CN101540836A - Camera chip size module with novel structure and method for producing same - Google Patents
Camera chip size module with novel structure and method for producing same Download PDFInfo
- Publication number
- CN101540836A CN101540836A CN200810088308A CN200810088308A CN101540836A CN 101540836 A CN101540836 A CN 101540836A CN 200810088308 A CN200810088308 A CN 200810088308A CN 200810088308 A CN200810088308 A CN 200810088308A CN 101540836 A CN101540836 A CN 101540836A
- Authority
- CN
- China
- Prior art keywords
- module
- camera
- components
- wiring board
- camera lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
Abstract
The invention relates to a camera chip size module with a novel structure and a method for producing the same. At present, a video transmission technique adopts a camera module technique, has separated components of a camera and a circuit board which have bulky volumes and inconvenient operation, and is likely to cause problems of easy generation of particulate pollutions, impossibility of unifying the sizes of printed circuit boards, data wastes, inventory accumulation and the like. The camera chip size module consists of a lens, a sensor, an element, a circuit board and vent holes, wherein the middle part on the surface of the circuit board is provided with the sensor and the edge part thereof is provided with the element, a pedestal of the lens is provided with the vent holes, the circuit board size is equal to the chip packaging size, and the circuit board, the sensor and the element are assembled in the pedestal of the lens ultra-precisely. By making use of a high temperature material, the particulate problem is solved; and by making use of a chip level packaging technique to minimize and standardize the module, the inventory problem is solved. The camera chip size module has the advantages of small volume, simple structure, no particulates, precise focal distance, vent hole design for the convenience of high temperature machining, convenient and flexible assembling operations, extensive range of application, and advantageous popularization.
Description
Technical field
The present invention relates to the electron optics field, be specifically related to a kind of camera chip size module and production method thereof of new structure.
Background technology
Along with increasing rapidly of video transmission technologies, requirement to the image input also enlarges thereupon, all adopt the camera module to achieve the goal at present, and prior camera and wiring board are separated components, camera need be arranged on PCB surface during assembling, and be bulky, be awkward, easily cause the pollution problem of micronic dust, the PCB printed circuit board sizes also can't be unified simultaneously, causes problems such as data waste and stock's accumulation.
Summary of the invention
The object of the present invention is to provide and a kind ofly utilize the wafer-level package technology, with module minimization and standardization, make the camera chip size module and the production method thereof of the new structure that module can process in the electronic devices and components mode.
The present invention is chip size module (CSM, be Chip Scale Module), the chip size module is for to be made of camera lens, transducer, components and parts, wiring board and steam vent, wiring board and components and parts design for microminiature, the PCB surface middle part is provided with transducer, and limit portion is provided with components and parts, and the camera lens base is provided with steam vent, the wiring board size equals the Chip Packaging size, and wiring board and transducer, components and parts are assembled in camera lens base inside by ultraprecise.
Production method of the present invention is:
One, utilize the use of high-temperature material (Reflowable), solved the problem of the micronic dust of the upright technology generation of group, its high-temperature material technology comprises:
A. the glass moulding camera lens replaces plastics non-refractory material camera lens;
B. high-temperature resistance plastice replaces general plastics;
C. vent design has solved the high temperature process heat dissipation problem.
Two, utilize the wafer-level package technology, with module minimization and standardization, module can be processed in the electronic devices and components mode, after the standardization, inventory problem just is readily solved, and its subminaturization precision processing technology comprises:
D. the wiring board size equals the Chip Packaging size;
E. extra smallization of components and parts, and be made in camera lens inside;
F. the ultraprecise packaging technology guarantees no micronic dust and correct focal length.
The invention has the advantages that little, simple in structure, the no micronic dust of volume, focal length accurately, vent design is convenient to high temperature process, assembly operation is convenient, flexible, uses in extensive rangely, is beneficial to popularization.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention.
1 is camera lens among the figure, the 2nd, and transducer, the 3rd, components and parts, the 4th, wiring board, the 5th, steam vent, the 6th, camera lens base.
Embodiment
The present invention is described in further details with most preferred embodiment below in conjunction with accompanying drawing:
The present invention is made of camera lens (1), transducer (2), components and parts (3), wiring board (4) and steam vent (5), wiring board (4) designs for microminiature with components and parts (3), middle part, wiring board (4) surface is provided with transducer (2), limit portion is provided with components and parts (3), camera lens base (6) is provided with steam vent (5), wiring board (4) size equals the Chip Packaging size, and wiring board (4) is assembled in camera lens base (6) inside with transducer (2), components and parts (3) by ultraprecise.
Production method of the present invention is:
One, utilize the use of high-temperature material (Reflowable), solved the problem of the micronic dust of the upright technology generation of group, its high-temperature material technology comprises:
A. the glass moulding camera lens replaces plastics non-refractory material camera lens;
B. high-temperature resistance plastice replaces general plastics;
C. vent design has solved the high temperature process heat dissipation problem.
Two, utilize the wafer-level package technology, with module minimization and standardization, module can be processed in the electronic devices and components mode, after the standardization, inventory problem just is readily solved, and its subminaturization precision processing technology comprises:
D. the wiring board size equals the Chip Packaging size;
E. extra smallization of components and parts, and be made in camera lens inside;
F. the ultraprecise packaging technology guarantees no micronic dust and correct focal length.
Claims (2)
1, a kind of camera chip size module of new structure, it is characterized in that it is made of camera lens (1), transducer (2), components and parts (3), wiring board (4) and steam vent (5), wiring board (4) designs for microminiature with components and parts (3), middle part, wiring board (4) surface is provided with transducer (2), limit portion is provided with components and parts (3), camera lens base (6) is provided with steam vent (5), wiring board (4) size equals the Chip Packaging size, and wiring board (4) is assembled in camera lens base (6) inside with transducer (2), components and parts (3) by ultraprecise.
2, a kind of production method of camera chip size module of new structure is characterized in that its production method is:
A, utilize the use of high-temperature material (Reflowable), solved the problem of the micronic dust that the upright technology of group produces, its high-temperature material technology comprises:
A. the glass moulding camera lens replaces plastics non-refractory material camera lens;
B. high-temperature resistance plastice replaces general plastics;
C. vent design has solved the high temperature process heat dissipation problem.
Utilize the wafer-level package technology, with module minimization and standardization, module can be processed in the electronic devices and components mode, after the standardization, inventory problem just is readily solved, and its subminaturization precision processing technology comprises:
D. the wiring board size equals the Chip Packaging size;
E. extra smallization of components and parts, and be made in camera lens inside;
F. the ultraprecise packaging technology guarantees no micronic dust and correct focal length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810088308A CN101540836A (en) | 2008-03-22 | 2008-03-22 | Camera chip size module with novel structure and method for producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810088308A CN101540836A (en) | 2008-03-22 | 2008-03-22 | Camera chip size module with novel structure and method for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101540836A true CN101540836A (en) | 2009-09-23 |
Family
ID=41123807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810088308A Pending CN101540836A (en) | 2008-03-22 | 2008-03-22 | Camera chip size module with novel structure and method for producing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101540836A (en) |
-
2008
- 2008-03-22 CN CN200810088308A patent/CN101540836A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8149321B2 (en) | Camera module and method of manufacturing the same | |
| JP5827385B2 (en) | The camera module | |
| US20110313252A1 (en) | Micro sensing apparatus | |
| US20130142504A1 (en) | Two part camera module | |
| US7388192B2 (en) | Image sensing module and process for packaging the same | |
| CN105679753A (en) | Optical module, fabrication method thereof and electronic device | |
| JP7292828B2 (en) | Imaging device module, imaging system, imaging device package and manufacturing method | |
| JP2006074757A (en) | Image capture device | |
| US20110096223A1 (en) | Camera module and manufacturing method thereof | |
| TWI719334B (en) | Photosensitive component, imaging module, smart terminal, method and mold for manufacturing photosensitive component | |
| CN101540836A (en) | Camera chip size module with novel structure and method for producing same | |
| US8969785B2 (en) | Easily assembled optical-electrical converting device having engaged locating elements for an optical coupling lens | |
| US20100208370A1 (en) | Camera lens assembly | |
| JP2008148253A (en) | Camera module, and imaging apparatus and assembling method thereof | |
| KR100820533B1 (en) | Camera module and production method of camera module | |
| US10566468B2 (en) | Optoelectronic module assembly and manufacturing method | |
| JP2009204721A (en) | Camera module and method for mounting the same | |
| KR101037685B1 (en) | Structure and method for assembling of camera module | |
| CN104902146B (en) | Camera module and photographic device | |
| CN203164578U (en) | HD reflow mobile phone camera module group | |
| KR101262373B1 (en) | Camera module and production method of camera mocule | |
| CN205122586U (en) | Image sensor encapsulates and has camera module of this encapsulation | |
| CN100422778C (en) | Electrical module cover, electrical module and optical transceiver | |
| CN100454508C (en) | Method for producing image-pickup assembly and camera module | |
| CN101127838A (en) | Image sensing module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090923 |