CN101598496A - The plate sieve - Google Patents

The plate sieve Download PDF

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Publication number
CN101598496A
CN101598496A CNA2009101157362A CN200910115736A CN101598496A CN 101598496 A CN101598496 A CN 101598496A CN A2009101157362 A CNA2009101157362 A CN A2009101157362A CN 200910115736 A CN200910115736 A CN 200910115736A CN 101598496 A CN101598496 A CN 101598496A
Authority
CN
China
Prior art keywords
sieve
plate
plate body
millimeter
sieve aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2009101157362A
Other languages
Chinese (zh)
Inventor
惠国庆
郭学亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Guangyunda Optoelectronics Technology Co Ltd
Original Assignee
Suzhou Guangyunda Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Guangyunda Optoelectronics Technology Co Ltd filed Critical Suzhou Guangyunda Optoelectronics Technology Co Ltd
Priority to CNA2009101157362A priority Critical patent/CN101598496A/en
Publication of CN101598496A publication Critical patent/CN101598496A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a kind of plate sieve, comprise the some sieve apertures that distribute on plate body and the plate body, the size of described sieve aperture is 0.02~0.07 millimeter, and the thickness of described plate body is 0.4~0.6 millimeter.Sieve aperture of the present invention is little, and the high conformity of sieve aperture makes it be fit to retrofit more; Plate body is thick, makes that the plate sieve is more wear-resisting, has prolonged the life-span of plate sieve, has reduced maintenance cost.

Description

The plate sieve
Technical field
The present invention relates to a kind of plate sieve.
Background technology
In the prior art, general screen cloth can pass through method manufacturings such as metal wire knitted, steel plate punching, steel bar built-up welding, steel casting.With the metal wire knitted is example, and the wire of usefulness is thin more, and the mesh screen hole of weaving into is just more little.In some application scenario, as the sieve bucket on high rotating speed centrigugal swing dryer, it is very thin micropore (strip hole) that the hole of whole body requires, the very thin sieve aperture of the difficult manufacturing of existing screen cloth manufacture method, in the centrifugal process that carries out medicine, food etc., can cause waste.Simultaneously, when using sieve plate in chemical industry (medicine) industry, the very high crystalline solid of a lot of hardness is arranged, when carrying out centrifuge dripping, crystalline solid can rub to screen cloth, and stream time has been grown, will be net sheet wear down even worn-off, and the life-span of sieve plate is shorter.
Summary of the invention
The object of the invention provides a kind of plate sieve, and it makes the plate sieve can be applied to the drying of retrofit, and has prolonged the life-span of plate sieve, has saved cost.
Technical scheme of the present invention is: a kind of plate sieve, comprise the some sieve apertures that distribute on plate body and the plate body, and the size of described sieve aperture is 0.02~0.07 millimeter, the thickness of described plate body is 0.4~0.6 millimeter.
The further technical scheme of the present invention is: a kind of plate sieve, comprise the some sieve apertures that distribute on plate body and the plate body, and the size of described sieve aperture is 0.02~0.07 millimeter, the thickness of described plate body is 0.4~0.6 millimeter.Wherein the shape of sieve aperture can be circular, square, strip or the like multiple shape, above the size of described sieve aperture be meant that sieve aperture plays the size of sieving actoion in screening process, wide etc. as the seam in the diameter of circular hole, hole, strip slit.
When described sieve aperture was circular hole, the diameter of described circular hole was 0.02~0.07 millimeter.
Described circular hole has the tapering of 3~5 degree.
When described sieve aperture was the hole, slit, the seam in hole, slit is wide to be 0.02~0.07 millimeter.
Advantage of the present invention is:
1. the present invention processes sieve aperture by laser on the plate body of plate sieve, makes the size of sieve aperture can accomplish 0.02~0.07 millimeter, and the high conformity of sieve aperture makes it be fit to retrofit more simultaneously.
2. the present invention is by increasing the energy that the liquid oxygen heater has improved laser, makes small sieve aperture can be machined on the plate body that thickness reaches 0.4~0.6 millimeter, makes that the plate sieve is more wear-resisting, prolonged the life-span of plate sieve, reduced maintenance cost.
Description of drawings
Fig. 1 is the structural representation of the specific embodiment of the invention;
Fig. 2 is the structural representation of the another specific embodiment of the present invention;
Fig. 3 is the local enlarged diagram of Fig. 2.
Wherein: 1 plate body; 2 sieve apertures.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is further described:
Specific embodiment 1:
As shown in Figure 1, a kind of plate sieve comprises equally distributed some sieve apertures 2 on plate body 1 and the plate body 1, and described sieve aperture 2 is a circular hole, and the diameter of described circular hole is 0.02~0.07 millimeter and has 3~5 taperings of spending that the thickness of described plate body 1 is 0.4~0.6 millimeter.
Specific embodiment 2:
As shown in Figures 2 and 3, a kind of plate sieve comprises equally distributed some sieve apertures 2 on plate body 1 and the plate body 1, and described sieve aperture 2 is the hole, slit, and the wide h of seam in hole, described slit is 0.02~0.07 millimeter, and the thickness of described plate body 1 is 0.4~0.6 millimeter.
The present invention processes sieve aperture by laser on the plate body of plate sieve, make the size of sieve aperture can accomplish 0.02~0.07 millimeter, and the high conformity of the sieve aperture of Laser Processing simultaneously makes it be fit to retrofit more; The present invention is by increasing the energy that the liquid oxygen heater has improved laser cutting, makes small sieve aperture can be machined on the plate body that thickness reaches 0.4~0.6 millimeter, makes that the plate sieve is more wear-resisting, prolonged the life-span of plate sieve, reduced maintenance cost.

Claims (4)

1. a plate sieve comprises some sieve apertures (2) that plate body (1) and plate body (1) upward distribute, and it is characterized in that: the size of described sieve aperture (2) is 0.02~0.07 millimeter, and the thickness of described plate body (1) is 0.4~0.6 millimeter.
2. plate sieve according to claim 1, it is characterized in that: when described sieve aperture (2) was circular hole, the diameter of described circular hole was 0.02~0.07 millimeter.
3. plate sieve according to claim 2, it is characterized in that: described circular hole has the tapering of 3~5 degree.
4. plate sieve according to claim 1, it is characterized in that: when described sieve aperture (2) was the hole, slit, the seam in hole, slit is wide to be 0.02~0.07 millimeter.
CNA2009101157362A 2009-07-16 2009-07-16 The plate sieve Pending CN101598496A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2009101157362A CN101598496A (en) 2009-07-16 2009-07-16 The plate sieve

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2009101157362A CN101598496A (en) 2009-07-16 2009-07-16 The plate sieve

Publications (1)

Publication Number Publication Date
CN101598496A true CN101598496A (en) 2009-12-09

Family

ID=41420025

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2009101157362A Pending CN101598496A (en) 2009-07-16 2009-07-16 The plate sieve

Country Status (1)

Country Link
CN (1) CN101598496A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101966491A (en) * 2010-10-20 2011-02-09 苏州光韵达光电科技有限公司 Sieve plate for centrifugal drying machine
CN113843628A (en) * 2021-10-28 2021-12-28 武昌工学院 Complete process system and process for robot-based cartridge filter manufacturing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101966491A (en) * 2010-10-20 2011-02-09 苏州光韵达光电科技有限公司 Sieve plate for centrifugal drying machine
CN113843628A (en) * 2021-10-28 2021-12-28 武昌工学院 Complete process system and process for robot-based cartridge filter manufacturing

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
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Open date: 20091209