CN101623934B - Materialized modification method and device used for laser three-dimensional irradiation of engineering plastic surface - Google Patents
Materialized modification method and device used for laser three-dimensional irradiation of engineering plastic surface Download PDFInfo
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- CN101623934B CN101623934B CN2009100699265A CN200910069926A CN101623934B CN 101623934 B CN101623934 B CN 101623934B CN 2009100699265 A CN2009100699265 A CN 2009100699265A CN 200910069926 A CN200910069926 A CN 200910069926A CN 101623934 B CN101623934 B CN 101623934B
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Abstract
A materialized modification method and a device used for laser three-dimensional irradiation of engineering plastic surface are disclosed. The device comprises a laser, an acousto-optic modulator, a beam expander, a dynamic focusing lens, an oscillating mirror group, a flat-field focusing lens, a CCD and DSP module. A to-be-processed workpiece is arranged on a tooling fixture in a laser irradiation area, an area path needing laser irradiation is input with the DSP which outputs a control signal, so that a laser matches with the acousto-optic modulator to send out standard continuous laser of peak value power, and the laser focus can move arbitrarily in the three-dimensional space by controlling the dynamic focusing lens and two oscillating mirrors, finally the laser focus is focused on the surface of the workpiece, thus finishing processing the area path. The method can change the material characteristics of the surface of the workpiece, by the method of chemical plating, copper deposition, nickel plating, gold plating and the like are carried out in the processing area, thus forming a conductive channel which can be used as a metal wire and can even directly carry out patching and encapsulation on the surface thereof.
Description
[technical field]: the present invention relates to a kind of laser three-D 3-dimensional irradiation engineering plastic surface that passes through, make the place of the illuminated mistake of engineering plastic surface that physics, chemical change take place, thereby change the method for its primary characteristic.
[background technology]: the traditional chemical plating method of engineering plastics at first needs to make the whole copper facing of material surface, nickel plating etc. through chemical roughen, activation process, and can't carry out the appointed area selective chemical plating.If can carry out regional chemical plating at engineering plastic surface, just can form conductive path, play the opering characteristics of electric apparatus such as lead, but traditional chemical plating method can't be realized this design, therefore restricted the enforcement of a lot of schemes.
[summary of the invention]: the object of the invention provides a kind of laser processing and device of brand-new engineering plastic surface, makes that the engineering plastic surface through the laser irradiation can change its original character, and then realizes the regioselectivity chemical plating.
This method moves by the three-dimensional of control laser spot, makes its snap action in the zone that needs the materialization modification, and the laser irradiation by high-energy-density makes irradiated engineering plastic surface produce new characteristic.The engineering plastics of handling by this method, surface nature changes, and method that can be by chemical plating is at the heavy copper of machining area, nickel plating, gold-plated etc., and then forms conductive channel, can be used as plain conductor and use, even can directly carry out the technology of paster encapsulation on its surface; And the zone of not shining through laser still keeps original plastic properties.
The materialization method of modifying that is used for the laser three-D irradiation of engineering plastic surface provided by the invention comprises successively:
The first, the engineering plastics part that will need to process is installed in above the frock jig in the laser irradiation area territory;
The second, observe part to be processed by the CCD detection system and whether be in place, whether need further rectification building-out;
Three, the engineering plastics piece surface is needed the zone routing of laser irradiation be transferred to the DSP control system by external input device;
Four,, make laser instrument cooperate acousto-optic modulator to send the quasi-continuous lasing of 30KW by DSP control system output control signal;
Five, change the deflection angle of focal height and 2 galvanometers by DSP control system control dynamic focusing mirror, make laser spot in three dimensions, to move arbitrarily, and focus on processed engineering plastics piece surface, thereby finish the processing of a paths at processed engineering plastics piece surface by the flat field focus lamp;
Six,, make laser instrument cooperate acousto-optic modulator to close laser by DSP control system output control signal;
Seven, change the deflection angle of focal height and 2 galvanometers by DSP control system control dynamic focusing mirror, make laser focus to next place, path to be processed, by the reciprocation cycle in the 4th step to the 7th step, process thereby finish all paths on the part to be processed surface.
A kind of materialization reforming apparatus of realizing above-mentioned laser three-D irradiation comprises:
● laser instrument and acousto-optic modulator: be used to produce the quasi-continuous lasing of high-peak power, in order to carry out the processing on workpiece to be machined surface;
● beam expanding lens: with the light spacing shaping that laser instrument sends, it is big that beam diameter becomes, the angle of divergence of compression laser;
● dynamic focusing mirror: control moving of its internal focus mirror group relative position by the DSP control system, make focal position of laser to move in Z-direction;
● X galvanometer: control its deflection angle by the DSP control system, make focal position of laser to move in X-direction;
● Y galvanometer: control its deflection angle by the DSP control system, make focal position of laser to move in Y direction;
● flat field focus lamp: make focussing plane become the plane, and play the effect of focusing by original space sphere;
● CCD monitoring system: form by imaging optical path and CCD, be positioned in the middle of dynamic focusing mirror and the galvanometer, be used to locate monitoring with whole process and result;
DSP control system module: this module is positioned in the computer controlled fabrication, this module is connected with laser instrument, acousto-optic modulator, dynamic focusing mirror, X, Y galvanometer and CCD monitoring system respectively by peripheral interface, the machining path that is used for configuring in advance is converted to data signal and inputs to above equipment respectively, various piece is cooperatively interacted finish process, and control constantly by CCD.
Advantage of the present invention and good effect:
The present invention proposes a kind of materialization method of modifying and device of laser three-D irradiation.This method can be so that the material behavior in the engineering plastic surface appointed area changes, thereby finishes the design that traditional handicraft can't be finished.The engineering plastics of handling by this method, surface nature changes, and method that can be by chemical plating is at the heavy copper of machining area, nickel plating, gold-plated etc., and then forms conductive channel, can be used as plain conductor and use, even can directly carry out the technology of paster encapsulation on its surface; And the zone of not shining through laser still keeps original plastic properties.The control of laser instrument, acousto-optic modulator, dynamic focusing system and scanning galvanometer system is finished automatically by DSP fully, the operator only need import machining path in advance and get final product, realized the process automation, make operating process easy, quick, workable, reduced requirement operator's professional knowledge.
[description of drawings]:
Fig. 1 is the index path of the materialization reforming apparatus of laser three-D irradiation;
Fig. 2 is the materialization reforming system control flow chart of laser three-D irradiation;
Among the figure, 1, laser instrument, 2, acousto-optic modulator, 3, beam expanding lens, 4, the dynamic focusing mirror, 5, the CCD monitoring system, 6, the directions X galvanometer, 7, Y direction galvanometer, 8, the flat field focus lamp, 9, workpiece to be machined
[specific embodiment]:
Embodiment 1: the materialization reforming apparatus of laser three-D irradiation
As shown in Figure 1, this device comprises:
● laser instrument 1 and acousto-optic modulator 2: be used to produce the quasi-continuous lasing of high-peak power, in order to carry out the processing on workpiece to be machined 9 surfaces;
● beam expanding lens 3: with the light spacing shaping that laser instrument sends, it is big that beam diameter becomes, the angle of divergence of compression laser;
● dynamic focusing mirror 4: control moving of its internal focus mirror group relative position by the DSP control system, make focal position of laser to move in Z-direction;
● X galvanometer 6: control its deflection angle by the DSP control system, make focal position of laser to move in X-direction;
● Y galvanometer 7: control its deflection angle by the DSP control system, make focal position of laser to move in Y direction;
● flat field focus lamp 8: make focussing plane become the plane, and play the effect of focusing by original space sphere;
● CCD monitoring system 5: form by imaging optical path and CCD, be positioned in the middle of dynamic focusing mirror and the galvanometer, be used to locate monitoring with whole process and result;
DSP control system module: this module is positioned in the computer controlled fabrication, this module is connected with laser instrument, acousto-optic modulator, dynamic focusing mirror, X, Y galvanometer and CCD monitoring system respectively by peripheral interface, the machining path that is used for configuring in advance is converted to data signal and inputs to above equipment respectively, various piece is cooperatively interacted finish process, and control constantly by CCD.
Embodiment 2: the laser three-D materialization modification example of engineering plastic surface
Concrete work flow is put into assigned address with workpiece to be machined 9 as shown in Figure 2; Observe workpiece to be machined by CCD monitoring system 5 and whether be in place, whether need further rectification building-out; The path of needs processing is inputed to the DSP control system by external input device; By DSP control system output control signal, make laser instrument 1 cooperate acousto-optic modulator 2 to send the quasi-continuous lasing of peak power 30KW, and control the deflection angle that dynamic focusing mirror 4 changes focal height and X galvanometer 6 and Y galvanometer 7; The laser beam that laser instrument produces is by beam expanding lens 3 spacing shapings, and enter dynamic focusing mirror 4 after the compression angle of divergence, two secondary reflections and 8 focusing of flat field focus lamp by two galvanometers make laser spot to move arbitrarily in three dimensions, and focus on processed engineering plastics piece surface, thereby finish the processing of a paths in the machined object surface by the flat field focus lamp.By DSP control system output control signal, make laser instrument cooperate acousto-optic modulator to close laser; Repeat above each step operation until finish all path processing on the part to be processed surface.Machining path after the laser scanning just can carry out chemical plating, finishes operations such as heavy copper, nickel plating.
Whole process can be monitored constantly by CCD monitoring system 5, goes wrong in time to feed back to the DSP control system and proofread and correct.
Embodiment 3:
Part through after the laser scanning at first immerses 5% LP-200, through 20 seconds to 30 seconds activation processing; And then the immersion clear water cleaned in 20 seconds to 30 seconds; Again through 5 hours electroless copper plating process; And then carry out pickling and washing; Carry out the Pd activation by Rona SMT Catalyst CF 5-10% then; Again through 2 hours chemical sinking nickel process; And then wash, dry, finish the process of electroless copper, nickel plating.
Copper plate can reach the 12-16 micron after finishing, and nickel coating can reach the 0.5-1.5 micron.
Claims (1)
1. the materialization method of modifying of a laser three-D irradiation that is used for engineering plastic surface is characterized in that this method comprises successively:
The first, the engineering plastics part that will need to process is installed in above the frock jig in the laser irradiation area territory;
The second, observe part to be processed by the CCD detection system and whether be in place, whether need further rectification building-out;
Three, the engineering plastics piece surface is needed the zone routing of laser irradiation be transferred to the DSP control system by external input device;
Four,, make laser instrument cooperate acousto-optic modulator to send the quasi-continuous lasing of peak power 30KW by DSP control system output control signal;
Five, change the deflection angle of focal height and 2 galvanometers by DSP control system control dynamic focusing mirror, make laser spot in three dimensions, to move arbitrarily, and focus on processed engineering plastics piece surface, thereby finish the processing of a paths at processed engineering plastics piece surface by the flat field focus lamp;
Six,, make laser instrument cooperate acousto-optic modulator to close laser by DSP control system output control signal;
Seven, change the deflection angle of focal height and 2 galvanometers by DSP control system control dynamic focusing mirror, make laser focus to next place, path to be processed, by the reciprocation cycle in the 4th step to the 7th step, process thereby finish all paths on the part to be processed surface;
The described materialization method of modifying that is used for the laser three-D irradiation of engineering plastic surface passes through to realize that as lower device this device comprises:
Laser instrument and acousto-optic modulator: be used to produce the quasi-continuous lasing of high-peak power, in order to carry out the processing on workpiece to be machined surface;
Beam expanding lens: with the light spacing shaping that laser instrument sends, it is big that beam diameter becomes, the angle of divergence of compression laser;
Dynamic focusing mirror: control moving of its internal focus mirror group relative position by the DSP control system, make focal position of laser to move in Z-direction;
X galvanometer: control its deflection angle by the DSP control system, make focal position of laser to move in X-direction;
Y galvanometer: control its deflection angle by the DSP control system, make focal position of laser to move in Y direction;
Flat field focus lamp: make focussing plane become the plane, and play the effect of focusing by original space sphere;
CCD monitoring system: form by imaging optical path and CCD, be positioned in the middle of dynamic focusing mirror and the galvanometer, be used to locate monitoring with whole process and result;
DSP control system module: this module is positioned in the computer controlled fabrication, this module is connected with laser instrument, acousto-optic modulator, dynamic focusing mirror, X, Y galvanometer and CCD monitoring system respectively by peripheral interface, the machining path that is used for configuring in advance is converted to data signal and inputs to above equipment respectively, various piece is cooperatively interacted finish process, and control constantly by the CCD monitoring system.
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| CN103433625A (en) * | 2013-09-04 | 2013-12-11 | 昆山市三星机械制造有限公司 | Laser texturing machine for plastic mold |
| CN104607638A (en) * | 2014-12-11 | 2015-05-13 | 广东汉唐量子光电科技有限公司 | Novel laser output device for 3D printing |
| CN105149792A (en) * | 2015-09-11 | 2015-12-16 | 深圳市生生电子设备有限公司 | Control system for three-dimensional laser carving machine |
| CN106252857A (en) * | 2016-07-29 | 2016-12-21 | 讯创(天津)电子有限公司 | The laser three-D making apparatus of a kind of novel ultra-narrow coupling slot antenna and manufacture method |
| CN109164111A (en) * | 2018-09-28 | 2019-01-08 | 东南大学 | Based on shared galvanometer SLM in line laser defects detection equipment and method |
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Effective date of registration: 20170803 Address after: 300461, Tianjin, Tianjin free trade zone (Tianjin Port Free Trade Zone), No. 31, five Haibin Road, 321 Patentee after: Tianjin Borui Photoelectric Technology Development Co., Ltd. Address before: 300072 Tianjin City, Nankai District Wei Jin Road No. 92 Co-patentee before: Tianjin Borui Photoelectric Technology Development Co., Ltd. Patentee before: Tianjin University |
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Effective date of registration: 20210930 Address after: 300385 block B, No. 4, Tianzhi Industrial Park, No. 12, Hongyuan Road, economic development zone, Xiqing District, Tianjin Patentee after: INNETECH (TIANJIN) ELECTRONICS Co.,Ltd. Address before: 300461 321, No. 31, Haibin fifth road, Tianjin Free Trade Zone (Tianjin Port Free Trade Zone), Tianjin Patentee before: TIANJIN BORUI OPTOELECTRIC TECHNOLOGY DEV Co.,Ltd. |