CN101582378B - Substrate processing apparatus and control method thereof - Google Patents

Abstract

The invention provides a computer readable storage medium storing a program for performing an operation method of a substrate processing apparatus. The operation method includes the steps of introducing a nonreactive gas into the vacuum preparation chamber before the gate valve is opened while the substrate is transferred between the vacuum preparation chamber of the vacuum processing unit and thetransfer unit, stopping introducing the nonreactive gas when an inner pressure of the vacuum preparation chamber becomes same as an atmospheric pressure, starting an evacuation process of the corrosi ve gas in the vacuum preparation chamber and then opening to atmosphere performed by letting the vacuum preparation chamber communicate with an atmosphere, and opening the gate valve after the step ofopening to atmosphere.

Description

Substrate board treatment and control method thereof

The application be the application number that proposed on October 28th, 2005 be 200510118834.3 divide an application.

Technical field

The computer-readable recording medium that the present invention relates to substrate board treatment and working procedure thereof and control method and be used to store this program.

Background technology

Substrate board treatment constitutes by connecting a plurality of chambers.As this chamber, conveying chamber is for example arranged, it is set at and carries out processed substrate (for example semiconductor wafer (below abbreviate " wafer " as) under atmospheric pressure state between conveying chamber and outside) on the supply unit of exchange; Wafer is carried out the vacuum processing chamber of predetermined process such as etching or film forming; Be connected vacuum preparation room (for example preload chamber) between this vacuum processing chamber and the above-mentioned conveying chamber etc.Connect into sealing state between these chambers respectively via gate valve.

Substrate board treatment carries out the conveying of wafer between these chambers, and wafer is handled in that vacuum treatment is indoor simultaneously.Flow process as the general wafer in having the substrate board treatment of above-mentioned chamber is as described below.For example, wafer is transported to above-mentioned conveying chamber from the outside.Then, wafer is transported to vacuum processing chamber through the vacuum preparation room.Then, in vacuum processing chamber, utilize predetermined process gas that wafer is handled, for example carry out processing such as etching or film forming.After the processing in vacuum processing chamber finishes, make wafer turn back to conveying chamber by the vacuum preparation room.In the exchange process of the wafer that between vacuum preparation room and conveying chamber, carries out, make the vacuum preparation room for example to atmosphere opening etc. and after forming the pressure of regulation, the gate valve of opening between the chamber carries out the exchange of wafer between vacuum preparation room and conveying chamber.In addition, when between vacuum preparation room and vacuum processing chamber, carrying out the exchange of wafer, for example carry out the vacuum-evacuate etc. of vacuum preparation room and form the pressure of regulation, the gate valve of opening between the chamber carries out the exchange of wafer between vacuum preparation room and vacuum processing chamber.In other words, when between each chamber, exchanging wafer so as described,, each chamber is controlled, made that it is the pressure of regulation in order to reduce the pressure differential between the chamber.

Yet,, when the gate valve of opening between the chamber, can produce various problems according to the pressure state of each chamber.For example, when opening gate valve, the processing gas that remains in the vacuum processing chamber produces adverse current, and the pollution of moisture etc. flows into from conveying chamber, at each indoor particulate (deposit, dust etc.) of rolling.Therefore, can produce wafer, perhaps the problem that is corroded of the structure member that produces this chamber to other chamber adverse currents because of corrosive process gases by particulate and pollutant institute pollution problems.

Therefore, before opening gate valve, adopt the whole bag of tricks and various structure that indoor pressure is controlled now.For example, when opening when making the vacuum preparation room to atmosphere opening, be purpose with the particulate of removing in advance in the vacuum preparation room at the gate valve between conveying chamber and the vacuum preparation room, having on one side provides N to the vacuum preparation room ₂Purge gas such as gas are Yi Bian carry out the technology (for example opening the H3-87386 communique with reference to the Japan Patent spy) of exhaust.

In addition, a plurality of vacuum processing chambers are connected on the common transfer chamber, on this common transfer chamber, connect in the substrate board treatment of so-called combination bench-type of vacuum preparation room (preload chamber), also has a kind of technology (for example opening the H7-211761 communique) with reference to the Japan Patent spy, when between common transfer chamber and vacuum processing chamber or preload chamber, opening gate valve, by providing N to common conveying chamber ₂The Purge gas of gas etc., so that the pressure ratio vacuum processing chamber of common transfer chamber or preload chamber are high slightly, thereby formation is towards the air-flow of vacuum processing chamber or preload chamber, by preventing to handle the contaminated stream of gas and moisture etc. to the common transfer chamber like this.

Summary of the invention

Yet, in above-mentioned prior art, when the gate valve of opening between the chamber, in order to prevent to handle the adverse current of gas and cross pollution and, providing N in order to remove particulate ₂In the time of the Purge gas of gas etc. the pressure between each chamber is adjusted and between the chamber, produced pressure differential.

Since the pressure differential that between the chamber, produces like this, and cause when opening gate valve, producing air-flow, thereby in the indoor problem of rolling particulate along with this air-flow.Particularly, if the pressure differential between the chamber is big, then can produce shock wave (compressible fluid surpasses the very strong pressure wave that the velocity of sound is transmitted when the high speed current downflow), owing to the transmission of this shock wave becomes the main cause of rolling particulate indoor.

With regard to this point, think as if the pressure differential that can reduce slightly between the chamber, then can suppress rolling of particulate.Yet in recent years, along with the improvement of Sealing Technology, the sealing property of each chamber increased than in the past.Therefore, with existing pressure controlled order, for example utilization importing Purge gas rises to more than the necessary degree indoor pressure, has to become the big problem of pressure differential that produces than actual needs between the chamber.

In addition, Yi Bian for example also can correctly detect the pressure of being had family, Yi Bian controlled pressure correctly makes that the pressure differential between the chamber can be not excessive.But, need expensive pressure gauge and control instrument in order correctly to carry out pressure control, thus the cost height, make pressure controlled order become complicated simultaneously, impracticable.

And, the Japan Patent spy open also record in the H7-211761 communique between each chamber, be provided with can switch bypass, by reducing pressure differential between the chamber opening this bypass of gate valve front opening, with the structure of violent flow (shock wave) that prevent from when opening gate valve, to produce gas., when opening bypass,,,,, thereby become the reason of rolling particulate in the chamber so this shock wave also might be propagated because when opening bypass, produce shock wave even before gate valve is opened owing between the chamber, produce pressure differential.

Therefore, the present invention is the invention of carrying out in view of these problems, the computer-readable recording medium that its purpose is to provide a kind of basic substrate board treatment and working procedure and control method and is used to store this program, just can be suppressed at shock wave and convection current when opening the sluices between the chamber by simple structure, by preventing effectively at the indoor particulate of rolling like this.

In order to solve above-mentioned problem, as adopt one side among the present invention, a kind of storage medium of embodied on computer readable can be provided, store the program of the operation method that is used to carry out substrate board treatment, wherein, described substrate board treatment comprises: the supply unit that carries out the exchange of described processed substrate between conveying chamber and outside; With at least more than one the vacuum treatment unit that is connected on this supply unit, it has by gate valve and is connected vacuum preparation room on the described supply unit, gas handles the processed substrate of packing into as handling with use corrosive gas by this vacuum preparation room, at least more than one vacuum processing chamber, it is characterized in that, described operation method comprises following operation: when carrying out the exchange of described processed substrate between the vacuum preparation room of described vacuum treatment unit and described supply unit, before opening described gate valve, in described vacuum preparation room, import inert gas; Become when identical in the internal pressure of described vacuum preparation room, stop to import described inert gas, begin the exhaust of the corrosive gas of described vacuum preparation room, then, be communicated with atmosphere to come to atmosphere opening by making described vacuum preparation room with atmospheric pressure; After the atmosphere opening operation, open described gate valve described.

In order to solve above-mentioned problem, as adopt among the present invention on the other hand, a kind of storage medium of embodied on computer readable can be provided, store the program of the control method that is used to carry out substrate board treatment, wherein, described substrate board treatment comprises: the supply unit that carries out the exchange of described processed substrate between conveying chamber and outside; With at least more than one the vacuum treatment unit that is connected on this supply unit, it has by gate valve and is connected vacuum preparation room on the described supply unit, gas handles the processed substrate of packing into as handling with use corrosive gas by this vacuum preparation room, at least more than one vacuum processing chamber, wherein, described vacuum preparation room has inert gas and imports the unit, the corrosive gas exhaust unit, atmosphere opening unit etc., it is characterized in that, described control method comprises following operation: when carrying out the exchange of described processed substrate between the vacuum preparation room of described vacuum treatment unit and described supply unit, before opening described gate valve, by controlling the gas importing valve that described inert gas imports the unit, in described vacuum preparation room, import inert gas; Judging the internal pressure of described vacuum preparation room when the atmospheric pressure state detecting unit that is arranged on described vacuum preparation room becomes when identical with atmospheric pressure, stop to import described inert gas by the valve of controlling described inert gas importing unit, by controlling the drain tap of described corrosive gas exhaust unit, begin the exhaust of the corrosive gas of described vacuum preparation room, then, control the atmosphere opening valve of described atmosphere opening unit, be communicated with atmosphere to come to atmosphere opening by making described vacuum preparation room; After the operation of atmosphere opening, control and open described gate valve described.

In order to solve above-mentioned problem, as adopting among the present invention on the other hand, can provide a kind of substrate board treatment, it is characterized in that, comprising: the supply unit that between conveying chamber and outside, carries out the exchange of described processed substrate; Be connected at least more than one the vacuum treatment unit on the described supply unit; At least more than one vacuum preparation room is set on the described vacuum treatment unit, is connected on the described supply unit by gate valve, has inert gas and imports unit, corrosive gas exhaust unit, atmosphere opening unit etc.; At least more than one vacuum processing chamber is set on the described vacuum treatment unit, uses corrosive gas as handling gas the processed substrate of packing into to be handled by described vacuum preparation room; And controller, when between the vacuum preparation room of described vacuum treatment unit and described supply unit, carrying out the exchange of described processed substrate, before opening described gate valve, by controlling the gas importing valve that described inert gas imports the unit, in described vacuum preparation room, import inert gas; Become when identical in the internal pressure that detects described vacuum preparation room with atmospheric pressure, by controlling the gas importing valve that described inert gas imports the unit, stop to import described inert gas, by controlling the drain tap of described etchant gas exhaust unit, begin the exhaust of the described corrosive gas of described vacuum preparation room, then, control the atmosphere opening valve of described atmosphere opening unit, by making described vacuum preparation room be communicated with atmosphere to come to atmosphere opening, and, in described control and open described gate valve after the operation of atmosphere opening.

In order to solve above-mentioned problem, as adopting among the present invention on the one hand, can provide a kind of program that is used to carry out the control method of substrate board treatment, it is characterized in that: have the supply unit that between transfer chamber and outside, carries out the exchange of described processed substrate; With at least more than one the vacuum treatment unit that is connected on this supply unit; This vacuum treatment unit has by gate valve and is connected vacuum preparation room on the described supply unit and at least more than one this vacuum preparation room that passes through uses corrosive gas as handling the vacuum processing chamber that gas is handled the processed substrate of packing into, this vacuum preparation room has inert gas and imports the unit, the corrosive gas exhaust unit, atmosphere opening unit etc., described method comprises following operation: when carrying out the exchange of described processed substrate between the vacuum preparation room of described vacuum treatment unit and described supply unit, open before the described gate valve, open the operation that described inert gas imports the gas importing valve of unit; Atmospheric pressure state detecting unit in being arranged on described vacuum preparation room, judge become atmospheric pressure state in the described vacuum preparation room after, the gas of closing described inert gas importing unit imports valve, open the drain tap of described corrosive gas exhaust unit simultaneously, after this by opening the atmosphere opening valve of described atmosphere opening unit, carry out operation to atmosphere opening; With the operation of opening described gate valve.

As the storage medium of the embodied on computer readable of the present invention adopting, device and program, even open before the gate valve, in the vacuum preparation room, import inert gas, can stop the importing of inert gas in advance.The pressure that can prevent the vacuum preparation room like this is elevated to more than the pressure that needs.And, owing to also can begin the exhaust of the corrosive gas of vacuum preparation room in advance, for example can make the exhausts such as corrosive gas that remain in the vacuum preparation room in advance, and need not wait gate valve to be opened, after this, even open gate valve to atmosphere opening, also can prevent corrosive gas to inflows such as conveying chambers, for example can prevent that the mechanical part in the conveying chamber is corroded.As employing the present invention, utilize the importing that stops inert gas in advance, begin the simple structure of the corrosive gas exhaust of vacuum preparation room simultaneously, the pressure that can prevent the vacuum preparation room is elevated to more than the pressure that needs, so can be suppressed at shock wave when opening the sluices and convection current between the chamber, so just can prevent rolled-up effectively at indoor particulate.

In addition, in the storage medium of embodied on computer readable, stopping constantly of importing of above-mentioned above-mentioned inert gas in the operation of atmosphere opening with can freely set the zero hour of above-mentioned corrosive gas exhaust, for example can set for above-mentioned vacuum preparation room in when becoming atmospheric pressure state.By adjusting the zero hour that stops the moment and corrosive gas exhaust that inert gas imports,, also can adjust to the degree of when opening gate valve, not rolling particulate like this even between vacuum preparation room and supply unit, have pressure differential.As employing the present invention, adjust such simple structure zero hour that stops the moment and corrosive gas exhaust that inert gas imports owing to utilize, the pressure that can prevent the vacuum preparation room is elevated to more than the pressure that needs, so can be suppressed between the chamber (here, be between vacuum preparation room and transmission unit) shock wave and convection current when opening the sluices, so just can prevent rolled-up effectively at indoor particulate.

In addition, in the storage medium that the aforementioned calculation machine can read, the aforesaid substrate processing unit has the adverse current detecting unit of the adverse current that detects the corrosive gas exhaust, after the corrosive gas exhaust of above-mentioned vacuum preparation room begins, under the situation of the adverse current that detects exhaust with above-mentioned adverse current detecting unit, even do not having under the controlled situation through adverse current behind the certain hour, Error processing when carrying out adverse current, under through the controlled situation of adverse current behind the certain hour, the Error processing in the time of also can not carrying out above-mentioned adverse current.Even detect the adverse current of moment like this, as in official hour, finishing, can not carry out Error processing, even opening gate valve prerequisite front opening vent valve like this so resemble the present invention, Error processing is for example as producing adverse current, even under the situation of the processing that will close vent valve,, can avoid to close the situation of the such inconvenience of vent valve owing to be moment to have produced adverse current only.

In addition, in the aforesaid substrate processing unit, shock wave also can be set between above-mentioned vacuum preparation room and above-mentioned supply unit suppress the unit, be used to suppress the shock wave that the pressure differential because of above-mentioned vacuum preparation room and above-mentioned supply unit produces, shock wave is set between this external above-mentioned vacuum preparation room and the above-mentioned vacuum processing chamber suppresses the unit, be used to suppress the shock wave that the pressure differential because of above-mentioned vacuum preparation room and above-mentioned vacuum processing chamber produces.This shock wave suppresses the unit by the communicating pipe that for example is communicated with between above-mentioned vacuum preparation room and above-mentioned supply unit or the above-mentioned vacuum processing chamber; Be configured in and prevent the shock motion unit on above-mentioned communicating pipe; In above-mentioned shock motion unit one side that prevents, the communicating pipe switch valve that is configured in high vacuum preparation room one side of pressure constitutes.

Suppress in the substrate board treatment of unit having such shock wave, can open gate valve after for example opening the communicating pipe switch valve.Even between vacuum preparation room and supply unit or vacuum processing chamber, have pressure differential like this, because the communicating pipe shock wave utilization of opening generation of switch valve prevents that the effect of shock motion unit from resting in communicating pipe, shock wave is not propagated, so can prevent that the particulate that causes because of shock wave is rolled-up.Owing between vacuum preparation room and supply unit or vacuum processing chamber, utilize and open communicating pipe switch valve reduction pressure differential, do not produce shock wave even after this open gate valve, in addition so can prevent that the particulate that causes because of shock wave is rolled-up yet.

In order to solve above-mentioned problem, as adopt among the present invention on the other hand, a kind of substrate board treatment can be provided, this substrate board treatment is to have processed substrate is implemented the regulate the flow of vital energy a plurality of chambers that comprise vacuum processing chamber at least of processing of body of use, between each chamber, can exchange the substrate board treatment of the structure of above-mentioned processed substrate, it is characterized in that, in above-mentioned a plurality of chambers, suppressing the unit producing the shock wave that is provided for suppressing the shock wave that produces because of the pressure differential between these chambers between the chamber of pressure differential at least.

In addition, above-mentioned shock wave suppresses the unit for example by the communicating pipe that is communicated with between the above-mentioned chamber; Be configured in and prevent the shock motion unit on above-mentioned communicating pipe; In an above-mentioned side that prevents the shock motion unit, the communicating pipe switch valve that is configured in the high chamber of pressure one side constitutes.In addition, above-mentioned processing gas is under the situation of corrosive gas, also on communicating pipe at the above-mentioned opposite side that prevents the shock motion unit, side in the low chamber of pressure also is provided with the communicating pipe switch valve, simultaneously also can prevent that the communicating pipe of the opposite side of shock motion unit is provided for evacuated vacuum exhaust unit of above-mentioned communicating pipe between the switch valve at above-mentioned shock motion unit and this of preventing.

In order to solve above-mentioned problem, as adopt among the present invention on the other hand, a kind of storage medium of embodied on computer readable can be provided, store the program of the control method that is used to carry out substrate board treatment, it is characterized in that, described substrate board treatment comprises: comprise at least using and handle gas is implemented the vacuum processing chamber of processing to processed substrate a plurality of chambers, between each chamber, can exchange described processed substrate by gate valve, has the communicating pipe that is communicated with between the described chamber, be configured in and prevent the shock motion unit on described communicating pipe, with be configured in described prevent shock motion unit one side the communicating pipe of high vacuum preparation room one side of pressure controlled valve described shock wave suppress the unit, opening described communicating pipe controlled valve, by make described communicating pipe between the chamber be communicated with after, open described gate valve.

In substrate board treatment with such shock wave inhibition unit, open gate valve after for example opening the communicating pipe switch valve, even between the chamber, there is pressure differential, prevent that because of opening the communicating pipe shock wave utilization that causes of switch valve the effect of shock motion unit from resting in communicating pipe, shock wave is not propagated.Because communicating pipe switch valve reduction pressure differential is opened in utilization, do not produce shock wave between this mistress even after this open gate valve yet.As the present invention adopting, utilization is being arranged on communicating pipe between the chamber, the simple structure that prevents the shock motion unit is set in this communicating pipe simultaneously, can be suppressed at shock wave when opening the sluices and convection current between the chamber, can prevent effectively at the indoor particulate of rolling like this.

In order to solve above-mentioned problem, as adopt among the present invention another, a kind of storage medium of embodied on computer readable can be provided, store the program of the control method that is used to carry out substrate board treatment, it is characterized in that, described substrate board treatment comprises: comprise at least using and handle a plurality of chambers that gas is implemented the vacuum processing chamber of processing to processed substrate, can exchange described processed substrate by gate valve between each chamber; Described shock wave suppresses the unit, setting has the communicating pipe between the communication chamber, be configured in and prevent the shock motion unit on described communicating pipe, be configured in the described communicating pipe controlled valve that prevents both sides, shock motion unit, the communicating pipe that is used for being configured in a described side that prevents the vacuum preparation room that shock motion unit and pressure are low described communicating pipe evacuated vacuum exhaust unit between the controlled valve, wherein, open before the described gate valve, closing two described communicating pipes during controlled valve, to be evacuated in described communicating pipe with the vacuum exhaust unit, become the lower pressure of pressure of the low chamber of specific pressure, when opening described gate valve, in communicating pipe of opening the low chamber of pressure one side behind the controlled valve, after the communicating pipe controlled valve of the side by opening the high chamber of pressure is communicated with between its chamber, open described gate valve.

As the present invention adopting, same as described above, even between the chamber, there is pressure differential,, can prevent to roll particulate because of shock wave causes having opened communicating pipe during switch valve.For example in communicating pipe of the side that will open the low chamber of pressure during switch valve, because the chamber that the pressure ratio pressure in communicating pipe is low is lower, in communicating pipe, produce shock wave, because this shock wave utilization prevents that the effect of shock motion unit from resting in communicating pipe, shock wave is not propagated, and does not roll particulate so do not produce.In addition, even open the communicating pipe switch valve of a side of the high chamber of pressure, same as described above, in communicating pipe, produce shock wave, because this shock wave utilization prevents that the effect of shock motion unit from resting in communicating pipe, shock wave is not propagated, and does not roll particulate so do not produce.Owing to utilize between the chamber and open the communicating pipe switch valve and reduce pressure differential, do not produce shock wave in addition, so can prevent to roll particulate because of what shock wave caused even after this open gate valve yet.Because can exhaust in communicating pipe, can prevent to cause communicating pipe contaminated in addition because of corrosive gas.

In the storage medium of above-mentioned fortune embodied on computer readable, in the time of also can utilizing above-mentioned atmosphere opening unit to be communicated with atmosphere from making above-mentioned vacuum preparation room, at least wait for through finishing time of delay to atmosphere opening, after finishing time of delay to atmosphere opening, if any the indication of opening above-mentioned gate valve, open above-mentioned gate valve according to this indication.

In this case, in the time of also can utilizing above-mentioned atmosphere opening unit to be communicated with atmosphere from making above-mentioned vacuum preparation room, wait for through after adjusting time of delay, wait for through finishing time of delay to atmosphere opening, this external wait is through during above-mentioned adjustment time of delay, when the indication of opening above-mentioned gate valve is arranged, begin to wait for through above-mentioned from this moment and finish time of delay to atmosphere opening, finish time of delay to atmosphere opening waiting for through above-mentioned.Can not change existing other sequence of batching products like this, go for vacuum preparation room of the present invention to the atmosphere opening order.

1Torr is decided to be (101325/760) Pa in this specification, and 1mTorr is decided to be (10 ^-3* 101325/760) Pa.

As described above, if adopt the present invention, then can provide and utilize simple structure to suppress shock wave when opening the sluices and convection current between the chamber, therefore, can prevent effectively at the indoor substrate board treatment of rolling particulate and working procedure and control method and the computer-readable recording medium that is used to store this program.

Description of drawings

Fig. 1 is the brief configuration figure of substrate board treatment that expression is applicable to the method for embodiment of the present invention.

Fig. 2 is the brief configuration figure of the gas pipe arrangement of expression preload chamber shown in Figure 1.

Fig. 3 is the flow chart of the conventional example of expression first atmosphere opening processing.

Fig. 4 is illustrated in the open mode of each valve in Fig. 3 processing and the sequential chart of closed condition with broken line.

Fig. 5 is illustrated in the flow chart of controller when carrying out the atmosphere opening processing that is applicable in the processing of first atmosphere opening under the situation of the present invention.

Fig. 6 is the sequential chart that is illustrated in each valve open mode in the processing of Fig. 5 or closed condition with broken line.

Fig. 7 is the flow chart of the existing example of expression second atmosphere opening processing.

Fig. 8 is illustrated in the open mode of each valve in Fig. 7 processing and the sequential chart of closed condition with broken line.

Fig. 9 is illustrated in the flow chart of controller when carrying out the atmosphere opening processing that is applicable in the processing of second atmosphere opening under the situation of the present invention.

Figure 10 is illustrated in the open mode of each valve in Fig. 9 processing and the sequential chart of closed condition with broken line.

Figure 11 is that the adverse current of expression when opening shown in Figure 2 sour vent valve detects the flow chart of handling.

Figure 12 is the schematic diagram of the configuration example of expression particulate loading checkout gear.

Figure 13 is pressure differential and the particulate schematic diagram that splash probability between concern of expression between the chamber.

Figure 14 is the schematic diagram that is illustrated in the configuration example under the situation that shock wave inhibition unit is set between preload chamber and the process chamber.

Figure 15 is that explanation is as the structure chart that prevents the Laval nozzle (lavalnozzle) of the example of shock motion unit.

Figure 16 is the structure diagram that explanation prevents other concrete examples of shock motion unit.

Figure 17 is that expression has the structure diagram of variation example that shock wave suppresses the substrate board treatment of unit.

Figure 18 is the brief configuration figure of the substrate board treatment that is made of multicell of expression vacuum treatment unit.

Figure 19 is the flow chart that is illustrated in the general example of the processing in the self-checking function of process chamber.

Figure 20 is the flow chart that concrete expression does not use the self check of the vacuum gauge that utilizes detecting element to handle.

Embodiment

Below, with reference to accompanying drawing optimum execution mode of the present invention is elaborated.In this specification and accompanying drawing, to the identical label of element annotation that in fact has the identical function structure, and the repetitive description thereof will be omitted.

At first, operation method and the control method to the substrate board treatment of optimum execution mode of the present invention describes.As the substrate board treatment of handling processed substrate, for example be at the conveying chamber that is in atmospheric pressure state and become the structure that is connected with vacuum preparation room (for example preload chamber) between the vacuum processing chamber of the processing of carrying out processed substrate of vacuum state.In such substrate board treatment, for example sending between conveying chamber and the preload chamber under the situation of taking out processed substrate, in order to reduce its pressure differential, and opening before the gate valve between conveying chamber and the preload chamber, the atmosphere opening of pressure that makes the pressure of preload chamber approach to be in the conveying chamber of atmospheric pressure state is handled.Below, enumerate concrete example the operation method and the control method of characteristic substrate board treatment in such atmosphere opening is handled described.

(structure example of substrate board treatment)

Describe with reference to the concrete example of accompanying drawing the substrate board treatment of the operation method of the substrate board treatment that goes for present embodiment and control method.Here, be that example describes with the substrate board treatment that is connected with more than one vacuum treatment unit on the conveying chamber that is in the atmospheric pressure atmosphere at least.Fig. 1 is the sectional view of brief configuration of the substrate board treatment of expression present embodiment.This substrate board treatment 100 has more than one or two, for example semiconductor wafer (below abbreviate " wafer " as) W carries out that film forming is handled or the vacuum treatment unit 110 of various processing such as etch processes to processed substrate; With the supply unit 120 of sending into or take out wafer W with respect to this vacuum treatment unit 110.Supply unit 120 has conveying chamber 130 shared when transfer wafers W.

In Fig. 1, expression be the situation that for example disposes two vacuum treatment unit 110A (110B) in the side of supply unit 120.Each vacuum treatment unit 110A (110B) has process chamber 140A (140B) and preload chamber 150A (150B) respectively, and it is connected with process chamber 140A (140B) and can be evacuated.Each vacuum treatment unit 110A (110B) manages throughout can be to processing or mutual different types of processing of wafer W embodiment such as identical type in the chamber 140A (140B).Manage throughout in the chamber 140A (140B), be respectively arranged with the objective table 142A (142B) that is used to place wafer W.Wherein, the vacuum unit of being made up of this process chamber 140 and preload chamber 150 110 is not limited to two, can also further append setting.

The conveying chamber 130 of above-mentioned supply unit 120 is for example by making N ₂The roughly rectangular casing in the cross section of the inert gas of gas etc. and clean air circulation constitutes.On the side of the long limit of conveying chamber 130, be arranged side by side a plurality of boxlike platform 132A, 132B, 132C.These boxlike platforms 132A, 132B, 132C play the effect as the processed substrate standby passage of placing box type container 134A, 134B, 134C.In Fig. 1, for example enumerated and on each boxlike platform 132A, 132B, 132C, respectively to have placed one example to three box type container 134A, 134B, 134C respectively, but the quantity of boxlike platform and box type container is not limited thereto, for example can be provided with one or two, also can be provided with more than four.

On each box type container 134A～134C, for example can and hold maximum 25 wafer W with equidistant multilayer placement, its inside for example forms can use N ₂The closed structure that gas is full of.And conveying chamber 130 constitutes by gate valve 136A～136C and can send into or take out wafer W to its inside.

In conveying chamber 130, be provided with common delivery device (atmosphere one side conveying device) 160 along its length direction (direction of arrow shown in Figure 1) transfer wafers W.This common delivery device 160 for example is fixed on the pedestal 162, and this pedestal 162 constitutes on the unshowned guide rail of figure that for example can alongst be provided with at the core in the conveying chamber 130 by linear electric motor mechanism and slides.Common conveying device 160 both can be the both arms mechanism with two pick-ups for example shown in Figure 1, perhaps also can be the single armed mechanism with a pick-up.

On the end of conveying chamber, just constitute on the side of the roughly rectangular minor face in cross section, be provided with locator (giving the location objective table) 137 in inside, the optical pickocff 139 that it has rotatable stage 138 and carries out optical detection wafer W periphery as positioner.This locator 137 is configured behind plane of orientation that detects wafer W and breach etc.

On another side on the long limit of conveying chamber 130, be connected with the cardinal extremity of above-mentioned two preload chamber 150A (150B) by gate valve (atmospheric side gate valve) 152A, the 152B that can open and close formation respectively.The front end of each preload chamber 150A, 150B is connected with above-mentioned process chamber 140A, 140B respectively by gate valve (inlet side gate valve) 144A, the 144B that can open and close formation.

In each preload chamber 150A (150B), be respectively arranged with interim placement wafer W and make it be in a pair of buffering objective table 154A, the 156A (154B, 156B) of standby.Here, with the buffering of conveying chamber one side with objective table 154A, 154B as the first buffering objective table, the buffering of an opposite side cushioned as second with objective table 156A, 156B uses objective table.Then, between two bufferings are with objective table 154A, 156A (154B, 156B), be provided with independent conveying device (conveying device of the vacuum one side) 170A (170B) that the multi-joint arm of, rotation in the wrong by stretching and lifting constitutes.Front end at these independent conveying device 170A (170B) is provided with pick-up 172A (172B), uses this pick-up 172A (172B) and can carry out the exchange transfer of wafer W in first, second buffering between with objective table 154A, 156A (154B, 156B).Wherein, sending into and take out wafer from preload chamber 150A (150B) in process chamber 140A (140B) uses above-mentioned independent conveying device 170A (170B) to carry out respectively.

In aforesaid substrate processing unit 100, be provided with the controller 180 of whole actions of control basal plate processing unit, controller 180 is also controlled the action that imports the valve of gas and blast pipe etc. to preload chamber 150A (150B) described later except the action of controlling above-mentioned each conveying device 160,170 and each gate valve 136,144,156 etc.Controller 180 has the microcomputer of the main body that for example constitutes this controller 180 and the memory of store various kinds of data etc.

(the gas matched tube structure figure of preload chamber)

Below, describe with reference to the gas matched tube structure of accompanying drawing the preload chamber in the above-mentioned vacuum treatment unit.Fig. 2 is the brief configuration figure of the gas pipe arrangement of expression preload chamber 150.This gas matched tube structure is the common structure of the preload chamber 150A (150B) of each vacuum treatment unit 110A (110B).

Air feed one side (for example top of preload chamber 150 and sidepiece) in preload chamber 150 disposes inert gas importing unit.This inert gas imports unit and has Purge gas supply pipe 181, is used for inert gas (for example Ar and N ₂Gas) offer preload chamber 150 as Purge gas.On Purge gas supply pipe 181, be provided with control valve (purge valve) V1, the V2 that connect side by side halfway as gas importing valve.Control valve V1, V2 are the devices of control Purge gas flow.For example, control valve V1 is the device that carrying out of narrating in the back controlled when atmosphere opening is handled, and control valve V2 is the device of controlling when carrying out the control of preload chamber pressure.Control valve V1, the V2 that Purge gas is used also can be made of a control valve.

In addition, air feed one side in preload chamber 150 is connected with the atmospheric pressure state detecting unit that detects atmospheric pressure state.Specifically, be connected with the atmospheric pressure transducer by the atmospheric pressure transducer with connecting pipings 182, pressure gauge is connected with connecting pipings 182 with this atmospheric pressure transducer by protective valve V3, simultaneously, connects Pirani ga(u)ge (Pirani gage).Above-mentioned atmospheric pressure transducer for example can be with formations such as crystal meters.Above-mentioned pressure gauge for example constitutes with capacitance-type pressure gage.For example also can replace above-mentioned Pirani gage with the convection type vacuum gauge.

On the other hand, dispose the atmosphere opening unit in exhaust one side of preload chamber 150 bottom of preload chamber 150 (for example).This atmosphere opening unit has the overflow pipe (atmospheric communicating pipe) 183 that preload chamber 150 is communicated with by overflow valve (atmospheric open valve) V4 with atmosphere.Wherein, on overflow pipe (atmospheric communicating pipe), between preload chamber 150 and overflow valve V4, be connected with the air supply pipe 184 of the gas (air) that is used to provide air cleaning to use.On air supply pipe 184, be provided with the control valve V5 that is used to control air mass flow halfway.

In addition, exhaust one side in preload chamber 150 disposes the vacuum exhaust unit.This vacuum exhaust unit has and is used for carrying out the Vacuum exhaust tube 185 of vacuum exhaust in the preload chamber 150.On Vacuum exhaust tube 185, be provided with side by side the main exhaust valve V6 and the slow vent valve V7 that connect halfway, simultaneously, be connected on the vacuum pump 190 of dry pump for example etc.Control main exhaust valve V6 under the situation of once carrying out a large amount of exhausts, the slow vent valve V7 of control under the situation that air displacement is finely tuned.

And, dispose the corrosive gas exhaust unit in exhaust one side of preload chamber 150.For this corrosivity exhaust unit, have between preload chamber 150 and vent valve V6, V7 via as the connected sour blast pipe 186 of the sour vent valve V8 of vent valve.Above-mentioned sour vent valve V8 for example uses under the situation of etchant gas (for example chlorine, hydrogen chloride etc.) at the processing gas as wafer, is used for the device that the sour exhaust of carrying out preload chamber 150 is controlled.Specifically, for example with wafer W when process chamber 140 takes out, the processing gas that might enter is carried out exhaust, for example corrosive gas etc. is carried out exhaust, perhaps the moisture that might enter from atmosphere one side etc. is carried out exhaust.Acid blast pipe 186 for example is connected on the exhaust equipment of the factory that vacuum treatment unit is set.On sour blast pipe 186, connect fluid (manostat) pressure device 192 as an example of adverse current detecting unit.

Each above-mentioned control valve V1～V8 for example controls by controller 180, carries out the pressure control in the preload chamber 150.Atmosphere opening when the gate valve 152 of preload chamber 150 is opened carries out this pressure control in handling.Controller 180 monitors manostats 192, detects and the adverse current of reporting adverse current etc. detects and handles.The details that atmosphere opening is handled and the adverse current detection is handled is narrated in the back.

(action of substrate board treatment)

Below, the action to the substrate board treatment of said structure describes with reference to accompanying drawing.At first, take out the wafer W that to handle by common delivery device 160 from each box type container 134A, 134B, 134C.The wafer W of being taken out by common delivery device 160 is transported to locator 137, moves on to and is placed on the rotatable stage 138 of locator 137, here is positioned.Then, the wafer W that is positioned has been got by above-mentioned common delivery device 160 once more, and is transported to vacuum treatment unit 110A or the preload chamber 150A of 110B or the front of 150B that will handle this wafer W.Then, after opening gate valve 152A or 152B, the wafer W on common delivery device 160 is sent in preload chamber 150A or the 150B from conveying chamber 130.Wafer W is being sent into after the end closing gate valve 152A or 152B to preload chamber 150A or 150B.

Be fed to the interior wafer W of preload chamber 150A or 150B after opening gate valve 144A or 144B, be fed to process chamber 140A or 140B by independent conveying device 170A or 170B.With wafer W to the sending into after the end of process chamber 140A or 140B, closing gate valve 144A or 144B begin to use for example the processing of etchant gas as the wafer W of handling gas in process chamber 140A or 140B.

Then, the processing of the wafer W in process chamber 140A or 140B is opened gate valve 144A or 144B after finishing, and by independent conveying device 170A or 170B preload chamber 150A or 150B are taken out and delivered to wafer W.After preload chamber 150A or 150B transfer wafers W end, closing gate valve 144A or 144B carry out the taking-up action of wafer W to conveying chamber 130.Just finished the wafer W of moving into processing, after opening gate valve 152A or 152B, delivered to conveying chamber 130, closing gate valve 152A or 152B from preload chamber 150A or 150B taking-up by common delivery device 160 to preload chamber 150A or 150B.

In above-mentioned action, when taking out to the conveying chamber 130 that is in atmospheric pressure state from preload chamber 150A or 150B or sending into wafer W, before opening gate valve 152A or 152B, carry out the atmosphere opening of preload chamber 150A or 150B and handle.

(atmosphere opening of preload chamber is handled)

Below, compare with conventional example and come the atmosphere opening of the preload chamber 150A of present embodiment or 150B handled and be elaborated with reference to accompanying drawing.Wherein, handle, implement by each valve being controlled wait by the controller 180 that moves based on regulated procedure for the atmosphere opening of present embodiment.

There is following open treated to handle as atmosphere opening, that is, and with N ₂Inert gases such as gas are that Purge gas imports to preload chamber, open overflow valve after becoming atmospheric pressure state, then, open the processing (processing of first atmosphere opening) of the gate valve between conveying chamber and the preload chamber after closing the Purge gas valve; More pay attention to the output of substrate board treatment, can open gate valve, when gate valve is opened, close the processing (processing of second atmosphere opening) of Purge gas valve in the moment of opening overflow valve.Atmosphere opening of the present invention is handled owing to go for first and second atmosphere openings and is handled two aspects, and therefore the situation of separating separately below describes.

(processing of first atmosphere opening)

At first, in order to compare with situation of the present invention, the conventional example that first atmosphere opening is handled describes.Fig. 3 is the flow chart of the conventional example of expression first atmosphere opening processing, and Fig. 4 is the state of a control figure of each valve in processing shown in Figure 3.Be the time of representing each valve open mode or closed condition with broken line graph in Fig. 4, each broken line graph staggers, so that see overlapping situation easily.

As shown in Figure 3 and Figure 4, in the conventional example that first atmosphere opening is handled, at first, open control valve shown in Figure 2 (purge valve) V1 at step S110, for example with N ₂The inert gas of gas etc. imports to preload chamber 150 as Purge gas.Then, judge at step S120 whether preload chamber 150 becomes atmospheric pressure state.For example judge about whether becoming atmospheric pressure state according to following mode.For example, when atmospheric pressure transducer shown in Figure 2 is opened, when Pirani gage is atmospheric pressure (750mTorr) simultaneously, judge that preload chamber 150 becomes atmospheric pressure state.

When judging that in step S120 preload chamber 150 becomes under the situation of atmospheric pressure state, in step S130, as shown in Figure 4, from becoming the moment t of atmospheric pressure state ₁₁Through stipulated time T ₁₁After, open overflow valve V4 and make in the preload chamber 150 and be communicated with atmosphere.

After this, in step S140, from becoming the moment t of atmospheric pressure state ₁₁Through stipulated time T ₁₂After, closed control valve (purge valve) V1 stops the importing of Purge gas.Then, in step S150, from closed control valve (purge valve) V1 moment t ₁₃Finish T time of delay through waiting for to atmosphere opening ₁₃Finishing T time of delay through this atmosphere opening ₁₃After, finish from then on constantly to begin to open gate valve 152 to atmosphere opening.

When judging that in step S150 having passed through this atmosphere opening finishes T time of delay ₁₃Situation under, in the indication of the medium gate valve 152 to be opened of step S160.Then, when in step S160, judging have under the situation of the indication of opening gate valve 152, in step S170, accept to open the indication of gate valve 152, and open gate valve 152.After opening gate valve 152, in the S180 step, open sour vent valve V8 and carry out exhaust, handle thereby finish a series of atmosphere opening.For example, be for to carry out exhaust (as corrosive gas (for example chlorine, hydrogen chloride etc.) etc. being carried out exhaust) at the gas that when process chamber 140 takes out wafer W, enters.In fact, from process chamber 140 taking-up wafer W the time, if make the pressure ratio process chamber 140 in the preload chamber 150 high slightly in advance, then because produce convection current slightly to process chamber 140 from preload chamber 150, and can prevent that corrosive gas from entering preload chamber from process chamber 140, but, also should consider situation about entering attached on the wafer W.

Therefore, in existing first atmosphere opening is handled, become behind the atmosphere opening state, make the pressure ratio conveying chamber 130 in the preload chamber 150 higher slightly, therefore can prevent the inflow of outside gas by importing Purge gas in preload chamber 150.Thereby, owing to for example can prevent the inflow of the pollution of outside moisture that gas contained etc., and can prevent cross pollution to wafer.

Yet, in recent years,, and make the sealings in the preload chamber 150 be further enhanced for example by to the improvement of the sealing of the service cover in preload chamber 150 etc. etc.Even now, as shown in Figure 4, now because to the time T that stops Purge gas ₁₂Be certain, so owing to the pressure that imports the preload chamber 150 that Purge gas causes has far above the needed pressure higher than conveying chamber 130.Therefore, when the gate valve of opening between preload chamber 150 and the conveying chamber 130 152, there is the problem that produces shock wave and strong convection current.If produce shock wave and strong convection current, then in preload chamber 150, will produce the problem of rolling particulate etc.

In addition, in existing first atmosphere opening is handled, because before opening gate valve 152, acid vent valve V8 still closes, so, because be communicated with atmosphere when having opened overflow valve V4, for example under the situation that overflow pipe 183 is communicated with conveying chamber 130 etc., the residual corrosive gas that flows to preload chamber might flow in the conveying chamber 130.When corrosive gas flowed in the conveying chamber 130, existence is the problem that is corroded of the mechanical part in conveying chamber 130 for example.

Therefore, in the present invention, in atmosphere opening was handled, the moment of closed control valve (purge valve) V1 can freely be set with the moment of opening sour vent valve V8.Therefore, for example also can be when preload chamber 150 become the moment of atmospheric pressure state, closed control valve (purge valve) V1 and stop Purge gas, and open sour vent valve V8.The pressure that can prevent preload chamber 150 like this is elevated to more than the required pressure, and can be emitted on corrosive gas residual in the preload chamber 150 in advance, and need not wait gate valve 152 to be opened.

(in first atmosphere opening is handled, using the concrete example of situation of the present invention)

Below, describe in above-mentioned first atmosphere opening is handled, using the concrete example of situation of the present invention.Here, be described the moment that becomes atmospheric pressure state in preload chamber 150 with reference to accompanying drawing 5 and Fig. 6, closed control valve (purge valve) V1 and stop Purge gas, and open the situation of sour vent valve V8.Fig. 5 uses the controller under the situation of the present invention to carry out the flow chart that atmosphere opening is handled in first atmosphere opening is handled, and Fig. 6 is the state of a control figure that is illustrated in each valve in the processing shown in Figure 5.Situation with Fig. 4 in Fig. 6 is identical, is the time of representing each valve open mode or closed condition with broken line graph, and each broken line graph staggers, so that see overlapping situation easily.

The atmosphere opening of present embodiment is handled and to be based on program and following the carrying out by controller 180.That is to say, as shown in Figure 5 and Figure 6, at first, open control valve shown in Figure 2 (purge valve) V1 at step S210, for example with N ₂Inert gases such as gas import to preload chamber 150 as Purge gas.Then, judge at step S220 whether preload chamber 150 becomes atmospheric pressure state.About whether becoming this atmospheric pressure state, identical with the situation of step S120 shown in Figure 3, for example,, when Pirani gage becomes atmospheric pressure (750mTorr) simultaneously, judge that preload chamber 150 becomes atmospheric pressure state when atmospheric pressure transducer is as shown in Figure 2 opened.

When judging that at step S220 preload chamber 150 becomes under the situation of atmospheric pressure state, become the moment t of atmospheric pressure state in preload chamber 150 ₂₁, for example meanwhile at step S230 as shown in Figure 6, closed control valve (purge valve) V1 stops the importing of Purge gas, simultaneously opens sour vent valve V8 at step S240, begins to enter the exhaust of the corrosive gas etc. of preload chamber 150 in advance.

After this, as shown in Figure 6, at step S250 from becoming the moment t of atmospheric pressure state ₂₁Through stipulated time T ₂₁After, open overflow valve V4, make in the preload chamber 150 to be communicated with atmosphere.

Then, T time of delay to be adjusted such as pass through at step S260 ₂₂This adjustment is used for and can opens gate valve 152 with Fig. 3 and existing sequence synchronization shown in Figure 4 time of delay.Because like this, can make from preload chamber shown in Figure 6 150 becomes to the moment of atmosphere opening state t ₂₁To time in the moment of opening gate valve 152, with the moment t that becomes from preload chamber shown in Figure 4 150 to the state of atmosphere opening ₁₁Time to the moment of opening gate valve 152 is identical, so, can not change existing other sequence of batching products, and use atmosphere opening of the present invention to handle.Wherein, may not need this processing of time of delay to be adjusted such as to pass through.By omitting this processing, also can be than opening gate valve 152 now quickly.Therefore, can accelerate whole sequence of batching products.

When judging through adjusting T time of delay at step S260 ₂₂Situation under, become through waiting for that atmosphere opening finishes T time of delay at step S270 ₂₃Finish T time of delay through this atmosphere opening ₂₃After, finish atmosphere opening, can open the gate valve 152 between conveying chamber 130 and the preload chamber 150.

Finish T time of delay when judging through atmosphere opening at step S270 ₂₃Situation under, become etc. the indication of gate valve 152 to be opened at step S280.Then,,, open gate valve 152, finish a series of atmosphere openings and handle in the indication that gate valve 152 is opened in step S290 acceptance when judging have under the situation of the indication of opening gate valve 152 at step S280.

Like this, the present invention is being used for the situation that first atmosphere opening is handled, be altered to the simple in-order of direct closed control valve (purge valve) V1 by the moment that becomes atmospheric pressure state in preload chamber 150, and can prevent that the pressure of preload chamber 150 is elevated to more than the pressure that needs.Because like this, shock wave that produces in the time of can suppressing to open gate valve 152 and strong convection current are so can prevent to roll particulate etc.

In addition, need not wait gate valve 152 to be opened, by opening sour vent valve V8 in advance, can carry out exhaust to the corrosive gas that remains in the preload chamber 150 in advance, even so after this open overflow valve V4, can prevent that also corrosive gas from passing through overflow valve V4 and flowing into conveying chamber 130 etc., so for example can prevent that the mechanical part in the conveying chamber 130 is corroded.

(processing of second atmosphere opening)

Below, in order to compare with situation of the present invention, the conventional example that second atmosphere opening is handled describes.Fig. 7 is the flow chart of the conventional example of expression second atmosphere opening processing, and Fig. 8 is the state of a control figure that is illustrated in each valve in the processing shown in Figure 7.In Fig. 8, identical with the situation of Fig. 4, be to represent that with the broken line graph of broken line each valve is in open mode or closed condition, the broken line graph of each broken line staggers, so that see overlapping situation easily.

As shown in Figure 7 and Figure 8, in the conventional example that second atmosphere opening is handled, at first open control valve shown in Figure 2 (purge valve) V1, for example with N at step S310 ₂Inert gases such as gas import to preload chamber 150 as Purge gas.Then, judge at step S320 whether preload chamber 150 becomes atmospheric pressure state.About whether becoming atmospheric pressure state, identical with the situation of step S120 shown in Figure 3.

When judging that at step S320 preload chamber 150 becomes under the situation of atmospheric pressure state, at step S330 as shown in Figure 8, from becoming the moment t of atmospheric pressure state ₃₁Through stipulated time T ₃₁After, open overflow valve V4, make in the preload chamber 150 to be communicated with atmosphere.In second atmosphere opening is handled, opening the moment t of overflow valve V4 ₃₂Become to atmosphere opening and finish, from the indication that begins to accept to open gate valve 152 at this moment.After this, no matter have or not the indication of opening gate valve 152, at process stipulated time T ₃₂After, closed control valve (purge valve) V1 stops the importing of Purge gas.

Judge from opening overflow valve t constantly at step S340 ₃₂Whether passed through purification concluding time T ₃₂Judge not through purifying concluding time T at step S340 ₃₂Situation under, the indication that judges whether to open gate valve 152 in the S410 step.

Judge in the S410 step under the situation of the indication of also not opening gate valve 152, turn back to the processing of step S340, still do not open the indication of gate valve 152, judge through purifying concluding time T at step S340 ₃₂Situation under, at step S350 closed control valve (purge valve) V1, stop the importing of Purge gas.

After this, judge have under the situation of the indication of opening gate valve 152, accepting on this basis of opening indication, become through waiting for that atmosphere opening finishes T time of delay at step S370 at step S360 ₃₃Finish T time of delay when judging through atmosphere opening at step S370 ₃₃Situation under, open gate valve 152 at step S380.After opening gate valve 152, open sour vent valve V8 at step S390, carry out the exhaust of corrosive gas etc. after, finish a series of atmosphere openings and handle.

In contrast, do not passing through purification concluding time T ₃₂State under, judge have under the situation of the indication of opening gate valve 152 in the S410 step, accepting on this basis of opening indication, at step S420 closed control valve (purge valve) V1, stop the importing of Purge gas, forward the processing of step S370 to, finish T time of delay when judging through atmosphere opening in the S370 step ₃₃Situation under, open gate valve 152 in the S380 step, after opening gate valve 152, open sour vent valve V8 at step S390, carry out the exhaust of corrosive gas etc. after, finish a series of atmosphere openings and handle.

Like this, in existing second atmosphere opening is handled, purifying concluding time T ₃₂During do not open under the situation of indication of gate valve 152, through purifying concluding time T ₃₂After, closed control valve (purge valve) V1 stops the importing of Purge gas.In contrast, purifying concluding time T ₃₂During have under the situation of the indication of opening gate valve 152, closed control valve (purge valve) V1 stops the importing of Purge gas at this moment.Can handle than first atmosphere opening like this and open gate valve 152 quickly.

In addition, identical with the processing of first atmosphere opening in existing second atmosphere opening is handled, after preload chamber 150 becomes atmospheric pressure state,, make the pressure ratio conveying chamber 130 in the preload chamber 150 high slightly by importing Purge gas, can prevent that the gas of outside from flowing into.Like this because, for example can prevent the inflow of the pollution of the moisture that contained in the gas outside etc., so can prevent cross pollution to wafer.

, in existing second atmosphere opening is handled, handle with existing first atmosphere opening and to compare, the time of closed control valve (purge valve) V1 shifts to an earlier date sometimes, if not from becoming the moment t of atmospheric pressure state ₃₁Through stipulated time T ₃₁After open overflow valve V4 because the indication that can not accept to open gate valve 152, after this in stopping Purge gas, the pressure that has preload chamber 150 is compared the tendency that is elevated to more than the pressure that needs with conveying chamber 130.Because of this situation, can be when opening gate valve 152 produce shock wave and strong convection current, produce roll particulate etc. such handle identical problem with existing first atmosphere opening.

In addition, in existing second atmosphere opening is handled, also owing to before opening gate valve 152, also closing sour vent valve V8, by being communicated with atmosphere in the moment of opening overflow valve V4, for example under the situation that overflow pipe 183 is communicated with conveying chamber 130 etc., worry that the residual corrosive gas that flows to preload chamber flows in the conveying chamber 130.Because of this situation also have the mechanical part that for example can corrode in the conveying chamber 130 such handle identical problem with existing first atmosphere opening.

So, in the atmosphere opening of present embodiment is handled, in second atmosphere opening is handled, the time of closed control valve (purge valve) V1 and the time of opening sour vent valve V8 can freely be set.Therefore, for example also can work as moment closed control valve (purge valve) V1 that becomes atmospheric pressure state in preload chamber 150, stop Purge gas, and open sour vent valve V8.Like this, the pressure that can prevent preload chamber 150 is elevated to and needs more than the pressure, and can carry out exhaust to the corrosive gas that remains in the preload chamber 150 in advance, and need not wait gate valve 152 to be opened.

(in second atmosphere opening is handled, using the concrete example of situation of the present invention)

Below, describe in above-mentioned second atmosphere opening is handled, using the concrete example of situation of the present invention.Here, be described the moment that becomes atmospheric pressure state in preload chamber 150 with reference to accompanying drawing 9 and Figure 10, closed control valve (purge valve) V1 and stop Purge gas, and open the situation of sour vent valve V8.Fig. 9 uses the controller under the situation of the present invention to carry out the flow chart that atmosphere opening is handled in second atmosphere opening is handled, and Figure 10 is the state of a control figure that is illustrated in each valve in the processing shown in Figure 9.Situation with Fig. 4 in Figure 10 is identical, is open mode or the closed condition of representing each valve with the broken line graph of broken line, and the broken line graph of each broken line staggers, so that see overlapping situation easily.

The atmosphere opening of present embodiment is handled and to be based on program and following the carrying out by controller 180.Just, at first, open control valve shown in Figure 2 (purge valve) V1 at step S510, for example with N as Fig. 9 and shown in Figure 10 ₂The inert gas of gas etc. imports to preload chamber 150 as Purge gas.Then, judge at step S520 whether preload chamber 150 becomes atmospheric pressure state.About whether becoming atmospheric pressure state for this reason, identical with the situation of step S120 shown in Figure 3.

Judge that in the S520 step preload chamber 150 becomes under the situation of atmospheric pressure state, become the moment t of atmospheric pressure state in preload chamber 150 ₄₁, for example meanwhile in the S530 step as shown in figure 10, closed control valve (purge valve) V1 stops the importing of Purge gas, simultaneously opens sour vent valve V8 in the S540 step, begins to enter the exhaust of the corrosive gas etc. of preload chamber 150 in advance.

After this, as shown in figure 10, at step S550 from becoming the moment t of atmospheric pressure state ₄₁Through stipulated time T ₄₁After, open overflow valve V4, preload chamber 150 is communicated with atmosphere.

Then, judge whether from opening the moment t of overflow valve at step S560 ₄₂Through adjusting T time of delay ₄₂This adjustment is to be used to make with Fig. 7 and existing order shown in Figure 8 to open gate valve 152 synchronously time of delay.Because like this, can make from preload chamber shown in Figure 10 150 to become moment t to the state of atmosphere opening ₄₁To time in the moment of opening gate valve 152, with the moment t that has become from preload chamber shown in Figure 8 150 to the state of atmosphere opening ₃₁Time to the moment of opening gate valve 152 is identical, so do not change existing other sequence of batching products, can use atmosphere opening of the present invention to handle.In addition, may not need this processing of time of delay to be adjusted such as to pass through.By omitting this processing, also can be than opening gate valve 152 now quickly.Whole like this sequence of batching products can be faster.

Do not pass through whole time of delay of t when judging at step S560 ₄₂Situation under, the indication that judges whether to open gate valve 152 at step S600.When judging under the situation of the indication of also not opening gate valve 152 at step S600, return the processing of step S560, still do not open the indication of gate valve 152, when judging through adjusting T time of delay at step S560 ₄₂Situation under, the indication that judges whether to open gate valve 152 at step S570.

After this, judge have under the situation of the indication of opening gate valve 152, accepting on this basis of opening indication, become through waiting for that atmosphere opening finishes T time of delay at step S580 at step S570 ₄₃Passed through to atmosphere opening end T time of delay in step S580 judgement ₄₃Situation under, open gate valve 152 at step S590.After opening gate valve 152, finish a series of atmosphere openings and handle.

In contrast, do not passing through adjustment T time of delay ₄₂State under, when judging to have under the situation of the indication of opening gate valve 152, accepting to forward step S580 on this basis of opening indication, when judging that at step S580 having passed through atmosphere opening finishes T time of delay at step S600 ₄₃Situation under, open gate valve 152 at step S590, finish a series of atmosphere opening and handle.

Like this, the present invention is being used for the situation that second atmosphere opening is handled, be altered to the simple in-order of direct closed control valve (purge valve) V1 by the moment that becomes atmospheric pressure state in preload chamber 150, the pressure that can prevent preload chamber is elevated to and needs more than the pressure.Owing to can be suppressed at the shock wave of generation when opening gate valve 152 and strong convection current like this, so can prevent to roll particulate etc.

And, owing to need not wait gate valve 152 to be opened, by opening sour vent valve V8 in advance, and can carry out exhaust to the corrosive gas that remains in the preload chamber 150 in advance, after this, even open overflow valve V4, can prevent that also corrosive gas from passing through overflow valve V4 and flowing in conveying chamber 130 grades, therefore, for example can prevent that the mechanical part in the conveying chamber 130 is corroded.

In Fig. 5 of the present invention and atmosphere opening shown in Figure 9 are handled, having enumerated in example in preload chamber 150 becomes atmospheric pressure state constantly, and closed control valve (purge valve) V1 stops Purge gas simultaneously, open the situation of sour vent valve V8, but may not be defined in this.In the present invention, owing to can freely set with the moment of opening sour vent valve V8 to the moment of closed control valve (purge valve) V1, utilization is to these settings constantly, also can be implemented in the certain hour that staggers behind closed control valve (purge valve) V1 and open sour vent valve V8 again, in addition, also can become atmospheric pressure state after the moment in preload chamber 150, certain hour closed control valve (purge valve) V1 that staggers opens sour vent valve V8.Preferably these are configured to utilize the moment of the importing and the exhaust of Purge gas constantly, and the pressure in the preload chamber 150 are compared height within reason with atmospheric pressure, do not roll particulate so that do not produce when opening gate valve 152.

(adverse current when opening sour vent valve detects and handles)

Below, in atmosphere opening of the present invention is handled, the adverse current of carrying out when opening sour vent valve detects to handle and describes with reference to accompanying drawing.In the present invention,, become atmospheric pressure state constantly, that is to say, carry out closed control valve (purge valve) V1, open sour vent valve V8 at the commitment of also not opening overflow valve V4 and gate valve 152 in preload chamber 150 as Fig. 5 and shown in Figure 9.Therefore, also worry instantaneous generation adverse current in sour blast pipe 186, but such adverse current is through meeting Be Controlled behind the certain hour.

Yet, if use the adverse current detecting unit, for example in sour blast pipe 186, detect adverse current with manostat 192, circulate a notice of with buzzer.In addition, also worry the Error processing when producing adverse current and close sour vent valve V8 by force.

So, in the present invention, when opening sour vent valve V8, carry out as shown in figure 11 adverse current and detect and handle, though in sour blast pipe 186 the instantaneous adverse current that detects, if Be Controlled is not at the appointed time then carried out Error processing yet.

Detect in as shown in figure 11 adverse current and to handle, when opening sour vent valve V8, judge whether by the adverse current detecting unit, for example in sour blast pipe 186, detected adverse current by manostat 192 at step S710.Do not detect under the situation of adverse current when judging at step S710, judge whether to have passed through official hour at step S720, for example three seconds, do not pass through under the situation of stipulated time in judgement, turn back to step S710, do not detect adverse current at the appointed time, judge at step S720 and passed through under the situation of stipulated time, finish adverse current and detect processing.Even this stipulated time can be tested the controlled time under the situation of instantaneous generation adverse current in sour blast pipe 186 in advance, is that the basis is set with this result who tests.But, owing to, also can freely set so detect the stipulated time of this adverse current because of the difference of substrate board treatment can produce deviation.Specifically for example can set the desirable time between 0～10 second for.

In contrast, detected under the situation of adverse current, judged whether to have passed through the stipulated time, do not passed through under the situation of stipulated time, turned back to step S710, up to detecting adverse current through the stipulated time when judging at step S730 at step S730 when judging at step S710.Then, passed through under the situation of stipulated time, to have judged whether Be Controlled of adverse current at step S740 when judging at step S730.For example, do not detecting under the situation of adverse current, judging adverse current Be Controlled through the stipulated time.In contrast, also detecting under the situation of adverse current, judging that adverse current does not have Be Controlled through the stipulated time.

When judging that at step S740 finishing adverse current under the controlled situation of adverse current detects processing, is judging that adverse current does not have to carry out Error processing at step S750 under the controlled situation.As this Error processing, for example report processing by buzzer etc., carry out the processing of positive closing acid vent valve V8 simultaneously.

Detect processing by carrying out adverse current like this, even the instantaneous adverse current that detects in sour blast pipe 186, if Be Controlled at the appointed time, then do not carry out Error processing, even, only can avoid in sour blast pipe 186 instantaneous generation adverse current just to close unfavorable situation in the enforcement of sour vent valve V8 so as the present invention, before opening gate valve 152, open sour vent valve V8.

(rolling the inspection and the checking of particulate phenomenon)

As mentioned above, as being handled, the atmosphere opening of the preload chamber of present embodiment is used in the substrate board treatment, then pass through to adjust the switching time of purge valve and sour vent valve, and the pressure differential between preload chamber and the conveying chamber can be adjusted to the degree of not rolling particulate when opening gate valve.

This main cause of rolling the phenomenon of particulate is, open between each chamber, during gate valve between for example conveying chamber and the preload chamber and between process chamber and the preload chamber between such chamber that pressure differential is arranged, the violent convection current of flowing and also not reaching the shock wave degree that the shock wave of generation causes.For example, as producing shock wave, then because this shock wave is instantaneous propagates into indoorly, produces violent flowing, so for example fall down attached to the particulate on the chamber interior walls, particulate is rolled in generation.

This shock wave is to produce behind the certain conditions such as pressure extent that satisfy between each chamber.Therefore, produce the possibility increase of rolling particulate that shock wave causes because of the pressure official post between each chamber.

Below, with reference to accompanying drawing how the pressure differential between the chamber is influenced the result who rolls under the situation that particulate tests and describe.Here, between process chamber shown in Figure 1 140 and preload chamber 150, give various pressure differentials, carry out when opening gate valve 144, detecting the test of the amount of the particulate of rolling at process chamber 140.

At first, the particulate loading checkout gear that uses in this test is described.Figure 12 represents to be arranged on the example of structure of the particulate loading checkout gear on the process chamber 140, and Figure 12 A is a stereogram, and Figure 12 B is a sectional view.Shown in Figure 12 A, the particulate loading checkout gear has the infrared rays receiver 250 of lasing light emitter 210, slit 220,230, the delustring device 240 that makes the laser delustring of lasing light emitter 210, for example CCD gamma camera of laser irradiation device etc. for example etc.A part of wall of process chamber 140 be provided with install quartz etc. constitute can printing opacity window portion 148.This window portion 148 is arranged on the office of self-excitation light source 210 can see through on the position of facing mutually in the process chamber 140 shown in Figure 12 B, and infrared rays receiver 250 is arranged on the position that can accept the scattered light that causes because of particulate in the process chamber 140 simultaneously.

Come the laser of self-excitation light source 210 to incide process chamber 140 from a window portion 148, see through in the process chamber 140, incide delustring device 240 by window portion 148 and the slit of facing mutually 230 by slit 220.The scattered light that the particulate that utilizes infrared rays receiver 250 to observe generation this moment by another window 148 causes.

Make fine-particle powder attached to below the gas supply part 146 in the process chamber 140 with such test, make preload chamber 150 and process chamber 140 pressure carry out various variations, when opening gate valve 144, have or not particulate to splash by infrared rays receiver 250 observations, repeatedly attempt repeatedly, studied the particulate probability that splashes.Figure 13 represents the result of this test.In Figure 13, transverse axis adopts the pressure of preload chamber 150, the longitudinal axis adopts the probability that splashes of particulate, is drawing the splash result of probability of particulate that pressure limit that the pressure of setting process chamber 140 puts down in writing in the column of Figure 13 upper right side obtains on each pressure of preload chamber 150 respectively.

According to result of the test shown in Figure 13, if the pressure of the process chamber 140 in the upper right column is P1, the pressure of the preload chamber of transverse axis is P2, be under the situation of 0.1mTorr for example at P1, from P2 is that 125mTorr begins to produce particulate and splashes, raise with the pressure of P1, the probability that splashes increases, and produces particulate with 100% probability and splashes being roughly more than the 175mTorr.At P1 is under the situation of 14mTorr, is that 100mTorr begins to produce particulate and splashes from P2, raises with the pressure of P1, and the probability that splashes increases, and produces particulate with 100% probability and splashes being roughly more than the 275mTorr.

For example, be under the situation of 100mTorr at P1, be that 225mTorr begins to produce particulate and splashes from P2, raise with the pressure of P1, the probability that splashes increases, and produces particulate with 100% probability and splashes being roughly more than the 450mTorr.At P1 is under the situation of 200mTorr, is that 400mTorr begins to produce particulate and splashes from P2, raises with the pressure of P1, and the probability that splashes increases, and produces particulate with 100% probability and splashes being roughly more than the 525mTorr.

As observe the pressure differential between each chamber and splash probability and each pressure relation, if the pressure ratio (P2/P1) of P1, P2 more than twice, then produces particulate and splashes, the big more particulate of pressure ratio splashes also big more as can be seen.On the other hand, P1, P2 are more little difficult more splashing as can be seen, in addition, if P1, P2 be below 100mTorr, though then for example pressure ratio more than twice, do not produce splashing of particulate yet.

It is the situation of process chamber 140 and preload chamber 150 that the relation that pressure differential between such chamber and particulate splash is not limited to, and for example resembles the situation of preload chamber 150 and conveying chamber 130, and we can say all has identical relation under the situation that has pressure differential between the chamber.

As mentioned above, when twice is above, open gate valve as the pressure ratio between the chamber as can be seen, produce shock wave, because this shock wave in indoor propagation, splashes at indoor particulate.Shock wave produces during for twice in pressure ratio, therewith theoretical consistent relevant with pressure ratio of the size of shock wave.In contrast, the pressure differential between the chamber is all approximately below the 100mTorr, even for example pressure ratio is that particulate does not splash yet more than the twice.

Therefore, in the atmosphere opening of the preload chamber 150 of present embodiment is handled, as control switching time of purge valve and sour vent valve, the pressure differential that makes preload chamber 150 and conveying chamber 130 all below 100mTorr, can prevent that the particulate when opening gate valve is rolled-up.In addition, even the pressure differential of preload chamber 150 and conveying chamber 130 all more than 100mTorr, the switching time as control purge valve and sour vent valve, makes the not words more than twice of its pressure ratio, owing to can prevent the generation of shock wave, so can prevent to roll particulate because of what shock wave caused.

In the above-described embodiment, switching time of the purge valve when the atmosphere opening of control preload chamber 150 is applicable to that situation of the present invention is illustrated, but is not limited to above-mentioned preload chamber, before opening gate valve, import N in this way ₂The Purge gas of gas etc. is carried out the chamber that pressure is adjusted, and also can be suitable for the purge valve of the present invention control of switching time.

The shock wave that produces during in addition for the gate valve opened between the chamber suppresses the unit by the shock wave that constitutes with the Laval nozzle of narrating later is set between the chamber, also can suppress shock wave.

(having the concrete example that shock wave suppresses the substrate board treatment of unit)

Below, with reference to accompanying drawing the concrete example that has such shock wave and suppress the substrate board treatment of unit is described.Figure 14 is illustrated in to be provided with between the preload chamber 150 of substrate board treatment shown in Figure 1 and the process chamber 140 and constitutes the example that shock wave suppresses cell cases.

Specifically, shock wave inhibition unit shown in Figure 14 is constructed as follows.Between preload chamber 150 and process chamber 140, connect inner separately communicating pipe (bypass line) 340.What be provided with the control valve 350 of this communicating pipe 340 of switch in the centre of communicating pipe 340 and form the regulation choke valve prevents shock motion unit 360.Prevent that shock motion unit 360 from being to be used to prevent opening the device that 340 o'clock communicating pipes produced shock Wave with control valve 350, the choke valve of regulation is for example arranged, can consider to make shock wave to serve as neutral wave and prevent the device propagated.

The control valve 350 of communicating pipe 340 is located at the high chamber of pressure one side in the case, prevents that shock motion unit 360 is located at the low chamber of pressure one side.This is because shock wave produces in the low chamber of pressure, can more effectively prevent shock Wave.In example shown in Figure 14, as handling under the situation of etchant gas that gas for example uses HCl etc., owing to make pressure ratio process chamber 140 height of preload chamber 150 mostly, make this etchant gas atmosphere not enter preload chamber 150, so the control valve 350 of communicating pipe 340 is located at preload chamber 150 1 sides, for example be located on the pipe arrangement 342 that constitutes communicating pipe 340, prevent that shock motion unit 360 is located at process chamber 140 1 sides, for example be located between the pipe arrangement 342,344 that constitutes communicating pipe 340.

As preventing shock motion unit 360,, can use the various devices such as jet pipe of choke valve if can prevent the device of shock motion.The shock motion unit 360 that prevents so for example can constitute with Laval nozzle shown in Figure 15 (De Laval Nozzle).As shown in figure 15, Laval nozzle is the jet pipe that choke valve is arranged, and is made of constriction 362, throat portion 364, expansion 366 specifically.In addition as shown in figure 16, prevent that shock motion unit 360 also can be used in the choke valve both sides and be made of the jet pipe that the part that enlarges constitutes.In addition, prevent shock motion unit 360 so long as can prevent shock motion, be not defined as above-mentioned structure, the filter that damping hole and porous ceramic, porous carbon etc. for example also can be set on communicating pipe 340 constitutes.

As shown in figure 14, prevent in the substrate board treatment of shock motion unit 360, when opening gate valve 144, open before the gate valve 144, make communicating pipe 340 open with control valve 350 in setting.During communicating pipe 340 produce shock wave because of the pressure differential between process chamber 140 and the preload chamber 150 this moment.Shock wave is by with preventing that the shock motion unit from resting in communicating pipe 340, for example rested in communicating pipe 340 with Laval nozzle.Can prevent that like this shock wave to process chamber 140 propagation, can prevent to roll particulate in process chamber 140.

, by opening communicating pipe 340, process chamber 140 and preload chamber 150 were communicated with by communicating pipes 340, so that the pressure differential between process chamber 140 and the preload chamber 150 fully reduce.Even and the pressure differential between process chamber 140 and the preload chamber 150 becomes the pressure differential that does not produce the shock wave degree, also to open gate valve 144.Even like this owing to open gate valve 144 and also do not produce shock wave, can prevent from reliably to roll particulate because of what shock wave caused.

Communicating pipe 340 is set between the chamber like this, be used in the simple structure that prevents that shock motion unit 360 is such was set in these 340 communicating pipes, even owing in communicating pipe 340, produce shock wave, can make this shock wave become standing wave, when not only opening gate valve 144, also can prevent from effectively communicating pipe 340 to roll particulate because of what shock wave caused even open.In addition as adopting substrate board treatment shown in Figure 14, owing to can prevent that shock wave to being propagated by the process chamber 140 of particle contamination easily, can prevent the pollution of particulate to substrate effectively.

(having the variation example that shock wave suppresses the substrate board treatment of unit)

Below, with reference to accompanying drawing the example of variation that has shock wave and suppress the substrate board treatment of unit is described.Figure 17 has the sketch of structure of example of variation that shock wave suppresses the substrate board treatment of unit for expression.In the substrate board treatment of etchant gas, use the situation that suppresses shock wave mechanism to describe at this as the use of processing gas.

In process chamber 140,,, for example resemble formation as shown in Figure 17 in order to protect the corrosion of communicating pipe 340 from etchant gas with under the situation of etchant gas as the use of processing gas.That is to say, increasing the control valve 350 that is located on the pipe arrangement 342 on communicating pipe 340, with preventing that shock motion unit 360 also is provided with control valve 430 on the pipe arrangement 344 of process chamber 140 1 sides.In the pipe arrangement 344 of this communicating pipe 340, preventing to connect blast pipe 420 between shock motion unit 360 and the control valve 430 in addition.And control valve 440 is set on this blast pipe 420, blast pipe 420 is connected to the vacuum pump 410 to communicating pipes 340 evacuated dry pump etc.

In substrate board treatment shown in Figure 17, before opening, it carries out following processing when opening gate valve 144.At first at the control valve 350,430 when all closing, of communicating pipes 340 both sides with being evacuated 410 pairs of communicating pipes 340 of vacuum pump.Like this processing gas that remains in communicating pipe 340 is carried out exhaust.Make this moment the pressure of pressure ratio process chamber 140 of communicating pipe 340 low.

Then, the control valve 430 of the chamber that pressure is low in the chamber of both sides (being process chamber 140 under a situation shown in Figure 17) side is opened.This moment, the pressure differential because of communicating pipe 340 and process chamber 140 produced shock wave.Owing to communicating pipe 340 be pumped into vacuum, pressure ratio process chamber 140 is low, and shock wave produced in communicating pipe 340, does not produce in process chamber 140 because of what shock wave caused and rolls particulate, so substrate can be not contaminated yet.In addition since the control valve 350 of preload chamber 150 1 sides close, so the shock wave that produces when opening control valve 430 does not propagate into preload chamber 150 yet.Even open the control valve 430 of communicating pipe 340 like this, do not produce because of what shock wave caused in preload chamber 150 yet and to roll particulate.

Open the control valve 350 of preload chamber 150 1 sides subsequently.Produce shock wave because of the pressure differential of preload chamber 150 and process chamber 140 this moment in the communicating pipe 340 of low preload chamber 150 1 sides of pressure.Since shock wave by with preventing that the shock motion unit from resting in communicating pipe 340, for example rested on Laval nozzle in communicating pipe 340, to process chamber 140 propagation.In process chamber 140, do not produce like this because of what shock wave caused and roll particulate, so substrate is not contaminated yet.

Proportional in view of the size and the pressure ratio between the chamber of shock wave, such processing is preferably implemented on the basis of the pressure of judging two chambers, makes the pressure ratio between the chamber constant too much.

In addition, being evacuated of communicating pipe 340 can be taken out substrates from process chamber 140 and finished after having closed gate valve 144, carries out simultaneously when being evacuated in the process chamber 140.That is to say, when in process chamber 140, being evacuated, as open the control valve 430 of process chamber 140 1 sides, utilize effect process chamber 140 evacuated vacuum pumps, can be not only in the process chamber 140, and to being evacuated in communicating pipe 340.Like this can be not to evacuated blast pipe 420 and vacuum pump 410 in communicating pipe 340.

In addition, in Figure 14 and example shown in Figure 17, be illustrated for will the situation that suppress shock wave mechanism being set between process chamber 140 and preload chamber 150 is as the chamber that pressure differential is arranged, but be not limited to this, also can between each chamber, be provided with and suppress shock wave mechanism.For example also can between preload chamber 150 and conveying chamber 130, be provided with and suppress shock wave mechanism.

(other structure example of substrate board treatment)

Below, other example of structure that can use substrate board treatment of the present invention are described.For example the invention is not restricted to substrate board treatment shown in Figure 1, go for various substrate board treatments.In Figure 18, represent the brief configuration of vacuum unit with the substrate board treatment of multicell formation.

Substrate board treatment 500 shown in Figure 180 has vacuum treatment unit 510, and it has processed substrate semiconductor wafer W a plurality of process chambers 540 of carrying out the various processing of film forming processing, etch processes etc. for example; Supply unit 120, its relative this vacuum treatment unit 510 is sent into wafer W and take out.The structure of supply unit 120 has the inscape of identical function structure to adopt same numeral owing to identical substantially with Fig. 1 for actual, has omitted the explanation that repeats.Supply unit 120 shown in Figure 180 is to be configured in example in the conveying chamber 130, that use the single armed mechanism formation common delivery device (atmosphere one side conveying device) 160 with a pick-up.Fixedly the pedestal 162 of common delivery device 160 is supported on the guide rail 164 that is provided with along its length, can be in conveying chamber 130.On this pedestal 162 and guide rail 164, be respectively arranged with the movable member and the fixed part of linear motor linear motor.Be provided with the linear electric motor mechanism 166 that is used to drive linear motor in the end of guide rail 164.On linear motor operated driving mechanism 166, connect controller 180.Based on the control signal of slave controller 180, drive linear motor operated driving mechanism 166 like this, common delivery device 160 and pedestal 162 all move to the direction of arrow along guide rail 164.

Figure 18 is the figure that represents for example the vacuum treatment unit 510 that six process chamber 540A, 540B, 540C, 540D, 540E, 540F are arranged to be configured in the side of supply unit 520.Vacuum treatment unit 510 has the common transfer chamber 550 of wafer being sent into or taking out six process chamber 540A～540F, chambers 540A～540F respectively by gate valve 512A, 512B, 512C, 512D, 512E, 512F be configured in this common transfer chamber 520 around.Constituting can be evacuated first, second preload chamber 560M, 560N in addition is configured on the common transfer chamber 520 by gate valve 564M, 564N respectively.This first, second preload chamber 560M, 560N are connected the side of conveying chamber 130 respectively by gate valve 562M, 562N.

Like this between above-mentioned common transfer chamber 550 and above-mentioned six the chambers 540A～540F and between above-mentioned common transfer chamber 550 and above-mentioned each preload chamber 560M, 560N, formation can switch airtight construction, be made to compound table, can be communicated with common transfer chamber 550 as required.Also constitute respectively between above-mentioned in addition first and second each preload chamber 560M, 560N and the above-mentioned conveying chamber 130 can switch airtight construction.

Above-mentioned chambers 540A～540F carries out for example processing or mutual different types of processing of identical type to wafer W.Manage objective table 542A, the 542B, 542C, 542D, 542E, the 542F that are provided for placing wafer W in chamber 540A, the 540B respectively throughout.Process chamber 540 is not defined as six in addition, can increase setting yet.

Above-mentioned each preload chamber 560M, 560N have temporary transient maintenance wafer W, make it lead to the function of next section after adjusting pressure.Above-mentioned preload chamber 560M, 560N also can constitute in the mode with cooling device and heater.In addition, the situation with shown in Figure 2 is identical respectively for the gas matched tube structure of preload chamber 560M, 560N.

The conveying device (conveying device of inlet side) 570 that for example being provided with in common transfer chamber 550 can bending by forming, the multi-joint arm of lifting, rotation is formed.This conveying device 570 is supported on the pedestal 572 and can rotates freely.Pedestal 572 configuration examples can be free to slide on the guide rail 574 from cardinal extremity in the common transfer chamber 550 to front-end configuration as utilizing leverage 576.As the conveying device 570 of formation adopting, slide along guide rail 574 by making conveying device 570, can arrive each preload chamber 560M, 560N and chambers 540A～540F.For example in the time will arriving above-mentioned each preload chamber 560M, 560N and face process chamber 540A, the 540F that is provided with mutually, make conveying device 570 be positioned at cardinal extremity one side of close common conveying chamber 550 along guide rail 574.In the time of will arriving above-mentioned six process chamber 540B～540E in addition, make conveying device 570 be positioned at front end one side near common conveying chamber 550 along guide rail 574.Can arrive all preload chamber 560M, 560N and the chambers 540A～540F that connects common transfer chamber 550 with a conveying device 570 like this.Conveying device 570 has two pick-ups, can two wafers of single treatment.

The structure of conveying device 570 is not limited to above-mentioned structure, can constitute with two conveying devices.For example also can bending near the cardinal extremity setting of common transfer chamber 550 by forming, first conveying device formed of the multi-joint arm of lifting, rotation, the while the front end setting of close common transfer chamber 550 can bending by forming, second conveying device formed of the multi-joint arm of lifting, rotation.The pick-up number of above-mentioned in addition conveying device 570 is not defined as two situation, for example can be the structure of having only a pick-up yet.

In substrate board treatment 500 as shown in figure 18, between the conveying chamber 130 and preload chamber 560M, 560N of supply unit 120, when opening gate valve 562M, 562N also be before it is opened, identical with substrate board treatment shown in Figure 1, import Purge gas to preload chamber 560M, 560N on one side, Yi Bian carry out handling to the atmosphere opening of atmosphere opening.Therefore in the atmosphere opening of such preload chamber 560M, 560N is handled, also identical with situation of the present invention, the time of closed control valve (purge valve) V1 can freely be set with the time of opening sour vent valve V8, for example can use Fig. 5 or atmosphere opening shown in Figure 9 to handle.

Because can prevent the pressure of preload chamber 560M, 560N like this is elevated to more than the pressure that needs, so can prevent that particulate is rolled-up, and can be emitted on processing gas, for example corrosive gas residual among preload chamber 560M, the 560N in advance, and need not wait gate valve 562M to be opened, 562N.

Between common transfer chamber 550 and chambers 540A～540F, in the time will opening gate valve 544A～544F, because of purpose is that the processing gas that prevents corrosive gas etc. flows into common transfer chamber 550 from chambers 540A～540F, utilize mostly to common transfer chamber 550 and import Purge gas, make the pressure of a little higher than chambers 540A of the pressure～540F of common transfer chamber 550.Therefore,, can produce shock wave, cause particulate rolled-up according to this pressure extent owing between common transfer chamber 550 and chambers 540A～540F, also produce pressure differential.Therefore, by for example Figure 14 or shock wave inhibition unit shown in Figure 17 are set between common carrying room 550 and chambers 540A～540F, identical with the situation of substrate board treatment 100 shown in Figure 1, can prevent reliably that the particulate that causes because of shock wave is rolled-up.

(self check of chamber is handled)

In each chamber of above-mentioned Fig. 1 or process chamber shown in Figure 18 140,540 and preload chamber 150,560 etc., mainly be with the operating efficiency that improves periodic maintenance, the time that shortens operation be purpose, sometimes the vacuum system of be evacuated with vacuum pump (exhaust), the self check that provides the gas system of the regulation gas of handling gas and Purge gas etc. to check are handled.

The concrete example of such self check being handled with reference to accompanying drawing describes.Figure 19 is the flow chart of the general example handled like this in the self-checking function that is illustrated in the process chamber 140,540.At first be evacuated with vacuum system in the S810 step.For example make actions such as vacuum pump, open vacuum gas discharge valve, process chamber 140,540 is evacuated, wait in the S820 step be configured on the gas system, for example to be configured in the mass flow controller of handling on the gas introduction tube etc. (MFC) stable.

Judge under the situation of having passed through wait MFC stabilization time at S820, import the gas (for example under the situation of process chamber 140,540 self checks, import and handle gas) of regulation in the S830 step, on one side with the membrane manometer, for example capacitance-type pressure gage monitor pressures that are arranged in the process chamber 140,540, Yi Bian make pressure rise to authorized pressure (lifting).When import handling gas, be to be used in the membrane manometer that wide range can detected pressures, generally can be 10 ^-4Torr～10 ²Range detection pressure about Torr.Membrane manometer is for example separated with thin metal film in the vacuum gauge container, and a side seal that is mounted to metal film becomes vacuum state, and the opposite side of metal film is communicated with process chamber.

Then, be located at vacuum system, for example be located at vacuum gauge, for example convection type vacuum gauge monitor pressures of the detecting element on the Vacuum exhaust tube, utilize vacuum system to be evacuated simultaneously in the utilization of S840 step.Wherein owing to being evacuated, so carry out pressure detecting with the vacuum gauge that is configured on the Vacuum exhaust tube.Utilize the vacuum gauge of detecting element, the Pirani ga(u)ge in addition that except above-mentioned convection type vacuum gauge, can enumerate, quartzy friction vacuum gauge etc.Convection type vacuum gauge and Pirani ga(u)ge for example are that the variations in temperature of the detecting element that constitutes with the platinum filament is become the instrument that changes in resistance is come detected pressures, generally can be 10 ^-3Range detection pressure about Torr～1Torr.Quartzy in addition friction vacuum gauge is the instrument with the change-detection pressure of the resonance state of the detecting element of tuning fork shape quartz crystal composition, generally can be 10 ^-2Torr～10 ³Range detection pressure about Torr.The for example crystal meter that the compound vacuum gauge that has quartzy friction vacuum gauge function and B-A shape ionization vacuum gauge function concurrently is arranged that can enumerate as crystal friction vacuum gauge.Utilize the vacuum gauge of such detecting element to have detecting element is exposed to the feature of carrying out detected pressures in the gas.

Then, carry out the identical processing of processing with S820, S830, S840 step respectively repeatedly, finish a series of self check and handle by the order of S850, S860, S870 step.

Like this in self check shown in Figure 19 is handled, when promoting the processing gas of (increase) importing (S830, S860 step), opposite with the situation of using the membrane manometer monitor pressures, when being evacuated (S840, S870 step), owing to use vacuum system, use the vacuum gauge monitor pressures that is configured in the detecting element on the vacuum tube etc.

Utilize the vacuum gauge of such detecting element different with membrane manometer, owing to being directly exposed in the processing gas that flows in the Vacuum exhaust tube, detecting element comes detected pressures, it is long more to be exposed to the time of handling in the gas, is easy to generate fault and over time more than membrane manometer.Therefore as processing shown in Figure 19,, use the vacuum gauge that utilizes detecting element, be easy to generate the fault of vacuum gauge etc., have the problem of lifetime as when the self check different with the processing substrate of reality handled.

And the pressure limit that adopts the vacuum gauge utilize detecting element to detect is included in the scope that can detect with membrane manometer.Just because the pressure limit of utilizing vacuum gauge, for example convection type vacuum gauge and the Pirani ga(u)ge of detecting element to detect is 10 ^-3Torr～1Torr, the pressure limit that can detect with quartzy friction vacuum gauge is 10 ^-2Torr～10 ³Torr is included in membrane manometer, the scope 10 that for example can detect with capacitance-type pressure gage for these ^-4Torr～10 ²In the Torr.Therefore also can substitute with membrane manometer utilizes the vacuum gauge of detecting element to come detected pressures.

So, in self check is handled, use membrane manometer, for example use capacitance-type pressure gage to substitute the vacuum gauge that utilizes detecting element, as not using the vacuum gauge that utilizes detecting element, can prevent to utilize the fault and over time of the vacuum gauge of detecting element.

Wherein, Figure 20 represents not use the vacuum gauge that utilizes detecting element to carry out the concrete example that self check is handled.In self check shown in Figure 20 is handled, at first, be evacuated with vacuum system in the S910 step, wait in the S920 step be configured on the gas system, for example to be configured in the mass flow controller of handling on the gas introduction tube etc. (MFC) stable.Judge under the situation of having passed through wait MFC stabilization time in the S920 step then, use membrane manometer, for example capacitance-type pressure gage monitor pressures that is arranged in the process chamber 140,540 on one side in the S930 step, Yi Bian make pressure rise to authorized pressure (lifting).Identical with the processing to S810～S830 step shown in Figure 19 so far.

Then, on one side in S940 step membrane manometer (for example capacitance-type pressure gage) monitor pressures, Yi Bian be evacuated with vacuum system.Close its protective valve this moment under situation about being provided with the vacuum gauge (for example convection type vacuum gauge, Pirani ga(u)ge, crystal meter etc.) of detecting element, the processing gas of corrosive gas etc. is not entered in the vacuum gauge.

Then, carry out the identical processing of processing with S920, S930, S940 step respectively repeatedly, finish a series of self check and handle by the order of S950, S960, S970 step.

Like this, in self check shown in Figure 20 is handled, not only (S930, S960 step) uses membrane manometer (for example capacitance-type pressure gage) monitor pressures when gas is handled in the importing that promotes, and (S940, S970 step) also uses membrane manometer (for example capacitance-type pressure gage) monitor pressures when being evacuated.Like this owing to do not use the vacuum gauge (for example convection type vacuum gauge, Pirani ga(u)ge, crystal meter etc.) that utilizes detecting element to carry out self check to handle, thus the probability of the fault etc. of the vacuum gauge that utilizes detecting element can be reduced, can life-saving.

With reference to accompanying drawing the execution mode that the present invention is fit to is illustrated above, but much less is not defined as such example.Be that those skilled in the art just can expect, the example of the example of various variations or correction in the category described in the claim scope can be interpreted as the scope that belongs to technology of the present invention certainly for these.

Claims (6)

1. a substrate board treatment is characterized in that, comprising:

At least comprise and use to handle gas is implemented the vacuum processing chamber handled to processed substrate a plurality of chambers, wherein, between each chamber, can exchange described processed substrate and

In described a plurality of chambers, suppress the unit producing the shock wave that is provided for suppressing the shock wave that produces because of the pressure differential between these chambers between the chamber of pressure differential at least,

Described shock wave suppresses the unit and comprises:

Be communicated with the communicating pipe between the described chamber;

Be configured in and prevent the shock motion unit on described communicating pipe; With

In a described side that prevents the shock motion unit, be configured in the communicating pipe controlled valve of high vacuum preparation room one side of pressure,

And described vacuum preparation room is arranged between conveying chamber and the vacuum processing chamber.

2. substrate board treatment as claimed in claim 1 is characterized in that:

Described processing gas is corrosive gas,

On described communicating pipe, at the described opposite side that prevents the shock motion unit, side at the low vacuum processing chamber of pressure also is provided with the communicating pipe controlled valve, simultaneously prevents that described shock motion unit and this from preventing that the communicating pipe of the opposite side of shock motion unit is provided with between the controlled valve and being used for the vacuum exhaust unit that described communicating pipe is evacuated.

3. substrate board treatment as claimed in claim 1 is characterized in that:

The described shock motion unit that prevents is the jet pipe that choke valve is arranged.

4. substrate board treatment as claimed in claim 1 is characterized in that:

The described shock motion unit that prevents is a wellhole.

5. the control method of a substrate board treatment is characterized in that, described substrate board treatment comprises:

At least comprise using and handle a plurality of chambers that gas is implemented the vacuum processing chamber of processing to processed substrate, between each chamber, can exchange described processed substrate by gate valve,

Have communicating pipe of being communicated with between the described chamber, be configured on described communicating pipe prevent the shock motion unit and be configured in described prevent shock motion unit one side the communicating pipe of a side of the high chamber of pressure controlled valve shock wave suppress the unit,

Opening described communicating pipe controlled valve, by make described communicating pipe be communicated with between the chamber after, open described gate valve.

6. the control method of a substrate board treatment is characterized in that, described substrate board treatment comprises:

At least comprise using and handle a plurality of chambers that gas is implemented the vacuum processing chamber of processing to processed substrate, between each chamber, can exchange described processed substrate by gate valve;

Shock wave suppresses the unit, setting has communicating pipe between the communication chamber, be configured in and prevent the shock motion unit on described communicating pipe, be configured in the described communicating pipe controlled valve that prevents both sides, shock motion unit, the communicating pipe that is used for being configured in a described side that prevents the chamber that shock motion unit and pressure are low described communicating pipe evacuated vacuum exhaust unit between the controlled valve, wherein

Open before the described gate valve,, will be evacuated in described communicating pipe, become the lower pressure of pressure of the low chamber of specific pressure with the vacuum exhaust unit closing two described communicating pipes during controlled valve,

When opening described gate valve,, after the communicating pipe controlled valve of the side by opening the high chamber of pressure is communicated with between its chamber, open described gate valve in communicating pipe of opening the low chamber of pressure one side behind the controlled valve.

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