CN101629971A - Probe station, probe socket, probe card and combination thereof - Google Patents

Probe station, probe socket, probe card and combination thereof Download PDF

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Publication number
CN101629971A
CN101629971A CN200810133585A CN200810133585A CN101629971A CN 101629971 A CN101629971 A CN 101629971A CN 200810133585 A CN200810133585 A CN 200810133585A CN 200810133585 A CN200810133585 A CN 200810133585A CN 101629971 A CN101629971 A CN 101629971A
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China
Prior art keywords
probe
combination
support member
socket receptacle
transmission axle
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CN200810133585A
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Chinese (zh)
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CN101629971B (en
Inventor
刘俊良
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Starr Technology (wuhan) Co Ltd
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SIDA SCIENCE AND TECHNOLOGY Co Ltd
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Priority to CN 200810133585 priority Critical patent/CN101629971B/en
Publication of CN101629971A publication Critical patent/CN101629971A/en
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Abstract

The invention relates to a probe system, a probe socket, a probe card and a combination thereof. The probe card of the invention comprises a circuit board. The circuit board is provided with a supporting component and radiating holes. The supporting component is used for supporting a plurality of probes to form a needle. The radiating holes are used for cooling the probe card.

Description

Probe station, probe socket receptacle, probe and combination thereof
Technical field
The present invention relates to a kind of probe station, probe socket receptacle, probe and combination thereof, particularly a kind of probe station, probe socket receptacle, probe and combination thereof with unique heat sinking function.
Background technology
In the manufacture process of integrated circuit component, all can test its electrical specification, so as to filtering out the integrated circuit component that does not meet product specification with probe.
Fig. 1 discloses a kind of probe station 11, and it comprises two and is set in parallel in the slide rail 16 of rectangular aperture platform both sides, a plurality of non-circular overarm 12 and at least one and is set up in fine setting platform 14 in the described non-circular overarm.Two ends of described non-circular overarm 12 are set up on the described slide rail 16 by a slide 18 respectively.Described fine setting platform 14 is used to carry a probe, and can adjust the relative angle of described probe and element under test.Described probe station 11 can be fixedly arranged on the tester table by a plurality of screws 13.
Yet semiconductor wafer is to be placed on the wafer base with heating arrangement when test.When testing, described heating arrangement can heat semiconductor wafer, for example carry out the reliability testing (reliabilitytest) of described integrated circuit component, and the heat of its generation can the heat radiation mode be sent to the residing test environment of described probe, or be sent to the residing test environment of described test board with heat exchange pattern via the probe tip of described probe, cause the temperature of described test environment to rise.And, physical property or the chemical property that the temperature that rises may cause described probe and be in the object of described test environment change (for example the characteristic of expanding with heat and contract with cold of material causes object to produce deformation), cause measuring process to carry out smoothly, perhaps influence the accuracy of measurement result.
Summary of the invention
Fundamental purpose of the present invention provides a kind of probe station, probe socket receptacle, probe and combination thereof, and it can reduce the environment temperature of probe described in the test process effectively, produces the variation of physics or chemical property to avoid described probe.
Probe station of the present invention comprises two slide rails, at least one non-circular overarm, a plurality of probe socket receptacle and at least one transmission axle.Two ends of described at least one non-circular overarm are arranged on described two slide rails.Described a plurality of probe socket receptacle is arranged in the described non-circular overarm.Described at least one transmission axle comprises at least one airduct, and wherein said at least one airduct is communicated to the bottom of described probe socket receptacle.
Probe socket receptacle of the present invention comprises a plurality of splicing ears and at least one wind-tunnel.Described a plurality of splicing ear is arranged at the bottom of described probe socket receptacle, is used to transmit and receive the electric signal between described transmission axle and the probe.Described at least one wind-tunnel is used to transmit nitrogen or the cold air that described transmission axle is sent.
Probe of the present invention comprises a circuit board.Described circuit board has support member and louvre.Described support member is used to support a plurality of probes and forms needle point.Described louvre is used to cool off described probe.
Combination of the present invention has depressed part, opening and sidewall, and wherein said opening is used to hold described support member.
Description of drawings
Fig. 1 shows a probe station;
Fig. 2 shows the relation between a probe station and element under test;
Fig. 3 shows the substructure of a probe socket receptacle;
Fig. 4 and Fig. 5 show the stereographic map of the subassembly of probe and collocation thereof;
Fig. 6 shows the combination figure of the subassembly of probe and collocation thereof;
Fig. 7 shows the stereographic map of another angle of the subassembly of probe and collocation thereof;
Fig. 8 shows the combination figure of the subassembly of probe and collocation thereof; And
The sectional view of Fig. 9 displayed map 8.
Embodiment
Fig. 2 shows the relation between probe station of the present invention and element under test.Similar with routine techniques, probe station 20 of the present invention also has two slide rail 16 and a plurality of non-circular overarms 12 that are set in parallel in described rectangular aperture platform both sides.A plurality of probe socket receptacles 24 are set up in the described non-circular overarm 12, the relative position of its fine-tuning probe and described element under test 21 (for example wafer).By moving horizontally and the vertical moving of described non-circular overarm 12 on described slide rail 16 in described non-circular overarm 12, described probe socket receptacle 24 can be by the optional position of coarse adjustment to described element under test 21.Different with routine techniques is, described probe socket receptacle 24 is by a transmission axle and outside tester table (scheme not shown) connection, and described transmission axle not only comprises signal wire, also comprises at least one airduct.Described airduct transmits nitrogen or cold air, and it can pass through described probe socket receptacle 24, and is penetrated by the wind hole 32 of its bottom.
Fig. 3 shows the substructure of described probe socket receptacle 24.Described base 31 comprises wind hole 32, its negotiable nitrogen or cold air, and be accompanied by electric signal and be sent to described probe 42.
Fig. 4 shows the stereographic map of the subassembly 41 of probe 42 of the present invention and collocation thereof.Described probe 42 has at least one louvre 427, it can be by nitrogen that described probe socket receptacle 24 transmitted or cold air and effectively realizes the samming of described probe 42, and effectively reduces the temperature that described probe 42 increases because of the heating of described element under test 21.Even if therefore described element under test 21 is heated to 300 ℃, described probe 42 still can be kept for example about 100 ℃ samming by described louvre 427.Not because of the increase of service time produces the biased situation of moving of pin, described a plurality of probes are fixed on the support member 424 with epoxy resin in order to ensure the horizontal level of probe.The end of described a plurality of probes forms needle point 423, and described needle point 423 and described probe 425 form an angle, in order to reduce the STRESS VARIATION that is produced when described probe 425 contacts with element under test 21.Described probe 42 can be provided with a plurality of registration holes 428, and its registration holes 33 with described probe socket receptacle 24 is relative, and can be locked in described probe socket receptacle 24 by screw in case of necessity.Described subassembly 41 is used to cover described probe 42, and it can prevent also that except being used to protect the described probe 42 nitrogen or cold air that described louvre 427 transmits from directly blowing to described element under test 21.Described subassembly 41 comprises opening 412 and a plurality of registration holes 411, and described opening 412 is used to hold the support member 424 of described probe 42.
Fig. 5 shows the stereographic map of another angle of the subassembly 41 of probe 42 of the present invention and collocation thereof.The subassembly 41 that Fig. 6 shows probe 42 of the present invention and collocation thereof according to the direction of Fig. 5 in conjunction with after stereographic map.Fig. 7 shows the reverse side stereographic map of the subassembly 41 of probe 42 of the present invention and collocation thereof.The subassembly 41 that Fig. 8 shows probe 42 of the present invention and collocation thereof according to the direction of Fig. 7 in conjunction with after stereographic map.The sectional view of Fig. 9 displayed map 8.
With respect to routine techniques, the subassembly 41 of probe station 20 of the present invention, probe socket receptacle 24, probe 42 and collocation thereof has following advantage at least:
1. described probe socket receptacle 24 also has wind-tunnel except that having signal wire.When the transmission measurement signal, can send nitrogen or cold air in the lump.
2. described probe 42 can utilize screw to lock described a plurality of registration holes 428 in described probe socket receptacle 24, and makes described probe 42 be parallel to described element under test 21.
3. described probe 42 is provided with louvre 427, can utilize nitrogen that described probe socket receptacle 24 transmits or cold air and keeps samming, and reduce the temperature of described probe 42.
4. by subassembly 41, described probe 42 can avoid nitrogen or cold air directly to blow to element under test 21.And described subassembly 41 still leaves a room in combination after the described probe 42, but nitrogen or cold air enter PARALLEL FLOW behind the described room via described louvre 427, and contacts arbitrary position of described probe 42 equably, and realizes the samming cooling purpose.
Technology contents of the present invention and technical characterstic disclose as above, yet the those skilled in the art still may be based on teaching of the present invention and announcement and done all replacement and modifications that does not break away from spirit of the present invention.Therefore, protection scope of the present invention should be not limited to those disclosed embodiments, and should comprise various do not break away from replacement of the present invention and modifications, and is contained by the claims of enclosing.

Claims (8)

1. probe, it comprises circuit board, it is characterized in that described circuit board comprises:
Support member, it is used to support a plurality of probes and forms needle point; And
Louvre, it is used to cool off described probe.
2. the combination of a probe is characterized in that it comprises:
Probe, it comprises support member and louvre, and described louvre is located at the other end of described support member; And
Subassembly, it has depressed part, opening and sidewall, and wherein said opening is used to hold described support member, and described sidewall is set up along the edge of described depressed part.
3. the combination of probe according to claim 2 is characterized in that wherein said depressed part comprises a room, and
Described room can be communicated with the zone more than 3/4ths of described probe.
4. the combination of probe according to claim 2 is characterized in that wherein said depressed part is along growing limit direction of principal axis extension and having broad respectively to narrower width.
5. the combination of probe according to claim 2 is characterized in that wherein said sidewall has a plurality of registration holes.
6. the combination of probe according to claim 2 is characterized in that wherein said subassembly has the pincer attack portion that is positioned at described opening both sides, and described pincer attack portion presents the shape of taper.
7. probe station is characterized in that it comprises:
Two slide rails;
At least one non-circular overarm, two end are arranged on described two slide rails;
A plurality of probe socket receptacles, it is arranged in the described non-circular overarm; And
At least one transmission axle, it comprises at least one airduct, and wherein said at least one airduct is communicated to the bottom of described probe socket receptacle.
8. probe socket receptacle, it can be connected to transmission axle and probe, it is characterized in that described probe socket receptacle comprises:
A plurality of splicing ears, it is used for transmitting and receiving electric signal between described transmission axle and described probe; And
At least one wind-tunnel, it is used to transmit nitrogen that described transmission axle sends or cold air to described probe.
CN 200810133585 2008-07-17 2008-07-17 Probe station, probe socket, probe card and combination thereof Active CN101629971B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200810133585 CN101629971B (en) 2008-07-17 2008-07-17 Probe station, probe socket, probe card and combination thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200810133585 CN101629971B (en) 2008-07-17 2008-07-17 Probe station, probe socket, probe card and combination thereof

Publications (2)

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CN101629971A true CN101629971A (en) 2010-01-20
CN101629971B CN101629971B (en) 2013-07-24

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103048490A (en) * 2011-10-17 2013-04-17 东京毅力科创株式会社 Support body for contact terminals and probe card
CN103134962A (en) * 2011-12-05 2013-06-05 日本麦可罗尼克斯股份有限公司 Probe assembly for inspecting power semiconductor devices and inspection apparatus using the same
CN103543303A (en) * 2012-07-10 2014-01-29 三菱电机株式会社 Inspection apparatus
CN113625016A (en) * 2021-07-27 2021-11-09 深圳市欧米加智能科技有限公司 Miniature blade needle module with heat dissipation function
CN116909590A (en) * 2023-09-07 2023-10-20 宜宾本信电子科技有限公司 OTP (one time programmable) burning jig for liquid crystal display

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000241454A (en) * 1999-02-23 2000-09-08 Mitsubishi Electric Corp Probe card for high temperature test and test equipment
US6342788B1 (en) * 1999-06-02 2002-01-29 International Business Machines Corporation Probing systems for chilled environment
CN1261993C (en) * 2003-04-03 2006-06-28 思达科技股份有限公司 Detection card for testing semiconductor

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103048490A (en) * 2011-10-17 2013-04-17 东京毅力科创株式会社 Support body for contact terminals and probe card
CN103048490B (en) * 2011-10-17 2016-10-05 东京毅力科创株式会社 The supporting mass of contact terminal and probe card
CN103134962A (en) * 2011-12-05 2013-06-05 日本麦可罗尼克斯股份有限公司 Probe assembly for inspecting power semiconductor devices and inspection apparatus using the same
US9146256B2 (en) 2011-12-05 2015-09-29 Kabushiki Kaisha Nihon Micronics Probe assembly for inspecting power semiconductor devices and inspection apparatus using the same, the probe assembly having a probe block, a probe, and a cooling device
CN103134962B (en) * 2011-12-05 2016-04-27 日本麦可罗尼克斯股份有限公司 Power semiconductor device examination probe assembly and the testing fixture using it
CN103543303A (en) * 2012-07-10 2014-01-29 三菱电机株式会社 Inspection apparatus
CN103543303B (en) * 2012-07-10 2016-06-15 三菱电机株式会社 Inspection units
CN113625016A (en) * 2021-07-27 2021-11-09 深圳市欧米加智能科技有限公司 Miniature blade needle module with heat dissipation function
CN113625016B (en) * 2021-07-27 2022-06-10 深圳市欧米加智能科技有限公司 Miniature blade needle module with heat dissipation function
CN116909590A (en) * 2023-09-07 2023-10-20 宜宾本信电子科技有限公司 OTP (one time programmable) burning jig for liquid crystal display
CN116909590B (en) * 2023-09-07 2023-12-01 宜宾本信电子科技有限公司 OTP (one time programmable) burning jig for liquid crystal display

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Effective date of registration: 20181211

Address after: Room 1106, 11F Comet Valley Space-time Building, No. 4 Luyu East Road, Donghu New Technology Development Zone, Wuhan City, Hubei Province

Patentee after: Starr Technology (Wuhan) Co., Ltd.

Address before: Taiwan, China

Patentee before: Sida Science and Technology Co., Ltd.

EE01 Entry into force of recordation of patent licensing contract
EE01 Entry into force of recordation of patent licensing contract

Application publication date: 20100120

Assignee: Decott Testing Technology (Suzhou) Co., Ltd

Assignor: Starr Technology (Wuhan) Co.,Ltd.

Contract record no.: X2020980003101

Denomination of invention: Probe station, probe socket, probe card and combination thereof

Granted publication date: 20130724

License type: Exclusive License

Record date: 20200616