CN101610638B - Line motherboard - Google Patents
Line motherboard Download PDFInfo
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- CN101610638B CN101610638B CN2008101259728A CN200810125972A CN101610638B CN 101610638 B CN101610638 B CN 101610638B CN 2008101259728 A CN2008101259728 A CN 2008101259728A CN 200810125972 A CN200810125972 A CN 200810125972A CN 101610638 B CN101610638 B CN 101610638B
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Abstract
The invention relates to a line motherboard provided with a plurality of line areas and a periphery area surrounding the line areas. The line motherboard comprises an insulating layer and a metal pattern layer, wherein the metal pattern layer is configured on the insulating layer and comprises at least one first electroplating wire and a plurality of lines. The lines are respectively positioned in the line areas, and the first electroplating wire is positioned in the periphery area. The lines are electrically connected with the first electroplating wire, wherein the first electroplating wire is provided with a first wavy edge and a second wavy edge which are opposite to each other.
Description
Technical field
The invention relates to a kind of wiring board, and particularly relevant for a kind of rigid line motherboard (rigidwiring mother board).
Background technology
Wiring board is the needed critical elements of a lot of electronic installations (electronic device).Wiring board can be assembled with a plurality of electronic components (electronic component), and these electronic components for example are crystal (chip) and passive device (passive component).By wiring board, these electronic components are electrically connected to each other, and signal could transmit between these electronic components.
Present wiring board normally forms the line motherboard cutting.Specifically, a line motherboard comprises a plurality of wiring boards, and line motherboard can pass through cutting process, so that these wiring boards are separated from one another.In addition, the circuit on these wiring boards normally forms by electroplating, and before carrying out above-mentioned plating, can make many plating lines (plating bar) earlier on line motherboard.Afterwards, by these plating lines, the circuit on the wiring board is able to form by plating.
Fig. 1 is the generalized section of the line motherboard of conventional art.See also Fig. 1, traditional line motherboard 30 comprises a resin bed 10 and many plating lines 20 (Fig. 1 illustrates), wherein be embedded in resin bed 10 in these plating lines 20, and the both sides toward each other of plating line 20 has two linear edges 22.
When line motherboard 30 is subjected to external force and exerts pressure, be subjected to the influence of above-mentioned linear edge 22, plating line 20 is difficult to disperse or discharge stress, to such an extent as to line motherboard 30 breaks easily.For instance, when carrying out the processing procedure of spray printing circuit, the pressure that nozzle produced can directly be urged to line motherboard 30, and the stress that this pressure produced can concentrate on the linear edge 22 of plating line 20.The situation that line motherboard 30 is broken easily.
Summary of the invention
The invention provides a kind of line motherboard, its plating line has wavy edge, can lower stress and break to avoid line motherboard.
The present invention proposes a kind of line motherboard, the surrounding zone that has a plurality of line areas and center on line areas.Line motherboard comprises an insulating barrier and a metal pattern layer.Metal pattern layer is configured on the insulating barrier, and comprises at least one first plating line and a plurality of circuit.Circuit lays respectively in the line areas, and first plating line is positioned at the surrounding zone.Circuit electrically connects first plating line, and wherein first plating line has one first wavy edge respect to one another and one second wavy edge.
In one embodiment of this invention, the thickness range of above-mentioned line motherboard is between 30 microns to 150 microns.
In one embodiment of this invention, the first above-mentioned wavy edge comprises a plurality of first camber line edges, and the second wavy edge comprises a plurality of second camber line edges, one of them first camber line edge is connected to another first camber line edge, and one of them second camber line edge is connected to another second camber line edge.
In one embodiment of this invention, above-mentioned these first camber line edges and these second camber line edge symmetric arrays.
In one embodiment of this invention, above-mentioned these first camber line edges and these second camber line edges are staggered.
In one embodiment of this invention, above-mentioned these first camber line edges and these second camber line edges are outwards outstanding.
In one embodiment of this invention, above-mentioned these first camber line edges and these second camber line edges cave inward.
In one embodiment of this invention, above-mentioned these first camber line edges and these second camber line edges is shaped as circular arc (circular arc) or ellipse arc (elliptic arc).
In one embodiment of this invention, the first above-mentioned wavy edge also comprises a plurality of first linear edges, the second wavy edge also comprises a plurality of second linear edges, one of them first camber line edge is connected between adjacent two first linear edges, and one of them second camber line edge is connected between adjacent two second linear edges.
In one embodiment of this invention, above-mentioned these first camber line edges and the junction between the junction between these first linear edges and these second camber line edges and these second linear edges are fillet.
In one embodiment of this invention, above-mentioned line motherboard also comprises many first plating lines and many second plating lines.These first plating lines and these second plating lines are checkerboard and arrange.
In one embodiment of this invention, be embedded in the insulating barrier in above-mentioned these first plating lines and these second plating lines.
In one embodiment of this invention, above-mentioned these first plating lines and these the second plating lines surface that protrudes in insulating barrier.
In one embodiment of this invention, above-mentioned line motherboard has more a plurality of cutting areas.These line areas and these surrounding zones all are positioned at these cutting areas, and the quantity of these cutting areas is less than the quantity of these line areas.
Based on above-mentioned, because first plating line of the present invention has one first wavy edge respect to one another and one second wavy edge, therefore, compared to conventional art, first plating line of the present invention can disperse stress, with the situation of avoiding line motherboard to break.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the generalized section of the line motherboard of conventional art.
Fig. 2 A is the schematic top plan view of the line motherboard of one embodiment of the invention.
Fig. 2 B is the local enlarged diagram of the line motherboard among Fig. 2 A.
Fig. 3 A is the local enlarged diagram of first plating line among Fig. 2 B.
Fig. 3 B is the enlarged diagram of first plating line of another embodiment of the present invention.
Fig. 4 A is the enlarged diagram of first plating line of another embodiment of the present invention.
Fig. 4 B is the enlarged diagram of first plating line of another embodiment of the present invention.
Fig. 5 A is the generalized section of Fig. 2 B center line I-I.
Fig. 5 B is the generalized section of the line motherboard of another embodiment of the present invention.
Fig. 6 is the schematic top plan view of the line motherboard of another embodiment of the present invention.
The main element symbol description
10: resin bed
20: plating line
22: linear edge
30: line motherboard
100,100A: line motherboard
100B: secondary line motherboard
100a: line areas
100b: surrounding zone
100c: cutting area
110,100 ': insulating barrier
110a: upper surface
120: metal pattern layer
200,200a, 200b, 200c: first plating line
210,210a, 210b, 210c: the first wavy edge
212,212a, 212b, 212c: first curved edge
220,220a, 220b, 220c: the second wavy edge
222,222a, 222b, 222b: the second camber line edge
214: the first linear edges
224: the second linear edges
230a: upper surface
230b: lower surface
300: circuit
300a: weld pad
300b: cabling
400: the second plating lines
Embodiment
Fig. 2 A is the schematic top plan view of the line motherboard of one embodiment of the invention, and Fig. 2 B is the local enlarged diagram of the line motherboard among Fig. 2 A.For convenience of description and simplify accompanying drawing, Fig. 2 A omits circuit 300 is shown.See also Fig. 2 A and Fig. 2 B, in the present embodiment, the surrounding zone 100b that line motherboard 100 has a plurality of line areas 100a and centers on line areas 100a.Line motherboard 100 comprises an insulating barrier 110 and a metal pattern layer 120.Metal pattern layer 120 is disposed on the insulating barrier 110, and comprises many first plating lines 200 and a plurality of circuits 300.
Specifically, circuit 300 comprises a plurality of weld pads (pad) 300a and many cablings (trace) 300b.These circuits 300 lay respectively in these line areas 100a, and first plating line 200 is positioned at surrounding zone 100b.Circuit 300 is electrically connected to first plating line 200, and circuit 300 can be electrically connected to first plating line 200 by the conduction connecting structure (not shown), and wherein conduction connecting structure for example is a kind of conductive blind hole structures (conductive blind via structure) or conductivity through-hole structure (conductive through hole structure).Certainly, in other embodiments, circuit 300 can also directly not connect first plating line 200 by conduction connecting structure.In addition, the line motherboard 100 of present embodiment for example is a strip line motherboard (strip).
What deserves to be mentioned is that in the embodiment shown in Fig. 2 A and Fig. 2 B, though metal pattern layer 120 comprises many first plating lines 200, in other unshowned embodiment, metal pattern layer 120 can also only comprise one first plating line 200.Therefore, the quantity of first plating line 200 shown in Fig. 2 A and Fig. 2 B is only for illustrating, and non-limiting the present invention.
In the present embodiment, line motherboard 100 can also comprise many first plating lines 200 and many second plating lines 400, and wherein these first plating lines 200 are checkerboard with these second plating lines 400 and are arranged on the line motherboard 100.Certainly, in other unshowned embodiment, line motherboard 100 can also only comprise wherein a kind of plating line, and promptly line motherboard 100 can comprise first plating line 200 or second plating line 400.
In addition, the structure of line motherboard 100 can only have one deck circuit 300, or has multilayer line.That is to say that line motherboard 100 can be individual layer line motherboard (single side circuit motherboard), two-sided line motherboard (double side mother circuit board) or multilayer line motherboard (multi-layer circuit mother board).
Fig. 3 A is the local enlarged diagram of first plating line among Fig. 2 B.See also Fig. 3 A, first plating line 200 has respect to one another one first wavy edge 210 and one second wavy edge 220.The first wavy edge 210 comprises a plurality of first camber line edges 212, and the second wavy edge 220 comprises a plurality of second camber line edges 222.One first camber line edge 212 is connected to another first camber line edge 212, and one second camber line edge 222 is connected to another second camber line edge 222.
Connect above-mentionedly, in the present embodiment, the first wavy edge 210 also comprises a plurality of first linear edges 214, and one of them first camber line edge 212 is connected between adjacent two first linear edges 214.The second wavy edge 220 also comprises a plurality of second linear edges 224, and one of them second camber line edge 222 is connected between adjacent two second linear edges 224.In other words, the first camber line edge 212 and first linear edge 214 are arranged alternately (arranged alternatively), and the second camber line edge 222 and second linear edge 224 are arranged alternately.
In addition, in the present embodiment, the first camber line edge 212 and the second camber line edge 222 be shaped as circular arc.Specifically, the first camber line edge 212 and the second camber line edge 222 be shaped as outwards outstanding circular arc, and the first camber line edge 212 and the second camber line edge 222 be symmetric arrays, promptly the first camber line edge 212 and the second camber line edge 222 are toward each other.Therefore, first plating line 200 is a symmetrical structure.
In addition, the junction between the junction between these first camber line edges 212 and these first linear edges 214 and these second camber line edges 222 and these second linear edges 224 is fillet (seeing also the zone in the imaginary circle shown in Fig. 3 A).In other words, the junction between the junction between the first camber line edge 212 and first linear edge 214 and the second camber line edge 222 and second linear edge 224 presents smooth-shaped.
Because first plating line 200 has the respect to one another first wavy edge 210 and the second wavy edge 220, therefore, when line motherboard 100 (seeing also Fig. 2 A) when suffering that external force is exerted pressure, the stress that this external force is produced line motherboard 100 can be dispersed to the first wavy edge 210 and the second wavy edge 220 of first plating line 200 equably.
For example, in the processing procedure that carries out the spray printing circuit, the pressure that nozzle produced can directly be urged to line motherboard 100 (seeing also Fig. 2 A), and the stress that this pressure produced can be dispersed to the first wavy edge 210 and the second wavy edge 220 equably, like this situation that can avoid line motherboard 100 to break in manufacture process.That is to say that the structure of first plating line 200 can reduce the situation that line motherboard 100 breaks, with reduction line motherboard 100 production costs, and the yield of raising line motherboard 100.
In addition, in the present embodiment, the thickness of line motherboard 100 (seeing also Fig. 2 A) can be very thin, and the size of thickness for example is between 30 microns to 150 microns.Though the thickness of line motherboard 100 is between 30 microns to 150 microns, stress still can be dispersed to the first wavy edge 210 and the second wavy edge 220 equably.Therefore, although the very thin thickness of line motherboard 100 (for example between 30 microns to 150 microns), the structure of first plating line 200 still can reduce the situation that line motherboard 100 breaks.
Fig. 3 B is the enlarged diagram of first plating line of another embodiment of the present invention.See also Fig. 3 B, the first plating line 200a has one first wavy edge 210a and one second wavy edge 220a, wherein the first wavy edge 210a comprises many first camber line edge 212a and many first linear edges 214, and the second wavy edge 220a comprises many second camber line edge 222a and many second linear edges 224.
The first plating line 200a of Fig. 3 B is similar to first plating line 200 of Fig. 3 A, and the two difference is: the first camber line edge 212a of Fig. 3 B and the shape of the second camber line edge 222a are outwards outstanding ellipse arc, and the first camber line edge 212a is staggered arrangement with the second camber line edge 222a.In other words, the first plating line 200a is a unsymmetric structure.
What deserves to be mentioned is to have in the technical field of the invention that common person can consult Fig. 3 B and the first camber line edge 212 among Fig. 3 A and the second camber line edge 222 are replaced to the first camber line edge 212a and the second camber line edge 222a shown in Fig. 3 B.That is to say that the first camber line edge 212 among Fig. 3 A and the second camber line edge 222 can be outwards outstanding ellipse arcs.
Fig. 4 A is the enlarged diagram of first plating line of another embodiment of the present invention.See also Fig. 4 A, the first plating line 200b has one first wavy edge 210b and one second wavy edge 220b, wherein the first wavy edge 210b comprises many first camber line edge 212b and many first linear edges 214, and the second wavy edge 220b comprises many second camber line edge 222b and many second linear edges 224.
The first plating line 200b of Fig. 4 A is similar to first plating line 200 of Fig. 3 A, and the two difference is: the first camber line edge 212b of Fig. 4 A and the shape of the second camber line edge 222b are the circular arc that caves inward, and the first camber line edge 212b and the second camber line edge 222b are staggered and arrange.In other words, the first plating line 200b is a unsymmetric structure.
Fig. 4 B is the enlarged diagram of first plating line of another embodiment of the present invention.See also Fig. 4 B, the first plating line 200c has one first wavy edge 210c and one second wavy edge 220c, wherein the first wavy edge 210c comprises many first camber line edge 212c and many first linear edges 214, and the second wavy edge 220c comprises many second camber line edge 222c and many second linear edges 224.
The first plating line 200c of Fig. 4 B is similar to first plating line 200 of Fig. 3 A, and the two difference is: the first camber line edge 212c of Fig. 4 B and the shape of the second camber line edge 222c are the ellipse arc that caves inward.
What deserves to be mentioned is, the persond having ordinary knowledge in the technical field of the present invention can be according to Fig. 4 A and the disclosed technical characterictic of Fig. 4 B, the first camber line edge 212b of Fig. 4 A and the second camber line edge 222b replaced to be shaped as the ellipse arc that caves inward, or the first camber line edge 212c of Fig. 4 B and the second camber line edge 222c replaced to be shaped as the circular arc that caves inward.
In addition, what should be specified is that the structure of second plating line 400 is identical with above-mentioned first plating line, 200～200c in fact, so do not give unnecessary details at this.
Fig. 5 A is the generalized section of Fig. 2 B center line I-I.See also Fig. 5 A, in the present embodiment, be embedded in the insulating barrier 110 in first plating line 200.Particularly, the upper surface 110a of the upper surface 230a of first plating line 200 and insulating barrier 110 trims in fact.In other words, line motherboard 100 (seeing also Fig. 2 A) basically can a kind of at last embedded line motherboard.In addition, second plating line 400 (seeing also Fig. 2 B) is embedded in the insulating barrier 110 in also being.
Fig. 5 B is the generalized section of the line motherboard of another embodiment of the present invention.See also Fig. 5 B, first plating line 200 of Fig. 5 B is similar to first plating line 200 of Fig. 5 A, and both differences are: first plating line 200 of Fig. 5 B protrudes in the surface of insulating barrier 110 '.In addition, second plating line 400 (seeing also Fig. 2 B) also is the upper surface 110a that protrudes in insulating barrier 110 '.
What deserves to be mentioned is that insulating barrier 110 can be a resin bed, and insulating barrier 110 for example is made by semi-solid preparation film, resin material or ceramic material.When insulating barrier 110 is by semi-solid preparation film, resin material or ceramic material when made, line motherboard 100 (please refer to Fig. 2 A) in fact can a kind of at last rigid line motherboard (rigid circuit mother board).
Fig. 6 is the schematic top plan view of the line motherboard of another embodiment of the present invention.See also Fig. 6, for convenience of description for the purpose of, Fig. 6 omits and to illustrate circuit 300.In the present embodiment, the line motherboard 100A of Fig. 6 is similar to the line motherboard 100 of Fig. 2 A, and both differences are: the line motherboard 100A of Fig. 6 has more a plurality of cutting area 100c.
Particularly, in the present embodiment, comprise a plurality of secondary line motherboard 100B in the line motherboard 100A, wherein line motherboard 100A for example is a tabular line motherboard (panel), and secondary line motherboard 100B can be identical with the line motherboard 100 (please refer to Fig. 2 A) of previous embodiment, and promptly secondary line motherboard 100B for example is the strip line motherboard.Secondary line motherboard 100B has a plurality of line areas 100a and the peripheral region 100b that centers on line areas 100a, and line areas 100a and surrounding zone 100b all are positioned at the cutting area 100c of line motherboard 100A, and wherein the quantity of cutting area 100c is less than the quantity of line areas 100a.
Specifically, in the present embodiment, can carry out cutting process, the secondary line motherboard 100B in the cutting area 100c is cut down line motherboard 100A.In other words, flat line motherboard 100A can cut into a plurality of secondary line motherboard 100B.In addition, the thickness of these secondary line motherboards 100B is identical in fact with the thickness of line motherboard 100A.
Connect above-mentionedly, the thickness of the line motherboard 100A of present embodiment can be very thin, and the size of thickness for example is between 30 microns to 150 microns.Though the thickness of line motherboard 100A is between 30 microns to 150 microns, but, the first wavy edge 210 and the second wavy edge 220 in secondary line motherboard 100B disperse external force (please refer to Fig. 3 A), and line motherboard 100A can avoid the situation of breaking in manufacture process.
In sum, because the two wavy edges respect to one another (i.e. the first wavy edge and the second wavy edge) that plating line of the present invention (i.e. first plating line and second plating line) is had, therefore, when line motherboard suffered that external force is exerted pressure, this external force can be dispersed to wavy edge equably to the stress that line motherboard produced.That is to say that above-mentioned wavy edge can bear the outside destroy that some processing procedures produce, so the present invention can reduce the situation that line motherboard breaks, and then the phenomenon that can avoid line motherboard in manufacture process, to break.So, the present invention can reduce the line motherboard production cost, and improves the yield of line motherboard.
In addition, because plating line of the present invention has wavy edge, therefore, even the thickness of line motherboard is between 30 microns to 150 microns, line motherboard of the present invention still more can bear damage of external force than traditional rigid line motherboard.So line motherboard of the present invention has good product reliability.
Though the present invention with embodiment openly as above; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking claims person of defining.
Claims (13)
1. line motherboard has a plurality of line areas and around the surrounding zone of those line areas, this line motherboard comprises:
One insulating barrier; And
One metal pattern layer, be disposed on this insulating barrier, and comprise at least one first plating line and a plurality of circuit, those circuits lay respectively in those line areas, and this first plating line is positioned at this surrounding zone, those circuits electrically connect this first plating line, and wherein this first plating line has one first wavy edge respect to one another and one second wavy edge, and are embedded in this insulating barrier in this first plating line.
2. line motherboard according to claim 1, the scope of its thickness is between 30 microns to 150 microns.
3. line motherboard according to claim 1, wherein this first wavy edge comprises a plurality of first camber line edges, and this second wavy edge comprises a plurality of second camber line edges, one of them first camber line edge is connected to another first camber line edge, and one of them second camber line edge is connected to another second camber line edge.
4. line motherboard according to claim 3, wherein those first camber line edges and those second camber line edge symmetric arrays.
5. line motherboard according to claim 3, wherein those first camber line edges and those second camber line edges are staggered.
6. line motherboard according to claim 3, wherein those first camber line edges and those second camber line edges are outwards outstanding.
7. line motherboard according to claim 3, wherein those first camber line edges and those second camber line edges cave inward.
8. line motherboard according to claim 3, wherein this first camber line edge and this second camber line edge is shaped as circular arc or ellipse arc.
9. line motherboard according to claim 3, wherein this first wavy edge also comprises a plurality of first linear edges, this second wavy edge also comprises a plurality of second linear edges, one of them first camber line edge is connected between adjacent two first linear edges, and one of them second camber line edge is connected between adjacent two second linear edges.
10. line motherboard according to claim 9, wherein the junction between the junction between those first camber line edges and those first linear edges and those second camber line edges and those second linear edges is fillet.
11. line motherboard according to claim 9 also comprises many these first plating lines and many second plating lines, those first plating lines and those second plating lines are checkerboard and arrange.
12. line motherboard according to claim 11 wherein is embedded in this insulating barrier in those second plating lines.
13. line motherboard according to claim 1 has more a plurality of cutting areas, those line areas and those surrounding zones all are positioned at those cutting areas, and the quantity of those cutting areas is less than the quantity of those line areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101259728A CN101610638B (en) | 2008-06-16 | 2008-06-16 | Line motherboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101259728A CN101610638B (en) | 2008-06-16 | 2008-06-16 | Line motherboard |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101610638A CN101610638A (en) | 2009-12-23 |
| CN101610638B true CN101610638B (en) | 2011-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101259728A Expired - Fee Related CN101610638B (en) | 2008-06-16 | 2008-06-16 | Line motherboard |
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| CN (1) | CN101610638B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376673A (en) * | 2010-08-06 | 2012-03-14 | 南亚电路板股份有限公司 | Packaging substrate and formation method thereof |
-
2008
- 2008-06-16 CN CN2008101259728A patent/CN101610638B/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| JP特开2005-93803A 2005.04.07 |
| JP特开平9-107174A 1997.04.22 |
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| CN101610638A (en) | 2009-12-23 |
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Granted publication date: 20110518 Termination date: 20120616 |