CN203164578U - HD reflow mobile phone camera module group - Google Patents
HD reflow mobile phone camera module group Download PDFInfo
- Publication number
- CN203164578U CN203164578U CN201320102554.3U CN201320102554U CN203164578U CN 203164578 U CN203164578 U CN 203164578U CN 201320102554 U CN201320102554 U CN 201320102554U CN 203164578 U CN203164578 U CN 203164578U
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- China
- Prior art keywords
- microscope base
- reflow
- camera lens
- camera module
- phone camera
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- Expired - Fee Related
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Abstract
The utility model provides an HD reflow mobile phone camera module group, comprising an SOMA sheet, a lens, a lens seat, a photosensitive chip, and a circuit board, wherein the upper part of the lens seat is provided with a recessed chamber for accommodating the lens; the SOMA sheet is located in the top of the lens seat; the circuit board is located in the bottom of the lens seat; and the photosensitive chip is arranged between the circuit board and the lens seat. The HD reflow mobile phone camera module group guarantees the lens BFL through a chip surface positioning mode to make the positioning more accurate, thereby guaranteeing the imaging effect thereof; the design of a spacing ring in the last generation reflow is eliminated and the cost is reduced; and the module group has a simple structure, and the overall dimension of the module group can be relatively small, minimumly reaching 4.5 mm x 4.5 mm, thereby meeting the requirement of miniaturization of the mobile phone camera module group.
Description
Technical field
The utility model relates to cell-phone camera module industry, and a kind of HD reflow cell-phone camera module is provided, and is a kind of focusing-free imaging module of the crossed reflow soldering based on chip surface location, can realize that high definition takes.
Background technology
The present successful volume production of first generation reflow module, VGA resolution is mainly used in the preposition shooting module of mobile phone.But along with development of science and technology, the preposition shooting module of mobile phone requires to realize the high definition shooting.Though the cell-phone camera module of traditional handicraft can realize high definition and take, but can't cross Reflow Soldering, can only link to each other with cell phone mainboard by connector, complex structure, cost are higher, and mobile phone also is difficult to accomplish ultra-thin; Though present reflow module can be crossed Reflow Soldering, but can't satisfying high definition again, the resolution of taking pictures takes.
So need that exploitation is a kind of can cross the cell-phone camera module that Reflow Soldering can realize that again high definition is taken, satisfy mobile phone market to the demand of shooting module: under the prerequisite of quality that guarantees to take pictures, and ultra-thin structure and lower cost control are arranged.
Summary of the invention
This use is novel to provide a kind of HD reflow cell-phone camera module, has solved the cell-phone camera module and still have the take pictures problem of quality of height under the prerequisite of superthin structure, and described HD reflow cell-phone camera module refers to that the high definition mobile phone can cross Reflow Soldering shooting module.
Described HD reflow cell-phone camera module comprises SOMA sheet, camera lens, microscope base, sensitive chip, wiring board, described microscope base top is provided with the cavity that holds camera lens, described SOMA sheet is positioned at the top of microscope base, described wiring board is positioned at the bottom of microscope base, and described sensitive chip is between wiring board and microscope base.
Described cavity is provided with the microscope base locating surface spacing to camera lens, and corresponding camera lens locating surface is arranged at the camera lens bottom.
The microscope base locating surface of described cavity is provided with microscope base point glue groove, and described camera lens is fixed in the microscope base by the UV glue of microscope base point glue groove.
Described microscope base locating surface is provided with venthole, and the other end of described venthole is communicated with the space that exists between microscope base and wiring board.
Described microscope base adopts the mode of chip surface location to contact the location with sensitive chip.
Described HD reflow mobile phone module is filled up the high definition camera blank that can cross Reflow Soldering in the market, meets the need of market; Guarantee camera lens BFL by the chip surface locator meams, make the location more accurate, guarantee the imaging effect of product, described camera lens is assembled from the front, the spacer ring design of cancellation previous generation reflow, and cost reduces; Because it has characteristic simple in structure, it is less that the profile of product also can be done, and module physical dimension minimum can be accomplished 4.5mm * 4.5mm, satisfies market to the demand of cell-phone camera module miniaturization.
Description of drawings
Fig. 1 is the synoptic diagram of previous generation reflow shooting module;
Fig. 2 is the exploded view of previous generation reflow shooting module;
Fig. 3 is the synoptic diagram of HD reflow mobile phone module;
Fig. 4 is the three-dimensional exploded view of HD reflow mobile phone module;
Fig. 5 is the exploded view of HD reflow mobile phone module;
Fig. 6 is the microscope base cavity synoptic diagram of HD reflow mobile phone module;
Fig. 7 is the venthole position view in the cavity;
Fig. 8 is the venthole position view of microscope base bottom;
Fig. 9 is the synoptic diagram of venthole;
Figure 10 is that the gas of venthole flows out synoptic diagram;
Figure 11 is the synoptic diagram of camera lens, microscope base and sensitive chip surface of contact.
Each component names: 1-SOMA sheet; The 2-camera lens; The 3-microscope base; The 4-sensitive chip; The 5-wiring board; 6-microscope base point glue groove; 7-microscope base locating surface; 8-camera lens locating surface; The 9-venthole; 10-camera lens microscope base surface of contact; 11-microscope base chip surface of contact; The 33-microscope base; The 22-camera lens; The 110-trim ring; The 44-sensitive chip; The 55-wiring board.
Embodiment
As Fig. 1, shown in Figure 2, previous generation VGA reflow module group lens 22 is to assemble from microscope base 11 bottoms, and trim ring 110 designs are arranged, the bottom is sensitive chip 44 and wiring board 55 then, described HD reflow mobile phone module is a kind of new reflow module method for designing, mainly contain following innovative point at previous generation reflow module: the BFL that guarantees camera lens by the chip surface locator meams, camera lens 2 is directly assembled from microscope base 3 tops, glue is fixed, soma sheet 1 is pasted in the outer face, cancel the design of camera lens trim ring, carried out exhaust from the bottom of camera lens 2, can realize the high definition cell-phone camera.
As Fig. 3, Fig. 4 and shown in Figure 5, described HD reflow cell-phone camera module comprises SOMA sheet 1, camera lens 2, microscope base 3, sensitive chip 4, wiring board 5, described microscope base 3 tops are provided with the cavity that holds camera lens 2, described SOMA sheet 1 is positioned at the top of microscope base 3, described wiring board 5 is positioned at the bottom of microscope base 3, and described sensitive chip 4 is between wiring board 5 and microscope base 3.
As shown in Figure 6, described cavity is provided with the microscope base locating surface 7 spacing to camera lens 2, corresponding camera lens locating surface 7 is arranged at camera lens 2 bottoms, the microscope base locating surface 7 of described cavity is provided with microscope base point glue groove 6, described camera lens 2 is fixed in the microscope base 3 by the UV glue of microscope base point glue groove 6, as shown in Figure 7, microscope base locating surface 7 is provided with venthole 9, as Fig. 8, shown in Figure 9, the other end of described venthole 9 is communicated with 5 spaces that exist between microscope base 3 and wiring board, Figure 10 is that the gas of venthole flows out synoptic diagram, and described microscope base 3 adopts the mode of chip surface location to contact the location with sensitive chip 4, and Figure 11 is camera lens, the synoptic diagram of microscope base and sensitive chip surface of contact, camera lens microscope base surface of contact 10 and microscope base chip surface of contact 11 have been shown, described microscope base 3 material selection PA9T can be high temperature resistant, crosses Reflow Soldering.
Described HD reflow cell-phone camera module number of assembling steps is as described below:
HD reflow module is for exempting from the module of focusing, to burnt behind the BFL(back focal lengh optics of camera lens) coherence request is very high, just can make module clear the reaching of taking pictures exempt from the purpose of focusing thereby have only the camera lens of allowing BFL to adjust to micron level.In camera lens microscope base when assembling, adopted classification, and first testing lens BFL is divided into two groups with camera lens, and namely BFL is greater than the design basis value with less than the design basis value, carries out assembly with corresponding microscope base respectively, camera lens mirror seat set after the combination reached exempt from the requirement of focusing.
Step 3: camera lens mirror seat set and the assembling of SOMA sheet:
Camera lens mirror seat set and SOMA sheet 1 bond by glue, and the purpose that the SOMA sheet uses is for preventing that dust from directly entering module internal and playing effect attractive in appearance, carries out this assembly tests such as MTF, BFL, outward appearance.
Step 4: HD refloew module assembling:
Be attached to the camera lens microscope base SOMA chip module that posts SOMA sheet 1 on the chip of accomplishing fluently gold thread with HA equipment, adopt the chip surface locator meams, microscope base 3 contacts the location with sensitive chip 4, microscope base chip surface of contact 11 positions in 11 with reference to the accompanying drawings, avoided chip to attach and microscope base thick error of bringing of glue when attaching, the while also can be avoided the out-of-flatness of wiring board and the influence to imaging effect that brings.
Wherein, the path with reference to the accompanying drawings 10 of giving vent to anger of described module, module adopts the tortuous path of giving vent to anger, and reduces dust and directly enters inner hidden danger from the external world.
Step 5: HD reflow module test:
The module of having assembled is carried out electrical property, optical property, outward appearance detection, with final qualified packing of product shipment.
Claims (5)
1. HD reflow cell-phone camera module, it is characterized in that: comprise SOMA sheet, camera lens, microscope base, sensitive chip, wiring board, described microscope base top is provided with the cavity that holds camera lens, described SOMA sheet is positioned at the top of microscope base, described wiring board is positioned at the bottom of microscope base, and described sensitive chip is between wiring board and microscope base.
2. HD reflow cell-phone camera module according to claim 1, it is characterized in that: described cavity is provided with the microscope base locating surface spacing to camera lens, and corresponding camera lens locating surface is arranged at the camera lens bottom.
3. HD reflow cell-phone camera module according to claim 1, it is characterized in that: the microscope base locating surface of described cavity is provided with microscope base point glue groove, and described camera lens is fixed in the microscope base by the UV glue of microscope base point glue groove.
4. according to claim 2 or 3 described HD reflow cell-phone camera modules, it is characterized in that: described microscope base locating surface is provided with venthole, and the other end of described venthole is communicated with the space that exists between microscope base and wiring board.
5. HD reflow cell-phone camera module according to claim 1 is characterized in that: described microscope base adopts the mode of chip surface location to contact the location with sensitive chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320102554.3U CN203164578U (en) | 2013-03-06 | 2013-03-06 | HD reflow mobile phone camera module group |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201320102554.3U CN203164578U (en) | 2013-03-06 | 2013-03-06 | HD reflow mobile phone camera module group |
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CN203164578U true CN203164578U (en) | 2013-08-28 |
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CN201320102554.3U Expired - Fee Related CN203164578U (en) | 2013-03-06 | 2013-03-06 | HD reflow mobile phone camera module group |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105025202A (en) * | 2014-04-28 | 2015-11-04 | 宁波舜宇光电信息有限公司 | One-piece shooting module base and exhaust method thereof |
CN105282403A (en) * | 2014-07-07 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Method of controlling camera shooting module resolution power uniformity and the camera shooting module |
CN106303164A (en) * | 2015-05-14 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Prevent camera module and assemble method thereof that chip tilts |
-
2013
- 2013-03-06 CN CN201320102554.3U patent/CN203164578U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105025202A (en) * | 2014-04-28 | 2015-11-04 | 宁波舜宇光电信息有限公司 | One-piece shooting module base and exhaust method thereof |
CN105025202B (en) * | 2014-04-28 | 2019-01-29 | 宁波舜宇光电信息有限公司 | Integral type camera module base and its method for exhausting |
CN105282403A (en) * | 2014-07-07 | 2016-01-27 | 宁波舜宇光电信息有限公司 | Method of controlling camera shooting module resolution power uniformity and the camera shooting module |
CN105282403B (en) * | 2014-07-07 | 2019-08-23 | 宁波舜宇光电信息有限公司 | A kind of method and camera module controlling camera module resolving power uniformity |
CN106303164A (en) * | 2015-05-14 | 2017-01-04 | 宁波舜宇光电信息有限公司 | Prevent camera module and assemble method thereof that chip tilts |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20210306 |