CN101578013B - Circuit board copper plating device - Google Patents
Circuit board copper plating device Download PDFInfo
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- CN101578013B CN101578013B CN2008103014477A CN200810301447A CN101578013B CN 101578013 B CN101578013 B CN 101578013B CN 2008103014477 A CN2008103014477 A CN 2008103014477A CN 200810301447 A CN200810301447 A CN 200810301447A CN 101578013 B CN101578013 B CN 101578013B
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- circuit board
- support bar
- copper plating
- plating device
- bar
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Abstract
The technical proposal provides a circuit board copper plating device, which comprises a support frame, a spacing frame and a holding part, and is characterized in that the support frame is provided with a supporting surface; the spacing frame is arranged in the support frame, connected with the support frame and provided with a bearing surface, and an included angle between the bearing surface and the supporting surface is an acute angle; and the holding part is arranged on the support frame and is used for fixing the circuit board copper plating device. The circuit board copper plating device ensures that the axial direction of a through hole of a circuit board substrate which is born on the spacing frame and the supporting surface form an acute angle, so that bubbles in a through hole of the circuit board substrate bears an action force along the axial direction of the circuit board substrate to make the bubbles in the through hole of the circuit board substrate escaped and then improve the quality of copper plating in the hole of the circuit board substrate.
Description
Technical field
The present invention relates to a kind of circuit board manufacturing equipment, relate in particular to a kind of circuit board copper plating device.
Background technology
Along with the continuous development of science and technology, microminiature mobile phone, hand-held calculator and electronic vehicle product etc. are all had higher requirement to miniaturization, the lightness of product.In order to adapt to this demand, the circuit level of the printed circuit board (PCB) in the electronic product improves constantly, and the pattern of printed circuit is densification day by day also, and the conductor width of circuit, conductor separation, clear size of opening etc. are also tiny day by day thereupon.Therefore, lightening, the circuit of printed circuit board (PCB) (Printed Circuit Board, be called for short PCB) can fine property and the performances such as conducting quality of interlayer circuit seem more and more important.
At present, in the printed circuit board (PCB), the conducting of interlayer circuit realizes by plated-through-hole usually.The quality of plated-through-hole generally be cannot say for sure to demonstrate,prove, especially the hole for high aspect ratio (sees also Quality and Reliability of HighAspect-Ratio Blind Microvias Formed by Laser-Assisted Seeding Mechanism in PCB, IEEE Volume:27, issue:2, April 2004Page (s): 115-124).
Circuit board is positioned in the circuit board copper plating device, when carrying out copper facing, can has bubble in the through hole of circuit board.Existing solution be utilize wave, modes such as supersonic oscillations quicken flowing of tank liquor and take away bubble in the through hole.But, wave with supersonic oscillations and also can produce micro-bubble, bubble residues in the through hole, can make and have cavity in the copper plate that forms after the through hole copper facing, and then in the pressing of later stage HTHP, mount etc. in the operation and may cause the copper plate in the through hole to break, thereby have a strong impact on the conduction property and the signal transmitting quality of circuit board.
Therefore, be necessary to provide a kind of and make in the copper facing process that bubble is overflowed easily in the circuit board through-hole, and then the circuit board copper plating device that can avoid the copper plate in the via to break.
Summary of the invention
Below with embodiment a kind of circuit board copper plating device is described.
A kind of circuit board copper plating device comprises carriage, interval box and retaining piece, it is characterized in that: described carriage has a supporting surface; Described interval box is arranged in the carriage, and is connected with carriage, and described interval box has a loading end, and the angle of described loading end and supporting surface is an acute angle; Described retaining piece is arranged at described carriage, is used for fixing described circuit board copper plating device.
With respect to prior art, utilize circuit board copper plating device in the technical program to place circuit board substrate when carrying out copper facing, can make circuit board substrate and described supporting surface have angle between the 0-90 degree, thereby the axis direction and the supporting surface of the through hole of circuit board substrate are acutangulated, so can make the residual bubble in the circuit board substrate through hole be subjected to a active force along its axis direction, be easy in through hole, overflow, thereby can in copper plate, not form cavity in the copper facing process of circuit board substrate, improve the quality of copper plate in the circuit board substrate hole.
Description of drawings
Fig. 1 is the perspective view of the circuit board copper plating device that provides of the technical program first embodiment.
Fig. 2 is the perspective view that circuit board substrate is positioned over the circuit board copper plating device that the technical program first embodiment provides.
Fig. 3 is that circuit board substrate is positioned over behind the circuit board copper plating device that the technical program first embodiment provides the force analysis figure of bubble in the through hole.
Fig. 4 is the perspective view of the circuit board copper plating device that provides of the technical program second embodiment.
Fig. 5 is the perspective view of the circuit board copper plating device that provides of the technical program the 3rd embodiment.
Fig. 6 is the perspective view of the circuit board copper plating device that provides of the technical program the 4th embodiment.
Embodiment
Below in conjunction with accompanying drawing and a plurality of embodiment the circuit board copper plating device of the technical program is described in further detail.
See also Fig. 1, the technical program first embodiment provides a kind of circuit board copper plating device 100, is used for circuit board substrate is carried out copper facing.Described circuit board substrate is meant finishes bore operation, prepares to carry out the circuit board that hole metallization is made.Described circuit board copper plating device 100 comprises carriage 110, interval box 120 and retaining piece 130.Described carriage 110 is the cuboid framework, comprises first support bar 1101, second support bar 1102, the 3rd support bar 1103, the 4th support bar 1104, the 5th support bar 1105, the 6th support bar 1106, the 7th support bar 1107, the 8th support bar 1108, the 9th support bar 1109, the tenth support bar the 1110, the 11 support bar 1111 and twelve earthly branches strut 1112.Wherein, first support bar 1101, second support bar 1102, the 3rd support bar 1103 and the 4th support bar 1104 are vertical successively connects and composes one first carriage 111.The 9th support bar 1109, the tenth support bar the 1110, the 11 support bar 1111 and twelve earthly branches strut 1112 be also vertical successively to connect and compose one second carriage 112.First support bar 1101 is parallel with the 9th support bar 1109, and second support bar 1102 is parallel with the tenth support bar 1110, and the 3rd support bar 1103 is parallel with the 11 support bar 1111, and the 4th support bar 1104 is parallel with twelve earthly branches strut 1112.The 5th support bar 1105 is vertically connected between first support bar 1101 and the 9th support bar 1109, is connected in simultaneously between second support bar 1102 and the tenth support bar 1110.The 6th support bar 1106 is vertically connected between second support bar 1102 and the tenth support bar 1110, is connected in simultaneously between the 3rd support bar 1103 and the 11 support bar 1111.The 7th support bar 1107 is vertically connected between the 3rd support bar 1103 and the 11 support bar 1111, is connected in simultaneously between the 4th support bar 1104 and the twelve earthly branches strut 1112.The 8th support bar 1108 is vertically connected between first support bar 1101 and the 9th support bar 1109, is connected in simultaneously between the 4th support bar 1104 and the twelve earthly branches strut 1112.
Because carriage 100 be the cuboid framework, so it has six surfaces, and each surface all can be used as supporting surface, is used to support be positioned over the interior circuit board of circuit board copper plating device 100.In the present embodiment, the surface of first carriage 111 that constitutes with first support bar 1101, second support bar 1102, the 3rd support bar 1103 and the 4th support bar 1104 is a supporting surface 113.
Described interval box 120 is positioned at carriage 110, and is connected with second carriage 112 with first carriage 111 respectively.Particularly, described interval box 120 comprises first distance bar 1201, second distance bar 1202, the 3rd distance bar 1203, the 4th distance bar 1204 that head and the tail connect.Wherein, first distance bar 1201 is connected between the tenth support bar 1110 and the twelve earthly branches strut 1112, and is parallel to the 9th support bar 1109.Second distance bar 1202 is connected between second support bar 1102 and the tenth support bar 1110, and the 3rd distance bar 1203 is connected between the 4th support bar 1104 and the twelve earthly branches strut 1112.The 4th distance bar 1204 is connected between second support bar 1102 and the 4th support bar 1104, and is parallel to first support bar 1101.In the present embodiment, described the 4th distance bar 1204 and the 3rd support bar 1103 shared bodies of rod.Second distance bar 1202 is parallel with the 3rd distance bar 1203, the angle of second distance bar 1202, the 3rd distance bar 1203 and second support bar 1102 is an acute angle, thereby interval box 120 has a loading end 121, and described loading end 121 is an acute angle with the angle of supporting surface 113.In the present embodiment, described circuit board copper plating device 100 comprises two interval box that are parallel to each other 120, and another interval box 120 also has a loading end 121, and described loading end 121 also is an acute angle with the angle of supporting surface 113.Certainly, described circuit board copper plating device 100 also can only comprise an interval box 120, drops for preventing circuit board substrate, and it can utilize holder clamping circuit board substrate to carry out copper facing.
Described loading end 121 is an acute angle theta with the angle of supporting surface 113.Preferably, θ can be worth for 45 degree to any one between 80 degree.Thereby the circuit board substrate that is positioned over loading end 121 supporting surface 113 relatively is positioned in the circuit board copper plating device 100 obliquely.
Preferably, described circuit board copper plating device 100 can further comprise carrier bar 1205, described carrier bar 1205 and second support bar 1102, the 4th support bar 1104 be arranged in parallel, and be connected between the 4th distance bar 1204 and the 3rd support bar 1103, with the circuit board substrate of further fixed placement in circuit board copper plating device 100, prevent that circuit board substrate from dropping from circuit board copper plating device 100.Described interval box 120 can further comprise fixed transverse rod 1206.Described fixed transverse rod 1206 and the 3rd support bar 1103 be arranged in parallel, and are connected between second distance bar 1202 and the 3rd distance bar 1203.
Described retaining piece 130 is used for fixing described circuit board copper plating device 100, and it can be geometrical clamp, hook or other element, and retaining piece 130 can be arranged at carriage 110.In the present embodiment, retaining piece 130 is two hooks, is separately positioned on the 9th support bar 1109 and the 11 support bar 1111 parallel to each other.In addition, described retaining piece 130 also can be arranged on the tenth support bar 1110 and twelve earthly branches strut 1112 parallel to each other.
See also Fig. 2, the circuit board copper plating device 100 shown in the present embodiment can be used for placing circuit board substrate 250 to treat that circuit board substrate 250 is carried out copper facing.Circuit board substrate 250 has adjacent circuit surface 251 and side 252.Described circuit surface 251 is meant the surface that is formed with the conducting wire.Circuit board substrate 250 also offers the through hole 2510 that runs through circuit board substrate 250, and the axis normal of described through hole 2510 is in circuit surface 251.When being positioned in the circuit board copper plating device 100 circuit board substrate 250 with pending copper facing, when promptly being positioned over described loading end 121, the side 252 of circuit board substrate 250 is resisted against supporting surface 113, and 251 on circuit surface contacts with loading end 121.That is, circuit board substrate 250 can be contained in the circuit board copper plating device 100 with supporting surface 113 with acutangulating.
When the angle between supporting surface 113 and the loading end 121 is θ, then be positioned over the circuit surface 251 and 113 one-tenth θ degree of supporting surface angle of the circuit board substrate 250 in the circuit board copper plating device 100, the axis of through hole 2510 also becomes θ degree angle with supporting surface 113.See also Fig. 2 and Fig. 3, the bubble 2511 in the described through hole 2510 is subjected to buoyancy F and pressure N in coating bath.The size of described buoyancy F equals bubble 2511 and is immersed in the suffered gravity of liquid that is arranged in the coating bath liquid, be F=ρ gV, ρ is the coating bath density of liquid in the formula, and V is the volume of the liquid that arranged by bubble, g is an acceleration of gravity, and the direction of buoyancy F straight up.Described pressure N is that the size of pressure N equals the component of buoyancy F perpendicular to the hole wall direction owing to the hole wall generation mutual extrusion of the bubble that is in contact with one another 2511 with through hole 2510 produces, i.e. N=Fcos θ, and the direction of pressure N is perpendicular to hole wall.Therefore, the sizes of the F ' that makes a concerted effort that bubble 2511 is suffered equal the component of buoyancy F along the hole wall direction, i.e. F '=Fsin θ, the direction of F ' for parallel axes upwards and through hole 2510 of making a concerted effort.Thereby bubble 2511 can be along the direction that the parallels to the axis through hole 2510 that moves up and overflow.That is to say that when circuit board substrate 250 and supporting surface 113 are positioned over when carrying out copper facing in the circuit board copper plating device 100 with acutangulating, the bubbles 2511 in the through hole 2510 can not be stranded in the through hole 2510, and can overflow from through hole 2510.Thereby, thereby circuit board substrate 250 can not form cavity in copper plate in the copper facing process, have higher copper facing quality.In the present embodiment, θ is 45 degree.
See also Fig. 4, the circuit board copper plating device 100 that the technical program second embodiment provides the circuit board copper plating device 200 and first embodiment to provide is roughly the same, its difference is: described circuit board copper plating device 200 has a plurality of interval box 220, described a plurality of interval box 220 is positioned at carriage 210, and be connected with second carriage 212 with first carriage 211 respectively, and described a plurality of interval box 220 is set parallel to each other.All constitute a space that is used to place circuit board substrate between every adjacent two interval box 220.Thereby described circuit board copper plating device 200 can carry a plurality of circuit board substrates and carry out copper facing.
Preferably, described circuit board copper plating device can be provided with carrier bar 2205, and carrier bar 2205 is used to be connected between adjacent two interval box 220, with the support force of intensifier circuit plate copper plating device 100.Particularly, in the present embodiment, the many carrier bars 2205 and second support bar 2102 be arranged in parallel, and are connected between second distance bar 2202 of described a plurality of interval box 220.A plurality of carrier bars 2205 are parallel with the 4th support bar 2104, and are connected between the 3rd distance bar 2203 of described a plurality of interval box 220.A plurality of carrier bars 2205 and second support bar 2102, the 4th support bar 2104 are parallel, and are connected between the 4th distance bar 2204 of described a plurality of interval box 220.
See also Fig. 5, the circuit board copper plating device 300 that the technical program the 3rd embodiment provides is improved on the basis of the circuit board copper plating device 200 that second embodiment provides, and its improvements are: described circuit board copper plating device 300 also comprises the connection box 340 of second carriage 312 that is connected in carriage 310.Described connection box 340 is the rectangle frame, comprises head rod 3401 connected vertically successively, second connecting rod 3402, the 3rd connecting rod 3403 and the 4th connecting rod 3404.Wherein, described head rod 3401 is parallel and relative with the 9th support bar 3109, described second connecting rod 3402 is parallel and relative with the tenth support bar 3110, described the 3rd connecting rod 3403 is parallel and relative with the 11 support bar 3111, and described the 4th connecting rod 3404 is parallel and relative with twelve earthly branches strut 3112.Described the 5th support bar 3105, the 6th support bar 3106, the 7th support bar 3107 and the 8th support bar 3108 all are connected to the extension of connection box 340 directions and with connection box 340.Retaining piece 330 can be arranged on relative head rod 3401 and the 3rd connecting rod 3403, or second relative connecting rod 3402 and the 4th connecting rod 3404.In the present embodiment, retaining piece 330 is arranged on relative head rod 3401 and the 3rd connecting rod 3403.
In the present embodiment, described circuit board copper plating device 300 can be put into circuit board substrate more easily and take out copper-plated circuit board substrate in copper-plated process, avoid picking and placeing in the circuit board substrate process 300 pairs of circuit board substrates of circuit board copper plating device and cause scratch or folding to hinder, to improve the copper-plated yields of circuit board substrate.
See also Fig. 6, the circuit board copper plating device 300 that a kind of circuit board copper plating device 400 that the technical program the 4th embodiment provides and the 3rd embodiment provide is roughly the same, and its difference is: described circuit board copper plating device 400 further comprises interval body 422.Described interval body 422 and second support bar 4102, the 4th support bar 4104 be arranged in parallel, and are connected between described a plurality of interval box 420.In the present embodiment, described interval body 422 is the zigzag bar, and distance bar 422 has a plurality of protuberances 4221 and recess 4222, the alternate each other setting of described protuberance 4221 and recess 4222.The peak of described protuberance 4221 is positioned on the described interval box 420, can contact with the circuit surface of circuit board.The minimum point of described recess 4221 is positioned in the middle of the two adjacent interval box 420, is used for leaning with the side of circuit board.Described interval body 422 is used to keep the distance between the two adjacent circuit board substrates, prevents that two adjacent circuit board substrates from fitting together, and causes its space, fitting part copper facing bad, and then influences the copper-plated quality of circuit board substrate.
The circuit board copper plating device of above-mentioned a plurality of embodiment, according to the difference of circuit board substrate size, the big I respective change of described loading end.The thickness that requires when the aspect ratio and the copper facing of the through hole of circuit board substrate not simultaneously, the spacing of described a plurality of loading ends of arranging in regular turn also can be done corresponding change.And the loading end quantity of circuit board copper plating device can be determined according to different copper facing cell bodies and copper circuit board number of substrates to be plated.And other structure that plays same fixing effect according to cell body different that form and retaining pieces also should be considered as the category of the technical program.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to the technical program claim with distortion according to the technical program.
Claims (12)
1. a circuit board copper plating device comprises carriage, interval box and retaining piece, it is characterized in that: described carriage has a supporting surface; Described interval box is arranged in the carriage, and is connected with carriage, and described interval box has a loading end, and the angle of described loading end and supporting surface is an acute angle; Described retaining piece is arranged at described carriage, is used for fixing described circuit board copper plating device.
2. circuit board copper plating device as claimed in claim 1 is characterized in that, described circuit board copper plating device comprises a plurality of interval box that are parallel to each other.
3. circuit board copper plating device as claimed in claim 2 is characterized in that described circuit board copper plating device further comprises many carrier bars, and described carrier bar is connected between adjacent two interval box.
4. circuit board copper plating device as claimed in claim 1 is characterized in that, the angle of the angle of described loading end and described supporting surface is between 45 degree are spent to 80.
5. circuit board copper plating device as claimed in claim 1, it is characterized in that, described carriage comprises first carriage and second carriage relative with first carriage, and described interval box is connected with second carriage with first carriage respectively, and described first carriage has a supporting surface.
6. circuit board copper plating device as claimed in claim 1, it is characterized in that, described carriage is the cuboid framework, and it comprises first support bar connected vertically successively, second support bar, the 3rd support bar and the 4th support bar, thereby constitutes one first carriage.
7. circuit board copper plating device as claimed in claim 6, it is characterized in that, described carriage also comprises the 9th support bar connected vertically successively, the tenth support bar, the 11 support bar and twelve earthly branches strut, thereby constitute one second carriage, wherein, the 9th support bar is parallel with first support bar, and the tenth support bar is parallel with second support bar, the 11 support bar is parallel with the 3rd support bar, and this twelve earthly branches strut is parallel with the 4th support bar.
8. circuit board copper plating device as claimed in claim 7, it is characterized in that, described interval box comprises first distance bar that head and the tail connect, second distance bar, the 3rd distance bar, the 4th distance bar, wherein, first distance bar is vertically connected between the tenth support bar and the twelve earthly branches strut, second distance bar tilts to be connected between second support bar and the tenth support bar, the 3rd distance bar tilts to be connected between the 4th support bar and the twelve earthly branches strut, the 4th distance bar is vertically connected between second support bar and the 4th support bar, second distance bar is parallel with the 3rd distance bar, second distance bar, the angle of the 3rd distance bar and second support bar is an acute angle, and first distance bar is parallel with the 4th distance bar.
9. circuit board copper plating device as claimed in claim 8 is characterized in that, described each interval box comprises fixed transverse rod, and described fixed transverse rod is connected between second distance bar and the 3rd distance bar.
10. circuit board copper plating device as claimed in claim 7 is characterized in that described circuit board copper plating device also comprises connection box, and described connection box is connected with second carriage.
11. circuit board copper plating device as claimed in claim 1, it is characterized in that described circuit board copper plating device further comprises interval body, described interval body is the zigzag bar, be connected between adjacent two interval box, be used to keep the distance between the two adjacent circuit board substrates.
12. circuit board copper plating device as claimed in claim 11 is characterized in that, described interval body has a plurality of protuberances and recess, the alternate each other setting of described protuberance and recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103014477A CN101578013B (en) | 2008-05-06 | 2008-05-06 | Circuit board copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008103014477A CN101578013B (en) | 2008-05-06 | 2008-05-06 | Circuit board copper plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101578013A CN101578013A (en) | 2009-11-11 |
| CN101578013B true CN101578013B (en) | 2011-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008103014477A Expired - Fee Related CN101578013B (en) | 2008-05-06 | 2008-05-06 | Circuit board copper plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101578013B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110248476A (en) * | 2019-06-12 | 2019-09-17 | 惠州市盈帆实业有限公司 | A kind of circuit board and its preparation process based on the discontinuous mesh of tomography |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88100740A (en) * | 1987-03-20 | 1988-12-21 | 国际商用机器公司 | Has the processor device that improves the control electromagnetic radiation |
| US5145405A (en) * | 1990-05-15 | 1992-09-08 | Hirose Electric Co., Ltd. | Chip connector structure |
| US6116492A (en) * | 1999-04-28 | 2000-09-12 | Behavior Tech Computer Corporation | Jig for facilitating surface-soldering pin to laminated metal sheet |
| CN1610490A (en) * | 2003-10-21 | 2005-04-27 | 华硕电脑股份有限公司 | Rotary angle frame type manufacturing tool |
-
2008
- 2008-05-06 CN CN2008103014477A patent/CN101578013B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN88100740A (en) * | 1987-03-20 | 1988-12-21 | 国际商用机器公司 | Has the processor device that improves the control electromagnetic radiation |
| US5145405A (en) * | 1990-05-15 | 1992-09-08 | Hirose Electric Co., Ltd. | Chip connector structure |
| US6116492A (en) * | 1999-04-28 | 2000-09-12 | Behavior Tech Computer Corporation | Jig for facilitating surface-soldering pin to laminated metal sheet |
| CN1610490A (en) * | 2003-10-21 | 2005-04-27 | 华硕电脑股份有限公司 | Rotary angle frame type manufacturing tool |
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| Publication number | Publication date |
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| CN101578013A (en) | 2009-11-11 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Granted publication date: 20110511 Termination date: 20140506 |