CN103217118A - Full-automatic SMT net plate thickness measuring method - Google Patents
Full-automatic SMT net plate thickness measuring method Download PDFInfo
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- CN103217118A CN103217118A CN2012100165823A CN201210016582A CN103217118A CN 103217118 A CN103217118 A CN 103217118A CN 2012100165823 A CN2012100165823 A CN 2012100165823A CN 201210016582 A CN201210016582 A CN 201210016582A CN 103217118 A CN103217118 A CN 103217118A
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Abstract
The invention relates to a full-automatic SMT net plate thickness measuring method which mainly resolves the problems that in existing full-automatic SMT net plate thickness measuring technology, measuring data cannot be stored and reused, and net plates cannot be combined into a whole. The full-automatic SMT net plate thickness measuring method is adopted and includes the steps: two Mark points are manufactured at two ends of a diagonal line of an SMT net plate in a laser cutting mode, and a coordinate system is established; placing the net plates on a double-vertical-type laser displacement sensor and a thickness measuring platform of a camera; measurement is conducted, a position actual machine platform coordinate (x1, y1) of a Mark 1 point is recorded, and at the same time, a machine platform coordinate (x2, y2) is recorded; automatic scanning is conducted, data are obtained according to the laser displacement sensors during the process of scanning, and thicknesses of the net plates on a patch are computed; and the technical scheme of a thickness chart, an upper surface arc face chart, and a lower surface arc face chart is generated. The problems are well resolved, and the full-automatic SMT net plate thickness measuring method can be applied to laser micro-processing industries.
Description
Technical field
The present invention relates to use in a kind of full-automatic the SMT web plate method for measuring thickness, particularly Laser Micro-Machining industry the measurement thickness of laser displacement sensor and the method for flatness.
Background technology
In the Laser Micro-Machining industry, for the SMT(surface installation technique) whether web plate all need to measure web plate thickness and meet the demands to check this web plate, and the general measure method is that the web plate that will need thickness measuring is put into and measures certain on the worktable in real time a bit or a certain area thickness and mark on web plate.But this method, if need other regional thickness information, then must be placed thicknessmeter with web plate and measure once more during reprocessing if take off web plate not to bit function, and increase repeats work and reduced production efficiency.As shown in Figure 1, web plate is placed off normal, and direction of scanning and web plate direction are inconsistent, and scanning obtains data and can't utilize again.This patent invent a kind of measurement web plate thickness and flatness, and can spanned file and web plate method of matching, generate the thickness of web plate and the surface chart and the web plate correspondence of flatness, when processing, only need need not repeatedly to carry out thickness measure with reference to thickness chart.
The invention provides a kind of full-automatic SMT web plate method for measuring thickness, promptly adopt the measurement thickness of laser displacement sensor and the method for flatness.
Summary of the invention
Technical matters to be solved by this invention is that to measure web plate thickness in the prior art single and can not represent the problem of specific region thickness.A kind of new full-automatic SMT web plate method for measuring thickness is provided, this method have the thickness measure of SMT web plate the efficient height, need not to carry out repeatedly thickness measure; The low advantage of accuracy height, error of SMT web plate thickness measure.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows: a kind of full-automatic SMT web plate method for measuring thickness comprises following several steps:
A) two ends on a diagonal line of SMT web plate use cut to make two Mark points, and set up coordinate system according to their physical location, and the coordinate that Mark1 is ordered is counted (0,0), the coordinate that Mark2 is ordered count (x, y);
B) web plate is put on the thickness measuring worktable, the thickness measuring worktable is equipped with double vertical laser displacement sensor and camera;
C) measure, at first camera moved near the Mark point, discern automatically, the record Mark1 actual board coordinate in position of ordering (x1 y1), moves to second Mark point then, write down equally the board coordinate (x2, y2);
D) carry out autoscan, the data that obtain according to laser displacement sensor in the scanning process, the thickness of web plate on the calculating path;
E) virtual coordinates and the board coordinate of ordering according to two Mark that obtain carries out bit manipulation, all points that scans are carried out translation, rotation, zoom operations, correspond on the model coordinate systems of web plate, and generation thickness chart and upper and lower surface surface chart, with actual web plate coupling, this thickness chart gets final product the thickness distribution of presentation-entity web plate again.
In the technique scheme, length that the thickness data in when scanning gathers is set at interval, in the path of scanning with a fixed length collection any thickness data and preserve.Thickness distribution figure color by dark red to dark blue expression thickness by thick to thin.The fitting surface figure of upper and lower surface is by forming apart from match between the sensor of each surface and its direction, uses the mode of triangle gridding to show.
The method is made the Mark point on web plate, make the thickness information of obtaining to mate with web plate, can utilize aborning again.
Adopt method of the present invention, solved in the SMT web plate thickness and the measurement of planeness, the problem that measurement data can not be preserved recycling and can not be integrated with web plate.Improve the efficient of SMT web plate thickness measure, need not to carry out repeatedly thickness measure.Improve the accuracy of SMT web plate thickness measure, reduced error, obtained better technical effect.
Description of drawings
Fig. 1 is a thickness scanning survey synoptic diagram in the prior art.
Fig. 2 makes two Mark points on the SMT web plate.
Fig. 3 is a web plate scanning collection thickness data path profile.
The serve as reasons thickness fitted figure that obtains of point of scanning of Fig. 4.
The invention will be further elaborated below by specific embodiment, but be not limited only to present embodiment.
Specific embodiment
[embodiment 1]
A kind of full-automatic SMT web plate method for measuring thickness comprises following several steps:
A) two ends on a diagonal line of SMT web plate use cut to make two Mark points, and set up coordinate system according to their physical location, and the coordinate that Mark1 is ordered is counted (0,0), the coordinate that Mark2 is ordered count (x, y);
B) web plate is put on the thickness measuring worktable, the thickness measuring worktable is equipped with double vertical laser displacement sensor and camera;
C) measure, at first camera moved near the Mark point, discern automatically, the record Mark1 actual board coordinate in position of ordering (x1 y1), moves to second Mark point then, write down equally the board coordinate (x2, y2);
D) carry out autoscan, the data that obtain according to laser displacement sensor in the scanning process, the thickness of web plate on the calculating path;
E) virtual coordinates and the board coordinate of ordering according to two Mark that obtain carries out bit manipulation, all points that scans are carried out translation, rotation, zoom operations, correspond on the model coordinate systems of web plate, and generation thickness chart and upper and lower surface surface chart, with actual web plate coupling, this thickness chart gets final product the thickness distribution of presentation-entity web plate again.
[embodiment 2]
This method adopts makes the Mark point, discerns the Mark point automatically, and methods such as contraposition generate the thickness chart information corresponding with web plate.At first need use cut to make two Mark points and set up coordinate system according to their physical location at the two ends on the diagonal line of SMT web plate, as shown in Figure 2, the coordinate that Mark1 is ordered is (0,0), the coordinate that Mark2 is ordered be (x, y).
Web plate is put on the thickness measuring worktable, the thickness measuring worktable is equipped with double vertical laser displacement sensor and camera, at first camera is moved near the Mark point when beginning to measure, automatically discern, (x1 y1), moves to second Mark point to the actual board coordinate in position that record Mark1 is ordered then, same record board coordinate (x2, y2).
Begin autoscan then, the thickness of web plate on the data computation path that obtains according to laser displacement sensor in the scanning process, as shown in Figure 3.
Last virtual coordinates and board coordinate of ordering according to two Mark that obtain carries out bit manipulation, all points that scans are carried out translation, rotation, zoom operations, correspond on the model coordinate systems of web plate, and generation thickness chart and upper and lower surface surface chart and actual web plate coupling, this thickness chart gets final product the thickness distribution of presentation-entity web plate, and thickness chart as shown in Figure 4.
The method is made the Mark point on web plate, make the thickness information of obtaining to mate with web plate, can utilize aborning again.
[embodiment 3]
A kind of full-automatic SMT web plate method for measuring thickness, comprise following several steps: a) two ends on a diagonal line of SMT web plate use cut to make two Mark points, and set up coordinate system according to their physical location, the coordinate that Mark1 is ordered counts (0,0), the coordinate that Mark2 is ordered count (x, y); B) web plate is put on the thickness measuring worktable, the thickness measuring worktable is equipped with double vertical laser displacement sensor and camera; C) measure, at first camera moved near the Mark point, discern automatically, the record Mark1 actual board coordinate in position of ordering (x1 y1), moves to second Mark point then, write down equally the board coordinate (x2, y2); D) carry out autoscan, the data that obtain according to laser displacement sensor in the scanning process, the thickness of web plate on the calculating path; E) virtual coordinates and the board coordinate of ordering according to two Mark that obtain carries out bit manipulation, all points that scans are carried out translation, rotation, zoom operations, correspond on the model coordinate systems of web plate, and generation thickness chart and upper and lower surface surface chart, with actual web plate coupling, this thickness chart gets final product the thickness distribution of presentation-entity web plate again.Length that the thickness data in when scanning gathers is set at interval, in the path of scanning with the certain-length collection any thickness data and preserve.Thickness distribution figure color by dark red to dark blue expression thickness by thick to thin.The fitting surface figure of upper and lower surface is by forming apart from match between the sensor of each surface and its direction, uses the mode of triangle gridding to show.
[embodiment 4]
As improvement of the present invention, SMT web plate method for measuring thickness, can also adopt following method: a kind of SMT web plate thickness and method measuring flatness, this method use the whole breadth of two coaxial laser displacement sensors scanning web plates and gather upper and lower surface with each sensor between range information, understand the upper and lower surface that will obtain and the distance between the sensor become thickness distribution figure and upper and lower surface with its coordinate fitting fitting surface figure after scanning is finished.During beginning, two distances between the sensor are determined in the calibration of use calibrated bolck, and web plate is put well, system moves the starting position that laser displacement sensor is moved to the web plate lower left corner by axle, begins to obtain thickness data and path then and moves to finish the scanning of the whole breadth of web plate.Length that the thickness data in when scanning gathers can be set at interval, in the path of scanning with each fixed length collection any thickness data and preserve.After scanning is finished,, it is fitted to thickness distribution figure according to the coordinate of point and the thickness information that obtains, color by dark red to dark blue expression thickness by thick to approaching.The fitting surface figure of upper and lower surface is by forming apart from match between the sensor of each surface and its direction, uses the mode of triangle gridding to show.
[embodiment 5]
As improvement of the present invention, SMT web plate method for measuring thickness, can also adopt following method: SMT web plate thickness and method measuring flatness comprise following several steps: use the calibrated bolck calibration, determine two distances between the sensor; Web plate is set level, and system moves by axle, two coaxial laser displacement sensors is moved to the starting position in the web plate lower left corner; C) use laser displacement sensor, move along certain path finishing the scanning of the whole breadth of web plate, and the range information between collection upper and lower surface and each sensor; D) after scanning is finished,,, fit to the fitting surface figure of thickness distribution figure and upper and lower surface with upper and lower surface and the distance between the sensor and its coordinate that obtains according to the coordinate of point and the thickness information that obtains.Length that the thickness data in when scanning gathers is set at interval, in the path of scanning with a fixed length collection any thickness data and preserve.Thickness distribution figure color by dark red to dark blue expression thickness by thick to thin.The fitting surface figure of upper and lower surface is by forming apart from match between the sensor of each surface and its direction, uses the mode of triangle gridding to show.Present embodiment has solved that to measure web plate thickness single and can not represent the problem of specific region thickness in the past.
Claims (4)
1. full-automatic SMT web plate method for measuring thickness comprises following several steps:
A) two ends on a diagonal line of SMT web plate use cut to make two Mark points, and set up coordinate system according to their physical location, and the coordinate that Mark1 is ordered is counted (0,0), the coordinate that Mark2 is ordered count (x, y);
B) web plate is put on the thickness measuring worktable, the thickness measuring worktable is equipped with double vertical laser displacement sensor and camera;
C) measure, at first camera moved near the Mark point, discern automatically, the record Mark1 actual board coordinate in position of ordering (x1 y1), moves to second Mark point then, write down equally the board coordinate (x2, y2);
D) carry out autoscan, the data that obtain according to laser displacement sensor in the scanning process, the thickness of web plate on the calculating path;
E) virtual coordinates and the board coordinate of ordering according to two Mark that obtain carries out bit manipulation, all points that scans are carried out translation, rotation, zoom operations, correspond on the model coordinate systems of web plate, and generation thickness chart and upper and lower surface surface chart, with actual web plate coupling, this thickness chart gets final product the thickness distribution of presentation-entity web plate again.
2. full-automatic SMT web plate method for measuring thickness according to claim 1, the length that the thickness data when it is characterized in that being provided with scanning is gathered at interval, in the path of scanning with the certain-length collection any thickness data and preserve.
3. SMT web plate thickness according to claim 1 and method measuring flatness, it is characterized in that thickness distribution figure color by dark red to dark blue expression thickness by thick to thin.
4. SMT web plate thickness according to claim 1 and method measuring flatness, the fitting surface figure that it is characterized in that upper and lower surface are by forming apart from match between the sensor of each surface and its direction, use the mode of triangle gridding to show.
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| CN2012100165823A CN103217118A (en) | 2012-01-19 | 2012-01-19 | Full-automatic SMT net plate thickness measuring method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019019131A1 (en) * | 2017-07-28 | 2019-01-31 | 深圳市兴华炜科技有限公司 | Steel mesh thickness measurement device and measurement method |
| CN110438790A (en) * | 2019-08-08 | 2019-11-12 | 拓卡奔马机电科技有限公司 | A kind of cutting fabric thickness detection system and method for cutting out for cutting |
| CN116465315A (en) * | 2023-04-06 | 2023-07-21 | 浙江迈沐智能科技有限公司 | Automatic screen quality detection method and system |
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| TW200936982A (en) * | 2008-02-22 | 2009-09-01 | Hirose Tech Co Ltd | Method and apparatus for measuring the thickness of object |
| CN101634547A (en) * | 2008-07-25 | 2010-01-27 | 财团法人精密机械研究发展中心 | System and method for measuring double-laser noncontact thickness |
| US20110050771A1 (en) * | 2009-08-26 | 2011-03-03 | Wen-Yuh Jywe | Automatic scan and mark apparatus |
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2012
- 2012-01-19 CN CN2012100165823A patent/CN103217118A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009038233A (en) * | 2007-08-02 | 2009-02-19 | Anritsu Corp | Method and device for inspecting printed board |
| TW200936982A (en) * | 2008-02-22 | 2009-09-01 | Hirose Tech Co Ltd | Method and apparatus for measuring the thickness of object |
| CN101634547A (en) * | 2008-07-25 | 2010-01-27 | 财团法人精密机械研究发展中心 | System and method for measuring double-laser noncontact thickness |
| US20110050771A1 (en) * | 2009-08-26 | 2011-03-03 | Wen-Yuh Jywe | Automatic scan and mark apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019019131A1 (en) * | 2017-07-28 | 2019-01-31 | 深圳市兴华炜科技有限公司 | Steel mesh thickness measurement device and measurement method |
| CN110438790A (en) * | 2019-08-08 | 2019-11-12 | 拓卡奔马机电科技有限公司 | A kind of cutting fabric thickness detection system and method for cutting out for cutting |
| CN110438790B (en) * | 2019-08-08 | 2020-12-08 | 拓卡奔马机电科技有限公司 | Cut fabric thickness detection system for cutting bed and cutting method |
| CN116465315A (en) * | 2023-04-06 | 2023-07-21 | 浙江迈沐智能科技有限公司 | Automatic screen quality detection method and system |
| CN116465315B (en) * | 2023-04-06 | 2024-05-14 | 浙江迈沐智能科技有限公司 | Automatic screen quality detection method and system |
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