CN101546878B - Electronic component mounting board, method for manufacturing the same and electronic circuit unit - Google Patents

Electronic component mounting board, method for manufacturing the same and electronic circuit unit Download PDF

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Publication number
CN101546878B
CN101546878B CN2009101295432A CN200910129543A CN101546878B CN 101546878 B CN101546878 B CN 101546878B CN 2009101295432 A CN2009101295432 A CN 2009101295432A CN 200910129543 A CN200910129543 A CN 200910129543A CN 101546878 B CN101546878 B CN 101546878B
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China
Prior art keywords
protuberance
matrix
electrode
electronic unit
substrate
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CN2009101295432A
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CN101546878A (en
Inventor
石井裕
直江邦浩
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Fujikura Ltd
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Fujikura Ltd
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Priority claimed from JP2008095019A external-priority patent/JP4852565B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

The present invention relates to an electronic component mounting board, a method for manufacturing the same and an electronic circuit unit. The electronic component mounting board includes: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

Description

Electronic unit mounting substrate and manufacture method thereof, electronic circuit component
The application is willing to 2008-079587 number based on 03 26th, 2008 spies to Japanese publication and on 04 01st, 2008 spy to Japanese publication is willing to advocate priority 2008-095019 number, and their content is applied at this.
Technical field
The present invention relates to the electronic unit mounting substrate, more specifically, the present invention relates to and to guarantee irrespectively that with the height tolerance of electronic unit enough the contact press and can reduce the electronic unit mounting substrate and the manufacture method thereof of conducting resistance and inductance and have the electronic circuit component of this electronic unit mounting substrate.
Background technology
In the past, as the installation method of the different circuit substrate of the height that electronic unit is installed to electrode etc., for example disclose the employing of opening record in the flat 11-214594 communique (hereinafter referred to as patent documentation 1) the spy utilized anisotropic conductive flexure strip (elastomer sheet) mounting substrate method or adopt the method for the mounting substrate that has utilized conductive elastomer for example shown in Figure 26 or adopt the method for the mounting substrate that has utilized leaf spring for example shown in Figure 27.
But, in the use of patent documentation 1 record in the method for anisotropic conductive flexure strip, electrically conductive microparticle is dispersed in the elastomer, has conductivity.Therefore, if compare, in any case all can have bigger contact resistance, conducting resistance with good conductors such as metals.And, be difficult to narrow and smallization of spacing.And, owing to the anisotropic conductive flexure strip itself costs an arm and a leg, so the cost height.
In addition, using conductive elastomer 103 shown in Figure 26, the conductive part β of the solder protuberance α of electronic unit 160 and circuit substrate 170 is electrically connected to be fetched in the method for installing, the same with the situation of using the anisotropic conductive flexure strip, compare with good conductor such as metal, contact resistance, conducting resistance become big.If reduce contact resistance and conducting resistance, then can increase the mix proportion of the electrically conductive microparticle that in elastomer, mixes, but this can reduce the deformability of conductive elastomer 103.That is, cause conductive elastomer 103 to become high resiliency～rigid body,, be difficult to possess enough addendum modifications as the stroke (stroke) of contact electrode.Thus, if do not possess enough path increments, then when the electrode that is possessed being installed having the electronic unit 160 of height tolerance or circuit substrate 170, realize conducting, but become insufficient than the Mechanical Contact of low electrode with height with highly higher electrode Mechanical Contact.As a result, might come in contact resistance increases or poor flow.
In addition, using leaf spring 113 shown in Figure 27, the method that electronic unit 160 and circuit substrate 170 are electrically connected need have mechanical spring structure.Therefore, be difficult to reduce terminal pitch.And, also might make conductivity reduce because of the oxidation of leaf spring 113.
And,, need to prolong leaf spring in order to ensure enough path increments.In addition, reducing under the situation of terminal pitch, leaf spring is attenuated.Therefore, because under any circumstance, inductance all can increase, so be difficult to use in high frequency electronic component.
Summary of the invention
The present invention is the invention of In view of the foregoing finishing, its purpose is, even if provide a kind of under the situation of the different electronic unit of the height that conductive part is installed, also can guarantee enough contact pressures, contact resistance and inductance are little and conductivity is outstanding, and have realized the electronic unit mounting substrate of cost degradation.
The present invention has adopted following scheme in order to solve above-mentioned problem, to realize goal of the invention.
(1) electronic unit mounting substrate of the present invention has: matrix, and it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation; Conductive component, it is configured to main part and is filled in these through holes, an end and the other end in aforementioned body portion have first protuberance and second protuberance respectively, and above-mentioned first protuberance is outstanding in the one side of above-mentioned matrix, and above-mentioned second protuberance is outstanding at the another side of above-mentioned matrix; Flexible base plate, it is configured in the above-mentioned one side of above-mentioned matrix, and has first peristome that above-mentioned first protuberance connects respectively; With oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that above-mentioned first protuberance connects; Above-mentioned each electrode is separated from each other configuration, at above-mentioned second peristome of a distolateral formation of above-mentioned each electrode.
In the electronic unit mounting substrate of above-mentioned (1) record, matrix is made of elastomer, and disposes electrode on a face of matrix.Therefore, when the conductive part of electrode and electronic unit etc. contacts, between electrode and conductive part, kept the contact of regulation to press.Especially the conductive part at electronic unit exists under the situation of height tolerance, and matrix can absorb the deviation of height.As a result, kept the excellent contact state.Therefore, can when alleviating loose contact, reduce to connect resistance.In addition, since the pin that used conductivity as conductive component, so can reduce conducting resistance.And, owing to can widen and shorten conducting portion, so can reduce the inductance of electrode.Therefore, the electronic unit mounting substrate of above-mentioned (1) record can be used for installation, the connection of high frequency electronic component.In addition, owing to can easily reduce electrode gap, can provide a kind of electronic unit mounting substrate of realizing the electrode configuration of planar high density arrangement.
(2) preferably also be provided with predetermined distance a plurality of protuberances of configuration side by side in the above-mentioned at least one side of above-mentioned matrix, the above-mentioned through hole of configuration between these protuberances, an above-mentioned end of aforementioned body portion and the top of raised part are positioned on the same imaginary plane, and the mode that aforesaid substrate joins according to the above-mentioned end face with a plurality of raised part is configured in the above-mentioned one side side of above-mentioned matrix.
Under the situation of above-mentioned (2), when electrode contacts with the conductive part of electronic unit etc.,, be configured in the height tolerance that protuberance on the matrix also can absorb this conductive part even if exist under the situation of height tolerance at the conductive part of electronic unit.As a result, between electrode and conductive part, kept the contact of regulation to press.Thus, can keep the excellent contact state, can when alleviating loose contact, reduce to connect resistance.
(3) preferably along another distolateral shape of above-mentioned electrode, on aforesaid substrate, dispose slit.
(4) preferably also dispose the tectosome that forms by above-mentioned electrode and aforesaid substrate at the another side of above-mentioned matrix.
(5) preferred another distolateral protrusion that disposes of the above-mentioned electrode on the one side of above-mentioned electrode.
(6) preferred another distolateral recess that disposes of the above-mentioned electrode on the one side of above-mentioned electrode.
(7) manufacture method of electronic unit mounting substrate of the present invention, this electronic unit mounting substrate has: matrix, it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation; Conductive component, it is configured to main part and is filled in these through holes, an end and the other end in aforementioned body portion have first protuberance and second protuberance respectively, and above-mentioned first protuberance is outstanding in the one side of above-mentioned matrix, and above-mentioned second protuberance is outstanding at the another side of above-mentioned matrix; Flexible base plate, it is configured in the above-mentioned one side of above-mentioned matrix, and has first peristome that above-mentioned first protuberance connects respectively; With oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that above-mentioned first protuberance connects; Above-mentioned each electrode is separated from each other configuration, at above-mentioned second peristome of a distolateral formation of above-mentioned each electrode; The manufacture method of described electronic unit mounting substrate has: the operation that a plurality of above-mentioned through holes are set with the interval of regulation on above-mentioned matrix; According to the mode that above-mentioned first protuberance and above-mentioned second protuberance of above-mentioned conductive component are given prominence at the above-mentioned one side and the above-mentioned another side of above-mentioned matrix respectively, above-mentioned conductive component is inserted into the operation of above-mentioned through hole; Above-mentioned one side at aforesaid substrate is provided with a plurality of above-mentioned electrodes, the position suitable with above-mentioned first protuberance at aforesaid substrate is provided with above-mentioned first peristome, in the position suitable with above-mentioned first protuberance of above-mentioned electrode the operation that above-mentioned second peristome forms tectosome is set; With the mode of inserting above-mentioned first protuberance of above-mentioned conductive component according to above-mentioned first peristome and above-mentioned second peristome, above-mentioned tectosome is arranged on the operation on the above-mentioned one side of above-mentioned matrix to above-mentioned tectosome.
(8) manufacture method of electronic unit mounting substrate of the present invention, this electronic unit mounting substrate has: matrix, it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation; Conductive component, it is configured to main part and is filled in these through holes, an end and the other end in aforementioned body portion have first protuberance and second protuberance respectively, and above-mentioned first protuberance is outstanding in the one side of above-mentioned matrix, and above-mentioned second protuberance is outstanding at the another side of above-mentioned matrix; Flexible base plate, it is configured in the above-mentioned one side of above-mentioned matrix, and has first peristome that above-mentioned first protuberance connects respectively; Oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that above-mentioned first protuberance connects; And protuberance, its spacing parallel arranging configuration with regulation on the one side at least of above-mentioned matrix is a plurality of; Above-mentioned electrode is configured to have to each other partitions, at above-mentioned second peristome of a distolateral formation of above-mentioned each electrode; The above-mentioned through hole of configuration between raised part; An above-mentioned end of aforementioned body portion and the end face of raised part are positioned on the same imaginary plane; Aforesaid substrate is configured in the above-mentioned one side side of above-mentioned matrix according to the mode that the above-mentioned end face with a plurality of raised part joins; The manufacture method of described electronic unit mounting substrate has: the operation that a plurality of above-mentioned through holes are set between the raised part of above-mentioned matrix; According to the mode that above-mentioned first protuberance and above-mentioned second protuberance of above-mentioned conductive component are given prominence at the above-mentioned one side and the above-mentioned another side of above-mentioned matrix respectively, above-mentioned conductive component is inserted into the operation of above-mentioned through hole; A plurality of above-mentioned electrodes are set on the above-mentioned one side of aforesaid substrate, the position suitable with above-mentioned first protuberance at aforesaid substrate is provided with above-mentioned first peristome, in the position suitable with above-mentioned first protuberance of above-mentioned electrode the operation that above-mentioned second peristome forms tectosome is set; With the mode that the end face of the raised part that disposes on the another side of above-mentioned first protuberance that inserts above-mentioned conductive component according to above-mentioned first peristome and above-mentioned second peristome to above-mentioned tectosome and aforesaid substrate and the one side at above-mentioned matrix joins, the operation of above-mentioned tectosome is set.
(9) circuit block of the present invention has the electronic unit mounting substrate of record in above-mentioned (1) or (2).
Description of drawings
Figure 1A is a vertical view of schematically representing the electronic unit mounting substrate relevant with first execution mode of the present invention.
Figure 1B is the profile of Figure 1A.
Fig. 2 A is a vertical view of schematically representing the variation of electrode.
Fig. 2 B is a vertical view of schematically representing the variation of electrode.
Fig. 3 A is the vertical view of first operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Fig. 3 B is the profile of Fig. 3 A.
Fig. 4 A is the vertical view of second operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Fig. 4 B is the profile of Fig. 4 A.
Fig. 5 A is the vertical view of the 3rd operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Fig. 5 B is the profile of Fig. 5 A.
Fig. 6 schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Fig. 7 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with second execution mode of the present invention.
Fig. 7 B is the profile of Fig. 7 A.
Fig. 8 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 3rd execution mode of the present invention.
Fig. 8 B is the profile of Fig. 8 A.
Fig. 9 schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 10 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 4th execution mode of the present invention.
Figure 10 B is the profile of Figure 10 A.
Figure 11 schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 12 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 5th execution mode of the present invention.
Figure 12 B schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 13 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 6th execution mode of the present invention.
Figure 13 B is the profile of Figure 13 A.
Figure 14 A is the vertical view of first operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Figure 14 B is the profile of Figure 14 A.
Figure 15 A is the vertical view of second operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Figure 15 B is the profile of Figure 15 A.
Figure 16 A is the vertical view of the 3rd operation of schematically representing the manufacture method of the electronic unit mounting substrate relevant with this execution mode.
Figure 16 B is the profile of Figure 16 A.
Figure 17 schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 18 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 7th execution mode of the present invention.
Figure 18 B is the profile of Figure 18 A.
Figure 19 schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 20 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 8th execution mode of the present invention.
Figure 20 B schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 21 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 9th execution mode of the present invention.
Figure 21 B schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 22 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the tenth execution mode of the present invention.
Figure 22 B is the profile of Figure 22 A.
Figure 23 A schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 23 B schematically represents to use the electronic unit mounting substrate relevant with the 11 execution mode that the profile of one example of electronic unit is installed.
Figure 24 A is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 12 execution mode of the present invention.
Figure 24 B schematically represents to use the electronic unit mounting substrate relevant with this execution mode that the profile of one example of electronic unit is installed.
Figure 25 is a vertical view of schematically representing the electronic unit mounting substrate relevant with the 13 execution mode of the present invention.
Figure 26 is a profile of schematically representing an example of electronic unit mounting substrate in the past.
Figure 27 is other routine profiles of schematically representing electronic unit mounting substrate in the past.
Embodiment
＜the first execution mode 〉
Below, present invention will be described in detail with reference to the accompanying, but the present invention is not limited to this, without departing from the spirit and scope of the present invention, can carry out various changes.
Figure 1A, 1B are the figure that schematically represents first execution mode of electronic unit mounting substrate 10 of the present invention (10A).Figure 1A is a vertical view, and Figure 1B is the L-L profile of Figure 1A.
Electronic unit mounting substrate 10A of the present invention is made of following part summary, that is: matrix 1, and it is made of flat elastomer, has a plurality of through holes 2 with the spacing parallel arranging configuration of regulation; Conductive component 3, it is configured to main part 3c and is filled in the through hole 2, at one end have the first protuberance 3a and the second protuberance 3b respectively with the other end, the first protuberance 3a is outstanding at the one side 1a of matrix 1, and the second protuberance 3b is outstanding at the another side 1b of matrix 1; Flexible base plate 4, it is configured on the one side 1a of matrix 1, and has the first peristome 4c that the first protuberance 3a connects respectively; With oval shape electrode 5, it disposes a plurality of on substrate 4, and each all has the second peristome 5d that the first protuberance 3a connects.In addition, electrode 5 is spaced from each other (having partitions 7) configuration.Near formation second a peristome 5d end 5e side of electrode 5.Below, be elaborated respectively.
Matrix 1 is made of flat elastomer.Matrix 1 is provided with the through hole 2 that is used for inserting to its thickness direction conductive component 3.This through hole 2 direction in the face of matrix 1 is a plurality of with being arranged at intervals with of regulation.Here, the interval of regulation for example is meant 0.5mm spacing～1mm spacing.Matrix 1 can suitably be regulated its thickness and hardness (elasticity) is used according to the path increment of necessity, and its thickness for example is 200 μ m～1000 μ m.
Matrix 1 is an elastomer, for example is made of natural rubber, latex, butyl rubber, silicone rubber, fluorubber etc.Matrix 1 can be according to the path increment or the characteristic of necessity, suitably selects in the middle of these and uses.Requiring under the bubble-tight situation, preferably using the outstanding butyl rubber of air-tightness.In addition, carrying out repeatedly continually under the situation of load-unloading, because permanent deflection is little, and reproducibility is good, so preferably use silicone rubber.
Silicone rubber can be regulated its hardness (elasticity) by the amount of method of vulcanizing or the filler that mixes with elastomeric material.Usually, under the few situation of the amount of filler of adding, can obtain softness and easy deformation, matrix 1 that path increment is big.On the other hand, if increase the filler that is added, then obtain hard and be difficult to be out of shape, matrix 1 that path increment is little.As this filler, for example can use silicon dioxide (SiO 2) or carbon black.
As fluorubber, can use fluorine compounds monomers such as vinylidene, hexafluoropropylene, tetrafluoroethene, whole fluorinated methyl vinyl ethers as raw material.By the starting monomer that makes this ormal weight is carried out the polymer that polymerization obtains, utilize peroxide or polyalcohol to make it that cross-linking reaction take place, can obtain fluorubber.
In through hole 2, dispose the main part 3c of conductive component 3.The position of the conductive part of the electronic unit that through hole 2 maybe will be installed according to electrode 5 is arranged on the matrix 1.As the size of through hole 2, can suitably regulate being provided with according to the inductance that is required (size of conductive component 3), for example be 50 μ m～250 μ m.
Conductive component 3 be by be filled in main part 3c in the through hole 2, at outstanding first protuberance 3a of the one side 1a of matrix 1 and the pin shape parts that constitute at the second outstanding protuberance 3b of the another side 1b of matrix 1.As this conductive component 3, can enumerate the outstanding copper of conductivity, brass, aluminium, stainless steel etc.Good in order to make with being electrically connected of electrode 5, can implement surface treatment to conductive component 3 as required.Especially in that conductive component 3 and electrode 5 are carried out under the situation of soldering, can use copper material or brass, can be coated with solder flux (flux) etc. in coupling part as required with electrode 5 as conductive component 3.
Like this, by using metal conductive component 3, with in the past use the situation of anisotropic conductive flexure strip or conductive elastomer compare, can reduce contact resistance, conducting resistance.In addition, by using the conductive component 3 of pin shape, can widen the width of conducting portion (main part 3c) and shorten its length.Therefore, compare, can realize the reduction of inductance with the situation of in the past use leaf spring.
Substrate 4 is configured on the one side 1a of matrix 1, is provided with a plurality of first peristome 4c that connected by the first protuberance 3a of conductive component 3.As this substrate 4, the preferred flexible base plate that uses, for example can enumerate the film like substrate that forms by PETG (PET), PEN (PEN), polyether sulfone (PES) etc., perhaps substrate that forms by polyimides, polyamidoimide, Polyetherimide etc. etc.In addition, the thickness of substrate 4 for example is 25 μ m～125 μ m.
Electrode 5 disposes a plurality of on the one side 4d of substrate 4, and each electrode 5 has partitions 7 each other.And electrode 5 is oval shape, is provided with the second peristome 5d of the first protuberance 3a that exposes conductive component 3 at the distolateral 5e of one.The end face of the one side 5c of electrode 5 and the first protuberance 3a can be on face roughly, can be not yet on face roughly.Here, roughly face is meant that the ladder difference of the end face of the one side 5c of electrode 5 and the first protuberance 3a is-10 μ m～+ 10 μ m.When electronic unit is installed,, can prevent that the first protuberance 3a from contacting with other electronic unit by on face roughly.And the area maximum that the side of the first protuberance 3a is contacted with electrode 5 realizes the raising of conducting.
As electrode 5, so long as material soft and that process, have conductivity easily gets final product, be not particularly limited, for example can enumerate copper or silver etc.The line of electrode 5 and interval (line and space) can suitably be regulated according to the spacing of conductive component 3.For example, when the spacing of conductive component 3 was 1mm, the line of electrode 5 and interval were about 0.35mm (L/S=0.350/0.350); When the spacing of conductive component 3 was 0.75mm, the line of electrode 5 and interval were about 0.265mm (L/S=0.265/0.265); When the spacing of conductive component 3 was 0.5mm, the line of electrode 5 and interval were about 0.175mm (L/S=0.175/0.175).
As the shape of electrode 5, so long as when electronic unit has been installed, can obtains enough path increments and get final product, the oval shape that is not limited to put down in writing among Fig. 1.As other shapes, for example can be the electrode 15 of 8 fonts shown in Fig. 2 A (Western pyriform), the electrode 25 of the shape that the front end shown in can also Fig. 2 B attenuates.
Fig. 3 A～Fig. 5 B is the figure that schematically represents the manufacture method of electronic unit mounting substrate 10A of the present invention.
At first, shown in Fig. 3 A, 3B, on matrix 1, form a plurality of through holes 2 with desirable interval.Fig. 3 A is a vertical view, and Fig. 3 B is the L-L profile of Fig. 3 A.Matrix 1 with through hole 2 can use the injection molding forming technology that has adopted metal pattern to make easily.Perhaps, can process formation through hole 2 on the matrix 1 of sheet by machining or based on the perforation of laser.Through hole 2 for example can be provided with the spacing of 0.5mm～1mm.
Then, shown in Fig. 4 A, 4B, respectively in the one side 1a and the outstanding mode of another side 1b of matrix 1, insert the main body 3c of conductive component 3 in the through hole of in Fig. 3 A, 3B, making 2 according to the first protuberance 3a of conductive component 3 and the second protuberance 3b.Fig. 4 A is a vertical view, and Fig. 4 B is the L-L profile of Fig. 4 A.As the method for inserting conductive component 3, use usually to be pressed into, to embed (insert) shaping etc., as long as can under the situation of not damaging matrix 1, insert, be not particularly limited.
Then, shown in Fig. 5 A, 5B, on the one side 4d of substrate 4, form a plurality of electrodes 5, on substrate 4, make the first peristome 4c of the first protuberance 3a perforation of conductive component 3, on electrode 5, make the second peristome 5d, form tectosome 6.Perhaps, can be earlier on substrate 4, form the first peristome 4c, electrode 5 is formed have the second peristome 5d then.Fig. 5 A is a vertical view, and Fig. 5 B is the L-L profile of Fig. 5 A.
About the formation method of tectosome 6, can adopt in the past known method to carry out.Under the situation that substrate 4 is for example formed by films such as PET, PEN, PES, printing on these films, be coated with or draw the conductive paste that contains the Ag powder etc., form electrode 5.
Under the situation that substrate 4 for example is made of polyimides, polyamidoimide, polyethers etc., forming with Cu on the one side 4d of these substrates 4 is the metal electrode 5 of principal component.
As the method that forms metal electrode 5, can enumerate for the Copper Foil flexible substrate that on substrate 4, is pasted with rolled copper foil or electrolytic copper foil, adopt the reduction method of photoetching technique (circuit pattern based on series of process such as removing of resist-coating, exposure, development, etching and resist forms).Perhaps, can also enumerate semi-additive process, promptly apply and wait, after being coated with resist, use photoetching technique then, form plating resist pattern at the copper layer that forms on the above-mentioned film about 0.1～1.0 μ m by electroless plating.Subsequently,, only electrode 5 parts are made the Copper Foil thick filmization based on electro-coppering etc., remove otiose kind of crystal layer subsequently by electroplating.Perhaps can also use the additive process that after the pattern that forms electrode 5 by resist, makes copper electrode pattern growth etc.
Subsequently, to the first protuberance 3a of the first peristome 4c and second peristome 5d insertion conductive component 3, arrangement body 6 on the one side 1a of matrix 1.
By above-mentioned steps, obtain electronic unit mounting substrate 10A of the present invention.
Fig. 6 is the electronic unit mounting substrate 10A that schematically represents to use present embodiment, and electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed on the circuit substrate 70 and the profile of an example of the electronic circuit component that obtains.The solder protuberance α that disposes on the one side 61a of first base material 61 of electronic unit 60 contacts with electrode 5, and the second protuberance 3b of conductive component 3 contacts with conductive part β in the one side configuration of second base material 70 of circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.
Be not particularly limited as electronic unit 60 and circuit substrate 70, can use known device.Conductive part β as in the solder protuberance α of configuration on the semi-conductor electricity electronic circuit 60 and configuration on circuit substrate 70 can use known in the past parts, and its size etc. is not particularly limited.
The position that electrode 5 is contacted by adjusting with solder protuberance α, suitably adjustment stroke amount.That is, greater than the size of other solder protuberances or be configured under the situation of highly higher position, near the other end 5f of electrode 5 side, electrode 5 is contacted with solder protuberance α, increase path increment in the size of solder protuberance α.Littler or be configured under the situation of highly lower position at solder protuberance α than other solder protuberances, near an end 5e side of electrode 5, electrode 5 is contacted with solder protuberance α, reduce path increment.
By according to the electronic unit of so installing, the contact site of solder protuberance α and electrode 5 is changed, obtain suitable path increment, can fully guarantee the pressure that contacts of solder protuberance α and electrode 5.As a result, can suppress the increase of poor flow or contact resistance.
Contact with electrode 5 by solder protuberance α etc. and to pressurize, destroyed in the oxide film thereon that the surface of solder protuberance α or electrode 5 forms because of wiping effect.Thus, can realize the raising of conductivity.
＜the second execution mode 〉
Fig. 7 A, 7B are the figure that schematically represents the electronic unit mounting substrate 10 (10B) relevant with second execution mode of the present invention.Give identical symbol to the part identical, omit explanation them with first execution mode.Fig. 7 A is a vertical view, and Fig. 7 B is the L-L profile of Fig. 7 A.The difference of the present embodiment and first execution mode is, the shape along the other end 5f side of electrode 5 disposes slit 9 on substrate 4.
As long as slit 9 is configured to surround at least the periphery of an end 5f side of electrode 5.By this slit 9, the path increment of electrode 5 increases, and when similarly electronic unit 60 being installed with first execution mode, can further absorb the height tolerance of solder protuberance α.Therefore, can in scope widely, regulate the contact pressure of electrode 5 and the solder protuberance α of electronic unit 60.As a result, can realize the homogenizing of the height of electronic unit, can more effective inhibition loose contact etc.
In order on substrate 4, to make such slit 9, by utilizing punch or laser etc. substrate 4 is processed, can be provided with easy and accurately.
＜the three execution mode 〉
Fig. 8 A, 8B are the figure that schematically represents the electronic unit mounting substrate 10 (10C) relevant with the 3rd execution mode of the present invention.Give identical symbol to the part identical, and omit explanation them with second execution mode.Fig. 8 A is a vertical view, and Fig. 8 B is the L-L profile of Fig. 8 A.The difference of the present embodiment and second execution mode is, disposes tectosome 6 (6a, 6b) at the two sides of matrix 1 1a, 1b.
By as present embodiment, the substrate 4 (4a, 4b) dispose electrode 5 (5a, 5b) is set, is tectosome 6 (6a, 6b) at the two sides of matrix 1 1a, 1b, can when being installed, electronic unit etc. more effectively absorb height tolerance on the two sides of matrix 1.Therefore, can there be the electronic unit 60 or the circuit substrate 70 of deviation, with higher design freedom assembling electronic circuit component in the two sides setting height(from bottom).
Represented to be provided with on the substrate 4 (4a, 4b) on the two sides that is disposed at matrix 1 the electronic unit mounting substrate of slit 9 among Fig. 8 A, the 8B, but under the little situation of the path increment of needs, can slit 9 similarly be set with first execution mode on substrate 4, also can be only in any one party setting of substrate 4a, 4b.
Fig. 9 is the electronic unit mounting substrate 10C that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The solder protuberance α that is configured on the semi-conductor electricity electronic circuit 60 contacts with the electrode 5a that disposes on the one side 1a of matrix 1, and the electrode 5b that disposes on the another side 1b of matrix 1 contacts with the conductive part β of circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.Under the situation of the electronic unit mounting substrate 10C that has used present embodiment, except obtaining the effect identical with above-mentioned first execution mode, owing to dispose tectosome 6 (6a, 6b) on the two sides of matrix 1, so can have the circuit substrate 70 of deviation in the two sides of matrix 1 setting height(from bottom), can access the high electronic circuit component of design freedom.In addition, contact with electrode 5b by conductive part β and to pressurize, destroyed in the oxide film thereon that the surface of conductive part β or electrode 5b forms because of wiping effect, can realize the raising of conductivity thus.
＜the four execution mode 〉
Figure 10 A, 10B are the figure that schematically represents the electronic unit mounting substrate 10 (10D) relevant with the 4th execution mode of the present invention.Figure 10 A is a vertical view, and Figure 10 B is the L-L profile of Figure 10 A.The difference of the present embodiment and second execution mode is, on the one side 5c of electrode 5, dispose protrusion 51 in the other end 5f of electrode 5 side, promptly, near electrode 5 and contact point that the conductive part (solder protuberance α) of electronic unit 60 contacts, dispose protrusion 51.
Protrusion 51 is configured in the contact point that electrode 5 contacts with the conductive part (solder protuberance α) of electronic unit 60.As protrusion 51, its shape is not particularly limited, shown in Figure 10 A, the 10B, can be the protrusion that the surface has curved surface for example, also can have a plurality of concavo-convex on the surface.
By protrusion 51 so is set, can increase the pressure that contacts with electronic unit 60.Thus, can more effectively suppress loose contact.
Represented on substrate 4, to be provided with the electronic unit mounting substrate of slit 9 among Figure 10 A, the 10B, but under the little situation of the path increment of needs, can slit 9 similarly be set on substrate 4 with first execution mode.
Figure 11 is the electronic unit mounting substrate 10D that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The solder protuberance α that is configured on the one side of semi-conductor electricity electronic circuit 60 contact with the protrusion 51 of configuration on electrode 5, and the second protuberance 3b of conductive component 3 contacts with the conductive part β that disposes on circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.By so contacting, can increase contact and press by protrusion 51.As a result, can more effectively suppress loose contact.In addition, because the enhancing of the wiping effect on the contact-making surface of protrusion 51 and solder protuberance α, so the oxide film thereon that forms on the surface of protrusion 51 or solder protuberance α is destroyed easily.Thus, can realize the raising of conductivity.
＜the five execution mode 〉
Figure 12 A, 12B are the figure that schematically represents the electronic unit mounting substrate 10 (10E) relevant with the 5th execution mode of the present invention.Figure 12 A is the same with above-mentioned first execution mode～the 4th execution mode, schematically shows the profile of electronic unit mounting substrate.Because vertical view (plane graph) is the same with the 4th execution mode, so omit.
The difference of present embodiment and the 3rd execution mode is, near the contact point of electrode 5 (5a, 5b) that is disposed at the tectosome 6 (6a, 6b) on two sides 1a, the 1b of matrix 1 and electronic unit, disposes protrusion 51 (51a, 51b).About protrusion 51, the same with the 4th execution mode.
According to present embodiment, by protrusion 51 is set, can increase the pressure that contacts with electronic unit 60 and circuit substrate 70, can more effectively suppress loose contact.
Illustrate the electronic unit mounting substrate that on the substrate 4 (4a, 4b) that is disposed on two sides 1a, the 1b of matrix 1, is provided with slit 9 among Figure 12 A, the 12B, but under the little situation of the path increment of necessity, can similarly on substrate 4 (4a, 4b), slit 9 be set with first execution mode, can be only slit 9 be set yet in any one party of substrate 4a, 4b.
Figure 12 B is the electronic unit mounting substrate 10E that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The solder protuberance α that is configured on the one side of semi-conductor electricity electronic circuit 60 contacts with the protrusion 51a that disposes on electrode 5a, and the conductive part β that is configured on the circuit substrate 70 contacts with the protrusion 51b that disposes on the electrode 5b of matrix 1.Thus, solder protuberance α and conductive part β are electrically connected.By so protrusion 51 (51a, 51b) being set on each, can increase the pressure that contacts with electronic unit 60 and circuit substrate 70 at the electrode on the two sides that is disposed at matrix 15 (5a, 5b).As a result, can more effectively suppress loose contact.In addition, protrusion 51a and solder protuberance α, and the contact-making surface of protrusion 51b and conductive part β on the wiping effect enhancing, therefore, oxide film thereon is destroyed easily, can realize the raising of conductivity.
＜the six execution mode 〉
Figure 13 A, 13B are the figure that schematically represents the 6th execution mode of electronic unit mounting substrate 10 of the present invention (10F).Figure 13 A is a vertical view, and Figure 13 B is the L-L profile of Figure 13 A.
Electronic unit mounting substrate 10 of the present invention (10F) is made of following part summary, that is: matrix 1, it is made of tabular elastomer, has on the 1a with a plurality of protuberance 1A of the spacing parallel arranging configuration of regulation and is configured in through hole 2 between the protuberance 1A respectively in its one side; Conductive component 3, its at least a portion that is configured to main part 3c is filled in the through hole 2, and the end of main part 3c and the end face 1At of protuberance 1A are in the same plane, an end and the other end at main part 3c dispose the first protuberance 3a and the second protuberance 3b respectively, the first protuberance 3a is outstanding at the one side 1a of matrix 1, and the second protuberance 3b is outstanding at the another side 1b of matrix 1; With tectosome 6, it is made of flexible base plate 4 and oval shape electrode 5, the mode that this flexible base plate 4 joins according to the end face 1At with a plurality of protuberance 1A is configured in the one side 1a side of matrix 1, and be provided with the first peristome 4c that the first protuberance 3a connects respectively, this oval shape electrode 5 disposes a plurality of on substrate 4, and each all has the second peristome 5d that the first protuberance 3a connects.And electrode 5 has partitions 7 mutually and disposes.Near formation second a peristome 5d end 5e side of electrode 5.Below, be elaborated respectively.
On the one side 1a of matrix 1, be formed with protuberance 1A with the predetermined distance configuration.Here, predetermined distance is meant for example 0.5mm spacing～1mm spacing.And the through hole 2 that is used to insert conductive component 3 is configured in the thickness direction of matrix 1.This through hole 2 is arranged between each protuberance 1A.
Protuberance 1A is by constituting with matrix 1 identical materials.The size of protuberance 1A, highly can when being installed, electronic unit suitably regulate setting by necessary path increment.About protuberance 1A, for example the height from the one side 1a of matrix 1 to the end face of protuberance 1A is 50 μ m～300 μ m, and width is 100 μ m～500 μ m.In addition, as its shape, get final product so long as can have suitable path increment and can stablize mounting substrate 4, be not particularly limited, for example can enumerate the shape of the end face planarization of polygonal pyramid such as polygon prism such as cylindric, triangular prism or quadrangular or positive polygon prism, circular cone or pyrometric cone, rectangular pyramid or positive polygonal pyramid etc.
In addition, preferably the height of each protuberance 1A is identical, and the end face of protuberance 1A is in the same plane.Make tectosome 6 be stabilized the ground mounting, can make and press constant with contacting of electronic unit in the end face of protuberance 1A.
A plurality of tectosomes can be configured on the one side 1a of matrix 1.At this moment, can change height and the width of protuberance 1A to each of each tectosome 6.
By configuration protuberance 1A on the one side 1a of matrix 1, even if under the situation of the elastomeric elasticity height (firmly) that uses, also can guarantee enough path increments as matrix 1.That is, owing to be provided with space 14 at protuberance 1A periphery, so, matrix 1 (protuberance 1A) easy deformation at the position of supporting electrode 5.Therefore, can use the elastomer of elasticity height (firmly) as matrix 1.Thereby, can widen the setting range of load and path increment, realize the optimal design of electronic unit mounting substrate easily.
In the present embodiment, in through hole 2, disposed at least a portion of the main part 3c of conductive component 3.Conductive component 3 is by the main part 3c that has filled its at least a portion in through hole 2, is configured in an end and first protuberance 3a of the other end and the pin shape parts that the second protuberance 3b constitutes of main part 3c respectively.And the end of main part 3c and the end face 1At of protuberance 1A are in the same plane.The first protuberance 3a is side-prominent in the one side of matrix 1, and the second protuberance 3b is side-prominent at the another side 1b of matrix 1.
Substrate 4 is configured to join with the end face 1At of each protuberance 1A at the one side 1a of matrix 1.
Electrode 5 disposes a plurality of on the one side 4d of substrate 4, and each electrode 5 has partitions 7 each other.And electrode 5 is oval shape, is provided with the second peristome 5d of the first protuberance 3a that exposes conductive component 3 at the distolateral 5e of one.On the other hand, other end 5f side of electrode 5 (contacting a side) and the end face 1At overlay configuration that is configured in the protuberance 1A on the one side 1a of matrix 1 with the conductive part of electronic unit.
Figure 14 A～Figure 16 B is the figure that schematically represents the manufacture method of electronic unit mounting substrate 10F of the present invention.
At first, shown in Figure 14 A, 14B, be formed on the matrix 1 that has a plurality of protuberance 1A on the one side 1a and between protuberance 1A, have through hole 2.Figure 14 A is a vertical view, and Figure 14 B is the L-L profile of Figure 14 A.
Matrix 1 with through hole 2 and protuberance 1A can be made easily by the injection molding forming technology that has adopted metal pattern.Perhaps, can make after the flaky matrix 1 with protuberance 1A is shaped, be processed to form through hole 2 by machining or based on the perforation of laser.
Then, shown in Figure 15 A, 15B, respectively in the one side 1a and the outstanding mode of another side 1b of matrix 1, insert the main body 3c of conductive component 3 in the through hole of in Figure 14 A, 14B, making 2 according to the first protuberance 3a of conductive component 3 and the second protuberance 3b.At this moment, the first protuberance 3a is more outstanding than the end face 1At of the protuberance 1A on the one side 1a that is configured in matrix 1.Figure 15 A is a vertical view, and Figure 15 B is the L-L profile of Figure 15 A.
As the method that conductive component 3 is inserted into through hole 2, use usually to be pressed into and to embed (insert) shaping etc., as long as but can under the situation of not damaging matrix 1, insert, be not particularly limited.
Then, shown in Figure 16 A, 16B, on the one side 4d of substrate 4, form a plurality of electrodes 5, on substrate 4, make the first peristome 4c of the first protuberance 3a perforation of conductive component 3, on electrode 5, make the second peristome 5d, form tectosome 6.Perhaps, can be earlier on substrate 4, form the first peristome 4c, electrode 5 is formed have the second peristome 5d then.Figure 16 A is a vertical view, and Figure 16 B is the L-L profile of Figure 16 A.
About the formation method of tectosome 6, identical with above-mentioned first execution mode.
Subsequently, insert the first protuberance 3a of conductive component 3, the mode arrangement body 6 that joins with the another side 4e of the end face 1At of the protuberance 1A on the one side 1a that is configured in matrix 1 and substrate 4 to the first peristome 4c and the second peristome 5d.
By above-mentioned steps, obtain the electronic unit mounting substrate 10F of the present invention shown in Figure 13 A, 13B.
Figure 17 is the electronic unit mounting substrate 10F that schematically represents to use present embodiment, and electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed on the circuit substrate 70 and the profile of an example of the electronic circuit component that obtains.The solder protuberance α that disposes on the one side 61a of first base material 61 of electronic unit 60 contacts with electrode 5, and the second protuberance 3b of conductive component 3 contacts with conductive part β in the one side configuration of second base material 71 of circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.
As electronic unit 60 and circuit substrate 70, identical with above-mentioned first execution mode.
The position that solder protuberance α contacts with electrode 5 is the other end 5f side of electrode 5, preferably on the protuberance 1A of matrix 1.When electrode 5 contacted with solder protuberance α, strain took place in protuberance 1A, and as shown in figure 17, the side 1As of protuberance 1A becomes curved surface.1A so is out of shape by protuberance, and it is an amount of that electrode 5 and contacting of solder protuberance α are pressed, and can become with suitable load connection electrode 5 and the state of solder protuberance α.
According to the present invention, only need to change the size of protuberance 1A or hardness, shape, just adjustment stroke amount simply moderately.Therefore,, change the contact site of solder protuberance α and electrode 5, obtain suitable path increment, can fully guarantee the pressure that contacts of solder protuberance α and electrode 5 by corresponding with the electronic unit that will install.As a result, can suppress the increase of poor flow or contact resistance.
In addition, contact with electrode 5 by solder protuberance α etc. and to pressurize, destroyed in the oxide film thereon that the surface of solder protuberance α or electrode 5 forms because of wiping effect, can realize the raising of conductivity thus.
＜the seven execution mode 〉
Figure 18 A, 18B are the figure that schematically represents the electronic unit mounting substrate 10 (10G) relevant with the 7th execution mode of the present invention.Give identical symbol for the part identical, omit explanation them with the 6th execution mode.Figure 18 A is a vertical view, and Figure 18 B is the L-L profile of Figure 18 A.The difference of present embodiment and the 6th execution mode is, the shape along the other end 5f side of electrode 5 disposes slit 9 on substrate 4.
As long as slit 9 is configured to surround at least the periphery of an end 5f side of electrode 5.By this slit 9, the path increment of electrode 5 increases, and when electronic unit 60 has been installed, can further absorb the height tolerance of solder protuberance α when the same with the 6th execution mode.Therefore, by matrix 1 and the protuberance 1A that on the one side 1a of matrix 1, is provided with, can in scope widely, regulate the contact pressure of electrode 5 and the solder protuberance α of electronic unit 60.Thereby, can further realize the homogenizing of the height of electronic unit more effectively suppressing loose contact etc.
In order on substrate 4, to make such slit 9, process by utilizing punch or laser etc., can be provided with easy and accurately.
Figure 19 is an electronic unit mounting substrate 10 (10G) of schematically representing to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.By configuration slit 9, when electronic unit 60 had been installed, tectosome 6 had more flexibly and works, and strain takes place protuberance 1A.As a result, can further absorb the height tolerance of solder protuberance α etc.
＜the eight execution mode 〉
Figure 20 A, 20B are the figure that schematically represents the electronic unit mounting substrate 10 (10H) relevant with the 8th execution mode of the present invention.Give identical symbol to the part identical, and omit explanation them with the 6th execution mode or the 7th execution mode.Figure 20 A is and the 6th execution mode or the identical profile of the 7th execution mode, Figure 20 B is an electronic unit mounting substrate of schematically representing to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The difference of present embodiment and the 7th execution mode is, also disposes tectosome 6b at the another side 1b of matrix 1.
By as present embodiment, the substrate 4 (4a, 4b) dispose electrode 5 (5a, 5b) is set, is tectosome 6 (6a, 6b) at the two sides of matrix 1 1a, 1b, can when being installed, electronic unit etc. more effectively absorb height tolerance on the two sides of matrix 1.Therefore, can have the electronic unit 60 or the circuit substrate 70 of deviation in the two sides setting height(from bottom), with higher design freedom assemble electronic circuits parts.
Illustrate the electronic unit mounting substrate that is provided with slit 9 on the substrate 4 (4a, 4b) on the two sides that is disposed at matrix 1 among Figure 20 A, the 20B, but under the little situation of the path increment of necessity, slit 9 can equally with the 6th execution mode be set on substrate 4, also can be only in any one party setting of substrate 4a, 4b.
Figure 20 B is the electronic unit mounting substrate 10H that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.
The solder protuberance α that is configured on the semi-conductor electricity electronic circuit 60 contacts with the electrode 5a that disposes on the one side 1a of matrix 1, and the electrode 5b that disposes on the another side 1b of matrix 1 contacts with the conductive part β of circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.Under the situation of the electronic unit mounting substrate 10H that uses present embodiment, except obtaining the effect identical with above-mentioned the 6th execution mode～the 7th execution mode, owing to dispose tectosome 6 (6a, 6b) on the two sides of matrix 1, so can have the circuit substrate 70 of deviation in the two sides of matrix 1 setting height(from bottom), obtain the high electronic circuit component of design freedom.In addition, contact with electrode 5b by conductive part β and to pressurize, make the surface of conductive part β or electrode 5b destroy oxide film thereon, can realize the raising of conductivity thus because of wiping effect.
Illustrate the electronic unit mounting substrate that on substrate 4, is provided with slit 9 among Figure 20 A, the 20B, but under the little situation of the path increment of necessity, slit 9 can be set on substrate 4 equally with the 6th execution mode.
＜the nine execution mode 〉
Figure 21 A, 21B are the profiles of schematically representing the electronic unit mounting substrate 10 (10I) relevant with the 9th execution mode of the present invention.To giving identical symbol, and omit explanation to them with the part that the 6th execution mode～the 8th execution mode is identical.Figure 21 A is and the 6th execution mode or the identical profile of the 7th execution mode, Figure 21 B is an electronic unit mounting substrate of schematically representing to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The difference of present embodiment and the 8th execution mode is, also disposes protuberance 1B at the another side 1b of matrix 1, and the mode of joining according to the end face 1Bt with this protuberance 1B disposes tectosome 6b.
Be configured in the protuberance 1B on the another side 1b of matrix 1, same with the protuberance 1A of above-mentioned first execution mode, can be according to the thickness of the electronic unit that will install or circuit substrate, matrix 1 or hardness etc., height or size, the shape etc. of suitably regulating protuberance 1B.In Figure 10 A, 10B, protuberance 1A and protuberance 1B are configured in same position at the one side 1a and the another side 1b of matrix 1, but are not particularly limited to this configuration, also can be configured in different positions in one side 1a and another side 1b.
By as present embodiment, on the one side 1a of matrix 1 and another side 1b, protuberance (1A, 1B) is set, to compare with the electronic unit mounting substrate 10C of the 8th execution mode, path increment increases.Therefore, can in scope widely, be absorbed in the height tolerance of the conductive part that disposes on the electronic unit that will install or the circuit substrate.Thereby, can under the condition of wide region more, obtain being suitable for the electronic unit that will install or the electronic unit mounting substrate of circuit substrate.
Illustrate the electronic unit mounting substrate that on substrate 4, is provided with slit 9 among Figure 21 A, the 21B, but under the little situation of the path increment of necessity, slit 9 can be set on substrate 4 equally with the 6th execution mode.
＜the ten execution mode 〉
Figure 22 A, 22B are the figure that schematically represents the electronic unit mounting substrate 10 (10J) relevant with the tenth execution mode of the present invention.Figure 22 A figure is a vertical view, and Figure 22 B is the L-L profile of Figure 22 A.The difference of present embodiment and the 7th execution mode is that the other end 5f side of the electrode 5 on the one side 5c of electrode 5 disposes protrusion 51.Protrusion 51 is identical with above-mentioned the 4th execution mode.
By protrusion 51 so is set, can make with electronic unit 60 to contact pressure ratio the 7th execution mode big.Thus, can more effectively suppress loose contact.
Illustrate the electronic unit mounting substrate that on substrate 4, is provided with slit 9 among Figure 22 A, the 22B, but under the little situation of the path increment of necessity, slit 9 can be set on substrate 4 equally with the 6th execution mode.
Figure 23 A is the electronic unit mounting substrate 10J that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.The solder protuberance α that is configured on the one side of semi-conductor electricity electronic circuit 60 contact with the protrusion 51 of configuration on electrode 5, and the second protuberance 3b of conductive component 3 contacts with the conductive part β that disposes on circuit substrate 70.Thus, solder protuberance α and conductive part β are electrically connected.By so contacting by protrusion 51, can increase contact and press, can more effectively suppress loose contact.In addition, because the wiping effect on the contact-making surface of protrusion 51 and solder protuberance α strengthens,, can realize the raising of conductivity so oxide film thereon is destroyed easily.
＜the ten one execution mode 〉
Figure 23 B is the electronic unit mounting substrate 10K that schematically represents similarly to be provided with on the electrode 5 of the electronic unit mounting substrate 10C that uses at the 8th execution mode the 11 execution mode of protrusion 51, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 70.Under this situation, also can obtain and the above-mentioned identical effect of electronic unit mounting substrate 10J.In addition, owing on the another side 1b of matrix 1, also dispose tectosome 6b, so the circuit substrate 70 that has height tolerance at conductive part β can be installed to the two sides of matrix 1.Thus, can be with higher design freedom assembling electronic circuit component.
＜the ten two execution mode 〉
Figure 24 A, 24B are the figure that schematically represents the electronic unit mounting substrate 10 (10L) relevant with the 12 execution mode of the present invention.Figure 24 A and above-mentioned the 6th execution mode～the 9th execution mode are same, have schematically represented the profile of electronic unit mounting substrate.Because vertical view (plane graph) is same with the tenth execution mode, so omit.
The difference of present embodiment and the 9th execution mode is, dispose protrusion 51 (51a, 51b) at the electrode 5 (5a, 5b) of tectosome 6 (6a, 6b) contact point last and electronic unit, wherein, described tectosome 6 (6a, 6b) is configured on two sides 1a, the 1b of matrix 1.Protrusion 51 and the 9th execution mode are same.
According to present embodiment, by protrusion 51 is set, can increase the pressure that contacts with electronic unit 60 and circuit substrate 70, can more effectively suppress loose contact.
Illustrate the electronic unit mounting substrate that on the substrate 4 (4a, 4b) of the two sides 1a, the 1b that are disposed at matrix 1, is provided with slit 9 among Figure 24 A, the 24B, but under the little situation of the path increment of necessity, can equally with first execution mode on substrate 4 (4a, 4b), slit 9 be set, can be only slit 9 be set yet in any one party of substrate 4a, 4b.
Figure 24 B is the electronic unit mounting substrate 10L that schematically represents to use present embodiment, electronic unit 60 (for example the semi-conductor electricity electronic circuit 60) is installed to the profile of the example on the circuit substrate 71.The solder protuberance α that is configured on the one side of semi-conductor electricity electronic circuit 60 contacts with the protrusion 51a that disposes on electrode 5a, and the conductive part β that is configured on the circuit substrate 70 contacts with the protrusion 51b that disposes on the electrode 5b of matrix 1.Thus, solder protuberance α and conductive part β are electrically connected.By so on each of the electrode 5 (5a, 5b) on the two sides that is disposed at matrix 1, protrusion 51 (51a, 51b) being set, can increase the pressure that contacts with electronic unit 60 and circuit substrate 70, can more effectively suppress loose contact.In addition, because protrusion 51a and solder protuberance α, and the wiping effect enhancing of the contact-making surface of protrusion 51b and conductive part β so oxide film thereon is destroyed easily, can realize the raising of conductivity.
＜the ten three execution mode 〉
Figure 25 is a vertical view of schematically representing the electronic unit mounting substrate 10 (10M) relevant with the 13 execution mode of the present invention.The difference of the present embodiment and second execution mode is that electrode 5 and slit 9 dispose differently.In the present embodiment, electrode 5 and slit 9 dispose respectively differently, but also can dispose by row differently.In the present embodiment, also can as above-mentioned the 3rd execution mode～the 12 execution mode, tectosome 6 be set at the two sides of matrix 1 1a, 1b, and, can on electrode 5, protrusion be set.And then, protuberance 1A can be set on substrate 1.Can obtain with above-mentioned second execution mode～the 12 execution mode in the identical effect of electronic unit mounting substrate that obtains.
Illustrate the electronic unit mounting substrate that on substrate 4, is provided with slit 9 among Figure 25, under the little situation of the path increment of necessity, slit 9 can be set on substrate 4 equally with first execution mode or the 6th execution mode.
The electronic unit mounting substrate 10 of above-mentioned first execution mode～the 13 execution mode (among the 10A～10H), can be at the other end 5f of electrode 5, promptly the contact point with electronic unit 60 is provided with depressed part.As depressed part, its shape for example is a curved surface, but can suitably change according to the shape of the conductive part (α, β) of institute's contacting electronic parts or circuit substrate.By depressed part so is set, the contraposition when it contacts with solder protuberance α or conductive part β is carried out easily, can realize the raising of productivity ratio.
[embodiment]
＜embodiment 1 〉
Be with the 0.5mm spacing through hole to be set on the elastomer of 800 μ m at the thickness that constitutes by silicone rubber, obtain the matrix shown in Figure 1B.Then, to being that the conductivity pin of principal component cleans/surface treatment with copper, the conductivity pin is pressed in the through hole.
Subsequently, will form on the substrate that is made of polyimides is that the tectosome of the circuit of principal component is arranged on elastomeric two sides, the electronic unit mounting substrate shown in construction drawing 8A, the 8B with copper.With this electronic unit mounting substrate as embodiment 1.
＜comparative example 1 〉
Use the anisotropic conductive elastomer of record in the patent documentation 1, make the electronic unit mounting substrate of 0.5mm spacing, with its as a comparative example 1.
＜comparative example 2 〉
Use the conductive elastomer of putting down in writing among Figure 26, make the electronic unit mounting substrate of 1mm spacing, with its as a comparative example 2.
＜comparative example 3 〉
Use the leaf spring of putting down in writing among Figure 27, make the electronic unit mounting substrate of 1.3mm spacing, with its as a comparative example 3.
Use the embodiment 1 of above-mentioned making and the electronic unit mounting substrate of comparative example 1～3, carry out the comparison of conduction, inductance.Its result is illustrated in the table 1.
Wherein, the electronic unit mounting substrate that conducting resistance is big is designated as BAD, and the electronic unit mounting substrate that obtains enough little conducting resistance is designated as GOOD.The electronic unit mounting substrate that inductance is surpassed 1.0nH is designated as BAD, with the GOOD that is designated as below the 1.0nH.
Table 1
Embodiment 1 Comparative example 1 Comparative example 2 Comparative example 3
Spacing 0.5mm 0.5mm 1.0mm 1.3mm
Inductance GOOD GOOD BAD BAD
Conducting resistance GOOD BAD BAD GOOD
According to table 1 as can be known, in comparative example 2 that has used conductive elastomer and the comparative example 3 that used leaf spring, inductance surpasses 1.0nH, has represented bigger value.Relative with them, in embodiment 1 and comparative example 1, inductance is represented the value less than 1.0nH, can be used for high frequency electronic component.In addition, using the elastomeric comparative example 1 of anisotropic conductive and using in the comparative example 2 of conductive elastomer, conducting resistance increases.Relative with them, at embodiment 1 with used in the comparative example 4 of leaf spring, can make fully to reduce conducting resistance.
In sum,, conducting resistance and inductance can be reduced, and narrow and smallization of spacing between terminal can be made according to electronic unit mounting substrate of the present invention.
＜embodiment 2 〉
Be with the 0.5mm spacing through hole to be set on the elastomer of 800 μ m at the thickness that constitutes by silicone rubber, obtain the matrix shown in Figure 21 A.Then, to being that the conductivity pin of principal component cleans/surface treatment with copper, the conductivity pin is pressed in the through hole.
Subsequently, will form on the substrate that is made of polyimides is that the tectosome of the circuit of principal component is arranged on elastomeric two sides, the electronic unit mounting substrate shown in the construction drawing 21A with copper.With it as embodiment 2.
Use the embodiment 2 of above-mentioned making and the electronic unit mounting substrate of comparative example 1～3, carry out the comparison of conduction, inductance, path increment, load.Its result is shown in the table 2.
Wherein, conducting resistance and the big electronic unit mounting substrate of contact resistance are designated as BAD, the electronic unit mounting substrate that obtains enough little conducting resistance is designated as GOOD.With inductance is that electronic unit mounting substrate more than the 1.0nH is designated as BAD, will be less than the GOOD that is designated as of 1.0nH.
Table 2
Embodiment 2 Comparative example 1 Comparative example 2 Comparative example 3
Load (gf) 5～50 45 44～71 20～100
Path increment (mm) 0.2～0.5 0.36 0.31 0.30
Minimum terminal intervals (mm) 0.5 0.5 1.0 1.3
Inductance GOOD GOOD BAD BAD
Conducting resistance GOOD BAD BAD GOOD
According to table 2 as can be known, in comparative example 2 that has used conductive elastomer and the comparative example 3 that used leaf spring, inductance surpasses 1.0nH, represents bigger value.Relative with them, in embodiment 2 and comparative example 1, inductance is represented the value less than 1.0nH, can be used for high frequency electronic component.
Using the elastomeric comparative example 1 of anisotropic conductive and using in the comparative example 2 of conductive elastomer, conducting resistance increases.Relative therewith, at embodiment 2 with used in the comparative example 4 of leaf spring, can make conducting resistance enough little.
In comparative example 1～3, path increment is about 0.3～0.36mm, and is relative therewith, in embodiment 2, obtained the path increment of 0.2～0.5mm.In addition, the load in the comparative example 1～3 is the arbitrary value in 20～100gf scope, and is relative therewith, is 5～50gf in embodiment 2.That is, according to the electronic unit mounting substrate of embodiment 2, can be with less than in the past power load.
Therefore,, can possess the more path increment and the accurate load of wide region,, also can appropriateness keep in touch pressure even if having the electronic unit of highly different conductive parts according to the electronic unit mounting substrate of embodiment 2, thereby, stable connection status can be kept.
More than preferred implementation of the present invention is illustrated, but the present invention is not limited to these embodiment.Without departing from the spirit and scope of the present invention, can constitute additional, omit, displacement, and other changes.By above-mentioned explanation restriction, only the scope by technical scheme does not limit in the present invention.

Claims (9)

1. electronic unit mounting substrate is characterized in that having:
Matrix, it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation;
Conductive component, it is configured to main part and is filled in these through holes, an end and the other end at described main part have first protuberance and second protuberance respectively, and described first protuberance is outstanding in the one side of described matrix, and described second protuberance is outstanding at the another side of described matrix;
Flexible base plate, it is configured in the described one side of described matrix, and has first peristome that described first protuberance connects respectively; With
Oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that described first protuberance connects;
Described each electrode is separated from each other configuration, at described second peristome of a distolateral formation of described each electrode.
2. electronic unit mounting substrate as claimed in claim 1 is characterized in that,
On the described at least one side of described matrix, also be provided with a plurality of protuberances that dispose side by side with predetermined distance,
The described through hole of configuration between these protuberances,
A described end of described main part and the top of described protuberance are positioned on the same imaginary plane,
Described substrate is configured in the described one side side of described matrix according to the mode that the described end face with a plurality of described protuberances joins.
3. electronic unit mounting substrate as claimed in claim 1 is characterized in that,
Another distolateral shape along described electrode disposes slit on described substrate.
4. electronic unit mounting substrate as claimed in claim 1 is characterized in that,
On the another side of described matrix, also dispose the tectosome that forms by described electrode and described substrate.
5. electronic unit mounting substrate as claimed in claim 1 or 2 is characterized in that,
Described electrode with described substrate away from one side on another distolateral protrusion that disposes of described electrode.
6. electronic unit mounting substrate as claimed in claim 1 is characterized in that,
Described electrode with described substrate away from one side on another distolateral recess that disposes of described electrode.
7. the manufacture method of an electronic unit mounting substrate, this electronic unit mounting substrate has: matrix, it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation; Conductive component, it is configured to main part and is filled in these through holes, and an end and the other end at described main part have first protuberance and second protuberance respectively, and described first protuberance is outstanding in the one side of described matrix, and described second protuberance is outstanding at the another side of described matrix; Flexible base plate, it is configured in the described one side of described matrix, and has first peristome that described first protuberance connects respectively; With oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that described first protuberance connects; Described each electrode is separated from each other configuration, at described second peristome of a distolateral formation of described each electrode;
This manufacture method is characterised in that to have:
The operation of a plurality of described through holes is set with the interval of regulation on described matrix;
According to the mode that described first protuberance and described second protuberance of described conductive component are given prominence at the described one side and the described another side of described matrix respectively, described conductive component is inserted into the operation of described through hole;
Described one side at described substrate is provided with a plurality of described electrodes, the position suitable with described first protuberance at described substrate is provided with described first peristome, in the position suitable with described first protuberance of described electrode the operation that described second peristome forms tectosome is set; With
According to the mode that described first peristome and described second peristome to described tectosome insert described first protuberance of described conductive component, described tectosome is arranged on the operation of the described one side of described matrix.
8. the manufacture method of an electronic unit mounting substrate, this electronic unit mounting substrate has: matrix, it is made of flat elastomer, has a plurality of through holes with the spacing parallel arranging configuration of regulation; Conductive component, it is configured to main part and is filled in these through holes, an end and the other end at described main part have first protuberance and second protuberance respectively, and described first protuberance is outstanding in the one side of described matrix, and described second protuberance is outstanding at the another side of described matrix; Flexible base plate, it is configured in the described one side of described matrix, and has first peristome that described first protuberance connects respectively; Oval shape electrode, it disposes a plurality of on this substrate, and each all has second peristome that described first protuberance connects; And protuberance, its spacing parallel arranging configuration with regulation on the one side at least of described matrix is a plurality of; Described electrode is configured to have to each other partitions, at described the 3rd peristome of a distolateral formation of described each electrode; The described through hole of configuration between described protuberance; A described end of described main part and the end face of described protuberance are positioned on the same imaginary plane; Described substrate is configured in the described one side side of described matrix according to the mode that the described end face with a plurality of described protuberances joins;
This manufacture method is characterised in that to have:
The operation of a plurality of described through holes is set between the described protuberance of described matrix;
According to the mode that described first protuberance and described second protuberance of described conductive component are given prominence at the described one side and the described another side of described matrix respectively, described conductive component is inserted into the operation of described through hole;
Described one side at described substrate is provided with a plurality of described electrodes, the position suitable with described first protuberance at described substrate is provided with described first peristome, in the position suitable with described first protuberance of described electrode the operation that described second peristome forms tectosome is set; With
Described first protuberance that inserts described conductive component according to described first peristome and described second peristome to described tectosome, and the another side of described substrate and the mode that end face at the described protuberance of the one side of described matrix configuration joins are provided with the operation of described tectosome.
9. a circuit block is characterized in that, has claim 1 or 2 described electronic unit mounting substrates.
CN2009101295432A 2008-03-26 2009-03-26 Electronic component mounting board, method for manufacturing the same and electronic circuit unit Expired - Fee Related CN101546878B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1574261A (en) * 2003-05-27 2005-02-02 精工爱普生株式会社 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus

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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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* Cited by examiner, † Cited by third party
Title
JP特开2006-202918A 2006.08.03

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