CN101619954A - Completely-integrated impact piece ignitor and preparation method thereof - Google Patents

Completely-integrated impact piece ignitor and preparation method thereof Download PDF

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Publication number
CN101619954A
CN101619954A CN 200910304324 CN200910304324A CN101619954A CN 101619954 A CN101619954 A CN 101619954A CN 200910304324 CN200910304324 CN 200910304324 CN 200910304324 A CN200910304324 A CN 200910304324A CN 101619954 A CN101619954 A CN 101619954A
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silicon
ignitor
paper tinsel
thorax
completely
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CN 200910304324
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CN101619954B (en
Inventor
施志贵
席仕伟
杨黎明
张茜梅
刘娟
唐海林
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Institute of Electrical Engineering of CAS
Institute of Electronic Engineering of CAEP
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Institute of Electronic Engineering of CAEP
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Abstract

The invention discloses a completely-integrated impact piece ignitor and a preparation method thereof, which belong to the technical filed of initiators and pyrotechnics. On the basis of a micro electronic mechanical system (MEMS) processing technology, the assembly can be finished in the process of processing a bridge foil, a flying plate, an accelerating chamber and a reflection plate, thus the preparation method is beneficial to improving the assembly precision of devices. In addition, the completely-integrated impact piece ignitor has the characteristic of parallel processing of an integrated circuit, is convenient to produce in large batch and reduces the manufacturing cost, and is beneficial to improving the consistency and the reliability of the process; and meanwhile, by using the metal bridge foil, the completely-integrated impact piece ignitor has short igniting time and can be widely applied to ignition of a plurality of novel high and safe initiators and pyrotechnics.

Description

A kind of completely-integrated impact piece ignitor and preparation method thereof
Technical field
The invention belongs to the priming system technical field, particularly a kind of completely-integrated impact piece ignitor based on microelectromechanical systems (MEMS) process technology and preparation method thereof.
Background technology
Conventional impact sheet detonator main element has bridge paper tinsel substrate, bridge paper tinsel, film flying, acceleration thorax, reflector plate and detonating charge post etc.The bridge paper tinsel is to be etched into by the on-chip Copper Foil that covers of dielectric, the dielectric substrate adopts alumina ceramic substrate usually, the effect that also has reflector plate, film flying normally is bonded at polyimides or the polyester film (close membrane) on the bridge paper tinsel, one diameter is arranged at film flying top is the sapphire or the stainless steel acceleration thorax of 1.2~1.5 times of bridge paper tinsel width approximately, and quickening thorax top is the explosive column that has the about collar of aluminium.Discharge-induced explosion takes place in the metal bridge paper tinsel under the high energy fast-pulse, the plasma that produces thus expands rapidly, shears and drive film flying high-speed impact high-desity explosive, makes it to finish rapidly to detonate.Because impacting each element of sheet detonator is discrete machine-shaping, becomes detonator through hand assembled again, therefore there is the low and high shortcoming of manufacturing cost of reliability.
U.S. Pat P4862803 has introduced the method for making impact piece ignitor with integrated circuit technique.Its ignition element adopts the heavily doped polysilicon bridge, and film flying adopts the silicon layer of the about 25mm of thickness of extension (or vacuum moulding machine or chemical deposition) growth on monocrystalline silicon piece.The silicon dioxide insulating layer of thickness range of having grown between polycrystalline silicon bridge layer and the film flying layer at 0.3mm~0.7mm.The metal pad that polycrystalline silicon bridge two ends have deposited the about 2mm of thickness and limited through excessive erosion.For the reflected pressure that polycrystalline silicon bridge conduction gasification back is produced directly acts on film flying, above the polycrystalline silicon bridge with adhering with epoxy resin heatproof glass-reflected sheet.For film flying is accelerated to more than the critical speed, corroded the acceleration thorax with electrochemical corrosive process on the silicon single crystal wafer back side, guarantee to impact sheet with enough kinetic energy detonating charges.It is said that this technology has improved the function reliability that impacts the sheet detonator, reduced manufacturing cost, be convenient to produce in enormous quantities.But there is following shortcoming in this patented technology:
A) ignition element of igniter adopts the polycrystalline silicon bridge, and need tens microseconds the duration of ignition, and having limited it needs the application of snap action occasion at some.
B) the acceleration thorax of igniter is by the electrochemical corrosive process preparation, and vertical perpendicularity of quickening thorax is difficult to guarantee.
C) reflector plate of igniter, is difficult to guarantee with bonding air-tightness between the polycrystalline silicon bridge and intensity by adhering with epoxy resin on the polycrystalline silicon bridge.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of completely-integrated impact piece ignitor, and a kind of preparation method of completely-integrated impact piece ignitor is provided simultaneously.
Completely-integrated impact piece ignitor of the present invention contains reflector plate, bridge paper tinsel, film flying and acceleration thorax.Its ignition element adopts the metal bridge paper tinsel, and directly preparation is above reflector plate, and the bridge paper tinsel closely is connected with film flying, quickens thorax and is arranged on the film flying top, is provided with the silicon dioxide insulator material layer between film flying and the acceleration thorax.
The preparation method of completely-integrated impact piece ignitor of the present invention, carry out successively as follows:
A) on the Pyrex sheet, use the sputtering technology depositing metal layers;
B) on metal level, prepare the photoresist mask of bridge paper tinsel shape, remove unwanted metal, form the metal bridge paper tinsel with corrosive liquid with photoetching process;
C) prepare photoresist mask with metal bridge paper tinsel correspondingly-shaped with photoetching process on the SOI substrate, etch the bonding step with the reactive ion etching method again, the height of bonding step is identical with the thickness of bridge paper tinsel; SOI is a kind of semi-conducting material with " silicon/silicon dioxide/silicon " three-decker.
D) prepare the photoresist mask of bond pad shapes with photoetching process on SOI, etch pad with the reactive ion etching method and discharge the district, etching depth is to the silicon dioxide layer of SOI substrate;
E) preparation there are the Pyrex sheet of metal bridge paper tinsel and SOI substrate electrostatic bonding are in the same place;
F) at the silicon chip surface sputtered aluminum rete of bonding meron, form the aluminium mask that quickens the thorax shape in aluminium film surface photoetching, corrosion; Quicken thorax with reactive ion etching method etching, etching depth is to the silicon dioxide layer of SOI substrate;
G) use the sand-wheel slice cutting machine scribing, the silicon chip that covers on the pad is removed, and glass-silicon chip structure is divided into tube core, the igniter moulding.
Igniter of the present invention adopts based on microelectromechanical systems (MEMS) process technology, can realize the fully integrated preparation of reflector plate, bridge paper tinsel, film flying and the acceleration thorax of impact piece ignitor, be convenient to produce in enormous quantities and reduce manufacturing cost, in process, finished assembling simultaneously, help improving the assembly precision of device, and possesses the parallel machining characteristics of integrated circuit, promptly after a flow process is finished, a plurality of chips have just machined simultaneously, be convenient to produce in enormous quantities and reduce manufacturing cost, and help improving the dependability of process consistency and device.Adopt the metal bridge paper tinsel among the present invention, make to shorten to the duration of ignition about 1ms, be applicable to the snap action occasion.The present invention adopts the reactive ion etching process preparation to quicken thorax, and making and quickening the vertical perpendicularity of thorax is 90 ± 2 °, helps improving flyer velocity.The present invention uses static bonding process adhering glass reflector plate, and bond strength helps improving reliability greater than the body intensity of glass and silicon chip.
Description of drawings
Fig. 1 is the structural representation of completely-integrated impact piece ignitor of the present invention
Fig. 2 is that A-A among Fig. 1 of the present invention is to generalized section
Fig. 3 is that B-B among Fig. 1 of the present invention is to generalized section
The specific embodiment
Fig. 1 is the structural representation of completely-integrated impact piece ignitor of the present invention, Fig. 2 is that A-A among Fig. 1 is to generalized section, Fig. 3 is that B-B among Fig. 1 is to generalized section, as can be seen, completely-integrated impact piece ignitor of the present invention contains glass-reflected sheet 7, metal bridge paper tinsel 9, silicon film flying 5 and silicon and quickens thorax 1 from Fig. 1~3.Metal bridge paper tinsel 9 is arranged on glass-reflected sheet 7 tops, and metal bridge paper tinsel 9 closely is connected with silicon film flying 5, and silicon quickens thorax 1 and is arranged on silicon film flying 5 tops, and silicon film flying 5 and silicon quicken to be provided with silicon dioxide insulator material layer 4 between the thorax 1.
The preparation method of completely-integrated impact piece ignitor of the present invention, carry out successively as follows:
A) be the copper metal layer of 4mm with sputtering unit sputter thickness on the Pyrex sheet of 4 inches of diameters, thickness 500mm.
B) preparing the photoresist mask of bridge paper tinsel 9 shapes with photoetching process on metal level, is that 35 liquor ferri trichloridi is removed unwanted copper metal with Baume degrees, forms metal bridge paper tinsel 9, the wide 400mm of bridge paper tinsel.
C) adopt the SOI substrate of 4 inches of diameters, prepare the photoresist mask of bonding step 10 shapes with photoetching process, etch bonding step 10 with inductance coupled reaction ion etching machine, its etching depth is 4mm.
Device silicon layer thickness 35mm in the SOI substrate, silica layer thickness 2mm, substrate silicon layer thickness 400mm.
D) prepare the photoresist mask of pad (8I, 8II) shape with photoetching process, etch pad (8I, 8II) with inductance coupled reaction ion etching machine and discharge district, the silicon dioxide layer of etching depth 31mm to SOI substrate.
E) adopt the substrate bonding machine that Pyrex sheet 7 and SOI substrate electrostatic bonding are in the same place, wherein metal bridge paper tinsel 9 and bonding step 10 are aimed at.
F) the thick aluminium film 2 of substrate silicon layer surface sputtering 1mm of the SOI substrate behind bonding; Aluminium film 2 photomask surfaces also use phosphoric acid, acetate and 16: 2: 1 solution of nitric acid to corrode the aluminium mask that thorax 1 shape is quickened in formation; Etch acceleration thorax 1 with inductance coupled reaction ion etching machine, the silicon dioxide layer of etching depth 400mm to SOI, the diameter 600mm of acceleration thorax 1.
G) use the sand-wheel slice cutting machine scribing, the SOI substrate that will cover on the pad (8I, 8II) is removed, and the igniter chip is cut apart moulding.

Claims (2)

1. a completely-integrated impact piece ignitor contains reflector plate, bridge paper tinsel, film flying and acceleration thorax, it is characterized in that:
Glass-reflected sheet (7) is positioned at the bottom of described igniter, metal bridge paper tinsel (9) is arranged on glass-reflected sheet (7) top, and closely be connected with silicon film flying (5), silicon quickens thorax (1) and is arranged on silicon film flying (5) top, and silicon film flying (5) and silicon quicken to be provided with silicon dioxide insulator material layer (4) between the thorax (1).
2. completely-integrated impact piece ignitor preparation method is characterized in that comprising step:
A) with sputtering unit sputter copper metal layer on the Pyrex sheet;
B) on metal level, prepare the photoresist mask of bridge paper tinsel (9) shape, remove unwanted copper metal, form metal bridge paper tinsel (9) with liquor ferri trichloridi with photoetching process;
C) adopt the SOI substrate to prepare the photoresist mask of bonding step (10) shape, etch bonding step (10) with inductance coupled reaction ion etching machine with photoetching process;
D) prepare the photoresist mask of pad (8I, 8II) shape with photoetching process, etch pad (8 I, 8 II) with inductance coupled reaction ion etching machine and discharge the district, be etched to the silicon dioxide layer of SOI substrate;
E) adopt the substrate bonding machine that Pyrex sheet and SOI substrate electrostatic bonding are in the same place, wherein metal bridge paper tinsel (9) and bonding step (10) are aimed at;
F) the substrate silicon layer surface sputtering aluminium film (2) of the SOI substrate behind bonding; Aluminium film (2) photomask surface and corrosion form the aluminium mask that quickens thorax (1) shape; Etch acceleration thorax (1) with inductance coupled reaction ion etching machine, be etched to the silicon dioxide layer of SOI;
G) use the sand-wheel slice cutting machine scribing, the SOI substrate that will cover on the pad (8 I, 8 II) is removed, and the igniter chip is cut apart moulding.
CN 200910304324 2009-07-14 2009-07-14 Completely-integrated impact piece ignitor and preparation method thereof Expired - Fee Related CN101619954B (en)

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Cited By (14)

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CN102924199A (en) * 2012-11-16 2013-02-13 中国工程物理研究院化工材料研究所 Slapper detonator with injection-molding structure
CN103378056A (en) * 2012-04-12 2013-10-30 北京理工大学 Integrated circuit chip-level self-destructive method based on MEMS metal bridge transducer element structure and structure thereof
CN103528445A (en) * 2013-10-09 2014-01-22 北京理工大学 Low-igniting-voltage miniature semiconductor bridge igniting assembly
CN103868417A (en) * 2014-04-02 2014-06-18 中国工程物理研究院化工材料研究所 Chip type exploding foil component and production method for same
CN104089542A (en) * 2014-07-15 2014-10-08 中国工程物理研究院化工材料研究所 Installation assembly for integrated discharge circuit slapper detonators
CN104387216A (en) * 2014-09-03 2015-03-04 中国工程物理研究院化工材料研究所 In-situ self-assembled slapper ignition component and preparation method thereof
CN104894511A (en) * 2015-07-01 2015-09-09 中国工程物理研究院化工材料研究所 Explosive logic network and preparation method thereof
CN105737681A (en) * 2016-03-10 2016-07-06 中国振华集团云科电子有限公司 Preparation method for bridge area of film bridge initiator
CN106482591A (en) * 2016-12-14 2017-03-08 中国工程物理研究院化工材料研究所 A kind of impact piece transducing meta structure and preparation method thereof
CN106643352A (en) * 2017-02-15 2017-05-10 中国工程物理研究院化工材料研究所 Low-energy initiator
CN106885496A (en) * 2017-03-30 2017-06-23 中国工程物理研究院化工材料研究所 Metal bridge transducing unit and its manufacture method
CN109115057A (en) * 2018-10-11 2019-01-01 中国工程物理研究院化工材料研究所 A kind of impact piece component and preparation method thereof using MEMS technology preparation
CN109945746A (en) * 2019-03-22 2019-06-28 中国电子科技集团公司第四十三研究所 The preparation method of chip Exploding Foil
CN110392857A (en) * 2017-03-14 2019-10-29 浜松光子学株式会社 Optical assembly

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103378056A (en) * 2012-04-12 2013-10-30 北京理工大学 Integrated circuit chip-level self-destructive method based on MEMS metal bridge transducer element structure and structure thereof
CN102924199A (en) * 2012-11-16 2013-02-13 中国工程物理研究院化工材料研究所 Slapper detonator with injection-molding structure
CN102924199B (en) * 2012-11-16 2015-06-17 中国工程物理研究院化工材料研究所 Slapper detonator with injection-molding structure
CN103528445A (en) * 2013-10-09 2014-01-22 北京理工大学 Low-igniting-voltage miniature semiconductor bridge igniting assembly
CN103528445B (en) * 2013-10-09 2015-07-08 北京理工大学 Low-igniting-voltage miniature semiconductor bridge igniting assembly
CN103868417A (en) * 2014-04-02 2014-06-18 中国工程物理研究院化工材料研究所 Chip type exploding foil component and production method for same
CN103868417B (en) * 2014-04-02 2016-02-17 中国工程物理研究院化工材料研究所 Chip-shaped Exploding Foil assembly and production method thereof
CN104089542B (en) * 2014-07-15 2015-10-14 中国工程物理研究院化工材料研究所 For the installation component of integrated discharge circuit Slapper detonator
CN104089542A (en) * 2014-07-15 2014-10-08 中国工程物理研究院化工材料研究所 Installation assembly for integrated discharge circuit slapper detonators
CN104387216A (en) * 2014-09-03 2015-03-04 中国工程物理研究院化工材料研究所 In-situ self-assembled slapper ignition component and preparation method thereof
CN104894511A (en) * 2015-07-01 2015-09-09 中国工程物理研究院化工材料研究所 Explosive logic network and preparation method thereof
CN104894511B (en) * 2015-07-01 2017-08-29 中国工程物理研究院化工材料研究所 explosive logic network and preparation method thereof
CN105737681A (en) * 2016-03-10 2016-07-06 中国振华集团云科电子有限公司 Preparation method for bridge area of film bridge initiator
CN106482591A (en) * 2016-12-14 2017-03-08 中国工程物理研究院化工材料研究所 A kind of impact piece transducing meta structure and preparation method thereof
CN106643352A (en) * 2017-02-15 2017-05-10 中国工程物理研究院化工材料研究所 Low-energy initiator
CN106643352B (en) * 2017-02-15 2018-03-23 中国工程物理研究院化工材料研究所 Low energy initiator
CN110392857A (en) * 2017-03-14 2019-10-29 浜松光子学株式会社 Optical assembly
US11579438B2 (en) 2017-03-14 2023-02-14 Hamamatsu Photonics K.K. Optical module
CN106885496A (en) * 2017-03-30 2017-06-23 中国工程物理研究院化工材料研究所 Metal bridge transducing unit and its manufacture method
CN109115057A (en) * 2018-10-11 2019-01-01 中国工程物理研究院化工材料研究所 A kind of impact piece component and preparation method thereof using MEMS technology preparation
CN109945746A (en) * 2019-03-22 2019-06-28 中国电子科技集团公司第四十三研究所 The preparation method of chip Exploding Foil
CN109945746B (en) * 2019-03-22 2021-07-23 中国电子科技集团公司第四十三研究所 Preparation method of sheet type explosive foil

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