CN101630671B - 集成引线悬臂 - Google Patents

集成引线悬臂 Download PDF

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CN101630671B
CN101630671B CN2009101522807A CN200910152280A CN101630671B CN 101630671 B CN101630671 B CN 101630671B CN 2009101522807 A CN2009101522807 A CN 2009101522807A CN 200910152280 A CN200910152280 A CN 200910152280A CN 101630671 B CN101630671 B CN 101630671B
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CN101630671A (zh
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约翰·T·康特雷拉斯
路易兹·M·弗兰卡-内托
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Western Digital Technologies Inc
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Hitachi Global Storage Technologies Netherlands BV
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    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
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    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/486Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit

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Abstract

本发明提供了一种集成引线悬臂或柔性件,其连接方案允许磁记录盘驱动器中读/写电路与读/写头之间有共面且交插的导电径迹。该柔性件具有导电衬底和绝缘层,径迹形成在绝缘层上。在柔性件的每端,有衬底材料的岛和绝缘层中的通孔,其允许到岛的电连接。导电径迹分成两个组且沿柔性件的长度基本平行地延伸,一组的径迹与另一组的径迹交插,每组承载正和负信号之一。在一端,一组的全部径迹通过通孔连接到该端处的岛,在另一端,另一组的全部径迹通过通孔连接到在该端的岛。借助于通过通孔到岛的连接,每种信号分配于组中的多个径迹中。

Description

集成引线悬臂
技术领域
本发明总地涉及磁记录盘驱动器中用于将读/写电路连接到读/写头的集成引线悬臂(integrated lead suspension,ILS),更特别地,涉及具有交插(interleaved)共面的导电线或径迹(trace)的ILS。
背景技术
在磁记录盘驱动器中,读/写头形成在气垫滑块(air-bearing slider)上,气垫滑块骑在旋转盘上方的空气薄膜上。机械悬臂将滑块连接到盘驱动器的致动器臂,机械悬臂包括柔性件(flexure),万向节(gimbal)在柔性件末端。滑块装设到万向节,这允许当盘旋转时在气垫上轻微的移动。
读/写电路(通常为读前置放大器/写驱动模块或芯片)与滑块上的读和写元件之间需要电连接。将机械连接与电连接集成的悬臂称为集成引线悬臂(ILS)。普通的ILS是导电金属衬底如不锈钢、绝缘电介质层如聚酰亚胺和在电介质层上图案化的导电铜线或径迹的基本柔性的叠层。
写驱动电路通常设置有到ILS的单点输入用于各个正和负写信号(+W和-W)。写驱动电路提供通过ILS然后到达写元件或写头的电流。写驱动电路电源电压和通过写头的电流的性能依赖于ILS径迹的特征阻抗。因此,期望具有这样的ISL,该ILS对于携载到写头的电流信号的径迹具有较宽的特征阻抗范围和低的信号损失。
发明内容
本发明涉及集成引线悬臂(ILS)或柔性件,其具有允许导电径迹共面且交插的连接方案。柔性件的导电衬底在每端具有导电岛,每个岛位于绝缘层中的通孔下,这允许到岛的电连接。导电径迹分成两个组,每个组携载正和负写信号之一。一组的径迹与另一组的径迹交插且沿柔性件的长度基本平行地延伸。在连接到写驱动电路的柔性件端部,第一组的所有径迹通过通孔连接到在该端的岛。来自写驱动电路的单点源(+W和-W信号之一)连接到电引线,该电引线与第一组的径迹之一共面且连接到第一组的所述径迹之一。该信号借助于通过通孔到岛的连接分配到第一组的多个径迹。以类似方式,在柔性件的另一端或者万向节端,第二组的径迹连接到在万向节端的岛。来自第二组的径迹的信号(+W和-W中的另一个)被与第二组的径迹之一共面且连接到第二组的所述径迹之一的电引线聚集且被引导到写元件。通过使第一组径迹在柔性件的一端连接到岛且使第二组径迹在柔性件的另一端连接到岛,在柔性件的信号进入点和离开点处会有信号的平衡。
柔性件还可以包括沿柔性件的长度在导电衬底中的多个窗口和间隙。在间隙中不存在导电材料减少了由导电衬底引起的信号损失。两组径迹的交插和导电衬底中的间隙允许较宽泛地调节互连特征阻抗。
为了更全面地理解本发明的本质和优点,请参照下面的与附图结合在一起的详细描述。
附图说明
图1是硬盘驱动器的头/盘组件(HDA)的俯视平面图,示出了根据本发明的具有电径迹互连阵列的柔性件。
图2A是柔性件的平面图,示出了根据本发明的在万向节段(gimbalsegment)与焊盘段(pad segment)之间的细长段(elongate segment)。
图2B是图2A的柔性件的通过截面2B-2B的放大剖视图,示出了其层叠构造。
图2C是图2A的柔性件的通过截面2C-2C的放大剖视图,示出了柔性件中的窗口或间隙。
图3A是柔性件的一端的一部分的平面图,示出了根据本发明的导电径迹的多重交叉共面连接(multiple-crossover coplanar connection,MCC)。
图3B是通过图3A的截面3B-3B的剖视图,示出了衬底材料的导电岛,该导电岛提供柔性件的绝缘电介质层之下的一组交插导电径迹的互连。
具体实施方式
图1是硬盘驱动器10的头/盘组件(HDA)的俯视平面图。硬盘驱动器10具有至少一个负载梁组件(load beam assembly)20,负载梁组件20具有集成引线悬臂(ILS)或柔性件30,柔性件30具有连接到读/写头29的导电互连径迹或线的阵列32。负载梁组件20装设到刚性臂22,刚性臂22连接到E块(E-block)24。盘驱动器10包括支承心轴(spindle)14的刚性基底12,心轴14支承盘的堆叠,包括顶盘16。心轴14被心轴马达(未示出)旋转,用于沿弯曲箭头17所示的方向旋转盘。盘驱动器10还包括旋转致动器组件40,旋转致动器组件40在枢转点41处旋转地安装到基底12。致动器组件40是音圈马达(VCM)致动器,其包括音图43和固定到基底12的磁体组件42。当被控制电路(未示出)加电时,音圈43移动且由此转动E块24以及装设的臂22和负载梁组件20以便将头29定位到盘上的数据轨道。径迹互连阵列32在一端连接到读/写头29,在其另一端连接到包含于安装在E块24侧面的电模块或芯片50中的读/写电路。
图2A是柔性件30的平面图,示出根据本发明的在万向节段51与焊盘段52之间的细长段31。柔性件30是包括三层的叠层:导电衬底、绝缘电介质层、用于电径迹或线的导电层以及可选的绝缘电介质覆盖层。万向节段51支承滑块(未示出),该滑块包含读/写头29(图1)且具有引向焊盘55的用于电连接到滑块上的焊盘的导电径迹53。柔性件30具有电连接端34,电连接端34连接到万向节段51上的径迹53。焊盘段52具有多个电连接焊盘,如电连接到芯片50(图1)的焊盘54、56。柔性件30具有电连接端36,电连接端36连接到焊盘段52上的焊盘54、56。多个交插的导电径迹或线32沿柔性件30的在柔性件端部34、36之间的细长段基本彼此平行地延伸。线32将芯片50中的写驱动器与装设到万向节末端51的滑块上的写头连接。线32的径迹互连阵列包括图2B、2C和3A所示的交插线并被分组为第一组线71、73、75、77和第二组线72、74、76、78。柔性件30还包括导电径迹或线57,导电径迹或线57将芯片50中的读前置放大器(preamplifier)与装设到万向节末端51的滑块上的读头连接。
图2B是图2A中的柔性件30的通过截面2B-2B的放大剖视图,示出其层叠结构。柔性件30包括:基本平坦的支承构件60;多个交插的导电径迹或线,如第一组中的线71、73、75、77和第二组中的线72、74、76、78;以及可选的绝缘电介质覆盖层66。线71-78一般由铜形成且示为携载微分写信号(differential write signal)(+W和-W),信号是交替的。支承构件60包括导电基底或衬底62和绝缘层64,导电基底或衬底62通常由金属如不锈钢形成,绝缘层64在径迹71-78与衬底62之间且由电介质材料如聚酰亚胺形成。支承衬底62一般约18微米厚,绝缘电介质层64一般约10微米厚。可选的电介质覆盖层66一般也由聚酰亚胺在线71-78上形成至约15微米的厚度。
如图2A所示,柔性件30还包括叠层的衬底62中的多个窗口或间隙33。这示于图2C中,图2C是图2A的截面2C-2C的剖视图。在间隙中,没有不锈钢在电介质层64下面。间隙减少了由导电衬底62引起的信号损失。交插的导电衬底62和窗口或间隙33允许较宽范围地调节互连特征阻抗。
图3A是部分柔性件30的平面图,示出端部36和到焊盘54、56的连接。焊盘54连接到+W信号且经引线81连接到线71,然后以将要描述的方式在绝缘层64之下连接到径迹或线73、75、77。焊盘56连接到-W信号且直接经扇出到(fan out)引线82、84、86、88的引线89连接到径迹或线72、74、76、78。第一组中的信号线71、73、75、77和第二组中的信号线72、74、76、78是交插的且在绝缘层64上共面,并沿柔性件30的细长段31基本彼此平行地延伸。在图3A中,每个信号由此扇出到四条线中,+W和-W信号如图所示地交插。线的数量可以增大或减小,例如从所示的8条到4条、6条、10条、12条等,从而达到期望的特征阻抗水平。单一源(single-source)连接54和56允许简单的二焊盘(2-pad)连接到毗邻的电互连,这允许简单的机械连接。如果空间允许,可以使用多个交插的焊盘。
柔性件的细长段31的端部36包括扇出连接,其将用于单端连接的线72、74、76和78经电引线89连接到焊盘56。端部36包括金属衬底62的岛90,其允许线71、73、75、77在绝缘层64之下连接到引线81。这在图3B中的剖视图中示出。金属衬底材料(通常为不锈钢)的岛90被金属衬底62中的间隙91围绕,使得岛90与衬底62的其余部分电隔离。此外,绝缘层64包括用导电材料填充的多个通孔101、103、105、107,其提供相关的线71、73、75、77与导电岛90之间的电连接。以此方式,来自引线81的信号被引导至引线71,然后在绝缘层64之下导向其他+W信号线中的每条。这实现了多重交叉共面连接(MCC),使得全部8条线在绝缘层64上共面。该MCC布局构造增大了到相邻导电径迹的侧/边缘面积,从而特征阻抗范围得到增大。
柔性件的细长段31在万向节段51(图1)附近的端部34处具有类似的MCC,这在图3A中未示出。然而,优选地在端部34处第二组中的线72、74、76、78通过通孔向下连接到衬底62中的岛。类似地,在端部34处线71、73、75、77被扇出且连接到来自万向节段51的单条电引线,从而形成与在末端36处引线89和引线82、84、86、88所示类似的电连接。通过在柔性件的一端使第一组线连接到岛且在柔性件的另一端使第二组线连接到岛,经过柔性件的信号进入点和离开点的导体的电寄生效应(electricalparasitics)是平衡的。通孔至岛连接具有固有的电寄生。两信号径迹(+W和-W)被平衡,使得两信号径迹都具有通孔/岛连接。平衡的信号径迹减小了到相邻信号线的串扰,例如图2A中的读线57。
虽然已经参照优选实施例具体示出并描述了本发明,但是本领域技术人员将理解,可以进行各种形式和细节上的改变而不偏离本发明的思想和范围。因此,所公开的发明应被视为仅是解释性的,且限定在仅由所附权利要求书指定的范围内。

Claims (13)

1.一种用于电连接两个电部件的导体组件,包括:
平坦支承构件,具有延伸于第一端与第二端之间的长度,所述平坦支承构件包括导电衬底和在该导电衬底上的电绝缘层,该导电衬底在所述平坦支承构件的第一端附近具有第一岛且该电绝缘层在所述第一岛处具有多个通孔;
第一组的平行导电线,在所述电绝缘层上且沿所述平坦支承构件的长度延伸,所述第一组中的每条导电线在所述第一岛处具有位于所述通孔处的末端且电连接到所述第一岛并由此电连接到所述第一组中的所有其他的导电线;
第一电引线,在所述第一端附近的所述电绝缘层上且电连接到所述第一组中的至少一条导电线并由此电连接到所述第一组中的所有导电线;以及
第二组的平行导电线,在所述电绝缘层上且沿所述平坦支承构件的长度延伸,所述第一组的导电线和所述第二组的导电线沿所述平坦支承构件的长度交插,
其中所述导电衬底在所述平坦支承构件的第二端附近具有第二岛,所述电绝缘层在所述第二岛处具有多个通孔,所述第二组中的每条导电线在所述第二岛处具有位于所述通孔处的末端且电连接到所述第二岛并由此电连接到所述第二组中的所有其他的导电线,且
所述导体组件还包括第二电引线,该第二电引线在所述第二端附近的所述电绝缘层上且电连接到所述第二组中的至少一条导电线并由此电连接到所述第二组中的所有导电线。
2.如权利要求1所述的导体组件,其中所述第一组中的所有导电线在所述第二端处的所述电绝缘层上电连接。
3.如权利要求1所述的导体组件,其中所述第二组中的所有导电线在所述第一端处的所述电绝缘层上电连接。
4.如权利要求1所述的导体组件,其中所述导电衬底包括在其端部之间的多个间隙,所述电绝缘层和交插的所述导电线跨过所述间隙延伸。
5.如权利要求1所述的导体组件,还包括在所述第一组和所述第二组的导电线之上的绝缘覆盖层。
6.如权利要求1所述的导体组件,其中所述两个电部件中的第一电部件是磁记录盘驱动器中的读/写头,第二电部件是盘驱动器中的读/写电路。
7.一种磁记录盘驱动器的柔性件,用于磁记录盘驱动器的写驱动电路与磁记录盘驱动器的写头的电连接,包括:
用于到所述写驱动电路的连接的焊盘段、用于到所述写头的连接的万向节段、以及连接在所述焊盘段与所述万向节段之间的细长段,所述柔性件的细长段包括:
支承构件,包括导电衬底和在该导电衬底上的电绝缘层,该导电衬底在所述支承构件的第一端附近具有第一岛且在所述支承构件的第二端附近具有第二岛,该电绝缘层在各个岛处具有多个通孔;
第一组的平行导电径迹,在所述电绝缘层上且沿所述支承构件的长度延伸,所述第一组中的每条导电径迹具有位于所述第一岛处的通孔处的末端且电连接到所述第一岛并由此电连接到所述第一组中的所有其他导电径迹;
第一电引线,将所述柔性件的焊盘段与所述第一组中的至少一条导电径迹连接并由此连接到所述第一组中的所有导电径迹;
第二组的平行导电径迹,在所述电绝缘层上且沿所述支承构件的长度延伸,所述第一组的导电径迹和所述第二组的导电径迹沿所述支承构件的长度交插,所述第二组中的每条导电径迹具有在所述第二岛处的通孔处的末端且电连接到所述第二岛并由此电连接到所述第二组中的所有其他导电径迹;以及
第二电引线,将所述万向节段与所述第二组中的至少一条导电径迹连接并由此连接到所述第二组中的所有导电径迹。
8.如权利要求7所述的柔性件,其中所述导电衬底包括在其端部之间的多个间隙,所述电绝缘层和交插的所述导电径迹跨过所述间隙延伸。
9.如权利要求7所述的柔性件,还包括在所述第一组的导电径迹和所述第二组的导电径迹之上的绝缘覆盖层。
10.如权利要求7所述的柔性件,还包括第三电引线,该第三电引线在所述支承构件的第一端附近将所述柔性件的焊盘段与所述第一组中的所有导电径迹连接。
11.如权利要求7所述的柔性件,还包括第四电引线,该第四电引线在所述支承构件的第二端附近将所述柔性件的万向节段与所述第二组中的所有导电径迹连接。
12.如权利要求7所述的柔性件,其中所述第一组的导电径迹用于接收正写信号和负写信号之一,所述第二组的导电径迹用于接收所述正写信号和负写信号中的另一种。
13.如权利要求7所述的柔性件,其中所述导电衬底由不锈钢形成。
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Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4907676B2 (ja) * 2009-01-16 2012-04-04 日本発條株式会社 ヘッド・サスペンション
US8400736B2 (en) * 2009-07-27 2013-03-19 Seagate Technology, Llc Slider top bond design with shorted pad configuration
US9842612B2 (en) 2009-10-01 2017-12-12 Seagate Technology Llc On head microelectronics for write synchronization
CN102194468B (zh) * 2010-03-19 2015-08-12 新科实业有限公司 悬臂件及具有该悬臂件的磁头折片组合、硬盘驱动器
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
CN102376311A (zh) * 2010-08-04 2012-03-14 新科实业有限公司 悬臂件、磁头折片组合及磁盘驱动单元
JP5583539B2 (ja) * 2010-10-01 2014-09-03 日本発條株式会社 フレキシャの配線構造
US9633680B2 (en) 2010-10-29 2017-04-25 Western Digital Technologies, Inc. Head suspension having a flexure tail with a covered conductive layer and structural layer bond pads
US9324344B1 (en) 2013-12-10 2016-04-26 Western Digital Technologies, Inc. Disk drive head suspension tail with ground pad outside of bonding region
US8467153B1 (en) 2010-10-29 2013-06-18 Western Digital Technologies, Inc. Disk drive head gimbal assembly having a flexure tail with folded bond pads
US9165580B2 (en) 2013-12-10 2015-10-20 Western Digital Technologies, Inc. Disk drive head suspension tail with stiffened edge alignment features
US8441761B1 (en) * 2011-01-03 2013-05-14 Magnecomp Corporation Hard disk drive suspension with reduced PSA change due to humidity and temperature variations
US8970989B1 (en) 2011-01-03 2015-03-03 Magnecomp Corporation Hard disk drive suspension with reduced PSA change due to humidity and temperature variations
JP5713718B2 (ja) * 2011-02-17 2015-05-07 日本発條株式会社 フレキシャ及びこれを備えたヘッドサスペンション
JP5870496B2 (ja) * 2011-03-18 2016-03-01 大日本印刷株式会社 サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
US8488279B1 (en) * 2011-11-22 2013-07-16 Western Digital (Fremont), Llc Disk drive suspension assembly with flexure having stacked interleaved traces
JP2013182641A (ja) * 2012-03-01 2013-09-12 Dainippon Printing Co Ltd サスペンション用基板
US8896968B2 (en) 2012-10-10 2014-11-25 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with dampers
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
CN104078055B (zh) * 2013-03-29 2018-10-26 东莞新科技术研究开发有限公司 挠性件及其制造方法、磁头折片组合以及磁盘驱动器
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US8879212B1 (en) 2013-08-23 2014-11-04 Western Digital Technologies, Inc. Disk drive suspension assembly with flexure having dual conductive layers with staggered traces
US9036305B1 (en) * 2013-11-18 2015-05-19 HGST Netherlands B.V. Magnetic recording disk drive with write driver to write head transmission line with multiple segments having different numbers of conductive traces
US9330695B1 (en) 2013-12-10 2016-05-03 Western Digital Technologies, Inc. Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) * 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US8928335B1 (en) 2014-01-24 2015-01-06 Hutchinson Technology Incorporated Stepped impedance flexure design in a hard disk drive
US9064513B1 (en) 2014-03-07 2015-06-23 Western Digital Technologies, Inc. Disk drive suspension assembly with flexure having dual conductive layers with staggered traces
US8934199B1 (en) 2014-03-31 2015-01-13 Western Digital Technologies, Inc. Disk drive head suspension tail with bond pad edge alignment features
US9196266B1 (en) * 2014-07-25 2015-11-24 HGST Netherlands B.V. Integrated lead suspension (ILS) for two-dimensional magnetic recording (TDMR) disk drive
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
US9218822B1 (en) 2015-05-13 2015-12-22 HGST Netherlands B.V. Disk drive with preamplifier with isolation for multiple readers in a slider with a common return signal
CN107735834B (zh) 2015-06-30 2019-11-19 哈钦森技术股份有限公司 具有改进的可靠性的盘驱动器头部悬架结构
US10043541B1 (en) * 2015-12-12 2018-08-07 Magnecomp Corporation Disk drive head stack assembly having height-controlled suspension circuit tail tack
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
US11818834B2 (en) * 2021-06-23 2023-11-14 Western Digital Technologies, Inc. Flexible printed circuit finger layout for low crosstalk

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5771568A (en) * 1995-03-02 1998-06-30 Hutchinson Technology Incorporated Method for manufacturing a head suspension having electrical trace interconnects with reduced capacitance
US5737152A (en) * 1995-10-27 1998-04-07 Quantum Corporation Suspension with multi-layered integrated conductor trace array for optimized electrical parameters
US5995328A (en) * 1996-10-03 1999-11-30 Quantum Corporation Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
US5717547A (en) * 1996-10-03 1998-02-10 Quantum Corporation Multi-trace transmission lines for R/W head interconnect in hard disk drive
US6275358B1 (en) * 1997-01-21 2001-08-14 Maxtor Corporation Conductor trace array having passive stub conductors
US6487047B1 (en) * 1999-06-02 2002-11-26 Maxtor Corporation Trace interconnect array having increased bandwidth by selective etching of traces and dielectric substrate
US6710675B2 (en) * 2000-10-04 2004-03-23 Hewlett-Packard Development Company, L.P. Transmission line parasitic element discontinuity cancellation
US6714385B1 (en) * 2001-04-16 2004-03-30 Hutchinson Technology Inc. Apparatus and method for controlling common mode impedance in disk drive head suspensions
US7352535B2 (en) * 2005-01-13 2008-04-01 Hitachi Global Storage Technologies Netherlands, B.V. Method and apparatus for reducing crosstalk and signal loss in flexing interconnects of an electrical lead suspension
US7489479B2 (en) * 2005-01-18 2009-02-10 Hitachi Global Storage Technologies Netherlands B.V. Electrical lead suspension having partitioned air slots
JP4916235B2 (ja) * 2006-06-29 2012-04-11 日東電工株式会社 配線回路基板
US7710688B1 (en) * 2007-02-06 2010-05-04 Hutchinson Technology Incorporated Split embedded signal transmission planes in integrated lead disk drive suspensions

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