CN101625994A - Large-sized wafer cutting method and device - Google Patents
Large-sized wafer cutting method and device Download PDFInfo
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- CN101625994A CN101625994A CN200810133409A CN200810133409A CN101625994A CN 101625994 A CN101625994 A CN 101625994A CN 200810133409 A CN200810133409 A CN 200810133409A CN 200810133409 A CN200810133409 A CN 200810133409A CN 101625994 A CN101625994 A CN 101625994A
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Abstract
The invention discloses a large-sized wafer cutting method and a large-sized wafer cutting device, which avoid damage to a wafer in a moving process by means of decreasing the wafer moving frequency. Each program can be carried out when a work loading platform is loaded to the wafer and can be finished by moving the work loading platform to a process unit or moving the process unit to the work loading platform.
Description
Technical field
The relevant a kind of large-sized wafer cutting method of the present invention and device, particularly wafer size are greater than the method for cutting chip and the device thereof of 30.48 centimetres (12 o'clock).
Background technology
When wafer after the leading portion operation is finished, just enter into packaging process, chip is done encapsulation again by cutting down on the wafer.The purpose of wafer cutting is the chip cutting separation that the leading portion working procedure processing will be finished on the wafer one by one.Generally can earlier wafer be delivered to grinder station wafer is carried out grinding back surface (backside grinding) to suitable thickness, then make wafer gluing (wafer mount) program, wafer be delivered on the wafer cutting machine cut (wafer cut) again.In packaging process, be mostly that delivering to each process equipment with the wafer pattern carries out operation.
Yet along with wafer size constantly increases, its structural strength can die down, and wafer warpage a little all may cause fracture in moving, so how mobile large-sized wafer will be a problem that urgent need overcomes in the technology.
Summary of the invention
In order to address the above problem, one of the object of the invention provides large-sized wafer cutting method and equipment thereof, moves number of times to avoid the wafer damage in the moving process by reducing wafer.
One of the object of the invention provides large-sized wafer cutting method and equipment thereof, and wafer loads a work microscope carrier can carry out every program, can move to the process unit place or process unit is moved to the work microscope carrier by the microscope carrier of will working and finish every program.
In order to achieve the above object, large-sized wafer cutting method according to an aspect of the present invention, comprise the following steps: to load a wafer in one work microscope carrier, wherein the active surface of wafer be up and wafer size greater than 30.48 centimetres; Attach a back and grind adhesive tape on the active surface of wafer; In the work microscope carrier polish process is carried out at the back side of wafer; Attach the back side of a diaphragm in wafer; Adhesive tape is ground at the back that removes the wafer active surface; And in the active surface of work microscope carrier cut crystal to obtain a plurality of chips.
Large-sized wafer cutting equipment according to a further aspect of the invention, it comprises: a work microscope carrier, to abandon in order to carry a wafer, the wafer size of the microscope carrier of wherein working carrying is greater than 30.48 centimetres; One first tape sticking device, it grinds adhesive tape in order to move to the work microscope carrier on the active surface of wafer to attach a back; One lapping device, it carries out a polish process in order to move to the work microscope carrier to the back side of wafer; One second tape sticking device, it is in order to move to the work microscope carrier to attach the back side of a diaphragm in wafer; One removes film device, and it grinds adhesive tape in order to move to the work microscope carrier with the back that removes the wafer active surface; And a cutting device, its in order to move to the work microscope carrier with the active surface of cut crystal to obtain a plurality of chips.
According to the large-sized wafer cutting equipment of another aspect of the invention, it comprises: a work microscope carrier, and it is in order to carry a wafer, and the wafer size of the microscope carrier of wherein working carrying is greater than 30.48 centimetres; One transmitting device, it is in order to the mobile working microscope carrier; One first tape sticking device, the microscope carrier of wherein working move to first tape sticking device and sentence attaching one back grinding adhesive tape on the active surface of wafer; One lapping device, the microscope carrier of wherein working move to lapping device and sentence a polish process is carried out at the back side of wafer; One second tape sticking device, the microscope carrier of wherein working move to second tape sticking device and sentence attaching one diaphragm in the back side of wafer; One removes film device, and the microscope carrier of wherein working moves to except that film device and grinds adhesive tape with the back that removes the wafer active surface; And one the cutting device, the microscope carrier of wherein working moves to cutter sweep and sentences the active surface of cut crystal to obtain a plurality of chips.
Description of drawings
Figure 1 shows that schematic flow sheet according to an embodiment of the invention.
Figure 2 shows that schematic diagram according to an embodiment of the invention.
Figure 3 shows that schematic diagram according to an embodiment of the invention.
Figure 4 shows that schematic diagram according to an embodiment of the invention.
Figure 5 shows that schematic diagram according to an embodiment of the invention.
Embodiment
Figure 1 shows that schematic flow sheet according to one embodiment of the invention method for cutting chip.In present embodiment, at first load a wafer in work microscope carrier (S10).Wherein, the active surface of wafer be up and this wafer size be greater than 30.48 centimetres (12 o'clock), for example 45.72 centimetres (18 o'clock) wafers.Then, attach a back grind adhesive tape (backside grinding tape) on the active surface of wafer (S20, the rubberizing program, taping).Afterwards, the upset wafer make chip back surface up (S30, roll-over procedure) and in work microscope carrier to the back side of wafer carry out a polish process (S40, polish process, grinding).After the grinding, will attach a diaphragm (protectivefilm) in the back side of wafer (S50, rubberizing program).Then, the active surface that wafer makes wafer (S60, roll-over procedure) up that overturns once more.Remove back on the active surface of wafer grind adhesive tape (S70, the membrane removal program, stripping).Then, in work microscope carrier on cut crystal active surface with obtain a plurality of chips (S80, cutting process, cutting).In the present invention, after obtaining a plurality of chips, wafer is carried on the work microscope carrier all the time, need not move to different process device place.
The above-mentioned explanation that continues in an embodiment, in polish process, can be displaced into work microscope carrier position with a lapping device or the microscope carrier of will working moves to the program that grind at a lapping device place.Same, in the rubberizing program, a tape sticking device can be displaced into the work microscope carrier position or the microscope carrier of will work and move to a tape sticking device place and carry out the back grinding adhesive tape or the rubberizing program of diaphragm.In addition, in cutting process, a cutting device can be moved to the work microscope carrier position microscope carrier of maybe will work and move to one and cut the device place and carry out cutting process.
Please refer to shown in Figure 2, in an embodiment in, large-sized wafer cutting equipment of the present invention comprises: a work microscope carrier (working susceptor) 10; One first tape sticking device (taping device) 20; One lapping device (grinding device) 40; One second tape sticking device 50; One removes film device (film-strippingdevice) 60; An and cutting device (cutting device) 70.
The above-mentioned explanation that continues, work microscope carrier 10 is to be used for carrying a wafer, the wafer size of the microscope carrier of wherein working carrying is greater than 30.48 centimetres.First tape sticking device 20 is to be used for moving to work microscope carrier 10 to grind adhesive tape in the active surface of wafer to attach a back.In an embodiment, comprise that also a wafer turning device 30 makes its active surface down in order to the upset wafer.Lapping device 40 can move to the back side of 10 pairs of wafers of work microscope carrier and carry out a polish process.Second tape sticking device 50 can move to work microscope carrier 10 and attach the back side of a diaphragm in wafer.Afterwards, wafer can overturn once again and make its active surface up.Remove film device 60 and move to the back grinding adhesive tape that work microscope carrier 10 removes the wafer active surface.Cut at last, cutter sweep 70 moves to work microscope carrier 10 and carries out the active surface of cut crystal to obtain a plurality of chips.
If equipment can overcome the wafer that need not overturn and can carry out pad pasting, grinding or cutting operation, do not limit among the present invention and must use wafer turning device 30.In addition, the present invention can utilize manipulator with first tape sticking device 20, wafer turning device 30, lapping device 40, second tape sticking device 50, remove film device 60 and cutter sweep 70 moves to work microscope carrier 10 to carry out the every program of wafer.In addition, also can set up other device 80 and move to work microscope carrier 10 operation of being correlated with manipulator according to demand.
Continue, in an embodiment, work microscope carrier 10 can be put as for being used on the transmitting device that the work microscope carrier is moved to each device place and carry out the associated wafer cutting process.This transmitting device can be a rotating disk 12 (turntable), as shown in Figure 3.Work microscope carrier 10 is arranged at and moves to the different device place on the rotating disk 12.So, large-sized wafer cutting equipment of the present invention can carry out continuous cutting operation and promote the product production capacity.In an embodiment, this transmitting device also can be a crawler belt 12 ', and other device, as first tape sticking device 20, wafer turning device 30, lapping device 40, second tape sticking device 50, remove film device 60 and cutter sweep 70, in-line arrangement (in-line) is provided with or assembling type series connection (cluster) setting continuously, as Fig. 4 and shown in Figure 5.In addition, be understandable that in the present invention when carrying out every program, suitable isolation and reset mode should be arranged to avoid the producing residual contaminants subsequent job in the process.
Comprehensively above-mentioned, the present invention moves number of times to avoid the wafer damage in the moving process by reducing wafer.Wafer loads a work microscope carrier can carry out every program, can move to the process unit place or process unit is moved to the work microscope carrier by the microscope carrier of will working and finish every program.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who is familiar with this technology can understand content of the present invention and is implementing according to this, when not limiting claim of the present invention with it, be every all changes that is equal to or replacement of doing according to disclosed spirit, must be encompassed in the claim of the present invention.
Claims (13)
1. large-sized wafer cutting method comprises the following step:
Load a wafer in one work microscope carrier, wherein the active surface of this wafer be up and this wafer size greater than 30.48 centimetres;
Attach a back and grind adhesive tape on the active surface of this wafer;
In this work microscope carrier a polish process is carried out at the back side of this wafer;
Attach the back side of a diaphragm in this wafer;
Adhesive tape is ground at this back that removes this wafer active surface; And
The active surface that cuts this wafer in this work microscope carrier is to obtain a plurality of chips.
2. large-sized wafer cutting method according to claim 1 is characterized in that also comprising and moves a lapping device in this work microscope carrier position or move the step that this work microscope carrier to lapping device place carries out this polish process.
3. large-sized wafer cutting method according to claim 1 is characterized in that also comprising a mobile cutting and is installed on this work microscope carrier position or moves the step that this work microscope carrier to cutting device place carries out this cutting process.
4. large-sized wafer cutting method according to claim 1 is characterized in that also comprising and moves a tape sticking device in this work microscope carrier position or move this work microscope carrier to tape sticking device place and carry out the step that the rubberizing program of adhesive tape is ground at this back.
5. large-sized wafer cutting method according to claim 1 is characterized in that also comprising and moves a tape sticking device in this work microscope carrier position or move the step that this work microscope carrier to tape sticking device place carries out the rubberizing program of this diaphragm.
6. large-sized wafer cutting method according to claim 1 is characterized in that before this polish process, also comprises this wafer of upset and makes the supine step of this wafer back.
7. large-sized wafer cutting method according to claim 6 is characterized in that also comprising the supine step of active that this wafer of upset makes this wafer before removing this back grinding adhesive tape.
8. large-sized wafer cutting equipment, it comprises:
One work microscope carrier, it is in order to carry a wafer, and wherein this wafer size of this work microscope carrier carrying is greater than 30.48 centimetres;
One first tape sticking device, it grinds adhesive tape in order to move to this work microscope carrier on the active surface of this wafer to attach a back;
One lapping device, it carries out a polish process in order to move to this work microscope carrier to the back side of this wafer;
One second tape sticking device, it is in order to move to this work microscope carrier to attach the back side of a diaphragm in this wafer;
One removes film device, and it grinds adhesive tape in order to move to this work microscope carrier with this back that removes this wafer active surface; And
One cutting device, its in order to move to this work microscope carrier with the active surface that cuts this wafer to obtain a plurality of chips.
9. large-sized wafer cutting equipment according to claim 8 is characterized in that also comprising a wafer turning device in order to this wafer that overturns.
10. large-sized wafer cutting equipment according to claim 9, it is characterized in that also comprising a manipulator in order to this first tape sticking device, this wafer turning device, this lapping device, this second tape sticking device, should remove film device and this cutter sweep moves to this work microscope carrier to carry out every program.
11. a large-sized wafer cutting equipment, it comprises:
One work microscope carrier, it is in order to carry a wafer, and wherein this wafer size of this work microscope carrier carrying is greater than 30.48 centimetres;
One transmitting device, it is in order to move this work microscope carrier;
One first tape sticking device, wherein this work microscope carrier is to move to this first tape sticking device to sentence attaching one back grinding adhesive tape on the active surface of this wafer;
One lapping device, wherein this work microscope carrier is to move to this lapping device to sentence a polish process is carried out at the back side of this wafer;
One second tape sticking device, wherein this work microscope carrier is to move to this second tape sticking device to sentence attaching one diaphragm in the back side of this wafer;
One removes film device, and wherein this work microscope carrier is to move to this to remove film device to remove this back grinding adhesive tape of this wafer active surface; And
One cutting device, wherein this work microscope carrier is to move to this cutter sweep to sentence the active surface of this wafer of cutting to obtain a plurality of chips.
12. large-sized wafer cutting equipment according to claim 11 is characterized in that this transmitting device is a rotating disk or a crawler belt.
13. large-sized wafer cutting equipment according to claim 12 is characterized in that also comprising a wafer turning device in order to this wafer on this work microscope carrier that overturns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810133409A CN101625994A (en) | 2008-07-09 | 2008-07-09 | Large-sized wafer cutting method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810133409A CN101625994A (en) | 2008-07-09 | 2008-07-09 | Large-sized wafer cutting method and device |
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| Publication Number | Publication Date |
|---|---|
| CN101625994A true CN101625994A (en) | 2010-01-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200810133409A Pending CN101625994A (en) | 2008-07-09 | 2008-07-09 | Large-sized wafer cutting method and device |
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| CN (1) | CN101625994A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811357A (en) * | 2014-01-24 | 2014-05-21 | 南通富士通微电子股份有限公司 | Ultra-thin wafer level package manufacturing method |
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
| CN109848814A (en) * | 2019-02-26 | 2019-06-07 | 北京中电科电子装备有限公司 | A kind of full-automatic wafer attenuated polishing device |
-
2008
- 2008-07-09 CN CN200810133409A patent/CN101625994A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811357A (en) * | 2014-01-24 | 2014-05-21 | 南通富士通微电子股份有限公司 | Ultra-thin wafer level package manufacturing method |
| CN104617051A (en) * | 2014-12-30 | 2015-05-13 | 上海仪电智能电子有限公司 | Preset adhesive film chip and implementation method thereof |
| CN109848814A (en) * | 2019-02-26 | 2019-06-07 | 北京中电科电子装备有限公司 | A kind of full-automatic wafer attenuated polishing device |
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Open date: 20100113 |