CN101582367B - Pulse type large beam spot electronic beam generating device - Google Patents
Pulse type large beam spot electronic beam generating device Download PDFInfo
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- CN101582367B CN101582367B CN2009103032380A CN200910303238A CN101582367B CN 101582367 B CN101582367 B CN 101582367B CN 2009103032380 A CN2009103032380 A CN 2009103032380A CN 200910303238 A CN200910303238 A CN 200910303238A CN 101582367 B CN101582367 B CN 101582367B
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002657 fibrous material Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
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Abstract
The invention discloses a pulse type large beam spot electron beam generating device, belonging to the technical field of modification of material surfaces. The device consists of a high-voltage pulsepower supply, a time sequence control circuit, an electronic gun and a vacuum chamber. The vacuum chamber is controlled by discharging time sequence of the high-voltage pulse power supply after reaching working pressure; a magnetic field formed in the electronic gun confines the discharge of a plasma anode; a plasma channel is formed between the cathode and the anode of the electronic gun; and the cathode is applied with high-voltage negative pulse so as to form electronic emission on the cathode surface and obtain the pulse electron beam with large beam spots. The device can generate electron beam with accelerating voltage of 20 to 35kV, the pulse duration of 2 to 4Mus, the beam spot area with the diameter of 60mm and repetition frequency of 0.1Hz, and the average energy density of the beam spot is 1 to 6J/cm<2>. The pulse type large beam spot electron beam generating device also has the advantages of reasonable design, simple structure, high degree of automation and the like and isapplicable to research and application of modification technique of the material surface.
Description
Technical field
The invention belongs to the material surface modifying technology field, relate to a kind of pulse type large beam spot electronic beam generating device.
Background technology
Material science is one of mainstay of human social development.Along with progress of modern technology, to the performance proposition requirements at the higher level of material, material science is faced with new challenges.Fatigue, wearing and tearing and corrosion are three kinds of main failure modes of engineering material, they are all closely related with the material surface state, in surface germinating etc., the key that improves these material serviceabilities is to improve its surface property as the fatigue crack of the resistance to wear of pressure vessels for the chemical industry and Corrosion of Pipeline, cutter and mould, component of machine.
Material surface modifying technology is an important branch of material science research, it is at the composition that does not change basis material, do not weaken on the mechanical property basis of basis material, adopt physics or chemical means to have the modified layer of specific function, to improve the performance such as heat-resisting, anti-corrosion, anti-oxidant and wear-resistant of material in the matrix surface preparation.Select rational surface modifying treatment, can under the situation of less technology and fund input, significantly promote the military service performance and the useful life of product.
Current, carry the development of beam material surface modifying technology rapidly, and demonstrate unique advantage in the Surface Engineering field, obtain people's extensive attention and research.Utilize a year beam can realize the kinds of surface treatment process, study carefully its essence, utilize the energy impact that carries beam to act on material surface exactly and produce extreme treatment conditions, comprise high temperature, high pressure and stress impact effect etc., make and mass distribution, chemistry and mechanical state take place in the energy district of material surface change, finally obtain unapproachable surface texture of conventional method and serviceability.
Carry beam and mainly comprise laser beam, ion beam and electron beam,, use electron beam to carry out having following advantage when material surface modifying is handled than laser beam and ion beam:
(1) be energy carrier with the accelerated electron, energy conversion efficiency can reach 80% during with material surface interactions, far above 5～10% of laser, and this high conversion efficiency to be subjected to the influence of material surface machining state very little;
(2) penetration capacity of duplet material so it is much bigger to inject the degree of depth at the energy that is equal to electron beam under the accelerating voltage, helps forming thicker surface reforming layer far above ion, does not exist element to inject problem simultaneously;
(3) electron beam processing is carried out in a vacuum, can effectively avoid handling problems such as material surface oxidation and pollution, and the vacuum work condition does not have specific (special) requirements, can utilize existing ripe vacuum to obtain technology and realize;
(4) the electron beam production process can directly be realized the conversion of electric energy by power electronic device, and intermediate link is few, designs relative with manufacturing process simple.
How to give full play to these advantages that electron beam is used for material surface modifying, develop the electron beam material surface modifying technology and the technology that rationally are suitable for, key depends on the energy response and the working method of the electron beam device that uses.
With regard to existing all kinds of electron beam devices, majority is used for welding, cutting processing or evaporation thermal source, secondly is to utilize electronics and matter interaction to produce the signal source of material tests, has the small part electron beam device to be exclusively used in the research of physics special effects again.Minority is used for the electron beam device that the electron beam material surface modifying technology is explored, and also only is simple refit or the combination of carrying out original technology at the special processing occasion, still has little (the about 1mm of electron beam spot area
2), problem such as the control ability of electronic beam current weak (hundreds of milliampere), energy input is limited, the material heat affected area is excessive.
At the practical application of electron beam material surface modifying, at first need to consider to increase the bundle spot area of electron beam, to realize the processing of big machined surface; Next is the beam intensity that guarantees electron beam, makes to handle to obtain enough energy densities in the material surface modifying layer; Be to introduce pulsed mode at last, reduce energy and excessively conduct heat, and the material surface evaporated material disturbs the scattering of incident beam in the course of processing, improves the flexibility of energy input intensity and control simultaneously to material matrix.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of pulse type large beam spot electronic beam generating device, overcomes above shortcomings in the prior art.This device can produce accelerating voltage 20～35kV, pulse durations 2～4 μ s, and bundle spot area Φ 60mm, the electron beam of repetition rate 0.1Hz, bundle spot mean energy density is 1～6J/cm
2, be applicable to material surface modifying Processing Technology and application.
In order to achieve the above object, the concrete technical scheme taked of the present invention is:
This pulse type large beam spot electronic beam generating device comprises high-voltage pulse power power-supply, sequential control circuit, electron gun and vacuum chamber.When vacuum indoor gas pressure is lower than operating air pressure, breakdown action by sequential control circuit operate high pressure impulse power electrical source, the negative electrode, plasma anode and the field coil that are respectively electron gun provide three tunnel independently high pressure outputs separately, be respectively 3kV, 15kV and 35kV, wherein 35kV is output as the main pulse that applies on the gun cathode 9, and polarity is for negative, and this high pressure output can require to regulate between 20～35kV according to concrete treatment process.
The negative electrode of electron gun adopts the compressed graphite fiber material, and plasma anodes centre is provided with aperture, and the negative electrode of electron gun and plasma anode are relatively arranged on the central axis of electron gun.Field coil is made up of the densely packed coil of two parallel placements, for providing the confining magnetic field that is parallel to electron gun axis between negative electrode and the plasma anode, and the work polarity of the magnetic field unanimity that two coils provide.The discharge plasma that the plasma anode forms to the electron gun axial expansion, constitutes the plasma discharge passage under magnetically confined; The high pressure main pulse that the high-voltage pulse power power-supply applies makes the gun cathode surface produce field emission, the electronics that emits forms electron beam to the directed movement of plasma anode under magnetically confined, pass plasma anodes centre diaphragm mouth and enter the vacuum chamber that is connected with electron gun, act on the surface of the work that is fixed on the workbench, realize the electron beam processed.
The invention has the beneficial effects as follows:
1) by large area cathode and non-focusing type Magnetic Field Design, suppress the self-pinch effect of emitting electrons, the beam spot diameter reaches Φ 60mm, can once realize the processing of big machined surface;
2) adopt the working method of short pulse, low-repetition-frequency, reduce electron beam energy and excessively conduct heat to material matrix and increase rotten district, avoided simultaneously that the material surface evaporated material disturbs the scattering of incident beam in the course of processing;
3) gun cathode accelerating voltage adjustable range broad, and all be in low pressure range, can effectively avoid producing in the electron beam course of processing x radiation x and pollute the protection operator safety;
4) adopt low-voltage and the scheme that big line combines in the design, the electron beam energy input is concentrated on handle material surface, instantaneous high power heating process can be competent at the surface modification treatment of refractory metal and ceramic-like materials.
Description of drawings
Accompanying drawing is a kind of pulse type large beam spot electronic beam generating device schematic diagram of the present invention.
Among the figure: 1 vacuum chamber; 2 workbench; 3 workpiece; 4 electron beams; 6 plasma anodes;
5 field coils; 7 electron guns; 8 High-Voltage Insulations; 9 gun cathodes; 10 vacuum seals;
11 high-voltage pulse power power-supplies; 12 sequential control circuits.
Embodiment
Below in conjunction with the drawings and specific embodiments to specific embodiments of the invention.
As shown in Figure 1, a kind of pulse type large beam spot electronic beam generating device by the present invention makes comprises high-voltage pulse power power-supply 11, sequential control circuit 12, electron gun 7 and vacuum chamber 1.
High-voltage pulse power power-supply 11 provides separately independently high pressure output for gun cathode 9, plasma anode 6 and field coil 5, be respectively 3kV, 15kV and 35kV, wherein 35kV is output as the main pulse that applies on the gun cathode 9, polarity is for negative, and this high pressure output can require to regulate between 20～35kV according to concrete treatment process.
The breakdown action of sequential control circuit 12 operate high pressure impulse power electrical sources 11, the sequential of adjusting three tunnel outputs of high-voltage pulse power power-supply cooperates.Can provide status display function in this circuit, the ruuning situation of monitoring high-voltage pulse power power-supply 11 and sequential control circuit 12 itself.
Electron gun 7 is tightly connected with vacuum chamber 1.Electron gun is made by stainless steel material, and length overall 0.5m installs negative electrode 9 and plasma anode 6, outer setting field coil 5 on the inside center axis.Wherein, negative electrode 9 is 20～30mm with plasma anode 6 end distances.
The field coil 5 of electron gun 7 outer setting is made up of the densely packed coil of two parallel placements, and two hub of a spools are apart from equating that with the coil mean radius work polarity of the magnetic field unanimity that two coils provide provides the confining magnetic field that is parallel to electron gun 7 axis.
When field coil adopted number of ampere turns (NI) to be 2500, electron gun 7 axis magnetic field intensitys reached 1500Oe, can article on plasma anode 6 discharge plasmas and the 4 formation operative constraints of negative electrode 7 electrons emitted bundles.
The described device of present embodiment can produce electron beam 4 parameters and is: accelerating voltage 20～35kV, pulse duration repetition rate 0.1Hz, bundle spot mean energy density 1～6J/cm
2
The course of work of this device is:
1, workpiece 3 is fixed on the workbench 2, workpiece 3 pending surfaces are over against electron beam 4 extraction locations;
2, use vacuum system that the vacuum in the vacuum chamber 1 is extracted into operating air pressure;
3, according to workpiece 3 surface modification needs, the voltage parameter of high-voltage pulse power power-supply 11 is set, with electrical power storage in energy storage device and reach predetermined value;
4, pass through the breakdown action of sequential control circuit 12 operate high pressure impulse power electrical sources;
5, field coil 5 forms the confining magnetic field that is parallel to electron gun 7 axis by electric current;
6, plasma anode 6 discharge, form plasma and under magnetically confined to the electron gun axial expansion, constitute the plasma discharge passage;
7, the high pressure main pulse makes gun cathode 9 surfaces produce the electronics emission, and the electronics that emits to 6 directed movements of plasma anode, forms electron beam 4 under magnetically confined;
8, electron beam 4 passes plasma anodes centre diaphragm and enters the vacuum chamber 1 that is connected with electron gun 7, acts on workpiece 3 surfaces, realizes the electron beam processed.
Claims (3)
1. pulse type large beam spot electronic beam generating device, comprise high-voltage pulse power power-supply (11), sequential control circuit (12), electron gun (7) and vacuum chamber (1), it is characterized in that: by the breakdown action of sequential control circuit (12) operate high pressure impulse power electrical source (11), the negative electrode (9), plasma anode (6) and the field coil (5) that are respectively electron gun (7) provide three tunnel independently high pressure outputs separately; Plasma anode (6) center is provided with aperture, and the negative electrode (9) of electron gun (7) is relatively arranged on the central axis of electron gun (6) with plasma anode (6); Field coil (5) is made up of the densely packed coil of two parallel placements, and the work polarity of the magnetic field unanimity that two coils provide is for providing the confining magnetic field that is parallel to electron gun (7) axis between negative electrode (9) and the plasma anode (6); The discharge plasma that plasma anode (6) forms to electron gun (7) axial expansion, constitutes the plasma discharge passage under magnetically confined; The high pressure main pulse that high-voltage pulse power power-supply (11) applies makes negative electrode (9) surface produce field emission, the electronics that emits forms electron beam (4) to plasma anode (6) directed movement under magnetically confined, pass plasma anode (6) central stop mouth and enter the vacuum chamber (1) that is connected with electron gun (7), act on workpiece (3) surface that is fixed on the workbench (2), realize the electron beam processed;
High-voltage pulse power power-supply (11) is that gun cathode (9), plasma anode (6) and field coil (5) provide separately independently high pressure output, provides 3kV respectively, 15kV and 35kV; Wherein 35kV is output as the main pulse that applies on the gun cathode (9), and polarity is for negative, and this high pressure output is regulated between 20～35kV.
2. a kind of pulse type large beam spot electronic beam generating device according to claim 1 is characterized in that, described negative electrode (9) adopts the compressed graphite fiber material.
3. a kind of pulse type large beam spot electronic beam generating device according to claim 1 is characterized in that, the aperture that described plasma anode (6) center is provided with is that diameter is 60mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009103032380A CN101582367B (en) | 2009-06-15 | 2009-06-15 | Pulse type large beam spot electronic beam generating device |
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|---|---|---|---|
| CN2009103032380A CN101582367B (en) | 2009-06-15 | 2009-06-15 | Pulse type large beam spot electronic beam generating device |
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| CN101582367A CN101582367A (en) | 2009-11-18 |
| CN101582367B true CN101582367B (en) | 2011-02-02 |
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| CN102430853B (en) * | 2011-09-21 | 2013-09-04 | 哈尔滨工业大学 | Image vision sensing method for welding pool of electron beam |
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| CN108878249B (en) * | 2018-06-19 | 2020-01-17 | 大连理工大学 | Pulse penning discharge plasma generating device |
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| JP6744694B1 (en) * | 2019-12-03 | 2020-08-19 | 株式会社ソディック | Surface modifying device and surface modifying method |
| CN111564353A (en) * | 2020-04-10 | 2020-08-21 | 西安电子科技大学 | High-energy electron beam source control system, method and device and part manufacturing method |
| CN115831691B (en) * | 2022-11-25 | 2023-07-07 | 广东省科学院中乌焊接研究所 | Pulse laser heating cathode electron gun, selective melting device and beam current regulating and controlling method |
| CN117733305B (en) * | 2024-02-20 | 2024-04-26 | 四川华束科技有限公司 | Sealed-off type electron gun and non-vacuum electron beam welding robot |
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|---|---|---|---|---|
| EP0314918A1 (en) * | 1987-11-06 | 1989-05-10 | PTR Präzisionstechnik GmbH | Control circuit for electron beam generator |
| JP2005076061A (en) * | 2003-08-29 | 2005-03-24 | Sodick Co Ltd | Method and device for reforming surface of metal member |
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| JP2007005011A (en) * | 2005-06-21 | 2007-01-11 | Sodick Co Ltd | Electron beam irradiation apparatus for reforming surface |
| CN101237727A (en) * | 2008-01-09 | 2008-08-06 | 桂林电子科技大学 | Power control Method and power device in electronic optical circuit system of electronic bundle impact furnace |
-
2009
- 2009-06-15 CN CN2009103032380A patent/CN101582367B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0314918A1 (en) * | 1987-11-06 | 1989-05-10 | PTR Präzisionstechnik GmbH | Control circuit for electron beam generator |
| JP2005076061A (en) * | 2003-08-29 | 2005-03-24 | Sodick Co Ltd | Method and device for reforming surface of metal member |
| CN1851843A (en) * | 2005-04-22 | 2006-10-25 | 中国科学院物理研究所 | Electron beam generating and controlling device |
| JP2007005011A (en) * | 2005-06-21 | 2007-01-11 | Sodick Co Ltd | Electron beam irradiation apparatus for reforming surface |
| CN101237727A (en) * | 2008-01-09 | 2008-08-06 | 桂林电子科技大学 | Power control Method and power device in electronic optical circuit system of electronic bundle impact furnace |
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