CN111123690A

CN111123690A - PCB board package for RTC integrated circuit with clock temperature compensation function

Info

Publication number: CN111123690A
Application number: CN201911254229.7A
Authority: CN
Inventors: 祝栲; 万长文; 张进
Original assignee: Jiangsu Caio Million Hong Electronics Co ltd
Current assignee: Jiangsu Caio Million Hong Electronics Co ltd
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2020-05-08

Abstract

The invention discloses a PCB (printed circuit board) package for an RTC (real time clock) integrated circuit with a clock temperature compensation function, which belongs to the field of clock temperature compensation and comprises a PCB package for the RTC integrated circuit with the clock temperature compensation function, wherein the PCB package for the RTC integrated circuit with the clock temperature compensation function is realized by utilizing a phase-change material, so that a PCB main body and an RTC integrated circuit main body can keep a stable working temperature for a long time by utilizing heat emitted in the working process of the PCB main body and the RTC integrated circuit main body, the RTC integrated circuit main body welded on the PCB main body and a temperature compensation circuit serving the RTC integrated circuit main body can stably work and are not easily influenced by the external environment temperature, a good heat preservation service can be provided for the PCB carrying the RTC integrated circuit, the heat preservation work can be completed under the environment with large external temperature difference change, and the failure of a heat preservation device due to the large external, the RTC integrated circuit is not easy to work in a low temperature state to cause larger error.

Description

PCB board package for RTC integrated circuit with clock temperature compensation function

Technical Field

The invention relates to the field of clock temperature compensation, in particular to a PCB (printed circuit board) package for an RTC integrated circuit with a clock temperature compensation function.

Background

The real Time clock is abbreviated rtc (real Time clock). The RTC used in the clock is an integrated circuit, generally called a clock chip, and the real-time clock chip is one of the most widely used consumer electronic products in daily life, and provides accurate real-time for people or provides an accurate time reference for an electronic system. The crystal oscillates at a preset frequency, and accurate timing is achieved by updating the counter.

The quartz crystal resonance frequency error compensation method is a method for accurately compensating a frequency division counter generating 1Hz frequency on the basis that the error of the crystal resonance frequency along with the change of the temperature is known, and the crystal frequency can drift along with the change of the temperature under a low-temperature environment, so that the temperature compensation is required for obtaining the accurate 1Hz clock by the real-time clock.

In order to compensate the error of the crystal oscillator output clock, in the currently used compensation circuit technology, a burst type compensation scheme is often adopted, that is, within a certain compensation interval period, a certain number of clocks are increased or decreased in a burst type within a certain second, and finally, a 1Hz clock is obtained through frequency division.

However, the compensation effect of the compensation circuit on the RTC integrated circuit is worse along with the temperature reduction of the working environment, and even when the temperature is as low as minus 40 ℃, the compensation effect of the compensation circuit is almost negligible, so for the RTC integrated circuit working at a low temperature for a long time, besides providing an effective compensation circuit for the RTC integrated circuit, the PCB board on which the RTC integrated circuit is required to be arranged should be prepared for keeping warm, and the influence of the long-time low-temperature working on the working accuracy of the RTC integrated circuit is avoided.

Disclosure of Invention

1. Technical problem to be solved

The invention aims to provide a PCB (printed circuit board) package for an RTC integrated circuit with a clock temperature compensation function, which can provide better heat preservation service for a PCB carrying the RTC integrated circuit, can finish heat preservation work in an environment with larger external temperature difference change, is not easy to cause failure of a heat preservation device due to overlarge external temperature difference and larger error caused by the working of the RTC integrated circuit in a low-temperature state.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

The RTC integrated circuit with the clock temperature compensation function is packaged by the PCB board, which comprises a PCB board main body, wherein the RTC integrated circuit main body is welded on the PCB board main body, an outer protective sleeve is sleeved outside the RTC integrated circuit main body, a plurality of positioning holes are drilled on the PCB board main body, a plurality of locking devices matched with the positioning holes are fixedly connected on the outer protective sleeve, the PCB board main body is fixedly connected with the locking devices through the plurality of mutually matched positioning holes and the outer protective sleeve, a heat preservation cavity and an outer protection cavity are drilled in the outer protective sleeve, the outer protection cavity is positioned outside the heat preservation cavity, a phase-change material is filled in the heat preservation cavity, a protection ball is filled in the outer protection cavity, the protection ball comprises a ball shell, a plurality of inner lining columns are fixedly connected on the inner wall of the ball shell, and one ends of the plurality of the inner lining columns, which are far away from the ball shell, all point to, the PCB circuit board that has the RTC integrated circuit can realize providing better heat preservation service for carrying, also can accomplish heat preservation work under the great environment of external temperature difference change, is difficult for leading to the heat preservation device to become invalid because of the too big external temperature difference, is difficult for causing the RTC integrated circuit to work under the low temperature state and causes great error.

Furthermore, the locking device comprises a positioning column and a locking ball, the positioning hole also comprises a cylindrical through hole and a spherical through hole which are respectively matched with the positioning column and the locking ball, and the PCB main body is connected with the outer protective sleeve through the matching of the locking ball and the spherical through hole.

Furthermore, a plurality of elastic balls are filled in the locking balls, the locking balls are filled to a bulging state by the elastic balls, and the elastic balls can increase the capacity of the locking balls for keeping the original shape on the premise of not influencing the elasticity of the locking balls, so that the fixing effect between the locking balls and the spherical through holes is increased.

Furthermore, the reference column includes the reference column main part, it has movable spout to open in the reference column main part, sliding connection has with self assorted balanced push pedal in the movable spout, fixedly connected with compression spring between balanced push pedal and the movable spout groove bottom plate, wherein the movable spout can further increase the holistic elasticity of locking ball, and the technical staff of being convenient for installs the locating hole, and after the installation finishes, because compression spring's effect can be decided the elastic ball in the locking ball, makes the locking ball easily keep the prototype, consolidates being connected between locking ball and the spherical through-hole.

Further, a plurality of lateral wall spacing grooves are cut on the lateral wall of the movable sliding groove, a plurality of lateral wall spacing groove-matched side sliders are connected to the lateral wall of the balance pushing plate, the balance pushing plate can slide in the movable sliding groove through the cooperation of the side sliders and the balance pushing plate, so that the side turning is not easy, the compression spring is not easy to deform due to non-working, the compression spring is not easy to lose efficacy, and meanwhile, the elastic ball can be effectively prevented from crossing the balance pushing plate to enter the movable sliding groove, and the filling degree of the locking ball is not easy to influence.

Furthermore, the elastic metal rod is inserted in the lining column and fixedly connected with the inner wall of the ball shell, and the elastic metal rod can increase the elasticity of the lining column, so that the lining column can quickly recover to the original shape after being impacted, bent and deformed by external force, and the whole protective ball is easy to maintain to the original shape.

Further, the width in outer protection chamber and the diameter phase-match of protection ball, outer protection intracavity have promptly and only lay one deck protection ball, make outer protective sheath surface tend to level and smooth, can effectively unload the power to external force impact, reduce because of the local protruding external force impact that causes in outer protective sheath surface concentrates probably, make outer protective sheath not fragile.

Furthermore, the surface of the ball shell is fixedly connected with a hard hair layer, the friction force between the two adjacent hard hair layers on the surfaces of the protective balls can be increased, the protective balls are not prone to being staggered and stacked mutually, and the protective balls are easy to keep in a flat state.

Further, a plurality of capillary micropores are dug on the ball shell, and the capillary micropores run through the ball shell, and intercommunication ball shell and external, a plurality of each other do not communicate between the capillary micropores, and when the outer protective sheath between heat preservation chamber and the outer protective sheath breaks, the phase change material of the liquefaction state that leaves in the heat preservation intracavity can be absorbed a small amount through the capillary micropores to the protection ball, reduces phase change material's the holistic damage of leaking to PCB board main part.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

the scheme realizes the heat preservation of the PCB main body and the RTC integrated circuit main body by utilizing the phase-change material, so that the PCB main body and the RTC integrated circuit main body can keep relatively stable working temperature for a relatively long time by utilizing the heat emitted in the working process of the PCB main body and the RTC integrated circuit main body, the RTC integrated circuit main body welded on the PCB main body and the temperature compensation circuit serving the RTC integrated circuit main body can stably work and are not easily influenced by the external environment temperature, meanwhile, the outer protective sleeve can be conveniently and rapidly installed or detached by technicians through the connection between the positioning column and the locking ball as well as the positioning hole, can realize better heat preservation service for the PCB circuit board carrying the RTC integrated circuit, the heat preservation device can complete heat preservation work under the environment with large external temperature difference change, the failure of the heat preservation device due to the overlarge external temperature difference is not easy to cause, and the large error caused by the work of the RTC integrated circuit in a low-temperature state is not easy to cause.

Drawings

FIG. 1 is an exploded view of the main structure of the PCB package of the RTC integrated circuit of the present invention.

Fig. 2 is a schematic structural view of the outer protective sheath of the present invention.

Figure 3 is a side cross-sectional view of an outer protective sheath of the present invention.

Fig. 4 is a side sectional view of an outer protective ball of the present invention.

Fig. 5 is a schematic structural view of the locking device of the present invention.

Fig. 6 is an exploded view of the main structure of the locking device of the present invention.

Fig. 7 is a schematic structural view of the positioning post of the present invention.

Fig. 8 is a side cross-sectional view of the locking device of the present invention.

Fig. 9 is a partial cross-sectional view of the connection between the outer protective sleeve and the PCB board.

The reference numbers in the figures illustrate:

1 PCB board main part, 2 RTC integrated circuit main part, 3 locating holes, 4 outer protective sheaths, 5 locking devices, 6 locating columns, 601 locating column main part, 602 movable sliding grooves, 603 side wall limiting grooves, 7 locking balls, 8 balance push plates, 9 compression springs, 10 elastic balls, 11 heat preservation cavities, 12 outer protection cavities, 13 protection balls, 1301 ball shells, 1302 inner lining columns, 1303 elastic metal rods, 1304 hard wool layers and 1305 capillary micropores.

Detailed Description

The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1-3, the RTC integrated circuit package with clock temperature compensation function includes a PCB main body 1, a RTC integrated circuit main body 2 welded on the PCB main body 1, an outer protective cover 4 sleeved on the outer side of the RTC integrated circuit main body 2, a plurality of positioning holes 3 drilled on the PCB main body 1, a plurality of locking devices 5 fixed on the outer protective cover 4 and matched with the positioning holes 3, the PCB body 1 and the locking device 5 are fixedly connected through a plurality of mutually matched positioning holes 3 and an outer protective sleeve 4, a heat preservation cavity 11 and an outer protection cavity 12 are chiseled in the outer protective sleeve 4, the outer protection cavity 12 is positioned at the outer side of the heat preservation cavity 11, the heat preservation cavity 11 is filled with phase-change materials, the outer protection cavity 12 is filled with a protection ball 13, the protection ball 13 comprises a ball shell 1301, a plurality of lining columns 1302 are fixedly connected on the inner wall of the ball shell 1301, and the ends of the lining columns 1302 away from the ball shell 1301 all point to the center of the protective ball 13.

Particularly, the actual size and ratio of the PCB main body 1 and the RTC integrated circuit main body 2 are not exactly as shown in fig. 1, and the PCB main body 1 is welded with the RTC integrated circuit main body 2 and other auxiliary integrated circuits, such as a temperature compensation circuit, a voltage regulator circuit, etc., necessary for the RTC integrated circuit main body 2 to work.

Most of heat emitted when the PCB main body 1 and the RTC integrated circuit main body 2 work normally is transmitted in the phase-change material located in the heat preservation cavity 11 through the outer protective sleeve 4, and the phase-change material stores the heat through liquefaction, so that the PCB main body 1 and the RTC integrated circuit main body 2 are at a relatively stable working temperature, and when the working environment temperature of the PCB main body 1 and the RTC integrated circuit main body 2 drops, the phase-change material stored in the heat preservation cavity 11 releases the stored heat through solidification, the working environment temperature of the PCB main body 1 and the RTC integrated circuit main body 2 is adjusted in a delayed way by using the heat generated by the work of the PCB main body 1 and the RTC integrated circuit main body 2, the temperature change of the working environment of the PCB main body 1 and the RTC integrated circuit main body 2 is slowed down, and the working error of the RTC integrated circuit main body 2 is reduced, and outer protection chamber 12 is the protective layer of heat preservation chamber 11 and the intussuseption of heat preservation chamber 11, when outer protective sheath 4 receives external force impact, outer protection chamber 12 and protection ball 13 can play the cushioning effect, make heat preservation chamber 11 be the phase change material of the intussuseption of heat preservation chamber 11 is difficult for receiving external force impact, and the inside lining post 1302 of ball casing 1301 internal connection is when receiving external force impact and taking place excessive deformation, can slow down the deformation of protection ball 13 through the striking between the inside lining post 1302, and make protection ball 13 recover the prototype after external force is let out, make protection ball 13 can effectually keep the prototype, can keep elasticity.

Referring to fig. 5-8, the locking device 5 includes a positioning post 6 and a locking ball 7, the positioning hole 3 also includes a cylindrical through hole and a spherical through hole respectively matching with the positioning post 6 and the locking ball 7, the connection between the PCB main body 1 and the outer protective cover 4 is realized by matching the locking ball 7 with the spherical through hole, the locking ball 7 is filled with a plurality of elastic balls 10, the locking ball 7 is filled with the plurality of elastic balls 10 to a bulging state, the elastic balls 10 can increase the ability of the locking ball 7 to maintain the prototype on the premise of not affecting the elasticity of the locking ball 7, the fixing effect between the locking ball 7 and the spherical through hole is increased, the positioning post 6 includes a positioning post main body 601, a movable sliding groove 602 is formed in the positioning post main body 601, a balance push plate 8 matching with itself is slidably connected in the movable sliding groove 602, a compression spring 9 is fixedly connected between the balance push plate 8 and the bottom plate of the movable, the compression spring 9 in a compressed state can enable the balance push plate 8 to always have a movement trend away from the bottom plate of the movable sliding groove 602, the notch of the movable sliding groove 602 can avoid the balance push plate 8 from sliding out of the movable sliding groove 602 through a narrow-mouth design, wherein the movable sliding groove 602 can further increase the overall elasticity of the locking ball 7, so that technicians can conveniently install the positioning hole 3, after the installation is finished, due to the effect of the compression spring 9, the elastic ball 10 can be fixed in the locking ball 7, so that the locking ball 7 can easily keep a prototype, the connection between the locking ball 7 and the spherical through hole is reinforced, a plurality of side wall limiting grooves 603 are drilled on the side wall of the movable sliding groove 602, a plurality of side edge slide blocks matched with the side wall limiting grooves 603 are connected on the side wall of the balance push plate 8, and the balance push plate 8 can not easily turn over when sliding in the movable sliding groove 602 through the cooperation of the, the compression spring 9 is not easy to deform in a non-working direction, the compression spring 9 is not easy to lose effectiveness, and meanwhile, the elastic ball 10 can be effectively prevented from crossing the balance push plate 8 to enter the movable sliding groove 602, so that the filling degree of the locking ball 7 is not easy to influence.

Particularly, the surface of the PCB body 1 should be coated with a heat insulation coating, and the coating of the heat insulation coating should not affect the normal operation of the circuit on the PCB body 1, so as to prevent the excessive heat from dissipating through the PCB body 1, and when the outer protective sleeve 4 needs to be disassembled urgently, the locking ball 7 can be punctured, and the elastic ball 10 filled in the locking ball 7 is released to release the connection between the positioning hole 3 and the locking device 5.

Referring to fig. 3-4, an elastic metal rod 1303 is inserted into the lining column 1302, and the elastic metal rod 1303 is fixedly connected to the inner wall of the ball housing 1301, the elastic metal rod 1303 can increase the elasticity of the lining column 1302, so that the lining column 1302 can recover to its original shape after being bent and deformed by external force, the protection ball 13 can be easily kept in its original shape as a whole, the width of the outer protection cavity 12 matches the diameter of the protection ball 13, i.e. only one layer of protection ball 13 is laid in the outer protection cavity 12, so that the surface of the outer protection sleeve 4 tends to be flat, the external force impact can be effectively relieved, the possibility of external force impact concentration caused by local protrusion on the surface of the outer protection sleeve 4 is reduced, the outer protection sleeve 4 is not easily damaged, the surface of the ball housing 1301 is fixedly connected with the bristle layer 1304, the bristle layers 1304 on the surfaces of two adjacent protection balls 13 can increase the friction force between the two adjacent protection balls 13, so that the protection balls 13, make protection ball 13 easily keep the tiling state, it has a plurality of capillary 1305 to cut on the ball casing 1301, and capillary 1305 runs through ball casing 1301, communicate ball casing 1301 and external world, each other do not communicate between a plurality of capillary 1305, when outer protective sheath 4 between heat preservation chamber 11 and outer protection chamber 12 breaks, protection ball 13 can absorb a small amount of phase change material of the liquefaction state of depositing in heat preservation chamber 11 through capillary 1305, reduce phase change material's the holistic damage of leaking to PCB board main part 1.

The scheme realizes the heat preservation of the PCB main body 1 and the RTC integrated circuit main body 2 by utilizing the phase-change material, so that the PCB main body 1 and the RTC integrated circuit main body 2 can keep a stable working temperature for a long time by utilizing the heat emitted in the working process of the PCB main body 1 and the RTC integrated circuit main body 2, the RTC integrated circuit main body 2 welded on the PCB main body 1 and the temperature compensation circuit serving the RTC integrated circuit main body 2 can stably work and are not easily influenced by the external environment temperature, meanwhile, the outer protective sleeve 4 can be conveniently and rapidly installed or detached by technicians through the connection between the positioning columns 6 and the locking balls 7 and the positioning holes 3, can realize better heat preservation service for the PCB circuit board carrying the RTC integrated circuit, the heat preservation device can complete heat preservation work under the environment with large external temperature difference change, the failure of the heat preservation device due to the overlarge external temperature difference is not easy to cause, and the large error caused by the work of the RTC integrated circuit in a low-temperature state is not easy to cause.

The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.

Claims

1. RTC is PCB board encapsulation for integrated circuit with clock temperature compensation function, including PCB board main part (1), its characterized in that: the PCB comprises a PCB body (1), an RTC integrated circuit body (2) welded on the PCB body (1), an outer protective sleeve (4) sleeved on the outer side of the RTC integrated circuit body (2), a plurality of positioning holes (3) drilled on the PCB body (1), a plurality of locking devices (5) matched with the positioning holes (3) fixedly connected on the outer protective sleeve (4), a heat preservation cavity (11) and an outer protection cavity (12) drilled in the outer protective sleeve (4), the outer protection cavity (12) is positioned on the outer side of the heat preservation cavity (11), the heat preservation cavity (11) is filled with a phase-change material, the outer protection cavity (12) is filled with a protection ball (13), the protection ball (13) comprises a ball shell (1301), a plurality of lining columns (1302) fixedly connected on the inner wall of the ball shell (1301), and one ends of the lining columns (1302) far away from the ball shell (1301) point to the center of the protective ball (13).

2. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 1, wherein: the locking device (5) comprises a positioning column (6) and a locking ball (7), and the positioning hole (3) also comprises a cylindrical through hole and a spherical through hole which are respectively matched with the positioning column (6) and the locking ball (7).

3. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 2, wherein: the locking ball (7) is filled with a plurality of elastic balls (10), and the elastic balls (10) fill the locking ball (7) to a bulging state.

4. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 2, wherein: reference column (6) include reference column main part (601), it has movable spout (602) to open in reference column main part (601), sliding connection has with self assorted balanced push pedal (8) in movable spout (602), fixedly connected with compression spring (9) between balanced push pedal (8) and movable spout (602) tank bottom plate.

5. The PCB board package for RTC integrated circuit with clock temperature compensation function of claim 4, characterized in that: a plurality of side wall limiting grooves (603) are formed in the side wall of the movable sliding groove (602), and a plurality of side sliding blocks matched with the side wall limiting grooves (603) are connected to the side wall of the balance push plate (8).

6. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 1, wherein: an elastic metal rod (1303) is inserted into the lining column (1302), the elastic metal rod (1303) is fixedly connected with the inner wall of the ball shell (1301), and the elasticity of the lining column (1302) can be increased through the elastic metal rod (1303).

7. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 1, wherein: the width of the outer protection cavity (12) is matched with the diameter of the protection ball (13), namely, only one layer of protection ball (13) is paved in the outer protection cavity (12).

8. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 1, wherein: the surface of the ball shell (1301) is fixedly connected with a hard wool layer (1304).

9. The PCB board package for the RTC integrated circuit having the clock temperature compensation function according to claim 1, wherein: a plurality of capillary micropores (1305) are drilled in the ball shell (1301), the capillary micropores (1305) penetrate through the ball shell (1301), the ball shell (1301) is communicated with the outside, and the capillary micropores (1305) are not communicated with each other.