CN101605642B

CN101605642B - Endless chipping belt

Info

Publication number: CN101605642B
Application number: CN2008800044708A
Authority: CN
Inventors: 田岛弘章; 小西良宽; 和气厚仁
Original assignee: Nitta Corp
Current assignee: Nitta Corp
Priority date: 2007-04-06
Filing date: 2008-04-03
Publication date: 2012-05-30
Anticipated expiration: 2028-04-03
Also published as: KR20090127404A; CN101605642A; WO2008126880A1; JP2008254376A; TW200919566A

Abstract

To provide a chip splitting endless belt capable of enhancing the yield of a small chip by preventing the splitting defect of such a chip. A first chip splitting endless belt 10 includes as a core body, a fabric 14 which is coated with a surface material 16, and at least one of the chip contact faces 10S formed by the surface materials 16 is satin-finished. Since the chip contact faces 10S have a proper surface roughness, friction resistance is suppressed by lessening the contact area between the chip contact faces 10S and the board, strip-like body or the like being a chip aggregate. Further, since sticking of the chip to the contact faces 10S is prevented, the yield of the chip is improved.

Description

Endless chipping belt

Technical field

The present invention relates to a kind of endless chipping belt (endless chipping belt), be used for wafer is divided into the chip of preliminary dimension, for example the ceramic chip resistor.

Background technology

The size of ceramic chip resistor and other chip is dwindled continuing, and reaches the size (0603 size) of 0.6mm * 0.3mm even littler.Therefore, using cutting machine through dicing method (dicing method) when wafer is cut, chip output reduces and the production cost of chip increase.

Because this situation; Known a kind of belt dicing method; Through make wafer between the belt of a pair of operation through and wafer is divided into chip; The surface coverage of the belt of said a pair of operation has woven fabric, and the belt of said a pair of operation is positioned at upside and downside (referenced patent file 1 to 3).

Summary of the invention

Technical problem

When surface coverage has the belt of woven fabric to be used for that wafer is divided into chip, be manufactured into the recess that very little chip may fall to woven fabric, and may generation chip cut apart fault, thereby chip output may reduce.

In addition, because the small size of chip need be used the minor diameter pulley when adopting the belt dicing method.Therefore, belt can not advance on pulley easily, and may generation chip cut fault, thereby this also possibly reduce chip output.

Therefore, the purpose of this invention is to provide a kind of endless chipping belt, thereby it can prevent cutting apart fault and improving chip output of little chip.Technical scheme

Endless chipping belt according to the present invention comprises superficial layer, and said superficial layer comprises slice surface and formed by rubber or resin.Said slice surface carries out roughened (mat-processed), thereby the maximum surface roughness Rmax of said slice surface is less than or equal to 35 μ m.

Endless chipping belt may further include core material, and said core material is formed by woven fabric, and said core material is covered by said superficial layer.In said endless chipping belt, the thickness that forms the line of said woven fabric can be less than or equal to 240 fens Tekes (dtex), and the woven density of said woven fabric can be more than or equal to 50 lpi lines per inch.

In said endless chipping belt, said woven fabric can be formed by in Fypro, polyester fiber, aromatic polyamide fibers, glass fibre and the cotton fiber at least one.

In said endless chipping belt, said superficial layer can be formed by in polyurethane rubber, acrylonitrile-butadiene rubber, chloroprene rubber, polybutadiene rubber, EP rubbers, hydrogenated nitrile-butadiene rubber, butadiene-styrene rubber, fluorubber, silicon rubber, natural rubber, blending-type polyurethane, polyurethane, polyamide, polyvinyl chloride, phenolic resins, polyimides, polyester and the fluororesin at least one.

The hardness of said superficial layer can be more than or equal to A70.Advantageous effects

According to the present invention, a kind of endless chipping belt can be provided, said endless chipping belt can prevent cutting apart fault and can improving the output of chip of little chip.The patent publication document No.2006-61778 of patent document 1 japanese unexamined.The patent publication document No.2006-62008 of patent document 2 japanese unexamined.The patent publication document No.2006-62141 of patent document 3 japanese unexamined.

Description of drawings

[Fig. 1] Fig. 1 is the concept map that wafer is divided into chip through endless chipping belt.[Fig. 2] Fig. 2 is to use the figure of chopper and slicer of the endless chipping belt of first embodiment.[Fig. 3] Fig. 3 is the cutaway view of first endless chipping belt of first embodiment.[Fig. 4] Fig. 4 is the cutaway view of second endless chipping belt of second embodiment.Explanation [0014] 10 first endless chipping belt 10S slice surface 14 woven fabric 14A, first lines (line) 14B second lines (line) 16 superficial layers 20 second endless chipping belts to Reference numeral

The specific embodiment

Below, with reference to accompanying drawing the first embodiment of the present invention is described.As that kind of following explanation, use the endless chipping belt of first embodiment that chip is cut apart.At first, wafer 30 is cut apart along a direction, thereby obtains a lot of silvers 32.Then, each of silver 32 is further cut apart along the direction perpendicular to its longitudinal direction, thereby obtains chip 34.

In such process, that is to say, wafer 30 is divided into the process of silver 32, and silver 32 is being divided in another process of chip 34, for example, use the chopper and slicer 40 shown in Fig. 2.In chopper and slicer 40, use a pair of first endless chipping belt 10.First endless chipping belt 10 is drawn between such as the pulley of first pulley 42 with minor diameter and second pulley 44, thereby pushes wafer 30 or silver 32 with first pulley 42.

The slit S that wafer 30 or silver 32 insert between a pair of first endless chipping belt 10.Wafer 30 or silver 32 are on the above-below direction at bending point 12 and are pressed, at this bending point 12 places first endless chipping belt 10 by first and second pulleys 42 and 44 bendings, thereby make wafer 30 and silver 32 be split into silver 32 or chip 34 (referring to Fig. 1).

As shown in Figure 3, first endless chipping belt 10 comprises the woven fabric 14 as core material.Woven fabric 14 is coated with the superficial layer 16 of polyurethane rubber.Form slice surface 10S through superficial layer 16, said slice surface 10S is the surface of first endless chipping belt 10 and contacts (referring to Fig. 1 and Fig. 2) with silver 32 with wafer 30.

At least one slice surface 10S carries out roughened, thereby the maximum surface roughness Rmax of slice surface 10S is less than or equal to 35 μ m.The slice surface 10S that has carried out roughened has suitable roughness, and the coefficient of friction of slice surface 10S is below the coefficient of friction of specular surface.Therefore, between slice surface 10S and the wafer 30 or the contact area between slice surface 10S and the silver 32 less, thereby limited frictional resistance and prevented the adhere to fault of chip 34 with slice surface 10S.Consequently, can improve the output of chip 34.Note that the edge of chip 34 may break if the surface roughness of slice surface 10S is excessive, the shape of the chip of cutting apart 34 possibly become improper, thereby possibly reduce the output of chip 34.Therefore, the maximum surface roughness Rmax of slice surface 10S is adjusted to and is less than or equal to 35 μ m.

When making first endless chipping belt 10, carry out the roughened of slice surface 10S.That is to say that the sheeting that will become superficial layer 16 is placed in the metal die, the surface of mould becomes coarse through the process such as blasting treatment in advance here.Then, sheeting is heated, thereby forms the sheet of first endless chipping belt 10.This process causes a little inhomogeneous surface that is passed to sheet of die surface.Consequently, slice surface 10S form have a little inhomogeneous.

Inhomogeneous when carrying out roughened when what use die surface as described above, because a little less than the adhesion of the superficial layer 16 that forms and mould, the sheet of formation can be easily from mold separation.That is to say, the only less situation comparison of power of needs so that sheet is removed and has the mould of smooth surface and have the slice surface 10S of specular surface from mould, this makes the endless chipping belt 10 of winning be easy to more produce.

For example, form woven fabric 14 and in belt width side the upwardly extending first line 14A is an aromatic polyamide fibers.For example, the second line 14B that extends in a longitudinal direction is the type of polyethylene terephthalate.The thickness of the first and

second line

14A, 14B all is less than or equal to 240 fens Tekes, for example is respectively 210 fens Tekes and 140 fens Tekes.At width and longitudinal direction, the woven density of woven fabric 14 is all more than or equal to 50 lpi lines per inch.For example, can be 55 lpi lines per inch.

Thickness through first and second line 14A as described above and 14B is set to suitably little and increases the woven density of woven fabric 14, inhomogeneous on the slice surface 10S that causes having prevented causing by the folding that cause of woven fabric 14 rather than by roughened.Therefore, prevent that chip 34 (referring to Fig. 1) from getting into the recess of slice surface 10S.In addition, use the thin first and

second line

14A, 14B to make the endless chipping belt 10 of winning to become thin.Also make the endless chipping belt 10 of winning to twine pulley suitably, for example first pulley 42 with minor diameter.

Note that first and second line 14A and the 14B, except above-mentioned material, can use one of them of Fypro, polyester fiber, glass fibre, cotton fiber or its combination as woven fabric 14.

The hardness of superficial layer 16 is adjusted to more than or equal to A70 (JIS-K6253), and said superficial layer 16 is covered on the surface as the woven fabric 14 of core material.The use of this relatively harder superficial layer 16 can prevent reliably that chip 34 (referring to Fig. 1) from sinking to getting into the recess on the slice surface 10S, and can protect the scraping that woven fabric 14 do not receive to cause with the EDGE CONTACT of chip 34 and the influence of other damage.

Note that rubber and resin except polyurethane rubber also can be used as superficial layer 16.For example, one of them of acrylonitrile-butadiene rubber, chloroprene rubber, polybutadiene rubber, EP rubbers, hydrogenated nitrile-butadiene rubber, butadiene-styrene rubber, fluorubber, silicon rubber, natural rubber, blending-type polyurethane, polyurethane, polyamide, polyvinyl chloride, phenolic resins, polyimides, polyester, fluororesin or its combination can be as the material of superficial layer 16.

The chopper and slicer 40 that has first endless chipping belt 10 through use has carried out chip cuts apart test (referring to Fig. 2), and has obtained good result.That is to say, the chopper and slicer 40 that has first endless chipping belt 10 when use 100 wafers 30 are divided into have 0.6mm * chip of 0.3mm size 34 time, the ratio of non-compliant chip 34 is less than one of percentage.On the other hand, when cutting apart identical wafer 30 through traditional chopper and slicer, the ratio of non-compliant chip 34 is about 50 percent.

As described above, in first embodiment, have first endless chipping belt 10 of slice surface 10S through use, said slice surface 10S has proper surface roughness, has prevented cutting apart fault and having improved the output of chip 34 of chip 34.

Note that and use woven fabric 14 to make the endless chipping belt 10 of winning thinner, for example about 0.7mm as core material.Therefore, first endless chipping belt 10 twines the minor diameter pulley suitably, for example first pulley 42.Therefore, use woven fabric 14 also to help to reduce the fault of cutting apart of chip 34 as core material.

Next second embodiment is described, mainly concentrates on difference with first embodiment.

As shown in Figure 4, second endless chipping belt 20 has the core material different with the core material of first endless chipping belt 10.That is to say that in second endless chipping belt 20, the rope 24 that embeds rubber layer 22 is as core material.Fabric 25 and superficial layer 26 respectively on the rubber layer 22 with under layering form.The material of superficial layer 26 is identical with the material of first embodiment.

On superficial layer 26, form slice surface 20S, said slice surface 20S is the surface of second endless chipping belt 20 and contacts (referring to Fig. 1 and Fig. 2) with silver 32 with wafer 30.The same with first endless chipping belt 10, slice surface 20S carries out roughened.

Because rope 24 is as core material, first endless chipping belt 10 of core material that second endless chipping belt 20 tends to than has woven fabric 14 is thicker.Yet, because the slight roughness of slice surface 20S, between slice surface 20S and the wafer 30 or the contact area (referring to Fig. 1) between slice surface 20S and the silver 32 reduce; And frictional resistance therebetween is restricted.This has increased the output of chip 34.

As described above, in a second embodiment, in first embodiment, have second endless chipping belt 20 of slice surface 20S through use, said slice surface 20S has proper surface roughness, has improved the output of chip 34.

Note that in first and second embodiment a pair of

slice surface

10S or 20S can carry out roughened.Under the sort of situation, even when slightly damaged of two

slice surface

10S or 20S, (for example, swiped), still maybe first or second

endless chipping belt

10,20 be turned so that

int slice surface

10S or 20S come out.Therefore, can prolong the life-span of first and second

endless chipping belts

10 and 20.

Composition material such as the parts of first and second endless chipping belts 10 of woven fabric 14 or

superficial layer

16 and 26 and 20 is not limited to the material in the foregoing description.In addition, the composition of chopper and slicer 40 (referring to Fig. 2) also is not limited to the composition of embodiment.For example, first and second pulleys 42 and 44 layout and the quantity that is included in the pulley in the chopper and slicer 40 also can be regulated.

The present invention is not restricted to the content described in the preferred embodiment; That is to say, can under the situation that does not deviate from the spirit and scope of the present invention, carry out various improvement and change the present invention.

The theme that content disclosed herein relates to Japanese patent application 2007-100607 number and comprises in (submission on April 6th, 2007), the full content of this patent application is incorporated herein by reference clearly.

Claims

1. endless chipping belt comprises:

Superficial layer; Said superficial layer comprises slice surface and is formed by rubber or resin; Said slice surface carries out roughened; Thereby the maximum surface roughness Rmax of said slice surface is less than or equal to 35 μ m, and said roughened realizes that through putting into a mould to the sheeting that will become said superficial layer the surface of said mould is in advance by roughening.

2. endless chipping belt according to claim 1 further comprises core material, and said core material is formed by woven fabric, and said core material is covered by said superficial layer.

3. endless chipping belt according to claim 2, the thickness that wherein forms the line of said woven fabric is less than or equal to 240 fens Tekes, and the woven density of said woven fabric is more than or equal to 50 lpi lines per inch.

4. endless chipping belt according to claim 2, wherein said woven fabric is formed by in Fypro, polyester fiber, aromatic polyamide fibers, glass fibre and the cotton fiber at least one.

5. endless chipping belt according to claim 1, wherein said superficial layer is formed by in polyurethane rubber, acrylonitrile-butadiene rubber, chloroprene rubber, polybutadiene rubber, EP rubbers, hydrogenated nitrile-butadiene rubber, butadiene-styrene rubber, fluorubber, silicon rubber, natural rubber, blending-type polyurethane, polyurethane, polyamide, polyvinyl chloride, phenolic resins, polyimides, polyester and the fluororesin at least one.

6. endless chipping belt according to claim 1, the hardness of wherein said superficial layer are more than or equal to A70, and the accepted standard of said A70 is JIS-K6253.