CN101576242A - Radiating method of high-power LED radiator and radiator for implementing same - Google Patents
Radiating method of high-power LED radiator and radiator for implementing same Download PDFInfo
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- CN101576242A CN101576242A CNA200910135565XA CN200910135565A CN101576242A CN 101576242 A CN101576242 A CN 101576242A CN A200910135565X A CNA200910135565X A CN A200910135565XA CN 200910135565 A CN200910135565 A CN 200910135565A CN 101576242 A CN101576242 A CN 101576242A
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- radiator
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Abstract
The invention discloses a radiating method of a high-power LED radiator and also discloses the radiator for implementing same, and the radiator comprises a radiating support and a plurality of LED lights. A printed circuit which can be connected with the LED lights is longitudinally arranged in the middle position of the front side of the radiating support, and the LED lights are welded on the printed circuit at intervals, and are fixed on the radiating support to form an integral structure. The invention has simple structure, and can rapidly radiate the heat of the high-power LED lights, thereby reducing the speed of LED brightness decline and greatly prolonging the service life of the LED lights; the LED lights can be used for more than 50000 hours at least by practical tests.
Description
Technical field
The present invention relates to radiator, particularly a kind of heat dissipating method of high-power LED radiator and implement the radiator of this method.
Background technology
Traditional roads light, its light source adopts powerful mercury vapor lamp, Metal halogen lamp or high-pressure mercury lamp etc. mostly, contain hazardous substance mostly in its light source, cause environmental pollution easily, and the thick heaviness of the lamp holder of making, power consumption is big, maintenance cost is high, illuminating effect is all unsatisfactory at aspects such as colour rendering and anti-dazzle performances.Meanwhile, the development of semiconductor light sources light emitting diode (LED) is but very rapid, and in recent years, the luminous efficiency of partial L ED has substantially exceeded incandescent lamp, even surpasses the luminous efficiency of fluorescent lamp.Compare with traditional Projecting Lamp electric light source, the basic nonhazardous of led light source, no electromagnetic pollution and have that volume is little, energy consumption is low, light efficiency is high, caloric value is relatively low and many-sided advantage such as long service life can substitute conventional light source and make roads light.
Consider single chip LED luminosity deficiency, the LED light fixture generally adopts led array formula structure, has produced thus that LED light fixture heat is concentrated, local temperature is too high, causes the light decay aggravation, thereby influence the normal use of LED, causes the reduction in service life.At present, power type white light LED can only be converted into luminous energy with about 15% electric energy, and remaining 85% energy changes into heat energy.Along with the increase of LED power, quantity of heat production increases, and bad if heat dissipation problem solves, heat concentrates in the small-sized chip, makes that the chip internal temperature is more and more higher.The too high meeting of chip temperature brings many problems, as quickening device aging, accelerates the speed of LED light decay, reduction of service life, even also can cause chip to burn; How effectively solve heat radiation, become and high-powerly face the problem that presses for solution most at the LED light fixture.
Summary of the invention
At the existing high-power LED lamp existing above-mentioned deficiency of dispelling the heat, one of the object of the invention is, provide a kind of and can be in time the heat of great power LED be dissipated, reduce the speed of LED light decay, thereby prolong the heat dissipating method of the high-power LED radiator in its service life.
The present invention also aims to, provide a kind of simple in structure, in light weight and rapid heat dissipation is used for realizing the radiator of the heat dissipating method of aforesaid high-power LED radiator.
The present invention for achieving the above object, the technical scheme that is provided is:
A kind of heat dissipating method of high-power LED radiator, it comprises some LED lamps, it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) fixing printing circuit: the printed wire that can connect described LED lamp in the positive vertical setting in centre position of described cooling stand;
(5) make LED lamp module: at interval described LED lamp is welded on the described printed wire, and is fixed on the described cooling stand and forms integral structure;
The heat that described LED lamp produces, distributes with heat radiation and convection action through described cooling stand.
Described step (3), it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
A kind of radiator of implementing the heat dissipating method of above-mentioned high-power LED radiator, it comprises a cooling stand and some LED lamps, it is characterized in that, the printed wire that can connect described LED lamp in the positive vertical setting in centre position of described cooling stand, described LED lamp is welded on the described printed wire at interval, and is fixed on the described cooling stand and forms integral structure.
On the cooling stand front of described LED lamp both sides, be arranged with and be convenient to the semicircle ventilation slot that this cooling stand ventilates.
Move towards the heatsink transverse fin that the interval vertically is provided with the big or small corresponding area of dissipation of light source of some and described LED lamp in the described cooling stand back side along its long limit.
Described radiating fin thickness is 1～5 millimeter.
Described cooling stand adopts 99% pure aluminum material to make.
The surface of described cooling stand possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Beneficial effect of the present invention is: method provided by the invention can be rapidly dissipates the heat of high-powered LED lamp, thereby reduces the speed of its light decay, increases the service life; Radiator provided by the invention, simple in structure, the cooling stand that adopts 99% pure aluminum material to make, in light weight; For making its radiating effect better, radiating fin thickness is 1～5 millimeter, is provided with two ventilation slots so that ventilate in cooling stand simultaneously; Cooling stand is provided with printed wire, can directly weld the LED lamp, and is fixed on the described cooling stand, forms the radiator structure of integral type, can be rapidly the heat of LED lamp be distributed, thereby has thoroughly solved the heat radiation difficult problem of great power LED; Simultaneously cooling stand is by nanotechnology treatments, its without water stained on its surface, is not stained with dirt, has self-cleaning function; Prove through practical test, the present invention in the course of the work, temperature maintains 45 ℃ ± 5 ℃ scope all the time; Prolonged the service life of LED lamp greatly, can use more than 50000 hours at least.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the left view of Fig. 1.
The specific embodiment
Embodiment: referring to Fig. 1, Fig. 2 and Fig. 3, the embodiment of the invention provides a kind of heat dissipating method of high-power LED radiator, and it comprises some LED lamps 3, and it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand 1: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins 11 along its long limit trend;
(3) preparation ventilation slot 12: on described cooling stand 1 front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot 12 that this cooling stand 1 ventilates;
(4) fixing printing circuit: the printed wire that can connect described LED lamp 3 in the described cooling stand vertical setting in 1 positive centre position;
(5) make LED lamp 3 modules: at interval described LED lamp 3 is welded on the described printed wire, and is fixed on the described cooling stand 1 and forms integral structure;
The heat that described LED lamp 3 produces, distributes with heat radiation and convection action through described cooling stand 1.
Described step (3), it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand 1.
The radiator that a kind of heat dissipating method of implementing above-mentioned high-power LED radiator is made, it comprises a cooling stand 1 and some LED lamps 3, and cooling stand 1 adopts 99% pure aluminum material to make, so it is in light weight, and heat conduction is fast, good heat dissipation.Cut into slices at described cooling stand 1 back side, shaping, make the heatsink transverse fin 11 of the big or small corresponding area of dissipation of light source that move towards vertically to be provided with at interval some and described LED lamp 3 along its long limit; These radiating fin 11 thickness are 2 millimeters, and in other embodiments, these radiating fin 11 thickness can be between 1～5 millimeter; The area of dissipation of radiating fin 11 can be set according to the light source actual size of LED lamp 3, promptly change its height and width, the quantity of radiating fin 11 and the length of cooling stand 1 can be adjusted according to actual conditions simultaneously, to reach the best radiating effect of LED lamp 3.The leading indicator of estimating a radiator is the efficiently radiates heat area of radiator, and the big more expression radiating effect of efficiently radiates heat area is good more.That is: the big more radiating effect of Pin and Fin ratio is good more, and Pin is meant the area of radiating fin 11, and Fin is meant the distance between the two adjacent fins.For making its radiating effect better, on described cooling stand 1 front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot 12 that this cooling stand 1 ventilates; After described cooling stand 1 machine-shaping, adopt nano-solution to handle again, make its surface have self-cleaning function, thereby possess waterproof and dustproof and anti-oxidant is arranged; Other embodiment can carry out other technical finesse or do not handle its surface; Can connect the printed wire of described LED lamp 3 in the described cooling stand vertical setting in 1 positive centre position, at interval described LED lamp 3 is welded on this printed wire, and be fixed on the described cooling stand 1, form the radiator structure of integral type, make LED lamp 3 modules; Heat in the time of can rapidly LED lamp 3 being worked like this distributes, thereby has thoroughly solved the heat radiation difficult problem of great power LED.
As described in the above embodiment of the present invention, adopt structure same or similar and other radiator and the heat dissipating method that obtain, all in protection domain of the present invention with it.
Claims (8)
1, a kind of heat dissipating method of high-power LED radiator, it comprises some LED lamps, it is characterized in that it comprises the steps:
(1) preparation one strip metal;
(2) preparation cooling stand: hole in the described strip metal back side, section, shaping processing, make its front form panel, the back side forms and is interval with some heatsink transverse fins along its long limit trend;
(3) preparation ventilation slot: on described cooling stand front, vertically be symmetrical arranged two and be used for the semicircle ventilation slot that this cooling stand ventilates;
(4) fixing printing circuit: the printed wire that can connect described LED lamp in the positive vertical setting in centre position of described cooling stand;
(5) make LED lamp module: at interval described LED lamp is welded on the described printed wire, and is fixed on the described cooling stand and forms integral structure;
The heat that described LED lamp produces, distributes with heat radiation and convection action through described cooling stand.
2, the heat dissipating method of high-power LED radiator according to claim 1 is characterized in that, described step (3), and it also comprises the steps:
(31), be used to make this surface to possess waterproof and dustproof, the processing of oxidation resistant nano-solution in the surface of described cooling stand.
3, a kind of radiator of implementing the heat dissipating method of the described high-power LED radiator of claim 1, it comprises a cooling stand and some LED lamps, it is characterized in that, the printed wire that can connect described LED lamp in the positive vertical setting in centre position of described cooling stand, described LED lamp is welded on the described printed wire at interval, and is fixed on the described cooling stand and forms integral structure.
4, radiator according to claim 3 is characterized in that, is arranged with to be convenient to the semicircle ventilation slot that this cooling stand ventilates on the cooling stand front of described LED lamp both sides.
5, radiator according to claim 3 is characterized in that, moves towards the heatsink transverse fin that the interval vertically is provided with the big or small corresponding area of dissipation of light source of some and described LED lamp in the described cooling stand back side along its long limit.
6, radiator according to claim 5 is characterized in that, described radiating fin thickness is 1～5 millimeter.
7, radiator according to claim 3 is characterized in that, described cooling stand adopts 99% pure aluminum material to make.
8, radiator according to claim 3 is characterized in that, the surface of described cooling stand possesses waterproof and dustproof, oxidation resistant nanotechnology treatments.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910135565XA CN101576242B (en) | 2009-04-27 | 2009-04-27 | Radiating method of high-power LED radiator and radiator for implementing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910135565XA CN101576242B (en) | 2009-04-27 | 2009-04-27 | Radiating method of high-power LED radiator and radiator for implementing same |
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| Publication Number | Publication Date |
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| CN101576242A true CN101576242A (en) | 2009-11-11 |
| CN101576242B CN101576242B (en) | 2011-01-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064266A (en) * | 2010-11-03 | 2011-05-18 | 宁波江丰电子材料有限公司 | Backboard for LED (light-emitting diode) chip and preparation method thereof |
| CN102297392A (en) * | 2011-06-01 | 2011-12-28 | 深圳大学 | LED (light emitting diode) street lamp shell with wind pressure utilization, hot-press heat dissipation and self-cleaning functions |
| CN105135389A (en) * | 2015-09-18 | 2015-12-09 | 浙江大邦科技有限公司 | Radiator and LED street lamp using same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3092901B1 (en) * | 2019-02-20 | 2022-07-22 | Rouge Eng Designs | Heat sink for lighting system |
| SE545963C2 (en) * | 2021-10-20 | 2024-03-26 | Uvivo Ab | COOLING FLANGE AND A LIGHTING FIXTURE |
-
2009
- 2009-04-27 CN CN200910135565XA patent/CN101576242B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064266A (en) * | 2010-11-03 | 2011-05-18 | 宁波江丰电子材料有限公司 | Backboard for LED (light-emitting diode) chip and preparation method thereof |
| CN102064266B (en) * | 2010-11-03 | 2013-02-27 | 宁波江丰电子材料有限公司 | Backboard for LED (light-emitting diode) chip and preparation method thereof |
| CN102297392A (en) * | 2011-06-01 | 2011-12-28 | 深圳大学 | LED (light emitting diode) street lamp shell with wind pressure utilization, hot-press heat dissipation and self-cleaning functions |
| CN105135389A (en) * | 2015-09-18 | 2015-12-09 | 浙江大邦科技有限公司 | Radiator and LED street lamp using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101576242B (en) | 2011-01-05 |
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