CN101616547A - Automatically put the plate system and throw in the substrate method - Google Patents
Automatically put the plate system and throw in the substrate method Download PDFInfo
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- CN101616547A CN101616547A CN200810302369A CN200810302369A CN101616547A CN 101616547 A CN101616547 A CN 101616547A CN 200810302369 A CN200810302369 A CN 200810302369A CN 200810302369 A CN200810302369 A CN 200810302369A CN 101616547 A CN101616547 A CN 101616547A
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Abstract
A kind of plate system of putting, it comprises: a bogey; A vacuum absorption device; First drive unit; The described plate system of putting also comprises a device of image scanning, and it is used to scan the image that is placed on the substrate on the described plummer; Second drive unit, it is used to drive described bogey translation; And control device, its described vacuum absorption device of substrate image analysing computer that scanning obtains according to described device of image scanning and be placed on position deviation between the substrate on the described bogey, and according to described second drive unit of this Deviation Control, so that described vacuum absorption device and the base plate alignment that is placed on the described bogey.The invention still further relates to a kind of method of throwing in substrate.
Description
Technical field
The present invention relates to flexible PCB and make the field, relate in particular to the plate system of putting automatically of flexible PCB production process and the method for throwing in substrate.
Background technology
The manufacture craft of circuit board generally includes blanking, via making, conducting wire making, welding resisting layer printing, step such as gold-plated.Blanking is meant the substrate that raw material such as copper clad laminate is cut into the appropriate size of being convenient to produce.The manufacture craft of via generally comprises boring and electroplate in the hole, to realize the interconnection of interlayer conducting wire.The conducting wire makes and is meant the conductive pattern of the Copper Foil on the substrate being made design, general by applying steps formation such as photoresistance, exposure imaging, circuit etching and photoresistance removal, be published in the document " Novel lithography process for extreme deeptrench by using laminated negative dry film resist " of IEEE 17th International Conference on MicroFlectro Mechanical Systems in 2004 referring to people such as Moon-Youn Jung.After via, conducting wire complete, can apply one deck welding resisting layer with the protection conducting wire, between the conducting wire, cause solder shorts when avoiding conducting wire oxidation and follow-up mounting at conducting wire outer surface (except that the terminating end points).The gold-plated gold layer that plates a floor height inactivity on the terminating end points of circuit board that is meant is protected the terminating end points, and satisfactory electrical conductivity is provided.
It generally is to carry out on conveyer belt that the conducting wire of circuit board makes, that is to say, earlier be positioned over circuit board on the conveyer belt successively, by conveyer belt substrate is sent to photoresistance coating machine, exposed mask, developing machine, etching solution spray groove and stripping machine again, thereby finishes the making of conducting wire.Yet when with manual type substrate being positioned over conveyer belt, it is wayward to put plate speed, thereby makes substrate spacing inequality on the conveyer belt, is not easy to the carrying out of subsequent technique.
At present, the board device of putting of automation occurs, and it generally adopts vacuum slot adsorption flexible substrate to put the plate action to finish.Yet, because flexible base, board is soft, can't pile up neat, and usually on the flexible base, board zones of different designed a plurality of tooling holes, be adsorbed onto the tooling hole of substrate when adopting vacuum slot adsorption flexible substrate easily, cause and put the plate action and can't proceed.If adopt the less vacuum slot of opening, the possibility that is adsorbed onto lead to the hole site reduces, yet because suction nozzle diminishes, then is adsorbed the strength increase that the position unit are is born by flexible base, board, is easy to generate the problem of damage flexible base, board in the adsorption process.
Therefore, be necessary to provide a kind of may command to adsorb the plate system of putting automatically of the position of substrate.
Summary of the invention
Below will a kind of plate system of putting automatically be described with embodiment.
A kind of plate system of putting, it comprises: a bogey, it is used to place substrate to be put; A vacuum absorption device, it is used to adsorb the substrate that is placed on the described bogey; First drive unit, it is used to drive the described relatively bogey motion of described vacuum absorption device to carry out the input of substrate; The described plate system of putting also comprises a device of image scanning, and it is used to scan the image that is placed on the substrate on the described plummer; Second drive unit, it is used to drive the translation in the plane at its place of described bogey; And control device, its described vacuum absorption device of substrate image analysing computer that scanning obtains according to described device of image scanning and be placed on position deviation between the substrate on the described bogey, and according to the translation of described second drive unit driving of this Deviation Control bogey, so that described vacuum absorption device and the base plate alignment that is placed on the described bogey.
A kind of put-on method of substrate, it comprises: scanning is positioned at the image of the substrate to be put on the bogey; Utilize one of control device analysis to be used to adsorb the vacuum absorption device of described substrate and be placed on position deviation between the substrate on the described bogey according to described image; According to described position deviation, utilize driving device controls to move described bogey so that described vacuum absorption device and the base plate alignment that is placed on the described bogey; Adopt described vacuum absorption device to adsorb described substrate and finish the input of substrate.
The plate system of putting in the technical program by accurate contraposition adsorbent equipment and substrate to be put, makes and puts the damage that has reduced in the plate process substrate.
Description of drawings
Fig. 1 is the schematic diagram of putting the plate system that the technical program embodiment provides.
Fig. 2 is a vacuum absorption device generalized section in the technical program.
Fig. 3 is that the adsorption hole and the substrate position of adsorption plane in the technical program concerns schematic diagram.
Fig. 4 is the adsorption plane of vacuum absorption device and the substrate contraposition process schematic diagram on the plummer.
Embodiment
Below in conjunction with accompanying drawing to the technical program provide put the plate system automatically and the substrate put-on method is described in further detail.
See also Fig. 1, the technical program embodiment provides a kind of plate system 100 of putting automatically, and it comprises slide rail 110, bogey 120, device of image scanning 130, vacuum absorption device 140, first drive unit 150, control device 160, second drive unit 170, rotating driving device 180 and height detecting device 190.Described bogey 120 is used to carry substrate to be put, described device of image scanning 130 is used to scan the image that is placed on the substrate on the described bogey 120, described vacuum absorption device 140 is relative with bogey 120, be used to adsorb substrate to be put, described first drive unit 180 is used to drive vacuum absorption device 140, and described second drive unit 190 is used to drive bogey 120.
Described slide rail 110 comprises first slide rail 111 and second slide rail 112 that is parallel to each other.The length direction of first slide rail 111 and second slide rail 112 is defined as the first axial X, the plane at first slide rail 111 and second slide rail, 112 places is the XY face, be defined as the second axial Y perpendicular to first slide rail 111 and second slide rail, 112 length directions, be defined as the 3rd axial Z perpendicular to the direction of XY face.
Bogey 120 comprises plummer 121, first keeper 122, second keeper 123 of a rectangle.Plummer 121 has a load plane 1211, and it is parallel to the XY face.
Device of image scanning 130 is used to detect the position of waiting to put substrate of carrying on the plummer 121, and device of image scanning 130 comprises two scanners at least.In the present embodiment, device of image scanning 130 comprises first scanner 131, second scanner 132, the 3rd scanner 133 and the 4th scanner 134.First scanner 131, second scanner 132, the 3rd scanner 133 and the 4th scanner 134 are separately positioned on around the bogey 120.In the present embodiment, the logical respectively connecting rod of first scanner 131 and the 3rd scanner 133 is fixed in first slide rail, 111, the second scanners 132 and the 4th scanner 134 is fixed in second slide rail 112 by a connecting rod respectively.Be appreciated that described connecting rod also slidably is arranged on the corresponding slide rail.
See also Fig. 2, vacuum absorption device 140 is a housing with cavity 144.It has base plate 141, and described base plate 141 has adsorption plane 142, and described adsorption plane 142 is relative with plummer 121, and described adsorption plane 142 is provided with a plurality of adsorption holes 143, and described base plate 141 is set to demountable structure.Zone, conducting wire and tooling hole on the different substrate adsorb different substrates, can adopt different base plate 142, so that can be avoided in the position that adsorption hole 143 is provided with.For different substrates, also can directly replace whole vacuum absorption device 140 in addition.
See also Fig. 3, the position that adsorption hole 143 is provided with is corresponding to waiting to adsorb the idle zone that the conducting wire is not set on the substrate 200 and does not have tooling hole, and with substrate on conducting wire zone 201 at a distance of certain distance, to guarantee can not make that the conducting wire on the substrate 200 sustains damage in absorption and the transport process.Described adsorption plane 142 can be general for a plurality of substrates, also can be according to different substrate models, and the special-purpose base plate 142 that design is used at this model substrate.
Described vacuum absorption device 140 links to each other with vacuum extractor (figure does not show), and described vacuum extractor is extracted the air in the cavity 144 of vacuum absorption device 140 out, thereby realizes the function of absorption substrate.
Described first drive unit 150 links to each other with vacuum absorption device 140, and links to each other with control device 160, under the control of control device 160.First drive unit 150 drives vacuum absorption device 140 relative plummers 121 and rises, descends and move horizontally.
Described second drive unit 170 comprises that first driver 171 and second driver 172 are respectively applied for control plummer 121 and produce mobile at the second axial Y and the first axial X.In the present embodiment, described first driver 171 is connected in plummer 121 by first actuating arm 173.Described second driver 172 is connected in plummer 121 by second linking arm 174.Described first driver 171 and second driver 172 can be linear motor.
Described rotating driving device 180 is installed on first drive unit 150, and described rotating driving device 180 links to each other with control device 160, under the control of control device 160, drives vacuum absorption device 140 and produces the rotation that is parallel to the XY face.
Described height measuring device 190 is used to detect the stacks as high of the substrate of placing on the plummer 121.Described height detecting device 190 comprises first detection piece 191 and second detection piece 192, described first detection piece 191 is installed on second connecting rod 135 of first scanner, 131 correspondences, and second detection piece 192 is installed on second connecting rod 135 of second scanner, 132 correspondences.Described first detection piece 191 and second detection piece 192 can be fiber device, and they link to each other with control device 160 respectively.First detection piece 191 and second detection piece 192 are delivered to control device with the signal of the stacks as high of plummer 121 upper substrates, by formula is set, the distance that control vacuum absorption device 140 moves along the 3rd axial Z when the absorption substrate and remove electrostatic equipment 101 and plummer 121 between distance.
Because board substrate is organic materials such as polyimides, be easy to generate Electrostatic Absorption between the substrate, in the present embodiment, put plate system 100 and further comprise electrostatic equipment 101, the described electrostatic equipment 101 that goes is relative with plummer 121, be slidingly mounted on respectively on first slide rail 111 and second slide rail 112 by first support bar 1011 and second support bar 1012, described first support bar 1011 and second support bar 1012 extend to the direction away from slide rail 110 along the 3rd axial Z, the described electrostatic equipment 101 that goes is arranged between them, and can slide along the length direction of first support bar 1011 and second support bar 1012.
Concrete, before vacuum absorption device 140 absorption substrates, the absorption that produces in order to prevent the static between the substrate needs to go electrostatic equipment 101 to slide into the other end by an end of substrate to be put, to eliminate static.The thickness of the substrate that on plummer 121, piles up and go the adjustment of distance between electrostatic equipment 101 and the plummer 121.The described electrostatic equipment 101 that goes can be electrostatic rod.
Using the above-mentioned plate method of putting of putting plate system 100 may further comprise the steps:
The first step provides the plate system 100 of putting.
Second step was stacked in the surface 1211 of plummer 121 with substrate, and finished neat and the Primary Location of piling up of substrate by first keeper 122 and second keeper 123.
The 3rd goes on foot, and eliminates the static of substrate to be adsorbed.By going electrostatic equipment 101 to slide to the other end from waiting an end of putting substrate, eliminate the static of waiting to put on the substrate along first slide rail 111 and second slide rail 112.
In the 4th step, scanning is positioned at the image of the substrate to be put on the bogey 120.Image by device of image scanning 130 scannings substrate to be put.
The 5th step is according to described image analysing computer vacuum absorption device 140 and be placed on position deviation between the substrate 200 on the described bogey.See also Fig. 4, vacuum absorption device 140 is near the fixed-site of the substrate on the plummer 121 200, by control device 160 analyzing and processing, determine to wait to adsorb the deviation of the relative position between the adsorption plane 142 of the position of substrate 200 and vacuum absorption device 140, described deviation comprises the deviation delta X of the first axial X, deviation delta Y and the angular deviation θ of the second axial Y.
In the 6th step, move described bogey 120 according to described Deviation Control, so that described vacuum absorption device 140 and the base plate alignment that is placed on the described bogey 120.Control device 160 control first drive units 124 and second drive unit 125 make the displacement that plummer 121 produces the first axial X and the second axial Y, with the deviation delta X that eliminates the first axial X and the deviation delta Y of the second axial Y.
The 7th step is according to the described vacuum absorption device 140 of described image image analysing computer and be placed on angular deviation θ between the substrate on the described bogey 120.Vacuum absorption device 140 is anglec of rotation θ under the driving of rotating driving device 170, make adsorption plane 142 and substrate 200 accurate contrapositions to be adsorbed, avoid the improper damage that substrate is caused of absorption position, the hole of also having avoided being adsorbed onto substrate makes absorption to carry out smoothly.
In the 8th step, adopt the described vacuum absorption device 140 described substrates 200 of absorption and finish the input of substrate 200.Adsorbent equipment 141 is moved to plummer 121, make adsorption plane 142 and substrate contacts to be adsorbed, the vacuum extractor that startup links to each other with vacuum absorption device 140 (figure does not show), adsorbent equipment 141 picks up substrate, under the control of control device 160, rotating driving device 170 drives vacuum absorption devices 140 anglec of rotation θ round about, guaranteeing the fixed-site before vacuum absorption device 140 each absorption substrates, and makes and does not produce angle tilt when throwing in substrate.Vacuum absorption device 140 is transmitted in the position that desire is placed with the substrate substrate that adsorbs under the driving of second drive unit 190, close vacuum extractor, makes substrate place assigned address.
Be appreciated that first drive unit 150 drives vacuum absorption device 140 and gets back to original position, repeat above-mentioned steps three, can put plate automatically to step 8.
Put plate system 100 by employing, can realize accurately contraposition between the substrate thrown in and the adsorption plane 142 accurately, thereby avoided in the adsorption process the damage that has owing to contraposition that error produces, simultaneously, also guaranteed carrying out smoothly of continuous input substrate the circuit of substrate.Logical, because vacuum absorption device 140 is set to have adsorption plane 142 structures of adsorption hole 143, can avoid the absorption damage that produces owing to flexible base, board is soft.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
1. put the plate system for one kind, it comprises:
A bogey, it is used to place substrate to be put;
A vacuum absorption device, it is used to adsorb the substrate that is placed on the described bogey;
First drive unit, it is used to drive the described relatively bogey motion of described vacuum absorption device to carry out the input of substrate;
It is characterized in that the described plate system of putting also comprises a device of image scanning, it is used to scan the image that is placed on the substrate on the described plummer;
Second drive unit, it is used to drive described bogey;
A control device, its described vacuum absorption device of substrate image analysing computer that scanning obtains according to described device of image scanning and be placed on position deviation between the substrate on the described bogey, and according to the translation of described second drive unit driving of this Deviation Control bogey, so that described vacuum absorption device and the base plate alignment that is placed on the described bogey.
2. the plate system of putting as claimed in claim 1, it is characterized in that, described vacuum absorption device comprises that an inside is formed with the housing of cavity, housing also has an adsorption plane, described adsorption plane offers a plurality of through holes and is connected with described cavity, described cavity is used for linking to each other with vacuum extractor, and described adsorption plane carries relative with cushion cap.
3. the plate system of putting as claimed in claim 1 is characterized in that, further comprises a rotating driving device, and it is fixed in described first drive unit, is used to drive described vacuum absorption device and rotates in being parallel to the plane of described bogey.
4. the plate system of putting as claimed in claim 1 is characterized in that, comprises that is further removed an electrostatic equipment, and it is mounted slidably between described vacuum absorption device and described bogey.
5. the plate system of putting as claimed in claim 4, it is characterized in that, further comprise two slide rails that are arranged at the relative both sides of described bogey respectively, a support bar slidably is installed on each slide rail, the described electrostatic equipment two ends of going are individually fixed in described support bar.
6. the plate system of putting as claimed in claim 1 is characterized in that, comprises further on the described bogey that keeper, described keeper are used to make the substrate alignment that places on the described bogey.
7. the plate system of putting as claimed in claim 1 is characterized in that, the described plate system of putting further comprises height detecting device, and it is used to detect the stacks as high that places the substrate on the described bogey.
8. the plate system of putting as claimed in claim 1 is characterized in that described device of image scanning comprises at least two scanners.
9. the put-on method of a substrate, it comprises:
Scanning is positioned at the image of the substrate to be put on the bogey;
Utilize a control device analysis to be used to adsorb the vacuum absorption device of described substrate and be placed on position deviation between the substrate on the described bogey according to described image;
According to described position deviation, utilize a driving device controls to move described bogey so that described vacuum absorption device and the base plate alignment that is placed on the described bogey;
Adopt described vacuum absorption device to adsorb described substrate and finish the input of substrate.
10. the put-on method of substrate as claimed in claim 9 is characterized in that, utilizes a rotating driving device to control this vacuum absorption device rotation so that described vacuum absorption device and the base plate alignment that is placed on the described bogey.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103023692A CN101616547B (en) | 2008-06-26 | 2008-06-26 | Automatic board-launching system and baseplate-launching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103023692A CN101616547B (en) | 2008-06-26 | 2008-06-26 | Automatic board-launching system and baseplate-launching method |
Publications (2)
| Publication Number | Publication Date |
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| CN101616547A true CN101616547A (en) | 2009-12-30 |
| CN101616547B CN101616547B (en) | 2010-12-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008103023692A Expired - Fee Related CN101616547B (en) | 2008-06-26 | 2008-06-26 | Automatic board-launching system and baseplate-launching method |
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| CN (1) | CN101616547B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595800A (en) * | 2011-01-04 | 2012-07-18 | 鸿骐新技股份有限公司 | Visual positioning device for carrying out high-accuracy synchronous attaching on multiple substrates and method thereof |
| CN104185415A (en) * | 2014-08-21 | 2014-12-03 | 昆山龙腾光电有限公司 | Substrate positioning and bearing device, substrate assembling system and substrate assembling method |
| CN106404786A (en) * | 2016-11-04 | 2017-02-15 | 中国科学院长春光学精密机械与物理研究所 | Circuit board image scanning device |
| CN108081764A (en) * | 2017-11-29 | 2018-05-29 | 南京协辰电子科技有限公司 | PCB automatic contraposition devices |
| CN111435068A (en) * | 2018-12-26 | 2020-07-21 | 深圳麦逊电子有限公司 | Method and system for checking integral step-by-step positioning precision of IC carrier plate testing machine |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100335431C (en) * | 2005-01-28 | 2007-09-05 | 广辉电子股份有限公司 | Base plate transfer device |
| JP4241639B2 (en) * | 2005-02-14 | 2009-03-18 | セイコーエプソン株式会社 | Droplet discharge device and maintenance method of droplet discharge head |
-
2008
- 2008-06-26 CN CN2008103023692A patent/CN101616547B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102595800A (en) * | 2011-01-04 | 2012-07-18 | 鸿骐新技股份有限公司 | Visual positioning device for carrying out high-accuracy synchronous attaching on multiple substrates and method thereof |
| CN104185415A (en) * | 2014-08-21 | 2014-12-03 | 昆山龙腾光电有限公司 | Substrate positioning and bearing device, substrate assembling system and substrate assembling method |
| CN104185415B (en) * | 2014-08-21 | 2018-01-16 | 昆山龙腾光电有限公司 | Substrate positioning carrier, substrate assembling system and substrate method for assembling |
| CN106404786A (en) * | 2016-11-04 | 2017-02-15 | 中国科学院长春光学精密机械与物理研究所 | Circuit board image scanning device |
| CN108081764A (en) * | 2017-11-29 | 2018-05-29 | 南京协辰电子科技有限公司 | PCB automatic contraposition devices |
| CN108081764B (en) * | 2017-11-29 | 2023-08-29 | 南京协辰电子科技有限公司 | Automatic alignment device for PCB |
| CN111435068A (en) * | 2018-12-26 | 2020-07-21 | 深圳麦逊电子有限公司 | Method and system for checking integral step-by-step positioning precision of IC carrier plate testing machine |
| CN111435068B (en) * | 2018-12-26 | 2022-08-02 | 深圳麦逊电子有限公司 | Method and system for checking integral step-by-step positioning precision of IC carrier plate testing machine |
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| Publication number | Publication date |
|---|---|
| CN101616547B (en) | 2010-12-08 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Granted publication date: 20101208 Termination date: 20160626 |