CN101604971B - Oscillator device capable of slowing down heat energy to radiate outside - Google Patents
Oscillator device capable of slowing down heat energy to radiate outside Download PDFInfo
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- CN101604971B CN101604971B CN2008101106544A CN200810110654A CN101604971B CN 101604971 B CN101604971 B CN 101604971B CN 2008101106544 A CN2008101106544 A CN 2008101106544A CN 200810110654 A CN200810110654 A CN 200810110654A CN 101604971 B CN101604971 B CN 101604971B
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- circuit board
- heat energy
- slowing down
- down heat
- energy
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Abstract
The invention provides a packaging device capable of slowing down heat energy to radiate outside and an oscillator device, in particular relates to a packaging device capable of slowing down heat energy to radiate outside, comprising a packaging assembly and a plurality of cantilevers for packaging a heating circuit module. The packaging assembly comprises a base, an outer cover and a plurality of joint components; the base and the outer cover together define an airtight space for containing the circuit module; the joint component is electrically connected with a circuit board, and each joint component is provided with a first end part away from the inner side of the base with a preset height and a second end part exposed outside the base; each cantilever is provided with a first end, a second end far away from the first end and a connection segment arranged between the first end and the second end; the first end of each cantilever is coupled with the circuit board, and the second end is coupled with the first end part of the joint component. Through prolonging the thermal conductive path distance of the connection segment, the heat energy can be radiated to outside slowly, thereby chances of heating repeatedly can be reduced to achieve the effect of reducing the energy consumption.
Description
Technical field
The invention relates to a kind of packaging system (Package) and oscillator arrangement, particularly relate to a kind of packaging system and oscillator arrangement of energy slowing down heat energy to radiate outside.
Background technology
Crystal oscillator (Crystal oscillator) not only often is used in the wireless telecommunication system, as the critical elements that reference frequency (Reference frequency) is provided, also provides the effect of timing in for example mobile phone, PDA, mobile computer.Because the frequency of quartz oscillator can change with temperature, in order to solve this problem, thermostatic control formula crystal oscillator (OCXO) is arranged then, and the appearance of temp. compensation type crystal oscillator (TCXO), with thermostatic control formula crystal oscillator is example, mainly be that crystal-oscillator circuit is placed on a seal casinghousing inner control in a specified temp job, so just can eliminate temperature, thereby reach the purpose of stabilized frequency the quartz crystal Effect on Performance.
As shown in Figure 1, be a kind of aspect of analysing and observe of thermostatic control formula crystal oscillator 9, it mainly is to lay a heater circuit 92 at a circuit board 91 end faces, and circuit board 91 bottom surfaces then are provided with a crystal oscillator 93, and has also protruded out many pins 94 downwards on the circuit board 91; Circuit board 91 is covered with the base plate 96 that a housing 95 and is positioned at circuit board 91 belows and energy closure casing 95 outward, housing 95 is iron coverings, base plate 96 is a printed circuit board (PCB) or one and 94 metallic plates that glass partition is arranged of pin, described pin 94 also runs through base plate 96 and outside being revealed in, and housing 95 inner spaces also are filled with foaming material 97.Utilize heater circuit 92 heating in good time in housing 95,, cooperate being coated with of material 97 of foaming to avoid heat to leak simultaneously so that crystal oscillator 93 can operate under suitable working temperature.
Yet, because of circuit board 91 peripheries contact with housing 95 inwalls, and described pin 94 connecting circuit plates 91 with run through base plate 96 and protrude from outside the base plate 96, therefore the heat that produced of heater circuit 92 sees through circuit board 91, described pin 94, base plate 96 easily, and the path of circuit board 91, housing 95 carries out heat conduction, so with heat energy dissipation in the external world, thus, cause heater circuit 92 must start heating continually, just can make to keep constant temperature in the housing 95, so power consumption heightens.
Summary of the invention
Therefore, a purpose of the present invention is promptly providing a kind of energy slowing down heat energy to radiate outside to reduce the packaging system of power consumption.
So the packaging system of the present invention's energy slowing down heat energy to radiate outside comprises a package assembling and a plurality of cantilever, in order to encapsulate a heater circuit module.
Package assembling has a pedestal, an enclosing cover and a plurality of lead piece, pedestal and enclosing cover define an airtight space that holds the heater circuit module jointly, described lead piece electrically connects the heater circuit module, each lead piece has a first end apart from the inboard predetermined altitude of pedestal, and a second end that exposes to the pedestal outside.
Each cantilever has one first end, the linkage section of second end and between first end and second end away from first end, first end couples the heater circuit module, second end couples the first end of lead piece, and the length of the thermally conductive pathways of linkage section is greater than the air line distance between first end and second end.
The packaging system of energy slowing down heat energy to radiate outside of the present invention, described linkage section is a bending shape.
The packaging system of energy slowing down heat energy to radiate outside of the present invention, described cantilever is made by the metal or alloy material with low thermal conduction characteristic.
Another object of the present invention is promptly at the oscillator arrangement that a kind of energy slowing down heat energy to radiate outside is provided.
The oscillator arrangement of the present invention's energy slowing down heat energy to radiate outside comprises a circuit module, a package assembling and a plurality of cantilever.
Circuit module has the heating control circuit that a circuit board, is arranged at circuit board, and a crystal oscillator that is arranged at circuit board; Package assembling has a pedestal, an enclosing cover and a plurality of lead piece, pedestal and enclosing cover define an airtight space that holds circuit module jointly, described lead piece electrically connects circuit board, each lead piece has a first end apart from the inboard predetermined altitude of pedestal, and a second end that exposes to the pedestal outside.
Each cantilever has one first end, the linkage section of second end and between first end and second end away from first end, first end couples circuit board, second end couples the first end of lead piece, and the length of the thermally conductive pathways of linkage section is greater than the air line distance between first end and second end.
The oscillator arrangement of energy slowing down heat energy to radiate outside of the present invention, described linkage section is a bending shape.
The oscillator arrangement of energy slowing down heat energy to radiate outside of the present invention, described heating control circuit and described crystal oscillator are located at the same side or the phase heteropleural of described circuit board respectively.
The oscillator arrangement of energy slowing down heat energy to radiate outside of the present invention, described cantilever is made by the metal or alloy material with low thermal conduction characteristic.
The oscillator arrangement of energy slowing down heat energy to radiate outside of the present invention, described oscillator arrangement is a temp. compensation type oscillator arrangement.
The present invention can slowing down heat energy to radiate outside packaging system and the effect of oscillator arrangement be: the distance of the thermally conductive pathways by increasing cantilever can delay heat energy to radiate outside, therefore reduces the chance of heating repeatedly, and then reaches the effect that reduces power consumption.
Description of drawings
Fig. 1 is a generalized section, and a kind of thermostatic control formula crystal oscillator is described;
Fig. 2 is a three-dimensional exploded view, illustrates that the preferred embodiment of the packaging system of the present invention's energy slowing down heat energy to radiate outside is applied to a temp. compensation type oscillator arrangement;
Fig. 3 is a part end view that enclosing cover is represented with section, and the heating control circuit of preferred embodiment and the phase heteropleural that crystal oscillator is arranged at circuit board respectively are described;
Fig. 4 is a vertical view, illustrates that preferred embodiment removes the assembly of enclosing cover.
Embodiment
About aforementioned and other technology contents, characteristics and effect of the present invention, in the following detailed description that cooperates with reference to graphic preferred embodiment, can clearly present.
The present invention is described in detail below in conjunction with drawings and Examples.
Consult Fig. 2, the preferred embodiment of encapsulation (Package) device of the present invention's energy slowing down heat energy to radiate outside is applied to a temp. compensation type oscillator arrangement, and the temp. compensation type oscillator arrangement comprises a plurality of cantilevers 1, a circuit module 2 and a package assembling 3.
Consult Fig. 3, circuit module 2 comprises that a circuit board 21, is arranged at the crystal oscillator 22 of a side of circuit board 21, and a heating control circuit 23 that is arranged at the opposite side of circuit board 21; Wherein, heating control circuit 23 is control chips, and control chip can be set and variations in temperature produces heat energy and to an airtight space 30 heating of package assembling 3 inside in good time according to the user.It should be noted that this preferred embodiment is that heating control circuit 23 and crystal oscillator 22 are located at the two-phase heteropleural of circuit board 21 respectively, but is located at the homonymy of circuit board 21, also belongs to the category that notion of the present invention contains.
Package assembling 3 has a pedestal 31, an enclosing cover 32 and a plurality of lead piece 33, pedestal 31 and enclosing cover 32 define the airtight space 30 in order to hold circuit module 2, and each lead piece 33 has a second end 332 that does not expose to pedestal 31 in order to the high circuit module 2 of frame with pedestal 31 and enclosing cover 32 contacted first ends 331 and.
Wherein, enclosing cover 32 is metallic plates, and pedestal 31 is to be made by metal material, and enclosing cover 32 and pedestal 31 be to mutually combine with the technology that (Seam seal) closed in the thermal resistance seam welding, makes airtight space 30 can form a sealing state; In addition, the inner surface of package assembling 3 mainly is the inner surface of pedestal 31, borrows the gold-plated thermal radiation backstop layer that is formed with.
Consult Fig. 2 and Fig. 4, each cantilever 1 has one first end 11, the linkage section 13 of one second end 12 and between first end 11 and second end 12, and first end 11 of each cantilever 1 is individually fixed in circuit board 21 4 corners of circuit module 2; 12 at second end of each cantilever 1 is individually fixed in the first end 331 of each lead piece 33, and the length of the thermally conductive pathways of linkage section 13 is greater than the air line distance of 12 at first end 11 and second end.
In this preferred embodiment, linkage section 13 is bending shape tortuous as the similar ileum, just with the bending shape heat conduction distance that extended, yet, it should be noted that, other implement aspects also can be not limited to bending shape, so long as be that the shape of purpose also is the category that notion of the present invention contains with lengthening thermally conductive pathways distance.
For fear of cause heating control circuit 23 to need heating repeatedly to cause power consumption to increase because of too fast conduction heat energy, described cantilever 1 is except changing conducting path into distance long zigzag path by the short straight line path of distance, add to have conductive characteristic metal or alloy (as: corronil) material good and the thermal conduction characteristic difference and make, can allow heat energy be difficult for dissipation and conduct to the outside, and then avoid heating control circuit 23 to need heating repeatedly, therefore can effectively reduce the required power consumption of temp. compensation type oscillator arrangement.
Conclude above-mentioned, the present invention can slowing down heat energy to radiate outside packaging system and the effect of oscillator arrangement be: the thermally conductive pathways of the linkage section 13 by adding long cantilever 1 is apart from delaying heat energy to radiate outside, therefore reduce the chance of heating repeatedly, and then reach the effect that reduces power consumption.
Claims (4)
1. the oscillator arrangement of an energy slowing down heat energy to radiate outside is characterized in that, described oscillator arrangement comprises:
One circuit module has the heating control circuit that a circuit board, is arranged at described circuit board, and a crystal oscillator that is arranged at described circuit board;
One package assembling, have a pedestal, an enclosing cover and a plurality of lead piece, described pedestal and described enclosing cover define an airtight space that holds described circuit module jointly, described lead piece electrically connects described circuit board, each lead piece has the first end of the inboard predetermined altitude of the described pedestal of a distance, and a second end that exposes to the described pedestal outside;
A plurality of cantilevers, each cantilever has one first end, one and described first end linkage section of second end and between described first end and described second end separately, described first end couples described circuit board, described second end couples the first end of described lead piece, and the length of the thermally conductive pathways of described linkage section is greater than the air line distance between described first end and described second end, and described linkage section is a bending shape; And
One thermal radiation backstop layer is formed at the inner surface of described package assembling in gold-plated mode.
2. the oscillator arrangement of energy slowing down heat energy to radiate outside according to claim 1 is characterized in that,
Described heating control circuit and described crystal oscillator are located at the same side or the phase heteropleural of described circuit board respectively.
3. the oscillator arrangement of energy slowing down heat energy to radiate outside according to claim 1 is characterized in that,
Described cantilever is made by the metal or alloy material with low thermal conduction characteristic.
4. the oscillator arrangement of energy slowing down heat energy to radiate outside according to claim 1 is characterized in that,
Described oscillator arrangement is a temp. compensation type oscillator arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101106544A CN101604971B (en) | 2008-06-12 | 2008-06-12 | Oscillator device capable of slowing down heat energy to radiate outside |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101106544A CN101604971B (en) | 2008-06-12 | 2008-06-12 | Oscillator device capable of slowing down heat energy to radiate outside |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101604971A CN101604971A (en) | 2009-12-16 |
| CN101604971B true CN101604971B (en) | 2011-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101106544A Expired - Fee Related CN101604971B (en) | 2008-06-12 | 2008-06-12 | Oscillator device capable of slowing down heat energy to radiate outside |
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| Country | Link |
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| CN (1) | CN101604971B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172552A (en) * | 1994-07-19 | 1998-02-04 | 模拟设备股份有限公司 | Enhanced heat dissipation lead frame |
| US6049256A (en) * | 1998-09-10 | 2000-04-11 | Cts Corporation | Low profile ovenized oscillator packing having a high thermal conductivity substrate |
| CN1700589A (en) * | 2004-05-19 | 2005-11-23 | 日本电波工业株式会社 | Constant temperature type crystal oscillator |
| CN1841920A (en) * | 2005-03-28 | 2006-10-04 | 日本电波工业株式会社 | Constant temperature crystal oscillator |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
-
2008
- 2008-06-12 CN CN2008101106544A patent/CN101604971B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172552A (en) * | 1994-07-19 | 1998-02-04 | 模拟设备股份有限公司 | Enhanced heat dissipation lead frame |
| US6049256A (en) * | 1998-09-10 | 2000-04-11 | Cts Corporation | Low profile ovenized oscillator packing having a high thermal conductivity substrate |
| CN1700589A (en) * | 2004-05-19 | 2005-11-23 | 日本电波工业株式会社 | Constant temperature type crystal oscillator |
| CN1841920A (en) * | 2005-03-28 | 2006-10-04 | 日本电波工业株式会社 | Constant temperature crystal oscillator |
| CN101047364A (en) * | 2006-03-30 | 2007-10-03 | 株式会社大真空 | Piezodectric vibration device |
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| Publication number | Publication date |
|---|---|
| CN101604971A (en) | 2009-12-16 |
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Granted publication date: 20110914 Termination date: 20180612 |