CN101587268A - Liquid crystal display device - Google Patents
Liquid crystal display device Download PDFInfo
- Publication number
- CN101587268A CN101587268A CNA2008100379652A CN200810037965A CN101587268A CN 101587268 A CN101587268 A CN 101587268A CN A2008100379652 A CNA2008100379652 A CN A2008100379652A CN 200810037965 A CN200810037965 A CN 200810037965A CN 101587268 A CN101587268 A CN 101587268A
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- CN
- China
- Prior art keywords
- data line
- wiring lead
- liquid crystal
- line wiring
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
- H01L2224/1705—Shape
- H01L2224/17051—Bump connectors having different shapes
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses a liquid crystal display device comprising a plurality of data wires and a plurality of corresponding data wire leading-out matching wires. Each data wire is formed by a second metal layer, each data wire leading-out matching wire is formed by a first metal layer, and each data wire and the corresponding data wire leading-out matching wire are electrically connected with each other. The device can effectively increase the thickness of insulating films between a conductive gold ball and the data wire leading-out matching wires, thereby greatly reducing the probability of bad phenomena such as D-COM short circuit, electrostatic damage and the like and enhancing the voltage resistibility of the data wires.
Description
Technical field
The present invention relates to a kind of liquid crystal indicator, particularly relate to a kind of liquid crystal indicator that can increase conductive gold spacer spacing in data line wiring lead and the sealing-in glue.
Background technology
Advantages such as thin-film transistor LCD device is frivolous with it, power saving, environmental protection are more and more accepted by consumers in general.All thin-film transistor LCD devices all include color membrane substrates and array base palte, connect with sealing-in glue between two substrates, include a liquid crystal layer in the sealing-in glue.Mainly comprise twisted-nematic (TN, Twist Nematics) pattern, plane conversion (IPS, In Plane Switching) pattern and vertical orientation (VA, Vertical Alignment) pattern in the present widely used liquid crystal indicator.In these display modes, color membrane substrates one side of TN pattern and VA pattern all is distributed with transparent electrically-conductive film as public electrode.Generally, this transparent conductive film adopts tin indium oxide (ITO, Indium Tin Oxide) material to form.
Fig. 1 is in the available liquid crystal display mode, the ball bearing made using synoptic diagram of array base palte one side.As shown in Figure 1, sweep trace 2 is formed by the first metal layer, and data line 1 is formed by second metal level.Sweep trace 2 and data line 1 intersect vertically across dielectric film.At the sealing-in glue 5 that distributing all around of liquid crystal display, sealing-in glue 5 traverses data line wiring lead 3 in data line terminal 7 one sides, and sealing-in glue 5 traverses sweep trace wiring lead 4 in sweep trace terminal 8 one sides.Sealing-in glue 5 contains the conductive gold spacer that is used to transmit the public electrode current potential.
The required current potential of transparent conductive film that is positioned on the color membrane substrates is to be conducted in the past by the gold goal of array base palte by sealing-in glue.So, above the wiring lead of sweep trace terminal one side and data line terminal one side, all can have gold goal to be dispersed in the sealing-in glue.These gold goals contact with transparent conductive film in color membrane substrates one side, and in array base palte one side, between the sweep trace wiring lead of general and sweep trace terminal one side across thicker dielectric film, and and between the data line wiring lead of data line terminal one side across the dielectric film that relatively approaches.
Figure 2 shows that data line terminal 7 one sides, the planimetric map that sealing-in glue 5, gold goal 6, data line 1 and data line wiring lead 3 form, wherein data line 1 and data line wiring lead 3 form by second metal level.Because in data line terminal 7 one sides, between gold goal 6 and the data line wiring lead 3 only across very thin one deck dielectric film, so various bad problems of appearance between gold goal and data line easily just.
Among Fig. 2 along the sectional view of A-A ' direction as shown in Figure 3.Generally, first dielectric film, 11 thickness that form on second metal level 10 exist
About, if the data line wiring lead that is formed by second metal level 10 is thicker, first dielectric film of locating in the section difference of data line wiring lead both sides 11 is just thinner relatively, at this time the data line wiring lead just contacts with gold goal 6 easily, cause the public electrode (COM) of the data line (D) that forms by second metal level 10 and color membrane substrates 9 one sides that the D-COM short circuit takes place, bright line will occur on the corresponding data line.Even if data line segment difference place, the D-COM short circuit phenomenon does not take place, because the spacing between gold goal 6 and the data line wiring lead is very little, gold goal 6 with COM current potential and data line current potential also be easy to take place the electrostatic breakdown phenomenon, light bright line will appear on the at this moment corresponding data line.
For adopting the above-mentioned bad problem that occurs after the gold goal technology, main countermeasure technology and the corresponding defective taked in the industry are as follows:
1, increase the thickness of this layer dielectric film on the data line wiring lead, the corresponding problem of bringing like this is can prolong the time of etching via hole on this layer dielectric film, in addition, is that the storage capacitance value of medium also can reduce with this layer dielectric film.
2, reduce the thickness of data line wiring lead, the corresponding problem of bringing like this is exactly the write capability reduction of data line, and perhaps, data line is wanted corresponding broadening, thereby causes the aperture opening ratio of display unit to descend.
3, do not mix gold goal in the sealing-in glue on the data line wiring lead, the problem of bringing like this is exactly that the sealing-in glue coating of data line terminal one side will be adopted different nozzles with the sealing-in glue coating at other positions, thereby brings the technology beat to descend.
4, use some repair wire structures, repair by laser repairing equipment, this mode needs the extra workload that increases, and repairing success ratio simultaneously can not guarantee.
Summary of the invention
The technical problem to be solved in the present invention is in order to overcome in the prior art conductive gold spacer spacing defect of insufficient in the data line wiring lead and sealing-in glue, a kind of liquid crystal indicator that can increase conductive gold spacer spacing in data line wiring lead and the sealing-in glue to be provided.
The present invention solves above-mentioned technical matters by following technical proposals: a kind of liquid crystal indicator, it comprises many data lines and many corresponding data line wiring leads, above-mentioned data line is formed by one second metal level, its characteristics are, above-mentioned data line wiring lead is formed by a first metal layer, and is electrical connection between every above-mentioned data line and the corresponding data line wiring lead.
Wherein, the concrete structure of this electrical connection is: be respectively equipped with a plurality of contact holes on this data line and the data line wiring lead, and be equipped with conductive film on all above-mentioned contact holes.
Wherein, be provided with an overlapping region between this data line and the data line wiring lead.
Wherein, a side of the crossover sites of this conductive film and data line wiring lead is located in this overlapping region.
Positive progressive effect of the present invention is: the present invention can not increase the dielectric film thickness, not reduce data line wiring lead thickness and do not adopt under the prerequisite of repair wire structure, increase the insulator film thickness between conductive gold spacer and the data line wiring lead effectively, thereby reduce the probability of bad phenomenon such as D-COM short circuit, electrostatic breakdown greatly, strengthen the voltage endurance capability of data line.
Description of drawings
Fig. 1 is the ball bearing made using synoptic diagram of array base palte one side in the available liquid crystal display device.
Fig. 2 connects the planimetric map of glue peripheral part for data line terminal one side seal of array base palte in the available liquid crystal display device.
Fig. 3 is along the sectional view of A-A ' direction among Fig. 2.
Fig. 4 connects the planimetric map of glue peripheral part for data line terminal one side seal of array base palte in the liquid crystal indicator of the present invention.
Fig. 5 is the synoptic diagram of an embodiment of liquid crystal indicator of the present invention.
Fig. 6 is the synoptic diagram of another embodiment of liquid crystal indicator of the present invention.
Fig. 7 is along the sectional view of B-B ' direction among Fig. 4.
Embodiment
Provide preferred embodiment of the present invention below in conjunction with accompanying drawing, to describe technical scheme of the present invention in detail.
In order to solve above-mentioned defective of the prior art, increase the distance between data line wiring lead and the conductive gold spacer, the invention provides a kind of design philosophy, form the data line wiring lead with the first metal layer exactly.Figure 4 shows that data line terminal 7 one sides, the planimetric map that sealing-in glue 5, gold goal 6, data line 1 and data line wiring lead 3 form, wherein data line 1 is still formed by the first metal layer, but the places different with original design are: whole data line wiring lead 3 is all formed by the first metal layer, and adopted a kind of mode of electrical connection 12 between second metal level of the first metal layer of data line wiring lead 3 and data line 1, do not interrupted with the signal that guarantees data line 1.
This electric connection structure is realized being electrically connected by contact hole 13 between data line wiring lead 3 that is formed by the first metal layer and the data line 1 that formed by second metal level as shown in Figure 5.Concrete structure is: on the first metal layer of data line wiring lead 3 and on second metal level of data line 1 contact hole 13 being set, cover conductive film 14 above the contact hole 13 at all these then respectively.
In addition, in order to prevent that extremely indivedual local contact holes 13 may etching not come out in actual production, perhaps etching is come out fully, the present invention's also special design in this electrical connection zone has the overlapping region 15 of second metal level of the first metal layer of a data line wiring lead 3 and data line 1, and this overlapping region 15 prepares for laser dotting to be communicated with data line wiring lead 3 and data line 1.This overlapping region 15 can be designed in the side of conductive film 14 with the crossover sites of data line wiring lead 3, as shown in Figure 5; Also can design at the opposite side of conductive film 14, as shown in Figure 6 with the crossover sites of data line wiring lead 3.
Structure specific embodiments as shown in Figure 5 is: the width of data line wiring lead 3 is 20um, and the width of data line 1 is 60um.The size of data line wiring lead 3 and the contact hole 13 above the data line 1 is 8um * 8um.Contact hole on the first metal layer is 1 example, 20 row, and the contact hole on second metal level is 3 row, 20 row.Second metal layer width for preparing for the overlapping region 15 of laser repairing is 10um.If the contact hole resistance size on the first metal layer is 50 Ω, the contact hole resistance size on second metal level is 1500 Ω, and can draw the resistance sizes that is electrically connected the zone so is 17.5 Ω.
The technology of liquid crystal indicator of the present invention is as follows: at first generate the first metal layer, as the data line wiring lead of sweep trace, grid, public electrode wire and data line terminal one side; Generating thickness then exists
About second dielectric film; Then, generate second metal level, as data line and transistorized source-drain electrode; Forming thickness then on the first metal layer exists
About first dielectric film; On the first metal layer and second metal level, form contact hole respectively then; On contact hole, cover layer of conductive film at last.Such structure as shown in Figure 7.
Fig. 7 is along the sectional view of B-B ' direction among Fig. 4.Because the data line wiring lead of data line terminal one side changes by the first metal layer 16 and forms, at this time the dielectric film thickness on the data line wiring lead is just at original first dielectric film, 11 thickness
About the basis on, increased by a thickness again
About second dielectric film 17, therefore total dielectric film thickness has just become on data line wiring lead this moment
About.Than original design, distance between conductive gold spacer 6 and the data line wiring lead has increased about 3 times, make to be short-circuited between data line wiring lead and the gold goal 6 or the probability of electrostatic breakdown greatly reduces, thereby make the voltage endurance capability of data line wiring lead strengthen greatly.
Though more than described the specific embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, under the prerequisite that does not deviate from principle of the present invention and essence, can make numerous variations or modification to these embodiments.Therefore, protection scope of the present invention is limited by appended claims.
Claims (4)
1, a kind of liquid crystal indicator, it comprises many data lines and many corresponding data line wiring leads, above-mentioned data line is formed by one second metal level, it is characterized in that, above-mentioned data line wiring lead is formed by a first metal layer, and is electrical connection between every above-mentioned data line and the corresponding data line wiring lead.
2, liquid crystal indicator as claimed in claim 1 is characterized in that, the concrete structure of this electrical connection is: be respectively equipped with a plurality of contact holes on this data line and the data line wiring lead, and be equipped with conductive film on all above-mentioned contact holes.
3, liquid crystal indicator as claimed in claim 2 is characterized in that, is provided with an overlapping region between this data line and the data line wiring lead.
4, liquid crystal indicator as claimed in claim 3 is characterized in that, a side of the crossover sites of this conductive film and data line wiring lead is located in this overlapping region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100379652A CN101587268A (en) | 2008-05-23 | 2008-05-23 | Liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100379652A CN101587268A (en) | 2008-05-23 | 2008-05-23 | Liquid crystal display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101587268A true CN101587268A (en) | 2009-11-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100379652A Pending CN101587268A (en) | 2008-05-23 | 2008-05-23 | Liquid crystal display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101587268A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022266925A1 (en) * | 2021-06-24 | 2022-12-29 | 京东方科技集团股份有限公司 | Array substrate, preparation method therefor and display panel |
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2008
- 2008-05-23 CN CNA2008100379652A patent/CN101587268A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022266925A1 (en) * | 2021-06-24 | 2022-12-29 | 京东方科技集团股份有限公司 | Array substrate, preparation method therefor and display panel |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20091125 |