CN101645440A - 具有预防单胞热电损毁功能的多胞连接大功率光电器件 - Google Patents
具有预防单胞热电损毁功能的多胞连接大功率光电器件 Download PDFInfo
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- CN101645440A CN101645440A CN200910027432A CN200910027432A CN101645440A CN 101645440 A CN101645440 A CN 101645440A CN 200910027432 A CN200910027432 A CN 200910027432A CN 200910027432 A CN200910027432 A CN 200910027432A CN 101645440 A CN101645440 A CN 101645440A
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- 238000005516 engineering process Methods 0.000 description 13
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- 229910002601 GaN Inorganic materials 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
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- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910005540 GaP Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
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- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910027432A CN101645440A (zh) | 2009-05-06 | 2009-05-06 | 具有预防单胞热电损毁功能的多胞连接大功率光电器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200910027432A CN101645440A (zh) | 2009-05-06 | 2009-05-06 | 具有预防单胞热电损毁功能的多胞连接大功率光电器件 |
Publications (1)
Publication Number | Publication Date |
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CN101645440A true CN101645440A (zh) | 2010-02-10 |
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CN200910027432A Pending CN101645440A (zh) | 2009-05-06 | 2009-05-06 | 具有预防单胞热电损毁功能的多胞连接大功率光电器件 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103296181A (zh) * | 2013-06-17 | 2013-09-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | 平衡热场分布的超大功率光电器件 |
CN104241412A (zh) * | 2013-06-17 | 2014-12-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种改善热分布集中的超大功率光电器件 |
-
2009
- 2009-05-06 CN CN200910027432A patent/CN101645440A/zh active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103296181A (zh) * | 2013-06-17 | 2013-09-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | 平衡热场分布的超大功率光电器件 |
CN104241412A (zh) * | 2013-06-17 | 2014-12-24 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种改善热分布集中的超大功率光电器件 |
CN103296181B (zh) * | 2013-06-17 | 2015-10-28 | 中国科学院苏州纳米技术与纳米仿生研究所 | 平衡热场分布的超大功率光电器件 |
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Owner name: SUZHOU INSTITUTE OF NANO-TECH AND NANO-BIONICS(SIN Free format text: FORMER OWNER: SUZHOU NANO TECHNIQUE + NANO BIONIC RESEARCH INST. Effective date: 20100907 |
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Free format text: CORRECT: ADDRESS; FROM: 215125 NO.398, RUOSHUI ROAD, GAOJIAO DISTRICT, DUSHUHU, INDUSTRIAL PARK, SUZHOU CITY, JIANGSU PROVINCE TO: 215123 NO.398, RUOSHUI ROAD, INDUSTRIAL PARK, SUZHOU CITY, JIANGSU PROVINCE |
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Effective date of registration: 20100907 Address after: 215123 Suzhou Industrial Park, Jiangsu, if waterway No. 398 Applicant after: Suzhou Institute of Nano-Tech and Bionics (SINANO), Chinese Academy of Sciences Address before: 215125 Jiangsu city of Suzhou province Dushu Lake Industrial Park No. 398 waterway if higher education Applicant before: Suzhou Nano Technique & Nano Bionic Research Inst. |
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Open date: 20100210 |