CN101634547B - System and method for measuring double-laser noncontact thickness - Google Patents
System and method for measuring double-laser noncontact thickness Download PDFInfo
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- CN101634547B CN101634547B CN2008101332973A CN200810133297A CN101634547B CN 101634547 B CN101634547 B CN 101634547B CN 2008101332973 A CN2008101332973 A CN 2008101332973A CN 200810133297 A CN200810133297 A CN 200810133297A CN 101634547 B CN101634547 B CN 101634547B
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Abstract
The invention provides a system and a method for measuring double-laser noncontact thickness. The system is provided with a pair of movable laser measurers; a thickness correcting jig is arranged in motion paths of the pair of laser measurers, and provides a reference thickness; a signal processing device is electrically connected with the pair of laser measurers; thus, the pair of laser measurers can scan two opposite surfaces of an object to be measured, and the thickness of the object to be measured can be acquired by comparing signals; during use for certain time, the pair of laser measurers can reacquire a measuring signal from the thickness correcting jig and compare the measuring signal and the previous measuring signal corresponding to the reference thickness to acquire the drifting situation of the laser signals; moreover, a parallelism correcting jig is arranged on the pair of laser measurers and provides a parallelism error compensating value; and the accuracy of measurement can be improved by adding the correcting value of laser signal shift and the parallelism error compensating value into the measuring result.
Description
Technical field
The present invention relates to a kind of amount of thickness examining system and method, particularly, a kind of have contactless thickness measurement system of double-laser and a method.This amount of thickness examining system has a pair of laser measuring appliance in order to measure the thickness of a thing to be measured, and arrange in pairs or groups a thickness correction tool and a parallel alignment tool to be producing a laser signal drift compensation value and a parallelism error offset respectively, and add in the THICKNESS CALCULATION of thing to be measured to improve the accuracy of measuring.
Background technology
General industrial community can utilize vernier scale or micrometer caliper to measure a thing thickness to be measured, and this class instrument needs directly contact measured amount thing, so be not suitable for the surface for soft materials or the thing to be measured in moving.
Contactless amount of thickness examining system can be used for measuring the thickness of mobile thing to be measured, or the surface is the thickness of the thing to be measured of soft materials.In contactless amount of thickness examining system, can use vortex flow-capacitive displacement sensing apparatus or vortex flow-laser light sensing apparatus to be used as measuring sensor.The former cost of equipment is quite high, does not meet cost benefit; The latter then is to use to understand in the process and produces the drift of laser signal and cause measurement result inaccurate.
Use any measuring equipment all to need an offset axis parallel with thing to be measured.Yet be that manufacturing technology or package technique all can't fully make measuring equipment parallel fully with thing to be measured, can produce error so measure resulting thickness; Under the situation that environment temperature changes, the mechanical tissue framework has the distortion of certain degree, so signal can produce drift error and then make the measurement result of thickness accurate inadequately.
Below existing, thickness measurement device that aforementioned techniques disclosed needs the defective that solves: 1, use vortex flow-higher equipment cost of capacitance sensing apparatus needs; 2, use vortex flow-laser sensor, except the cost height, more need further to solve the laser signal and drift about the error that measurement result produced; 3, have assembly error between each member of common contactless amount of thickness examining system, and the thermal deformation errors that environment temperature caused, therefore need to solve of the influence of every error to measurement result.
Summary of the invention
Fundamental purpose of the present invention is to provide contactless amount of thickness examining system of a kind of double-laser and method, and the surface of the thing to be measured in moving by a pair of laser measuring appliance scanning one to be to obtain the measurement signal, can know the thickness of this thing to be measured after as calculated.
Another object of the present invention is to provide contactless amount of thickness examining system of a kind of double-laser and method, it has correction and the parallelism error compensation that can carry out the drift of laser signal, proofread and correct by this or compensation because of use, environment temperature and/or measuring error that mechanical tissue brought, and improve the accuracy of measuring according to this.
The objective of the invention is to be achieved by following technical proposals:
The contactless amount of thickness examining system of a kind of double-laser in order to measure the thickness of thing to be measured, is characterized in that:
A pair of movably laser measuring appliance is configured to relative mutually;
The thickness correction tool has a root thickness and is configured in this motion path to the laser measurer;
Signal process device electrically connects this to the laser measuring appliance;
This is obtained two to the laser measuring appliance to this thickness correction tool and measures signal, this signal process device calculates reference value to should root thickness with this measurement signal to the laser measuring appliance, and/or calculates laser drift error compensation value in order to compensate the thickness measurements of this thing to be measured.
The contactless amount of thickness examining system of a kind of double-laser in order to measure the thickness of thing to be measured, is characterized in that:
A pair of movably laser measuring appliance is configured to relative mutually;
The parallel alignment tool has the sensor of correction and correction sensing tool and is disposed at this on the laser measuring appliance;
Signal process device electrically connects this to the laser measuring appliance;
Wherein this moves the laser measuring appliance and with the thickness of measuring this determinand, and in this process that laser measuring appliance is moved, this correction sensor is obtained several to this correction sensing tool and is measured signal, and sends signal process device to and to calculate this everybody of laser measuring appliance mobile route put depth of parallelism offset.
The contactless thickness method for measurement of a kind of double-laser is characterized in that: comprise the steps
The root thickness measuring process is measured obtaining the measurement signal the thickness correction tool with a pair of laser measuring appliance, and is calculated root thickness through signal processing apparatus;
Thing thickness scanning step to be measured, this moves and scans relative two surfaces of the thickness direction of thing to be measured to the laser measuring appliance, and produces several measurement signals;
THICKNESS CALCULATION step, this signal process device receive this each position thickness signal measured to this thing to be measured to the laser measuring appliance, via calculating and comparing this root thickness to obtain measuring thickness.
The invention has the beneficial effects as follows: the designed thickness measurement system of the present invention has reduced the cost of existing product of the same type, and has improved measuring accuracy effectively, has avoided various measuring error.
Description of drawings
Fig. 1 is the principle schematic of thickness measure of the present invention.
Fig. 2 is a structure configuration synoptic diagram of the present invention.
Fig. 3 is the structure and the work synoptic diagram of a kind of parallel alignment tool of the present invention.
Fig. 4 is the structure and the work synoptic diagram of the another kind of parallel alignment tool of the present invention.
Fig. 5 penetrates the execution of measuring appliance and each tool and the interaction block schematic diagram of THICKNESS CALCULATION for electricity of the present invention.
Fig. 6 is a root thickness measuring process synoptic diagram of the present invention.
Fig. 7 is a thing thickness scanning step synoptic diagram to be measured of the present invention.
Fig. 8 is a laser drift correction synoptic diagram of the present invention.
Fig. 9 is a kind of parallelism error compensation process of the present invention synoptic diagram.
Figure 10 is the another kind of parallelism error compensation process of the present invention synoptic diagram.
The calcspar of Figure 11 contactless thickness method for measurement for the present invention carries out.
Embodiment
Below in conjunction with drawings and Examples the present invention is further described.
About measuring principle of the present invention, consult Fig. 1.Measure light L1 when laser measuring appliance A sends thing B to be measured, and measure light L1 and get back to laser measuring appliance A through forming a reflection ray L2 by this thing B to be measured surface, this moment, the light intensity of reflection ray L2 can convert the first signal value to; Distance between thing B to be measured and this laser measuring appliance A changes, and then measures light L1 and gets back to laser measuring appliance A through forming another reflection ray L3 by this thing B to be measured surface, and this moment, the light intensity of reflection ray L3 can convert the second signal value to; The signal relation of this first signal value and this second signal value can be converted into distance (thickness).
According to aforementioned principles, consult Fig. 2.The thickness measurement system that the present invention is designed is offered passage 12 usefulness that run through structure at support 10 and is passed through for thing 200 to be measured (for example film or sheet material).
Two line rails 13 and 14 are provided in this passage 12 both sides abreast.Driving mechanism 15 comprises motor 152, rule belt 156 and 158 rotates when driving two that transmission shaft 154 and this transmission shaft 154 drive.This driving mechanism 15 is provided on this support 10, wherein should the time advise belt 156 and 158 and be parallel to two line rails 13 and 14 respectively.
Consult Fig. 2, a pair of laser measuring appliance 20 comprises one first laser measuring appliance 21 and one second laser measuring appliance 22. Laser measuring appliance 21 or 22 all is configured on slide block 23 and 24.This slide block 23 and 24 is respectively in conjunction with this on time rule belt 156 or 158 and line rail 13 and 14.In addition, laser measuring appliance 21 and 22 is toward each other and in alignment with same plumb line.
Consult Fig. 3, the lamellar body 42 collocation measuring appliances that parallel alignment tool 40 has reflection potential constitute; This lamellar body 42 is fixedly arranged on the first laser measuring appliance, 21 1 sides, and this measuring appliance is the second laser measuring appliance 22.This second laser measuring appliance 22 can send measures light to this lamellar body 42, and light can reflect back into the second laser measuring appliance, 22 formation correctiong signals.
Consult Fig. 4, this parallel alignment tool 40 also can be made of a vortex flow sensor 52 and a vortex flow sensing tool 54.This vortex flow sensor 52 is configured in the first laser measuring appliance, 21 1 sides, and vortex flow sensing tool 54 is configured in the second laser measuring appliance 22 and this vortex flow sensor 52 relatively.
Consult Fig. 5, this reciprocation to laser measuring appliance 20 and this thickness correction tool 30 can produce thickness measure signal, for example a magnitude of voltage as from the foregoing.This parallel alignment tool 40 or 50 runnings can produce depth of parallelism compensating signature, for example a magnitude of voltage.This thickness measure signal is sent to signal process device 60, calculates by analysis and can correspondence go out one-tenth-value thickness 1/10; This depth of parallelism compensating signature is sent to signal process device 60, calculates by analysis and can correspondence go out the parallelism error offset.
Consult Fig. 6, finish based on root thickness measurement step 70 about the measurement of root thickness.This step is first surface measurements 31 and second surface measurements 32 that the first laser measuring appliance 21 and the second laser measuring appliance 22 moved and aimed at this thickness correction tool 30.The first laser measuring appliance 21 can be obtained first surface measurements 31 and measure signal (a0); The second laser measuring appliance 22 can be obtained second surface measurements 32 and measure signal (b0); (a0 b0) is sent to the signal process device (not shown), and reaches the corresponding relation that calculating can obtain this signal value and thickness by analysis, and the thickness of this moment is root thickness D0 will to measure signal.
Consult Fig. 7, finish based on thing thickness scanning step 80 to be measured about the measurement of the thickness of thing to be measured.To be the first laser measuring appliance 21 move and scan the in-plane (being relative two surfaces of thickness direction) on relative two surfaces of thing 200 to be measured with the second laser measuring appliance 22 to this step abreast, and produce several measure signals (an, bn), n＞0 wherein.(an, bn) (a0, b0) comparison can obtain the many places thickness measurements Dn of this thing 200 to be measured to the thickness measure signal again through suitable conversion with the measurement signal of root thickness D0.Be understandable that, can further utilize one-tenth-value thickness 1/10 everywhere to calculate the average thickness Dav of thing to be measured.
Consult Fig. 8, finish based on laser drift correction step 90 because of variation of ambient temperature produces the signal drifting problem about the laser signal.This step be the first laser measuring appliance 21 and the second laser measuring appliance 22 through one period service time after, the place, place of this thickness correction tool 30 is got back in displacement again, and obtain thickness measure signal (a ' 0 again with the first laser measuring appliance 21 and 22 pairs first surface measurements 31 of the second laser measuring appliance and second surface measurements 32, b ' 0), the root thickness of this moment is constant.Therefore, (a0 b0), can access signal drift compensation value Δ S to calculate and compare the measurement signal of previous root thickness through the signal process device (not shown).When restarting thing thickness scanning step to be measured, this signal drift compensation value Δ S add this thing to be measured the thickness measure signal (an, bn) in, in the THICKNESS CALCULATION step, revise the measurement signal and the thickness of this thing to be measured by this.Above-mentioned laser drift correction step 90 is can be in measuring process, automatically performs according to certain cycle.
Consult Fig. 9, produce the compensation problem of parallelism error because of package technique or variation of ambient temperature, can finish based on parallelism error compensation process 100 about mechanical framework.This step system carries out before the thing thickness scanning to be measured, drives the first laser measuring appliance 21 and the second laser measuring appliance, 22 synchronous shift.On the throne moving past in the journey, the second laser measuring appliance 22 can be measured signal to the lamellar body 42 acquisition Pingdus that are configured in the first laser measuring appliance, 21 1 sides, and the signal value corresponding conversion of each position become a parallelism error offset Δ Hn, n＞0 wherein, and form a data bank information.When execution thing thickness to be measured scanned, the Thickness Measurement by Microwave of each position of thing to be measured can suitably add this parallelism error offset Δ Hn made measurement thickness more accurate.
Above-mentioned parallelism error compensation process 100 is to add with fixing parallelism error offset Δ Hn to measure in the thickness, but the variation of environment temperature is unfixed sometimes, therefore can adopt the pattern of instant compensation.
Consult Figure 10, about another parallelism error compensation process 110, tie up in the process of carrying out thing 200 thickness measures to be measured, the vortex flow sensor 52 that is configured in the first laser measuring appliance, 21 1 sides can be measured signals to vortex flow sensing tool 54 acquisition that is configured in the second laser measuring appliance, 22 1 sides, and immediately the signal corresponding conversion of each position is become a parallelism error offset Δ Hn.Δ Hn suitably added to make in the thickness measurements that to measure thickness more accurate.
Consult Figure 11, according to above each step that discloses, the present invention comprises the contactless thickness method for measurement of a kind of double-laser, and its concrete steps are as follows:
Root thickness measuring process 70 is measured to obtain a thickness correction tool with a pair of laser measuring appliance and to be measured signal (a0 b0), and calculates root thickness D0 through signal processing apparatus;
Thing thickness scanning step 80 to be measured moves and scans relative two surfaces of the thickness direction of thing to be measured to the laser measuring appliance, and produce most measure signals (an, bn), n＞0 wherein;
In addition, also include laser drift correction step 90, this to the displacement of laser measuring appliance with to should the thickness correction tool and obtain thickness measure signal (a ' 0 again, b ' 0), through this signal process device calculate and compare previous root thickness the measurement signal (a0, b0), obtain a signal drift compensation value Δ S, and with this signal drift compensation value Δ S add this thing to be measured the thickness measure signal (an, bn) in, to revise the measurement signal and the thickness of this thing to be measured.
And parallelism error compensation process 100 or 110, it utilizes the depth of parallelism signal between two laser measuring appliances of parallel alignment tool measurement, and calculate to produce parallelism error offset Δ H via this signal process device, this parallelism error offset is in order to add the measurement thickness of revising this thing to be measured in this THICKNESS CALCULATION step.
The above example is, be the present invention's preferred embodiment; it only is the design idea that illustrates the present invention; be not to be used to limit interest field of the present invention, all technological means with equalization realize that designed measuring system of the present invention all should be considered as within protection scope of the present invention.
Claims (7)
1. contactless amount of thickness examining system of double-laser in order to measure the thickness of thing to be measured, is characterized in that:
A pair of movably laser measuring appliance is configured to relative mutually;
The thickness correction tool has a root thickness and is configured in this motion path to the laser measurer;
Signal process device electrically connects this to the laser measuring appliance;
The parallel alignment tool, it is configured on the laser measuring appliance;
This is obtained two to the laser measuring appliance to this thickness correction tool and measures signal, this signal process device calculates reference value to should root thickness with this measurement signal to the laser measuring appliance, and/or calculates laser drift error compensation value in order to compensate the thickness measurements of this thing to be measured;
In this process that laser measuring appliance is moved, another this laser measuring appliance can be obtained several to this parallel alignment tool and measure signal, and sends signal process device to and put depth of parallelism offset with everybody who calculates this two lasers measuring appliance path of motion.
2. the contactless amount of thickness examining system of double-laser as claimed in claim 1 is characterized in that: this thickness correction tool has first surface measurements and second surface measurements, and the thickness between this first surface measurements and this second surface measurements is this root thickness.
3. the contactless amount of thickness examining system of double-laser as claimed in claim 1, it is characterized in that: described parallel alignment tool has the lamellar body of reflection potential.
4. the contactless amount of thickness examining system of double-laser as claimed in claim 1 is characterized in that: also comprise the parallel alignment tool, this parallel alignment tool is made of vortex flow sensor and vortex flow sensing tool; This vortex flow sensor configurations is on a laser measuring appliance, and this vortex flow sensing tool is configured in relative this vortex flow sensor on another laser measuring appliance; This is to laser measuring appliance moving process, and this vortex flow sensor is obtained several to this vortex flow sensing tool and measured signal, and sends signal process device to and to calculate this everybody of laser measuring appliance mobile route put depth of parallelism offset.
5. contactless amount of thickness examining system of double-laser in order to measure the thickness of thing to be measured, is characterized in that:
A pair of movably laser measuring appliance is configured to relative mutually;
The parallel alignment tool has the sensor of correction and correction sensing tool and is disposed at this on the laser measuring appliance;
Signal process device electrically connects this to the laser measuring appliance;
Wherein this moves the laser measuring appliance and with the thickness of measuring this determinand, and in this process that laser measuring appliance is moved, this correction sensor is obtained several to this correction sensing tool and is measured signal, and sends signal process device to and to calculate this everybody of laser measuring appliance mobile route put depth of parallelism offset.
6. the contactless amount of thickness examining system of double-laser as claimed in claim 5 is characterized in that: this correction sensor in the described parallel alignment tool is this laser measuring appliance; This correction sensing tool cording in this parallel alignment tool has a lamellar body of reflection potential and is configured on another this laser measuring appliance.
7. the contactless amount of thickness examining system of double-laser as claimed in claim 5 is characterized in that: described parallel alignment tool is made of vortex flow sensor and vortex flow sensing tool; This vortex flow sensor configurations is on a laser measuring appliance, and this vortex flow sensing tool is configured in relative this vortex flow sensor on another laser measuring appliance.
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| CN2008101332973A CN101634547B (en) | 2008-07-25 | 2008-07-25 | System and method for measuring double-laser noncontact thickness |
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| CN2008101332973A CN101634547B (en) | 2008-07-25 | 2008-07-25 | System and method for measuring double-laser noncontact thickness |
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| CN101634547B true CN101634547B (en) | 2011-08-03 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102538686A (en) * | 2010-12-09 | 2012-07-04 | 财团法人金属工业研究发展中心 | Thickness measurement method |
| CN103217118A (en) * | 2012-01-19 | 2013-07-24 | 昆山思拓机器有限公司 | Full-automatic SMT net plate thickness measuring method |
| CN104553040B (en) * | 2014-12-30 | 2016-05-25 | 中国航空工业集团公司北京航空精密机械研究所 | The compensation arrangement of the depth of parallelism between the flat board of two relative motions of a kind of correction |
| CN106247995A (en) * | 2016-09-05 | 2016-12-21 | 水利部交通运输部国家能源局南京水利科学研究院 | A kind of ship lift guide rail parallelism measuring method |
| CN108020164B (en) * | 2016-10-31 | 2020-10-13 | 泰科电子(上海)有限公司 | Thickness detection experiment platform |
| TWI629451B (en) * | 2017-04-14 | 2018-07-11 | 由田新技股份有限公司 | Object thickness measurement system, method, detecting apparatus, computer readable medium, and computer program product |
| CN109238092A (en) * | 2018-09-14 | 2019-01-18 | 佛山市恒力泰机械有限公司 | Ceramic adobe thickness online automatic detection method and device |
| CN109121156B (en) * | 2018-09-28 | 2021-10-22 | 硕讯科技（苏州）有限公司 | Noise budget control debugging measurement system for wireless communication product |
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| CN2677873Y (en) * | 2003-10-15 | 2005-02-09 | 财团法人精密机械研究发展中心 | Non-contact thickness measuring device |
| CN2788125Y (en) * | 2005-04-13 | 2006-06-14 | 嘉兴学院 | On-line monitoring device for measuring thickness of smooth surface plate |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2677873Y (en) * | 2003-10-15 | 2005-02-09 | 财团法人精密机械研究发展中心 | Non-contact thickness measuring device |
| CN2788125Y (en) * | 2005-04-13 | 2006-06-14 | 嘉兴学院 | On-line monitoring device for measuring thickness of smooth surface plate |
Non-Patent Citations (1)
| Title |
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| 王采国等.高温定板带厚度在线测量仪.《浙江工业大学学报》.1996,第24卷(第3期),第258-262页. * |
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