CN101587881A - Module integrated circuit packaging structure with temperature compensation and control quartz oscillator - Google Patents
Module integrated circuit packaging structure with temperature compensation and control quartz oscillator Download PDFInfo
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- CN101587881A CN101587881A CN 200810097174 CN200810097174A CN101587881A CN 101587881 A CN101587881 A CN 101587881A CN 200810097174 CN200810097174 CN 200810097174 CN 200810097174 A CN200810097174 A CN 200810097174A CN 101587881 A CN101587881 A CN 101587881A
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- temperature compensation
- quartz oscillator
- control quartz
- substrate
- integrated circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention relates to a module integrated circuit packaging structure with a temperature compensation and control quartz oscillator, which is applied to electronic equipment. The module integrated circuit packaging structure is characterized by comprising a substrate, the temperature compensation and control quartz oscillator, at least one chip, an adhesive body and a covering shell, wherein the temperature compensation and control quartz oscillator and the chip are both arranged on the upper surface of the substrate; the adhesive body is paved on the upper surface of the substrate and covers the temperature compensation and control quartz oscillator and the chip; and the covering shell covers the adhesive body and is arranged on the upper surface of the substrate so as to form the module integrated circuit packaging structure, thus the adhesive body and the covering shell can stop the influence of outside temperature change on the temperature compensation and control quartz oscillator so as to achieve the aim of stable work of the temperature compensation and control quartz oscillator 120.
Description
Technical field
The present invention relates to a kind of module integrated circuit packaging structure, relate in particular to a kind of module integrated circuit packaging structure with temperature compensation and control quartz oscillator with temperature compensation and control quartz oscillator.
Background technology
Temperature compensated quartz oscillator (Temperature Compensation Crystal Oscillator, TCXO) be widely used in mobile phone and global positioning system (Global Positioning System, GPS) in, because the demand of miniaturization module is day by day gradually big, the GPS that TCXO is applied in the miniaturization module also will arise at the historic moment, and wherein the characteristic of temperature-compensating is considerable.Illustrate, the GPS device needs clock pulse (Clock) very accurately, can demodulate correct position comes out, if the clock pulse of GPS device is inaccurate, will cause can't locate or position location and physical location side-play amount excessive, above-mentioned situation for the user, is very inconvenient.So the temperature-compensating specification of TCXO that is applied in the GPS device is very strict, its side-play amount all is defined in below the 0.5ppm usually.
Yet, present prior art with TCXO in the field of applying GPS, because of TCXO itself to environmental impact such as the suitable sensitivity of ambient temperature variation, make GPS in running, be subjected to environmental impact, thereby cause the stability decreases of TCXO.
So the inventor thinks that above-mentioned defective can improve, and, observe and research, and cooperate the utilization of scientific and technological principle, and propose reasonable in design and can effectively improve the present invention of above-mentioned defective by concentrated according to the correlation experience of being engaged in for many years in this respect.
Summary of the invention
Therefore purpose of the present invention is to provide a kind of module integrated circuit packaging structure with temperature compensation and control quartz oscillator, in order to reduce environmental impact, reaches the purpose of temperature compensation and control quartz oscillator working stability.
According to above-mentioned purpose of the present invention, the present invention proposes a kind of module integrated circuit packaging structure with temperature compensation and control quartz oscillator, it is characterized in that, this module integrated circuit packaging structure comprises: substrate; Temperature compensation and control quartz oscillator, it is arranged at the upper surface of this substrate; At least one chip, it is arranged on the upper surface of this substrate; Adhesive body, it is layed on the upper surface of this substrate, and coats this temperature compensation and control quartz oscillator and this chip; And the lid shell, it coats this adhesive body, and is arranged on the upper surface of this substrate, and wherein this adhesive body and this lid shell are construed as isolation structures, and this isolation structures provides the exhausted function of thermal resistance in this temperature compensation and control quartz oscillator.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this substrate can further be provided with at least one to through hole that should temperature compensation and control quartz oscillator.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this through hole can be positioned at the below of this temperature compensation and control quartz oscillator middle position.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this substrate can be metallic support, circuit board, aluminium base, silicon substrate or ceramic substrate.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this lid shell can be has anti electromagnetic wave and the good metal shell of thermal conductivity.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this adhesive body can be heat cured filler material.
According to above-mentioned purpose of the present invention, the present invention also proposes a kind of module integrated circuit packaging structure with temperature compensation and control quartz oscillator, it is characterized in that, comprise: substrate, be arranged at temperature compensation and control quartz oscillator on this substrate and at least one and be arranged at chip on this substrate, this substrate is provided with at least one to through hole that should temperature compensation and control quartz oscillator, and this temperature compensation and control quartz oscillator and this chip are coated by the isolation structures that is construed as by adhesive body and lid shell, and this isolation structures and this through hole provide the exhausted function of thermal resistance in this temperature compensation and control quartz oscillator.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this through hole can be positioned at the below of this temperature compensation and control quartz oscillator middle position.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this adhesive body can coat this temperature compensation and control quartz oscillator and this chip, and this lid shell is coated on this adhesive body.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this substrate can be metallic support, circuit board, aluminium base, silicon substrate or ceramic substrate.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this lid shell can be has anti electromagnetic wave and the good metal shell of thermal conductivity.
In the above-mentioned module integrated circuit packaging structure with temperature compensation and control quartz oscillator, this adhesive body can be heat cured filler material.
The present invention has following beneficial effect: make temperature compensation and control quartz oscillator be arranged in the module integrated circuit packaging structure, reduce environmental impact, reach the purpose of temperature compensation and control quartz oscillator working stability.
In order to make narration of the present invention more detailed and complete, in the following summary of the invention, provide many different embodiment or example, can understand the application of the different characteristic in different embodiment with reference to following description and conjunction with figs..
Description of drawings
Fig. 1 has the first embodiment schematic diagram of the module integrated circuit packaging structure of temperature compensation and control quartz oscillator for the present invention.
Fig. 2 has the manufacture method flow chart of the module integrated circuit packaging structure of temperature compensation and control quartz oscillator for the present invention.
Fig. 3 has the method flow block diagram of the module integrated circuit packaging structure of temperature compensation and control quartz oscillator for the present invention.
Fig. 4 has the second embodiment schematic diagram of the module integrated circuit packaging structure of temperature compensation and control quartz oscillator for the present invention.
Wherein, description of reference numerals is as follows:
100 module integrated circuit packaging structures
110 substrates
112 upper surfaces
114 through holes
120 temperature compensation and control quartz oscillators
1201 conductive feet positions
130 chips
140 adhesive bodies
150 lid shells
200 isolation structures
S300-S330 method flow step
Embodiment
Please refer to Fig. 1, the invention provides a kind of module integrated circuit packaging structure with temperature compensation and control quartz oscillator, be applied to electronic equipment such as global positioning system, mobile phone or mobile electronic communication system etc., this module integrated circuit packaging structure 100 comprises: substrate 110, temperature compensation and control quartz oscillator 120, two chips 130 and lid shells 150.
(Printing Circuit Board, PCB), aluminium base, silicon substrate, ceramic substrate etc., this substrate 110 has upper surface 112 for the material of this substrate 110 such as metallic support, all kinds of circuit board.In this specific embodiment, this substrate 110 is the BT resin laminate, and it is a multi-layer substrate structure, comprising: one deck resin bed plate at least; Metal level, at least between one deck resin bed plate, as reference plane (ground plane), the top layer of this substrate then is coated with the copper plate of nickel/gold as holding wire cabling and face of weld in order to moulding sputter copper layer for it at this.
This temperature compensation and control quartz oscillator 120 is arranged on the upper surface 112 of this substrate 110, and electric connection is reached with the holding wire cabling of these substrate 110 top layers in the conductive feet position 1201 of this temperature compensation and control quartz oscillator 120.These temperature compensation and control quartz oscillator 120 operation principles, mainly be by temperature-compensation circuit environmental impact such as ambient temperature to be changed the frequency of oscillation variable quantity minimizing that is produced, its present temperature-compensating mode has direct compensation mode and indirect compensation way respectively.Wherein, the temperature-compensation circuit that the direct compensation mode is made up of thermistor and resistance capacitance composite component, in quartz (controlled) oscillator, be in series with quartz-crystal unit, when extraneous variations in temperature, the capacitance respective change of the resistance of thermistor and crystal equivalent series electric capacity, thereby the temperature drift of counteracting or reduction frequency of oscillation.Compensation way divides two types again for analog and digital indirectly.Analog indirect compensation way is to utilize thermistor equitemperature sensing element to form temperature-voltage conversion circuit, and with on the varicap that this voltage is applied to quartz-crystal unit is connected in series mutually, by the variation of quartz-crystal unit series electrical capacity, drift compensates to the non-linear frequency of quartz-crystal unit.Digital indirect compensation way is to add analog-to-digital converter (A/D Converter) in analog circuit, converts analog quantity to digital quantity.
In this specific embodiment, this module integrated circuit packaging structure 100 comprises two chips 130, but not as limit, these two chips 130 are respectively the fundamental frequency chip of responsible signal processing and the radio frequency chip of received signal, this fundamental frequency chip is integrated and is comprised: and microprocessor module (Microprocessor, CPU), memory module (DRAM, SRAM, Flash), power management module (Power Manager), microprocessor peripheral circuit module (Processor peripherals) and clock pulse module (Clock); This radio frequency chip is integrated and is comprised: and amplifier module (Amplifier), filter module (Filter), frequency demultiplier module (Low Noise Block Downconverter, LNB), frequency synthesizer module (Frequency Synthesizer), oscillator module (Filter) and Anneta module (Antenna Element) or the like.Above-mentioned electronic component can utilize surface mounting technology (Surface Mount Technology, SMT), pin passes circuit board (Through Hole), ball grid encapsulation (Ball Grid Array, BGA), grid array (Land Grid Array, LGA), column gate array (Column Grid Array, CGA), (Plastic Ball Grid Array, PBGA) etc. mode is arranged on the upper surface 112 of this substrate 110 plastic ball grid array.In addition, the internal circuit of this module integrated circuit packaging structure 100 utilizes semiconductor technology to pile up formation, and this semiconductor technology then comprises photoetching process, etch process, reaches metal deposition process or the like, and so all non-emphasis of the present invention of above-mentioned technology is not at this detailed description.
This adhesive body 140 is heat cured filler material, it is formed on the upper surface 112 of this substrate 110, and coat this temperature compensation and control quartz oscillator 120 and this two chips 130, in order to reduce environmental impact, reach the purpose of temperature compensation and control quartz oscillator 120 working stabilities.
This lid shell 150 is for to have anti electromagnetic wave and the good metal shell of thermal conductivity, and it coats this adhesive body 140, and is arranged on the upper surface 112 of this substrate 110, forms this module integrated circuit packaging structure 100.This adhesive body 140 is construed as isolation structures 200 with this lid shell 150, this isolation structures 200 provides thermal resistance exhausted function for this temperature compensation and control quartz oscillator 120, make this temperature compensation and control quartz oscillator 120 be in the space of comparatively constant and the difficult and external environment condition generation heat exchange of temperature, and then reduce this temperature compensation and control quartz oscillator 120 and be subjected to influence of temperature variation.
Please refer to Fig. 2 and shown in Figure 3, according to the foregoing description, the invention provides the method flow step S300 that a kind of manufacturing has the module integrated circuit packaging structure of temperature compensation and control quartz oscillator, it comprises: step S310, step S320 and step S330.
Step S310 provides substrate 110, and have at least one chip 130 on this substrate 110 (two chips 130 shown in the figure) and temperature compensation and control quartz oscillator 120.
Step S320 fills adhesive body 140, and it is layed on the upper surface 112 of substrate 110, and coats this temperature compensation and control quartz oscillator 120 and this two chips 130.
Step S330, covering shell 150, it coats this adhesive body 140, and be arranged on the upper surface 112 of substrate 110, form module integrated circuit packaging structure 100, whereby temperature compensation and control quartz oscillator 120 and external environment condition are completely cut off, to block the heat exchange of temperature compensation and control quartz oscillator 120 and external environment condition.
Please refer to Fig. 4, it is the second embodiment of the present invention, in the present embodiment, this substrate 110 further is provided with at least one through hole 114 (through hole 114 only is shown among the figure), through hole 114 is positioned at the below of this temperature compensation and control quartz oscillator 120, the purpose that this at least one through hole 114 is set is to remove the metal level in these temperature compensation and control quartz oscillator 120 lower substrate 110, to reduce the cooling effect of this metal level, that is the heat conduction factor of minimizing metal, and then allow this temperature compensation and control quartz oscillator 120 under the state of temperature constant, work, make it not to be vulnerable to the influence of temperature change, reach the purpose of temperature compensation and control quartz oscillator 120 more stable work; In other words, this through hole 114 all can provide the effect that blocks heat exchange with the above-mentioned isolation structures 200 that is construed as by this adhesive body 140 and this lid shell 150, constant with the operating ambient temperature of reaching temperature compensation and control quartz oscillator 120.And in the present embodiment, because the conductive feet position 1201 of this temperature compensation and control quartz oscillator 120 is positioned at the edge of oscillator packaging body, so the position of this at least one through hole 114 is positioned at the lower position of the packaging body central authorities of this temperature compensation and control quartz oscillator 120, make this at least one through hole 114 can not influence the electrical connection of this temperature compensation and control quartz oscillator 120 and this substrate 110; But above-mentioned explanation is not in order to limiting the present invention, and the position of this through hole 114 and quantity can be adjusted according to the pin position design of employed temperature compensation and control quartz oscillator 120 etc.
The present invention is arranged at temperature compensation and control quartz oscillator 120 in the module integrated circuit packaging structure 100, reduces environmental impact, compared with the prior art under, reach the purpose of temperature compensation and control quartz oscillator 120 working stabilities.
Though the present invention with a preferred embodiment openly as above; yet it is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can doing various changes and modification, so protection scope of the present invention should be as the criterion with claims.
Claims (12)
1. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator is characterized in that, this module integrated circuit packaging structure comprises:
Substrate;
Temperature compensation and control quartz oscillator, it is arranged at the upper surface of this substrate;
At least one chip, it is arranged at the upper surface of this substrate;
Adhesive body, it is layed in the upper surface of this substrate, and coats this temperature compensation and control quartz oscillator and this chip; And
The lid shell, it coats this adhesive body, and is arranged on the upper surface of this substrate, and wherein this adhesive body and this lid shell are construed as isolation structures, and this isolation structures provides the exhausted function of thermal resistance in this temperature compensation and control quartz oscillator.
2. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 1 is characterized in that: this substrate further is provided with at least one to through hole that should temperature compensation and control quartz oscillator.
3. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 2 is characterized in that: this through hole is positioned at the below of this temperature compensation and control quartz oscillator middle position.
4. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 3 is characterized in that: this substrate is metallic support, circuit board, aluminium base, silicon substrate or ceramic substrate.
5. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 3 is characterized in that: this lid shell is to have anti electromagnetic wave and the good metal shell of thermal conductivity.
6. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 3 is characterized in that: this adhesive body is heat cured filler material.
7. module integrated circuit packaging structure with temperature compensation and control quartz oscillator, it is characterized in that, comprise: substrate, be arranged at temperature compensation and control quartz oscillator on this substrate and at least one and be arranged at chip on this substrate, this substrate is provided with at least one to through hole that should temperature compensation and control quartz oscillator, and this temperature compensation and control quartz oscillator and this chip are coated by the isolation structures that is construed as by adhesive body and lid shell, and this isolation structures and this through hole provide the exhausted function of thermal resistance in this temperature compensation and control quartz oscillator.
8. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 7 is characterized in that: this through hole is positioned at the below of this temperature compensation and control quartz oscillator middle position.
9. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 8 is characterized in that: this adhesive body coats this temperature compensation and control quartz oscillator and this chip, and this lid shell is coated on this adhesive body.
10. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 9 is characterized in that: this substrate is metallic support, circuit board, aluminium base, silicon substrate or ceramic substrate.
11. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 9 is characterized in that: this lid shell is to have anti electromagnetic wave and the good metal shell of thermal conductivity.
12. the module integrated circuit packaging structure with temperature compensation and control quartz oscillator as claimed in claim 9 is characterized in that: this adhesive body is heat cured filler material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810097174 CN101587881A (en) | 2008-05-19 | 2008-05-19 | Module integrated circuit packaging structure with temperature compensation and control quartz oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810097174 CN101587881A (en) | 2008-05-19 | 2008-05-19 | Module integrated circuit packaging structure with temperature compensation and control quartz oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101587881A true CN101587881A (en) | 2009-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810097174 Pending CN101587881A (en) | 2008-05-19 | 2008-05-19 | Module integrated circuit packaging structure with temperature compensation and control quartz oscillator |
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| CN (1) | CN101587881A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014191859A3 (en) * | 2013-05-31 | 2015-03-05 | International Business Machines Corporation | Thermal oscillator |
| CN105374804A (en) * | 2015-12-08 | 2016-03-02 | 深圳佰维存储科技有限公司 | Intelligent wearable device |
| CN110504939A (en) * | 2019-08-29 | 2019-11-26 | 北京康特睿科光电科技有限公司 | A kind of crystal oscillator and its manufacturing method |
| CN110622291A (en) * | 2017-06-23 | 2019-12-27 | 周星工程股份有限公司 | Substrate supporting apparatus |
| CN111123690A (en) * | 2019-12-10 | 2020-05-08 | 江苏卡欧万泓电子有限公司 | PCB board package for RTC integrated circuit with clock temperature compensation function |
| CN111883516A (en) * | 2020-07-24 | 2020-11-03 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of integrated module and electronic equipment |
-
2008
- 2008-05-19 CN CN 200810097174 patent/CN101587881A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014191859A3 (en) * | 2013-05-31 | 2015-03-05 | International Business Machines Corporation | Thermal oscillator |
| US9640748B2 (en) | 2013-05-31 | 2017-05-02 | International Business Machines Corporation | Thermal oscillator |
| CN105374804A (en) * | 2015-12-08 | 2016-03-02 | 深圳佰维存储科技有限公司 | Intelligent wearable device |
| CN110622291A (en) * | 2017-06-23 | 2019-12-27 | 周星工程股份有限公司 | Substrate supporting apparatus |
| CN110622291B (en) * | 2017-06-23 | 2024-05-14 | 周星工程股份有限公司 | Substrate supporting apparatus |
| CN110504939A (en) * | 2019-08-29 | 2019-11-26 | 北京康特睿科光电科技有限公司 | A kind of crystal oscillator and its manufacturing method |
| CN111123690A (en) * | 2019-12-10 | 2020-05-08 | 江苏卡欧万泓电子有限公司 | PCB board package for RTC integrated circuit with clock temperature compensation function |
| CN111883516A (en) * | 2020-07-24 | 2020-11-03 | 青岛歌尔智能传感器有限公司 | Packaging structure and packaging method of integrated module and electronic equipment |
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Open date: 20091125 |