at the middle part, lower end of installation portion 133, and area is little than installation portion 133.The two ends up and down of installation portion 133 1 sides of each sidewall 13 are respectively arranged with a lock and establish portion 135, thereby be used for cooperating with fan 60 fan 60 are fixed to fixed mount 10.
This substrate 20 is made by the heat conductivility good metal, has the rectangle convex extension part 22 that a roughly rectangular portion that is sticked 21 reaches from these portion's 21 upper surface middle part that are sticked upwards protrude out.This portion 21 that is sticked is used for being sticked with heat-generating electronic elements.This convex extension part 22 is corresponding with the opening 1101 of the base plate 110 of fixed mount 10, and it passes opening 1101 and is connected with heat pipe 30.
Described each heat pipe 30 has a straight endotherm section 31, outwards bends two linkage sections 33 of extension and the vertical heat release section 35 of extending from each linkage section 33 from endotherm section 31 opposite ends.The endotherm section 31 of these heat pipes 30 is sticked with the convex extension part 22 of substrate 20, in order to the heat of absorptive substrate 20.One fixture 40 is used for fixing heat pipe 30.This fixture 40 has the pressing plate 41 and downward, outside vertically extending two fixed parts 43 of self-pressing plate 41 opposite ends of a lengthwise.Fixture 40 is striden and is established heat pipe 30, and its two fixed part 43 is attached at the relative both sides of opening 1101 of the base plate 110 of fixed mount 10 respectively.Two screws 45 pass substrate 20 the portion that is sticked 21, fixed mount 10 base plate 110 and cooperate with two fixed parts 43 of fixture 40 and substrate 20, fixture 40 be fixed on the fixed mount 10.The endotherm section 31 of heat pipe 30 is located in 22 of the convex extension parts of the press section 41 of fixture 40 and substrate 20.
Please consult Fig. 3 and Fig. 4 simultaneously, described groups of fins 50 is located in 13 of two sidewalls of fixed mount 10, the whole height of groups of fins 50 is slightly smaller than the height of sidewall 13 installation portions 133, groups of fins 50 is slightly smaller than the width of sidewall 13 installation portions 133 along the width of fan 60 axial directions, thereby makes groups of fins 50 be located between the installation portion 133 of two sidewalls 13 fully and do not contact with sidewall 13.This groups of fins 50 is parallel to each other and fin 51 that equidistant buckle is provided with by some.The relative both sides of each fin 51 dash respectively and are provided with four-way hole 53.The condensation segment 35 of heat pipe 30 is arranged in respectively in these through holes 53, welds and support these fin 51.Groups of fins 50 is provided with at interval with the endotherm section 31 of heat pipe 30.
Described fan 60 is positioned at a side of radiator fin group 50, and to establish portion 135 corresponding with the lock of fixed mount 10.This fan 60 comprises the two square plate bodys that be arranged in parallel 61,63, and four jiaos of this two plate body 61,63 offer corresponding installing hole 611,631 respectively.Four long spiro nails 65 pass the installing hole 611,631 of fan 60 respectively, and establish portion 135 with the lock of fixed mount 10 and cooperate, thereby fan 60 is fixed on the fixed mount 10.
Among the present invention, fixed mount 10 forms for integrated punching, make simple, save operation, thereby reduced the manufacturing cost of heat abstractor, and the sidewall 13 of fan 60 and fixed mount 10 and groups of fins 50 setting at interval, during heat abstractor work, avoided causing fin 51 distortion of groups of fins 50, thereby guaranteed the radiating efficiency of heat abstractor because of fan 60 vibrations; In addition, fixed mount 10 of the present invention not only has structure such as the fixed arm 112 sealed with circuit board, also has with the sealed structure example of fan 60 such as the lock of sidewall 13 to establish portion 135, and the sidewall 13 of this fixed mount 10 also has the wind-guiding function of wind scooper concurrently simultaneously.
Claims (10)
1. heat abstractor, be used for the electronic element radiating on the circuit board, comprise a substrate that contacts with electronic component, be arranged at a groups of fins of substrate top and be positioned at a fan of groups of fins one side, it is characterized in that: described heat abstractor also comprises an integrally formed fixed mount, described fixed mount comprises that one connects the base of substrate and extends from the relative both sides of base one described groups of fins is enclosed therebetween two sidewalls, and described fan is fixed on the described fixed mount by described two sidewalls.
2. heat abstractor as claimed in claim 1 is characterized in that: described fan and groups of fins are provided with at interval.
3. heat abstractor as claimed in claim 1, it is characterized in that: the whole height of described groups of fins is slightly smaller than the height of sidewall, groups of fins is slightly smaller than the width of sidewall along the width of fan axial direction, thereby groups of fins is located between two sidewalls fully.
4. as any described heat abstractor of claim 1 to 3, it is characterized in that: the two ends up and down of a side of each sidewall are respectively arranged with a lock and establish portion, thereby be used for cooperating with fan fan are fixed to fixed mount.
5. heat abstractor as claimed in claim 1, it is characterized in that: also comprise the some heat pipes that connect described groups of fins and substrate, described each heat pipe has the endotherm section that is sticked with substrate, from two heat release section that the bending of endotherm section opposite end is extended, described heat release section wears and supports described groups of fins.
6. heat abstractor as claimed in claim 5, it is characterized in that: described base comprises a base plate, from four jiaos of outward extending four fixed arms of base plate, described substrate is fixed on the base plate and with heat pipe and is connected, and some locking parts pass these fixed arms respectively and cooperate with circuit board.
7. heat abstractor as claimed in claim 6, it is characterized in that: described base comprises the two L shaped linking arms that extend from relative two lateral bucklings of base plate, each linking arm comprises that described extension board is connected with corresponding side walls from the upwardly extending a plate of base plate one side and from the outward extending extension board of connecting plate upper end-face edge.
8. heat abstractor as claimed in claim 7 is characterized in that: described each sidewall comprises that a transition part that links to each other with linking arm reaches from the transition part top a upwardly extending rectangle installation portion, and described groups of fins is located between two installation portions.
9. heat abstractor as claimed in claim 5 is characterized in that: described substrate comprises a portion of being sticked that is sticked with electronic component and from the convex extension part that the described portion's upper surface that is sticked upwards protrudes out, described convex extension part wears the base plate of described fixed mount and is connected with heat pipe.
10. heat abstractor as claimed in claim 9 is characterized in that: a fixture stride the endotherm section of establishing heat pipe and with the screw fit of the base plate that wears substrate and fixed mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810303613A CN101646331B (en) | 2008-08-08 | 2008-08-08 | Radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810303613A CN101646331B (en) | 2008-08-08 | 2008-08-08 | Radiating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101646331A true CN101646331A (en) | 2010-02-10 |
| CN101646331B CN101646331B (en) | 2012-09-19 |
Family
ID=41657973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810303613A Expired - Fee Related CN101646331B (en) | 2008-08-08 | 2008-08-08 | Radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101646331B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200796A (en) * | 2012-01-06 | 2013-07-10 | Tdk株式会社 | Electronic device chassis and electronic device |
| CN107104083A (en) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | Buckling component, radiating subassembly and the combining structure with chipset of low air loss |
| TWI703919B (en) * | 2019-05-03 | 2020-09-01 | 大陸商深圳興奇宏科技有限公司 | Fixing fastener of liquid cooling heat dissipation device and liquid cooling heat dissipation module thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2479568Y (en) * | 2001-04-12 | 2002-02-27 | 赐得利企业有限公司 | Improved device of radiator for central controller |
| CN2528111Y (en) * | 2002-01-26 | 2002-12-25 | 富准精密工业(深圳)有限公司 | Radiator |
| CN2562367Y (en) * | 2002-06-28 | 2003-07-23 | 林三原 | Improved radiator combining structure |
| CN2632363Y (en) * | 2003-05-20 | 2004-08-11 | 奇鋐科技股份有限公司 | CPU radiatnig module |
-
2008
- 2008-08-08 CN CN200810303613A patent/CN101646331B/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200796A (en) * | 2012-01-06 | 2013-07-10 | Tdk株式会社 | Electronic device chassis and electronic device |
| CN103200796B (en) * | 2012-01-06 | 2016-01-20 | Tdk株式会社 | Electronic equipment framework and electronic equipment |
| CN107104083A (en) * | 2016-02-19 | 2017-08-29 | 恩佐科技股份有限公司 | Buckling component, radiating subassembly and the combining structure with chipset of low air loss |
| TWI703919B (en) * | 2019-05-03 | 2020-09-01 | 大陸商深圳興奇宏科技有限公司 | Fixing fastener of liquid cooling heat dissipation device and liquid cooling heat dissipation module thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101646331B (en) | 2012-09-19 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120919 Termination date: 20140808 |
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| EXPY | Termination of patent right or utility model |