CN101636275B - Thermal print head - Google Patents
Thermal print head Download PDFInfo
- Publication number
- CN101636275B CN101636275B CN2008800060700A CN200880006070A CN101636275B CN 101636275 B CN101636275 B CN 101636275B CN 2008800060700 A CN2008800060700 A CN 2008800060700A CN 200880006070 A CN200880006070 A CN 200880006070A CN 101636275 B CN101636275 B CN 101636275B
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- China
- Prior art keywords
- layer
- mentioned
- heating resistor
- thermal printer
- printer head
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33525—Passivation layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3353—Protective layers
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- Electronic Switches (AREA)
Abstract
A thermal print head (A) is provided with an insulating board (1), a heating resistor (2) arranged on the board (1), and a protection film (4) covering the heating resistor (2). The protection film (4) is composed of a first layer (41), a second layer (42) and a third layer (43). The first layer (41) is brought into contact with the heating resistor (2). The second layer (42) covers the first layer (41). The second layer (42) is harder than the first layer (41), and has a thermal conductivity higher than that of the first layer (41). The third layer (43) is an outermost layer covering the second layer (42). The third layer (43) is harder than the second layer (42) and is thinner than the second layer (42).
Description
Technical field
The present invention relates to the thermal printer head that uses on a kind of thermal printer.
Background technology
The device (for example with reference to patent documentation 1) of thermal printer head for printing desirable image or literal by recording mediums such as heat-sensitive paper are heated up partly.Fig. 3 shows an example of existing thermal printer head.Thermal printer head X shown in this Fig. 3 comprises the substrate 91 that is formed with part enamel 92, disposes electrode pattern 93 on substrate 91.In addition, be formed with the heating resistor 94 that is connected on the electrode pattern 93 and on main scanning direction, extends on the substrate 91.Heating resistor 94 is covered by diaphragm 95.During printing, heat-sensitive paper under the state that protected film 95 is pushed, relative motion on sub scanning direction.
In the printing of having used above-mentioned thermal printer head X, the attachment phenomenon that heat-sensitive paper sticks on the diaphragm 95 becomes problem.Usually, on the surface of heat-sensitive paper, be applied with resinous coat.This resinous coat is because from the heat of thermal printer head X and fusion is attached on the diaphragm 95.Under this state, when resinous coat solidified, heat-sensitive paper pasted on the diaphragm 95.This attachment phenomenon of the fast more easy more generation of print speed printing speed.This be owing to the pressing force that makes diaphragm 95 with heat-sensitive paper for high speed printing increase or above-mentioned resinous coat easily by heating rapidly, the cause of cooling rapidly.
Patent documentation 1: TOHKEMY 2002-2005 communique.
Summary of the invention
The present invention makes on the basis of above-mentioned situation, and therefore, problem of the present invention is, a kind of high speed that can take into account printing is provided and suppresses the two thermal printer head of attachment phenomenon.
Comprise by thermal printer head provided by the invention: substrate, by the heating resistor of aforesaid substrate supporting with cover the diaphragm of above-mentioned heating resistor.Said protection film constitutes by first, second and third layer.Above-mentioned ground floor directly contacts with above-mentioned heating resistor.The above-mentioned second layer covers above-mentioned ground floor, and is harder than above-mentioned ground floor.In addition, the above-mentioned second layer has the pyroconductivity bigger than above-mentioned ground floor.Above-mentioned the 3rd layer covers the above-mentioned second layer, harder than the above-mentioned second layer.In addition, above-mentioned threeply degree is littler than the above-mentioned second layer.
Preferred above-mentioned the 3rd layer thickness is 0.05～0.5 μ m.
According to said structure,, can strengthen the heat transfer coefficient of said protection film integral body by the above-mentioned second layer is set.This helps making heat from above-mentioned heating resistor to the heat-sensitive paper transmission, is suitable for realizing the high speed that prints.By make as outermost above-mentioned the 3rd layer the hardest, can make the detrusion of the said protection film in the printing less.Thus, heat-sensitive paper is taken off from said protection film easily, can suppress attachment phenomenon.Be more than the 0.05 μ m preferably by making above-mentioned the 3rd layer thickness, the effect of the above-mentioned detrusion that can be inhibited more fully.On the other hand, be below the 0.5 μ m by making above-mentioned the 3rd layer thickness, the pyroconductivity of said protection film integral body is reduced unreasonably.In addition, in the manufacturing process of above-mentioned thermal printer head, can prevent owing to above-mentioned the 3rd layer formation causes that aforesaid substrate is exceedingly crooked.
Preferred above-mentioned the 3rd layer is made of any of TaN or TiN-SiAlON.Such material is suitable for making above-mentioned the 3rd layer to become layer harder than the above-mentioned second layer and that pyroconductivity is bigger.In addition, TaN or TiN-SiAlON are the material of good waterproof performance.Therefore, the 3rd layer that is made of these materials is suitable for well the resinous coat after the fusion being flicked, and is suitable for realizing suppressing attachment phenomenon.
Can further understand other feature and advantage of the present invention by following being described in detail with reference to the accompanying drawings.
Description of drawings
Fig. 1 illustrates to want portion's cutaway view based on an example of thermal printer head of the present invention.
Fig. 2 is the vertical view of wanting portion that the thermal printer head of Fig. 1 is shown.
Fig. 3 be illustrate existing thermal printer head an example want portion's cutaway view.
The specific embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is specifically described.
Fig. 1 and Fig. 2 show the example based on thermal printer head of the present invention.Illustrated thermal printer head A has substrate 1, electrode pattern 2, heating resistor 3 and diaphragm 4.Moreover, in Fig. 2,, only show electrode pattern 2 and heating resistor 3 in order to understand conveniently.
Substrate 1 is for example made for aluminium oxide ceramics for the insulated substrate of the rectangle that extends on main scanning direction.Upper surface at substrate 1 is formed with part enamel 11.The band shape of part enamel 11 on main scanning direction, extending.Understand ground as the cutaway view from Fig. 1, part enamel 11 bloats on the thickness direction of substrate 1 (among Fig. 1 upward to).
Electrode pattern 2 is used for including common electrode 21 and a plurality of absolute electrodes 22 as illustrated in fig. 2 to heating resistor 3 energisings.Common electrode 21 is included in band-like portions of extending on the main scanning direction and a plurality of dendritic part of extending on sub scanning direction upper comb dent shape ground from these band-like portions.A plurality of absolute electrodes 22 are arranged along main scanning direction alternately with above-mentioned a plurality of dendritic parts.Electrode pattern 2, is fired the cream after this coating and form after on the substrate 1 by resin acid (resinate) Au cream thick film screen printing for example.
Heating resistor 3 is the pyrotoxin of thermal printer head A.The band shape of heating resistor 3 for extending on main scanning direction crossed over the above-mentioned a plurality of dendritic parts of common electrode 21 and the fore-end of each absolute electrode 22.When passing through a common electrode 21 and a selecteed absolute electrode 22 to heating resistor 3 energisings, part that contacts with this absolute electrode 22 in the heating resistor 3 and near heating thereof.Heating resistor 3 is fired behind thick film screen printing by for example ruthenium-oxide cream and is formed.
As shown in Figure 1, diaphragm 4 covers heating resistors 3, by ground floor 41, the second layer 42, constitute for the 3rd layer 43.
Ground floor 41 directly contacts with heating resistor 3, for example by SiO
2Amorphous glass such as-ZnO-MgO class glass constitute.The thickness of ground floor 41 is about 6 μ m.The hardness of the ground floor 41 that is made of above-mentioned material is about 600Hk.Ground floor 41 for example can form by firing behind the printing coated glass cream.
The second layer 42 is made of as the big for example SiC of the amorphous glass of the material of ground floor 41 thermal conductivity ratio, and its thickness is about 4 μ m.The hardness of the second layer 42 that is made of this material is about 1300Hk.The second layer 42 for example forms by sputter.
For example be made of TaN for the 3rd layer 43, its thickness is about 0.1 μ m.Moreover this thickness is an example only, is not defined.In the present invention, the 3rd layer 43 thickness can be taken as the value of suitably selecting from the scope of for example 0.05～0.5 μ m.The 3rd layer 43 the hardness that is made of above-mentioned material is about 1400～1500Hk.For example form for the 3rd layer 43 by sputter.
Below, the effect of thermal printer head A is described.
Because the above-mentioned second layer 42 is made of SiC, the ground floor 41 that the thermal conductivity ratio amorphous glass constitutes big.Therefore, compare by the situation that amorphous glass forms, can make the coefficient of heat conduction of diaphragm 4 big with for example diaphragm 4 integral body.This heat that helps the resistive element of spontaneous heating in the future 3 is fit to the high speed of printing to the heat-sensitive paper transmission.
In addition, as mentioned above, have in constituting 3 layers of diaphragm 4 as outermost the 3rd layer of 43 structure the hardest, therefore, even heat-sensitive paper is big to the pressing force of diaphragm 4, the 3rd layer 43 also is difficult to detrusion.Its result, heat-sensitive paper peels from diaphragm 4 easily, can suppress attachment phenomenon.In order to suppress the 3rd layer 43 detrusion, the thickness that preferably makes the 3rd layer is more than the 0.05 μ m.On the other hand, be below the 0.5 μ m by making the 3rd layer 43 thickness, can prevent that the coefficient of heat conduction of diaphragm 4 integral body from diminishing unreasonably.Like this, can not damage transmission facilitation effect, can realize the inhibition effect of adhering to above-mentioned from the heat of heating resistor 3.In addition, be below the 0.5 μ m by making the 3rd layer 43 hard relatively thickness, can avoid in the manufacturing process of thermal printer head A, forming the overbending of the 3rd layer of 43 o'clock substrate 1.
As the TaN of the 3rd layer 43 material is that the contact angle of water droplet is the material that ratio about 60 degree is easier to drying.Therefore, even the resinous coat fusion of heat-sensitive paper also can be flicked by the 3rd layer of 43 resinous coat with fusion.Thereby, can prevent that resinous coat attached on the 3rd layer 43, is suitable for the inhibition of attachment phenomenon.
Thermal printer head of the present invention is not defined to above-mentioned embodiment.For example be not limited to TaN, also can use TiN-SiAlON as the 3rd layer material.The material of the second layer of TiN-SiAlON ratio such as SiC etc. is hard, and the contact angle that is water droplet is the material that the ratio about 58 degree is easier to drying.Thereby, even using under the situation of this material, also can realize taking into account the high speed of above-mentioned printing and suppress attachment phenomenon the two.
Claims (3)
1. thermal printer head comprises:
Substrate;
Heating resistor by described substrate supporting; With
Cover the diaphragm of described heating resistor,
Described diaphragm comprises with the contacted ground floor of described heating resistor, covers the second layer of this ground floor and cover the 3rd layer of this second layer; the described second layer is harder and have a pyroconductivity bigger than described ground floor than described ground floor; described the 3rd layer harder and thinner than the described second layer than the described second layer
Described ground floor is by SiO
2The amorphous glass of-ZnO-MgO constitutes.
2. thermal printer head as claimed in claim 1 is characterized in that:
Described the 3rd layer thickness is 0.05～0.5 μ m.
3. thermal printer head as claimed in claim 1 is characterized in that:
Described the 3rd layer is made of TaN or TiN-SiAlON.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP045937/2007 | 2007-02-26 | ||
| JP2007045937A JP2008207439A (en) | 2007-02-26 | 2007-02-26 | Thermal print head |
| PCT/JP2008/052958 WO2008105307A1 (en) | 2007-02-26 | 2008-02-21 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101636275A CN101636275A (en) | 2010-01-27 |
| CN101636275B true CN101636275B (en) | 2011-05-18 |
Family
ID=39721142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008800060700A Active CN101636275B (en) | 2007-02-26 | 2008-02-21 | Thermal print head |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7969459B2 (en) |
| JP (1) | JP2008207439A (en) |
| CN (1) | CN101636275B (en) |
| WO (1) | WO2008105307A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5825778B2 (en) * | 2010-12-10 | 2015-12-02 | ローム株式会社 | Thermal print head |
| CN103492186B (en) * | 2011-05-16 | 2016-04-20 | 京瓷株式会社 | Thermal head and possess the thermal printer of this thermal head |
| CN104039557B (en) * | 2012-02-28 | 2016-12-07 | 京瓷株式会社 | Thermal head and possess the thermal printer of this thermal head |
| US9440450B2 (en) | 2012-09-28 | 2016-09-13 | Kyocera Corporation | Thermal head and thermal printer provided with same |
| CN106536206B (en) * | 2014-07-29 | 2018-04-27 | 京瓷株式会社 | Thermal head and thermal printer |
| JP6499251B1 (en) * | 2017-09-27 | 2019-04-10 | アオイ電子株式会社 | Thermal head |
| JP7063442B2 (en) * | 2018-02-27 | 2022-05-09 | ローム株式会社 | Thermal print head |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2548011B2 (en) | 1983-07-01 | 1985-12-13 | Europ Propulsion | PROCESS FOR MAKING BIOACTIVE DEPOSITS OF CALCIUM PHOSPHATES AND PRODUCTS OBTAINED |
| JPS6034449U (en) * | 1983-12-16 | 1985-03-09 | 三菱電機株式会社 | thermal recording head |
| JP2520105B2 (en) | 1985-08-13 | 1996-07-31 | 旭化成工業株式会社 | Printer head and method of manufacturing the same |
| JPS6295245A (en) | 1985-10-22 | 1987-05-01 | Alps Electric Co Ltd | Thermal head |
| JPH02172758A (en) * | 1988-12-26 | 1990-07-04 | Seiko Instr Inc | Thermal head |
| JPH0449057A (en) * | 1990-06-18 | 1992-02-18 | Matsushita Electric Ind Co Ltd | Thin film type thermal head and manufacture thereof |
| JPH04110165A (en) | 1990-08-30 | 1992-04-10 | Fuji Xerox Co Ltd | Thermal head and manufacture thereof |
| JP3860348B2 (en) * | 1998-11-19 | 2006-12-20 | ローム株式会社 | Thermal print head and manufacturing method thereof |
| EP1195255A4 (en) * | 1999-06-15 | 2007-07-18 | Rohm Co Ltd | Thermal print head and method of manufacture thereof |
| JP2002002005A (en) | 2000-06-19 | 2002-01-08 | Rohm Co Ltd | Thick film type thermal printing head |
| US6441840B1 (en) | 2000-06-19 | 2002-08-27 | Rohm Co., Ltd. | Thick-film thermal printhead with improved paper transfer properties |
| JP2004230583A (en) * | 2003-01-28 | 2004-08-19 | Kyocera Corp | Thermal head and thermal printer using the same |
-
2007
- 2007-02-26 JP JP2007045937A patent/JP2008207439A/en active Pending
-
2008
- 2008-02-21 CN CN2008800060700A patent/CN101636275B/en active Active
- 2008-02-21 WO PCT/JP2008/052958 patent/WO2008105307A1/en active Application Filing
- 2008-02-21 US US12/528,516 patent/US7969459B2/en active Active
Non-Patent Citations (8)
| Title |
|---|
| JP平2-172758A 1990.07.04 |
| JP平4-110165A 1992.04.10 |
| JP平4-49057A 1992.02.18 |
| JP昭60-34449U 1985.03.09 |
| JP昭62-37170A 1987.02.18 |
| JP昭62-95245A 1987.05.01 |
| JP特开2000-153630A 2000.06.06 |
| JP特开2004-230583A 2004.08.19 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101636275A (en) | 2010-01-27 |
| WO2008105307A1 (en) | 2008-09-04 |
| JP2008207439A (en) | 2008-09-11 |
| US7969459B2 (en) | 2011-06-28 |
| US20100085412A1 (en) | 2010-04-08 |
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