CN101636066A

CN101636066A - Heat sink

Info

Publication number: CN101636066A
Application number: CN200810303072A
Authority: CN
Inventors: 彭学文; 陈锐华
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: RUGAO YONGXING CASING CO Ltd
Priority date: 2008-07-25
Filing date: 2008-07-25
Publication date: 2010-01-27
Anticipated expiration: 2028-07-25
Also published as: CN101636066B

Abstract

A heat sink used for radiating heat of two adjacent heating electronic elements comprises a first radiator arranged on one heating electronic element, a second radiator arranged parallel to the first radiator and arranged on the other heating electronic element and a plurality of heat pipes connecting the first and second radiators, wherein, each heat pipe comprises an evaporator section penetrating the first radiator, a condenser section penetrating the second radiator and a connection section between the evaporator section and the condenser section; the first radiator comprises a soaking plate stuck to one electronic element and a first fin group tightly stuck to the soaking plate; the first fin group is of honeycomb structure; the evaporator sections of the heat pipes are flat, are contained in the first fin group and are clamped between the first fin group and the soaking plate. The first fin group in the invention is of honeycomb structure, thus effectively increasing the heat radiating area; the soaking plate enables the heat from the heating electronic elements to be uniformly transmitted to the first fin group so as to fully utilize every part of the first fin group to radiate heat.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor especially with great heat radiation effect.

Background technology

Along with electronic industry constantly develops, electronic component (particularly central processing unit) speed of service and overall performance are in continuous lifting, and its caloric value is also in continuous increase thereupon.For making electronic component energy operate as normal, industry generally is provided with radiator it is dispelled the heat on electronic component.Usually, described radiator comprises a solid base that is sticked with heat-generating electronic elements, some fin by base extends upward also are provided with the heat pipe that connects base and fin for strengthening heat radiation, reach fin quickly with the heat with heat-generating electronic elements.Yet because the base of radiator is a solid, the heat that heat-generating electronic elements produces easily concentrates on the centre of base, can not be uniformly distributed in fast on the whole base, is unfavorable for that heat evenly reaches each fin.In addition, under the situation of radiator integral constancy of volume, the area of dissipation that the fin of traditional structure can provide is very limited, thereby radiating efficiency is lower.Therefore, need provide a kind of radiating efficiency higher heat abstractor.

Summary of the invention

In view of this, be necessary the heat abstractor that provides a kind of radiating efficiency higher.

A kind of heat abstractor, in order to two adjacent heat-generating electronic elements are dispelled the heat, comprise that one is arranged at first radiator on the heat-generating electronic elements wherein, be set up in parallel and be arranged at second radiator on another heat-generating electronic elements and be connected first with first radiator, some heat pipes of second radiator, each heat pipe comprises the evaporation section that penetrates first radiator, be located in the condensation segment of second radiator and the linkage section between evaporation section and condensation segment, described first radiator comprises that one is labelled to the soaking plate on an electronic component wherein and first fins group on soaking plate of closely being sticked, described first fins group has alveolate texture, the evaporation section of described heat pipe is flat, is housed in first fins group and is clamped between first fins group and the soaking plate.

Compared with prior art, first fins group has honeycomb among the present invention, effectively increases area of dissipation; Soaking plate makes the heat on the described wherein heat-generating electronic elements evenly reach first fins group, and each part that makes full use of first fins group is dispelled the heat, and effectively improves the radiating efficiency of heat abstractor.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional combination figure of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of Fig. 1.

Fig. 3 is the end view of first fins group among Fig. 1.

Embodiment

See also Fig. 1 and Fig. 2, heat abstractor in one embodiment of the present invention, be used for first and

second heater element

52,54 on the circuit board 50 is dispelled the heat second radiator 20 that this heat abstractor comprises first radiator 10, be arranged side by side with first radiator 10 and an opposite heat tube 30 of first and

second radiator

10,20 of hot link.Described first and

second radiator

10,20 is attached at first and

second heater element

52,54 respectively to its heat radiation.

Above-mentioned first radiator 10 comprises a bracing frame 12, be fixed on the soaking plate 14 on the bracing frame 12 and first fins group 16 on soaking plate 14 of being sticked.The soaking plate 14 and first fins group 16 are to fix by the mode of welding or stickup.Bracing frame 12 is rectangular, respectively establishes a fixing hole 120 near four jiaos of places, on fixing hole 120 and the circuit board 50 perforation 510 of setting corresponding so that screw 80 passes bracing frame 12 bracing frame 12 is fixed on the circuit board 50.Bracing frame 12 1 side centre positions are provided with a breach 122.Soaking plate 14 is a plate shaped heat pipe, is packaged with working media in it, so relative entity metal plate has good heat conductivity and the little advantage of quality.Soaking plate 14 is rectangular, and its shape size is complementary with bracing frame 12, so that soaking plate 14 just in time is attached on the bracing frame 12.One side of soaking plate 14 outwards protrudes out a bar shaped mouth-sealed portion 140; When soaking plate 14 was sticked at bracing frame 12, mouth-sealed portion 140 passed the breach 122 of bracing frame 12 and protrudes out outside bracing frame 12, avoids interfering with bracing frame 12.Described first fins group 16 is rectangular, and its honeycomb is to form by piling up the number of metal thin slice, and its honeycomb can be made up of polygons such as some circles, triangle, quadrangles, also can be to be formed by irregular polygon-shaped piecing together.In the present embodiment, the honeycomb that first fins group 16 has is made up of several hexagonal holes, and each hexagonal hole forms the gas channel 160 that air feed stream passes through, (consulting Fig. 3).An accepting groove 162 is also established in the bottom of first fins group 16, and heating tube 30 is accommodated in it, and the cross section of accepting groove 162 is a rectangle.

Described second radiator 20 comprises a base plate 22 and is attached at second fins group 24 of base plate 22.Base plate 22 is made by the heat conductivility good metal, and second fins group 24 has the structure identical with first fins group 16, promptly also has honeycomb, and the lower surface of second fins group 24 is fixed on the upper surface of base plate 22 by the welding or the mode of pasting.Second fins group 24 is interval with a pair of hole 240 of accommodating heat pipe 30 in its top.

Described each heat pipe 30 comprises evaporation section 32, a condensation segment 34 and the linkage section 36 between evaporation section 32 and condensation segment 34 of a flat.The upper and lower surface of evaporation section 32 is the plane, so that evaporation section 32 is contained in the accepting groove 162 of first fins group 16, the bottom surface coplane of its lower surface and first fins group 16, the lower surface that guarantees evaporation section 32 can directly be sticked upper surface in soaking plate 14 to obtain maximum contact area.Linkage section 36 comprises horizontal part 360 that connects evaporation section 32 and the rake 362 that connects condensation segment 34, horizontal part 360 and rake 362 antarafacial settings.Horizontal part 360 is parallel to each other and is provided with perpendicular to evaporation section 32, rake 362 and evaporation section 32 antarafacial settings, and the condensation segment 34 of being convenient to heat pipe 30 inserts in the hole 240 of second radiator 20 smoothly.

During assembling, screw 80 passes the fixing hole 120 of bracing frame 12 in turn, is fixed in the perforation 510 of circuit board 50, is fixed on first radiator 10 on the circuit board 50 and makes the bottom surface of soaking plate 14 be close to first heater element 52; Equally, the base plate 22 that screw 80 passes second radiator 20 is fixed on second radiator 20 on the circuit board 50, and second heater element 54 is close in the bottom surface of base plate 22 simultaneously.The evaporation section 32 of heat pipe 30 is housed in the accepting groove 162 of first fins group 16, the bottom surface coplane of its lower surface and first fins group 16 and be clamped to soaking plate 14 and first fins group 16 between, condensation segment 34 is located in the hole 240 of second radiator 20 at interval, at this moment, the horizontal part 360 of linkage section 36 is set in parallel in the side of first and

second radiator

10,20.

During work, the soaking plate 14 of first radiator 10 absorbs the heat of first heater element 52 and is distributed in quickly and evenly on the soaking plate 14, part heat is directly by 16 heat radiations of first fins group, another part is delivered to second fins group 24 of second radiator 20 by heat pipe 30, and is transmitted to its bottom by second fins group, 24 tops; Simultaneously, the base plate 22 of second radiator 20 absorbs the heat of second heater element 54 and upwards transmits fast, is promptly transmitted to its top fast by the bottom of second fins group 24.So far, the heat of first and

second heater element

52,54 is evenly distributed on second fins group 24 of second radiator 20, improves the utilance at second fins group, 24 middle parts, makes full use of each part of second fins group 24, promotes the radiating efficiency of heat abstractor.

First and

second fins group

16,24 is honeycomb among the present invention, has the advantage that volume is light, cooling surface area is big.In addition, the base plate 22 of second radiator 20 also can be made a soaking plate, so that even fast second fins group 24 with heat transferred to the second radiator 20.

Claims

1. heat abstractor, in order to two adjacent heat-generating electronic elements are dispelled the heat, comprise that one is arranged at first radiator on the heat-generating electronic elements wherein, be set up in parallel and be arranged at second radiator on another heat-generating electronic elements and be connected first with first radiator, some heat pipes of second radiator, each heat pipe comprises the evaporation section that penetrates first radiator, be located in the condensation segment of second radiator and the linkage section between evaporation section and condensation segment, it is characterized in that: described first radiator comprises that one is labelled to the soaking plate on an electronic component wherein and first fins group on soaking plate of closely being sticked, described first fins group has alveolate texture, the evaporation section of described heat pipe is flat, is housed in first fins group and is clamped between first fins group and the soaking plate.

2. heat abstractor as claimed in claim 1 is characterized in that: the linkage section of described heat pipe comprises horizontal part that connects evaporation section and the rake that is connected condensation segment, and described horizontal part and rake antarafacial are provided with.

3. heat abstractor as claimed in claim 2 is characterized in that: the bottom surface coplane of the lower surface of the evaporation section of described heat pipe and first fins group.

4. heat abstractor as claimed in claim 3 is characterized in that: the horizontal part of described linkage section is set in parallel in the side of first and second radiator.

5. heat abstractor as claimed in claim 4 is characterized in that: the horizontal part of described linkage section is perpendicular to the evaporation section setting.

6. heat abstractor as claimed in claim 1 is characterized in that: described first radiator also comprises a bracing frame, and described soaking plate is fixed on the bracing frame.

7. heat abstractor as claimed in claim 6 is characterized in that: the described soaking plate one side mouth-sealed portion that stretches out, described mouth-sealed portion pass a side of bracing frame and protrude out a side at first radiator.

8. heat abstractor as claimed in claim 7 is characterized in that: the side of support frame as described above is offered a breach, and the mouth-sealed portion of described soaking plate passes the breach of bracing frame and is fixed on the bracing frame.

9. heat abstractor as claimed in claim 1, it is characterized in that: described second radiator comprises that one adheres on the base plate on another heat-generating electronic elements and is installed on described base plate and has second fins group of alveolate texture, and the condensation segment of described heat pipe is located in second fins group of second radiator at interval.