CN101618480A - High vacuum exhaustion laser sealing device and process of micro-infrared detector - Google Patents

High vacuum exhaustion laser sealing device and process of micro-infrared detector Download PDF

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Publication number
CN101618480A
CN101618480A CN 200910055331 CN200910055331A CN101618480A CN 101618480 A CN101618480 A CN 101618480A CN 200910055331 CN200910055331 CN 200910055331 CN 200910055331 A CN200910055331 A CN 200910055331A CN 101618480 A CN101618480 A CN 101618480A
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China
Prior art keywords
vacuum
laser
sample
sample platform
high vacuum
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CN 200910055331
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Chinese (zh)
Inventor
俞君
朱三根
王小坤
曾智江
郝振贻
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Shanghai Institute of Technical Physics of CAS
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Shanghai Institute of Technical Physics of CAS
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Priority to CN 200910055331 priority Critical patent/CN101618480A/en
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Abstract

The invention discloses a high vacuum exhaustion laser sealing device and a process of a micro-infrared detector. The device mainly comprises an outer shell, a sample platform, a heating ring and a temperature and vacuum keeping system. The process comprises the following steps: fixing a sample on the sample platform; connecting the heating ring below the sample platform with a fixed groove through a bolt; connecting the sample platform through three support posts fixed at the bottom of the outer shell; closing a reinforced glass sealing door; pumping high vacuum in a cavity by a vacuum exhaustion dolly through an exhaust port, and opening the power supply of a heater in exhaustion; baking devices to exhausting air completely; sealing the sample by a laser technology through a laser transmission port after finishing preparing vacuum. With the advantages of simple structure and convenient use, the invention establishes a process foundation for a detector encapsulation technology tending to integration and micromation, and provides a reliable execution space for a non-refrigeration type or thermoelectric refrigeration type micro-infrared detector for exhaustion by high vacuum baking and laser sealing after removing an exhaust pipe.

Description

Micro-infrared detector high vacuum exhaustion laser sealing device and technology
Technical field
The present invention relates to laser processing technology, specifically be meant a kind of micro-infrared detector high vacuum exhaustion laser sealing device and technology.
Background technology
Because most of Infrared Detectors are in cryogenic when working, therefore, it is most critical and the most basic in the design that adiabatic and vacuum keeps.
The vacuum life of Infrared Detectors is mainly determined by the composite factor influence of material outgassing, leak rate, exhaust air technique and getter.Its material mainly contains stainless steel, can cut down, titanium alloy, oxygen-free copper and some nonmetallic materials, as 95 potteries, low temperature glue etc.
The present invention is based on the high vacuum exhaustion sealing process in non-refrigeration type or the encapsulation of thermoelectric cooling type infrared detector module.The process of present stage is oxygen-free copper blast pipe of soldering on the device wall (diameter ≈ φ 6mm), carry out high vacuum exhaustion by this blast pipe, after check reaches expection vacuum, carry out manual clamp, make cavity airtight, keep vacuum in the device, guarantee the performance of detector.
Yet the encapsulation of detector is tending towards integrated and microminiaturized in the world, so the development of micro-infrared detector becomes the technology that leads gradually.Simultaneously, the space flight Infrared Detectors is one of crucial component of satellite, its reliability is directly connected to the bulk life time of satellite, so the Infrared Detectors of AEROSPACE APPLICATION be except will having highly sensitive characteristic, and its reliability index must satisfy application requirements.
Because blast pipe has occupied certain space on probe body, if will accomplish " miniature ", the overall dimensions of detector then are not suitable for loading it, and profile is not attractive in appearance yet.Therefore carry out high vacuum by blast pipe and toast the encapsulation requirement that the mode of exhaust and manual clamp can not adapt to micro detector fully.Based on the research tendency of Infrared Detectors,, must carry out the supporting encapsulation technology that adapts to its development also in order to improve present incomplete clamping ﹠ sealing technology.Therefore, the sealing tech of optimization micro-infrared detector high vacuum exhaustion is especially necessary.
Summary of the invention
The purpose of this invention is to provide a kind of novel device and technology that is used for road encapsulation behind the micro-infrared detector, solve the clamp problem of sealing of micro-infrared detector high vacuum exhaustion.
Because cavity will bear high vacuum, in order to guarantee reliability, shell body 1 is selected stainless steel for use.Open a Laser Transmission mouth in the center of top of shell body 1, optical glass 101 is sealed on the Laser Transmission mouth with low temperature glue.
Inside cavity is a sample platform 2.Because shell body 1 is selected stainless steel for use, heat can be to shell body 1 conduction during the sample baking, and therefore for the heat transfer of slowing down, housing bottom is fixed three tetrafluoroethene support columns 201 and supported copper sample platform 2, (height of required sample platform, promptly laser focal can pass through to regulate the packing ring on the support column).
Because exhaust is an important step of road encapsulation process behind the detector, whether exhaust fully directly has influence on the performance of detector, and parts can adsorb some gases in assembling process, when being in vacuum environment, it will give vent to anger because of parsing, so in the high vacuum exhaustion process, should improve the temperature in the exhaust process and prolong evacuation time as far as possible, the gas that is adsorbed on the vacuum chamber inner surface is discharged as far as possible, reduce the vacuum chamber inner surface residual gas gas output after exhaust is finished.In order to heat fully, guarantee that also exhaust is abundant simultaneously, a heating collar 202 is installed below sample platform 2,90 ± 5 ℃ of baking temperatures are adjustable.And it is by bolt that heating collar 202 is fixing with sample platform 2 with a circular holddown groove 203.
In order accurately to grasp virtual condition in the cavity, the housing sidewall interface that designs several necessity is realized exhaust outside, and vacuum, temperature controlling.
Concrete processing step is:
1, sample 3 is put on the sample platform 2;
2, close the safety glass hermatic door, take out high vacuum in the cavity by exhaust outlet 102, open the power supply of heating collar 202 and temperature controller 103 simultaneously with high-vacuum molecular pump exhaust unit;
3, regulate focal length and each welding condition of laser 4, make laser facula aim at the aperture that need seal;
4, open laser.
Advantage of the present invention:
1, this apparatus structure is simple, and is easy to use.
2, this device has been established the technology basis for being tending towards integrated and microminiaturized detector encapsulation technology.
3, this device provides non-refrigeration type or thermoelectric cooling type micro-infrared detector to carry out the reliable enforcement space of high vacuum baking exhaust and laser sealing process after removing blast pipe.
Description of drawings
Fig. 1 is high vacuum baking exhaustion laser closure system connection layout;
Shell body---1;
Optical glass---101;
Exhaust outlet---102;
Temperature controller---103;
Vacuum gauge---104;
Inflation inlet---105;
The sample platform---2;
Support column---201;
Heating collar---202;
Holddown groove---203;
Sample---3;
Laser---4.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is described in further detail:
High vacuum baking exhaust apparatus of the present invention comprises: shell body 1, sample platform 2, support column 201, heating collar 202 and vacuum maintenance system etc.
Sample 3 is fixed on the sample platform 2 in the vacuum cavity.The heating collar 202 of being close to sample platform 2 belows links to each other with circular stainless steel holddown groove 203 by four bolts.For the heat transfer of slowing down, three support columns that are fixed on shell body 1 bottom 201 adopt tetrafluoroethene, support sample platform 2 with it, be adjusted to proper height after, with nut that sample platform 2 and support column 201 is fixing.
Then, close the safety glass hermatic door, connect exhaust outlet 102 with TURBOVAC-50K type high-vacuum molecular pump exhaust unit and take out high vacuum in the cavity, open the power supply of heating collar 202 in exhaust, the baking device makes degasification abundant.In the process of pumping high vacuum, be careful vacuum, variation of temperature situation in the cavity closely.
Because temperature<100 that the thermoelectric cooling module of encapsulation can bear in the shell ℃, therefore experiment adopts OMRON E5CSZ type digital temperature controller temperature control in 90 ± 5 ℃ of scopes.
Show that according to high-vacuum molecular pump exhaust unit vacuum is better than 10 in cavity -3Can carry out sealing process during Pa.Because what open on sample device cap is the aperture of Ф 0.5mm, the YAG laser-beam welding machine laser facula of therefore adjusting model and be JHM-1GY-300B is to φ 1.5mm, negative out of focus 15mm, mariages electric current 205A, pulsewidth 15ms, frequency 2Hz.Utilize laser welding technology under high vacuum state, see through optical glass 101, hot spot is hit on aperture, make device material can cut down melting and seal aperture.
After this technology is finished, in vacuum cavity, inflate, open hermatic door, take out the device of sealing by inflation inlet 105.Seal leak rate through the detection of MS-40 leak detector and be better than 0.9 * 10 -9Torrl/s, this is worth in indication range, and promptly sealing process is finished.Otherwise, repeat laser weld to sample and satisfy and seal till the leak rate requirement.
This laser seal technology of micro-infrared detector after high vacuum baking exhaust that be used for can guarantee the reliability that device seals better, the device performance of being honored as a queen is good, processing processing step that blast pipe produced and the burden on the space have been remedied simultaneously, guaranteed that detector is sealing the maintenance of back to vacuum, has improved the reliability of detector.

Claims (2)

1. micro-infrared detector high vacuum exhaustion laser sealing device, it mainly comprises shell body (1), sample platform (2), support column (201), heating collar (202) and vacuum keep system, it is characterized in that: sample platform (2) is installed in the shell body (1) by three tetrafluoroethene support columns (201), a heating collar (202) is installed in sample platform (2) below, and heating collar (202) is adjacent to the back side that is fixed on sample platform (2) with a holddown groove (203) and four bolts, the center of top of shell body (1) is opened a Laser Transmission mouth (101) by the optical glass sealing, on the shell body (1) exhaust outlet (102) is installed also simultaneously, temperature controller (103), vacuum gauge (104) and inflation inlet (105).
2. micro-infrared detector laser sealing process method based on the described device of claim 1, it is characterized in that: it may further comprise the steps:
A. sample (3) is fixed on the sample platform (2) in the vacuum cavity, close the safety glass hermatic door, connect exhaust outlet (102) with TURBOVAC-50K type high-vacuum molecular pump exhaust unit and take out high vacuum in the cavity, open the power supply of heating collar (202) in exhaust, the baking device makes degasification abundant;
B. will test and adopt OMRON E5CSZ type digital temperature controller temperature control in 90 ± 5 ℃ of scopes;
C. show that according to high-vacuum molecular pump exhaust unit vacuum is better than 10 in cavity -3During Pa, adjust JHM-1GY-300B type YAG laser-beam welding machine laser facula to φ 1.5mm, negative out of focus 15mm, mariages electric current 205A, pulsewidth 15ms, frequency 2Hz.Utilize laser welding technology under high vacuum state, see through optical glass (101), hot spot is hit on the φ 0.5mm aperture of opening on sample (3) the device cap, make device material can cut down melting and seal aperture;
D. after step C technology is finished, in vacuum cavity, inflate, open hermatic door, take out the device of sealing, seal leak rate through the detection of MS-40 leak detector and be better than 0.9 * 10 by inflation inlet (105) -9During Torrl/s, sealing process is finished, otherwise, repeat A-C step to sample and satisfy and seal till the leak rate requirement.
CN 200910055331 2009-07-24 2009-07-24 High vacuum exhaustion laser sealing device and process of micro-infrared detector Pending CN101618480A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104162742A (en) * 2013-05-20 2014-11-26 深圳市大族激光科技股份有限公司 Laser processing method and processing device
CN105067656A (en) * 2015-08-06 2015-11-18 哈尔滨工业大学 Superhigh-temperature sample stage suitable for high-power laser heating
CN105252143A (en) * 2015-11-23 2016-01-20 哈尔滨工业大学 Large-power vacuum laser welding device
CN105385833A (en) * 2015-12-14 2016-03-09 中国北方发动机研究所(天津) Modifying, thermal-treatment and preheating device for valve seat ring of engine
CN107215847A (en) * 2017-07-06 2017-09-29 上海应用技术大学 A kind of quick micromachining device of Teflon and method
CN107580534A (en) * 2015-04-08 2018-01-12 费尔索梅特有限及两合公司 Method for the vacuum laser welding at least workpiece of two-part
CN109374395A (en) * 2018-11-13 2019-02-22 中国科学院上海硅酸盐研究所 Sample sealed compartment for array sample laser heating system
CN109470230A (en) * 2018-11-21 2019-03-15 中国船舶重工集团公司第七0七研究所 A kind of solid wave/resonant gyroscope sealing structure
CN109604753A (en) * 2018-11-21 2019-04-12 中国船舶重工集团公司第七0七研究所 Solid wave/resonant gyroscope automates package system
CN109751868A (en) * 2019-01-15 2019-05-14 福建江夏学院 A kind of vacuum chamber with wireless control warming module
CN110773866A (en) * 2019-12-04 2020-02-11 广东省焊接技术研究所(广东省中乌研究院) Vacuum welding device and method for amorphous alloy
CN111906440A (en) * 2020-07-28 2020-11-10 东莞市中麒光电技术有限公司 Preparation method of display screen module
CN113427124A (en) * 2020-03-05 2021-09-24 海纳光电股份有限公司 High-temperature environment processing device and method for hard and brittle plates
CN113964233A (en) * 2021-09-07 2022-01-21 云南昆物新跃光电科技有限公司 Packaging method of low-temperature vacuum infrared detector

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104162742B (en) * 2013-05-20 2016-05-25 大族激光科技产业集团股份有限公司 Laser processing and processing unit (plant)
CN104162742A (en) * 2013-05-20 2014-11-26 深圳市大族激光科技股份有限公司 Laser processing method and processing device
CN107580534A (en) * 2015-04-08 2018-01-12 费尔索梅特有限及两合公司 Method for the vacuum laser welding at least workpiece of two-part
CN105067656B (en) * 2015-08-06 2017-06-27 哈尔滨工业大学 A kind of superhigh temperature sample stage suitable for high power laser heating
CN105067656A (en) * 2015-08-06 2015-11-18 哈尔滨工业大学 Superhigh-temperature sample stage suitable for high-power laser heating
CN105252143A (en) * 2015-11-23 2016-01-20 哈尔滨工业大学 Large-power vacuum laser welding device
CN105252143B (en) * 2015-11-23 2017-09-29 哈尔滨工业大学 A kind of powerful vacuum laser soldering device
CN105385833A (en) * 2015-12-14 2016-03-09 中国北方发动机研究所(天津) Modifying, thermal-treatment and preheating device for valve seat ring of engine
CN107215847A (en) * 2017-07-06 2017-09-29 上海应用技术大学 A kind of quick micromachining device of Teflon and method
CN109374395A (en) * 2018-11-13 2019-02-22 中国科学院上海硅酸盐研究所 Sample sealed compartment for array sample laser heating system
CN109604753A (en) * 2018-11-21 2019-04-12 中国船舶重工集团公司第七0七研究所 Solid wave/resonant gyroscope automates package system
CN109470230A (en) * 2018-11-21 2019-03-15 中国船舶重工集团公司第七0七研究所 A kind of solid wave/resonant gyroscope sealing structure
CN109470230B (en) * 2018-11-21 2022-06-10 中国船舶重工集团公司第七0七研究所 Solid wave/resonance gyroscope sealing structure
CN109751868A (en) * 2019-01-15 2019-05-14 福建江夏学院 A kind of vacuum chamber with wireless control warming module
CN110773866A (en) * 2019-12-04 2020-02-11 广东省焊接技术研究所(广东省中乌研究院) Vacuum welding device and method for amorphous alloy
CN113427124A (en) * 2020-03-05 2021-09-24 海纳光电股份有限公司 High-temperature environment processing device and method for hard and brittle plates
CN111906440A (en) * 2020-07-28 2020-11-10 东莞市中麒光电技术有限公司 Preparation method of display screen module
CN113964233A (en) * 2021-09-07 2022-01-21 云南昆物新跃光电科技有限公司 Packaging method of low-temperature vacuum infrared detector
CN113964233B (en) * 2021-09-07 2024-01-23 云南昆物新跃光电科技有限公司 Packaging method of low-temperature vacuum infrared detector

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Open date: 20100106