CN101532636A - Light-emitting diode (LED) chip module and light source module - Google Patents
Light-emitting diode (LED) chip module and light source module Download PDFInfo
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- CN101532636A CN101532636A CN200810085353A CN200810085353A CN101532636A CN 101532636 A CN101532636 A CN 101532636A CN 200810085353 A CN200810085353 A CN 200810085353A CN 200810085353 A CN200810085353 A CN 200810085353A CN 101532636 A CN101532636 A CN 101532636A
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Abstract
The invention relates to a light-emitting diode (LED) chip module which comprises an LED chip and a brightness enhancement film (BEF). The LED chip is provided with a light-emitting surface on which the BEF is configured, a first surface facing to the LED chip and a second surface backing on to the LED chip. The BEF is provided with a plurality of polygonal pyramid parts which are positioned on the first surface and/or the second surface and arranged in an array of polygon. The LED chip module can supply relatively concentrated light beam. A light source module adopting the BEF is also provided.
Description
Technical field
The present invention relates to a kind of chip module and light source module, and be particularly related to a kind of LED chip module and light source module that adopts brightness enhancement film.
Background technology
Light emitting diode (light-emitting diode, LED) have long such as the life-span, volume is little, high shock resistance, low-heat produce and advantage such as low power consumption, therefore has been widely used in indicator or light source in family expenses and the various device.In recent years, light emitting diode is towards multicolour and high brightness development, so its application has extended to large-scale billboards, traffic signals identification light and association area.In future, light emitting diode even may become the main lighting source that has power saving and environment-friendly function concurrently.
Fig. 1 is a kind of known surface adhesive type (surface mount device, SMD) generalized section of LED chip module.Please refer to Fig. 1, surface-mounting LED chip module 100 comprises light-emitting diode chip for backlight unit 110, lead frame (leadframe) 120, molded structure (molding element) 130 and printing opacity sealing (transparent encapsulant) 140.Light-emitting diode chip for backlight unit 110 is disposed on the lead frame 120.Molded structure 130 covered section lead frames 120, and have the opening 132 that exposes light-emitting diode chip for backlight unit 110.Printing opacity sealing 140 is filled in the opening 132, with protection light-emitting diode chip for backlight unit 110.Light-emitting diode chip for backlight unit 110 is suitable for sending light beam 112, and light beam 112 can penetrate the printing opacity sealing 140 that is disposed in the opening 132 and be transmitted to the external world.
In known surface adhesion type LED chip module 100, because the width of opening 132 can be greater than the width of light-emitting diode chip for backlight unit 110, so that ccontaining light-emitting diode chip for backlight unit 110, so light beam 112 can have the angle of divergence to a certain degree.If desire need to be applied to the occasion of the good light source of collimation with surface-mounting LED chip module 100, to still need and on surface-mounting LED chip module 100, dispose collector lens.
Summary of the invention
The invention provides a kind of LED chip module, the light beam that it provided is comparatively concentrated.
The invention provides a kind of light source module, it can provide brightness higher light source.
The present invention proposes a kind of LED chip module, it comprise light-emitting diode chip for backlight unit and brightness enhancement film (brightness enhancement film, BEF).Light-emitting diode chip for backlight unit has exiting surface.Brightness enhancement film is disposed on the exiting surface, and has towards the first surface of light-emitting diode chip for backlight unit and the second surface of backward luminous diode chip for backlight unit.Brightness enhancement film has a plurality of polygonal taperings, and these polygonal taperings are positioned at first surface and/or second surface, and is the polygon arrayed.
In one embodiment of this invention, LED chip module also comprises fluorescence coating (fluorescentlayer), and it is disposed on the brightness enhancement film.In addition, LED chip module can also comprise carrier and printing opacity sealing (encapsulant).Light-emitting diode chip for backlight unit is to be disposed on the carrier, and printing opacity sealant covers light-emitting diode chip for backlight unit and brightness enhancement film.
The present invention also proposes a kind of LED chip module, and it comprises light-emitting diode chip for backlight unit, fluorescence coating and above-mentioned brightness enhancement film.Light-emitting diode chip for backlight unit has exiting surface.Fluorescence coating is disposed on the exiting surface.Brightness enhancement film is disposed on the fluorescence coating.
Below list the embodiment that is applicable to above-mentioned two kinds of LED chip modules simultaneously.
In one embodiment of this invention, LED chip module also comprises carrier and printing opacity sealing.Light-emitting diode chip for backlight unit is to be disposed on the carrier, and printing opacity sealant covers light-emitting diode chip for backlight unit, brightness enhancement film and fluorescence coating.
In one embodiment of this invention, these polygonal taperings are to be positioned at first surface.The drift angle in these polygonal taperings points to light-emitting diode chip for backlight unit, and second surface is the plane.
In one embodiment of this invention, these polygonal taperings are to be positioned at second surface.The drift angle in these polygonal taperings points to the direction away from light-emitting diode chip for backlight unit, and first surface is the plane.
In one embodiment of this invention, these polygonal taperings are to be positioned at first surface and second surface.The drift angle that is positioned at these polygonal taperings of first surface points to light-emitting diode chip for backlight unit, and the drift angle that is positioned at these polygonal taperings of second surface points to the direction away from light-emitting diode chip for backlight unit.
The present invention reintroduces a kind of LED chip module, and it comprises carrier, light-emitting diode chip for backlight unit, printing opacity sealing and brightness enhancement film.Light-emitting diode chip for backlight unit is disposed on the carrier, and has first exiting surface.Printing opacity sealant covers light-emitting diode chip for backlight unit, and have second exiting surface.Brightness enhancement film is disposed on second exiting surface, and wherein second exiting surface is between the brightness enhancement film and first exiting surface.Brightness enhancement film has towards the first surface of printing opacity sealing and the second surface of printing opacity sealing dorsad, and has a plurality of polygonal taperings.These polygonal taperings are positioned at first surface and/or second surface, and are the polygon arrayed.
In one embodiment of the invention, first exiting surface and second exiting surface are in fact towards same direction.
In one embodiment of this invention, LED chip module also comprises fluorescence coating, and it is disposed on first exiting surface.The printing opacity sealing also coats fluorescence coating, and second exiting surface is between brightness enhancement film and fluorescence coating.
In one embodiment of this invention, these polygonal taperings are to be positioned at first surface.The drift angle in these polygonal taperings points to the printing opacity sealing, and second surface is the plane.
In one embodiment of this invention, these polygonal taperings are to be positioned at second surface.The drift angle in these polygonal taperings points to the direction away from the printing opacity sealing, and first surface is the plane.
In one embodiment of this invention, these polygonal taperings are to be positioned at first surface and second surface.The drift angle that is positioned at the polygonal tapering of first surface points to the printing opacity sealing, and the drift angle that is positioned at the polygonal tapering of second surface points to the direction away from the printing opacity sealing.
The present invention proposes a kind of light source module again, and it comprises at least one light-emitting component, light element and brightness enhancement film.Light-emitting component is suitable for sending light beam.Light element is disposed on the bang path of light beam, and has incidence surface and exiting surface.Brightness enhancement film is disposed on the incidence surface.Come the light beam of self-emission device can penetrate brightness enhancement film and incidence surface in regular turn and enter in the light element, and be passed to outside the light element by exiting surface.
In one embodiment of this invention, brightness enhancement film has towards the first surface of incidence surface and the second surface of incidence surface dorsad.Brightness enhancement film has a plurality of polygonal taperings, and these polygonal taperings are positioned at first surface and/or second surface, and is the polygon arrayed.The drift angle in these polygonal taperings can point to incidence surface or point to direction away from incidence surface.
In one embodiment of this invention, brightness enhancement film has towards the first surface of incidence surface and the second surface of incidence surface dorsad.Brightness enhancement film has a plurality of first strip lug bosses that are positioned at first surface, and these first strip lug bosses are arranged along first direction, and each first strip lug boss is along extending with the vertical in fact second direction of first direction.Brightness enhancement film can have more a plurality of second strip lug bosses that are positioned at second surface, and these second strip lug bosses are arranged along third direction, and each second strip lug boss along with the vertical in fact four directions of third direction to extension.The four directions is to spending greater than 0 with the angle of second direction.
In one embodiment of this invention, the four directions is to vertical in fact with second direction.
In one embodiment of this invention, brightness enhancement film has towards the first surface of incidence surface and the second surface of incidence surface dorsad.Brightness enhancement film has a plurality of second strip lug bosses that are positioned at second surface, and these second strip lug bosses are arranged along third direction, and each second strip lug boss along with the vertical in fact four directions of third direction to extension.
In the LED chip module of one embodiment of the invention, because the light beam that light-emitting diode chip for backlight unit sent can be transmitted to the external world through after the brightness enhancement film earlier again, so LED chip module can provide comparatively integrated light beam.In the light source module of one embodiment of the invention and since light beam that light-emitting component sent can be earlier by entering light element after the brightness enhancement film again, so light source module can provide brightness higher light source.
For above-mentioned feature and advantage of the present invention can be become apparent, a plurality of embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is a kind of generalized section of known surface adhesion type LED chip module.
Fig. 2 A is the generalized section of the LED chip module of first embodiment of the invention.
Fig. 2 B is the thin portion generalized section of the light-emitting diode chip for backlight unit among Fig. 2 A.
Fig. 2 C is that brightness enhancement film among Fig. 2 A is with its first surface stereogram up.
Fig. 2 D is the following view of the brightness enhancement film among Fig. 2 A.
Fig. 3 A is the generalized section of the LED chip module of second embodiment of the invention.
Fig. 3 B is that brightness enhancement film among Fig. 3 A is with its second surface stereogram up.
Fig. 4 A is the generalized section of the LED chip module of third embodiment of the invention.
Fig. 4 B is the stereogram of the brightness enhancement film among Fig. 4 A.
Fig. 5 is the generalized section of the LED chip module of fourth embodiment of the invention.
Fig. 6 is the generalized section of the LED chip module of fifth embodiment of the invention.
Fig. 7 is the generalized section of the LED chip module of sixth embodiment of the invention.
Fig. 8 is the generalized section of the LED chip module of seventh embodiment of the invention.
Fig. 9 is the following view of brightness enhancement film of the LED chip module of eighth embodiment of the invention.
Figure 10 A is the structural representation of the light source module of ninth embodiment of the invention, and Figure 10 B is the stereogram of the brightness enhancement film among Figure 10 A.
Figure 11 A is the structural representation of the light source module of tenth embodiment of the invention, and Figure 11 B is the stereogram of the brightness enhancement film among Figure 11 A.
Figure 12 A is the structural representation of the light source module of eleventh embodiment of the invention.
Figure 12 B is the stereogram of the brightness enhancement film among Figure 12 A.
Figure 13 is the structural representation of the light source module of twelveth embodiment of the invention.
Description of reference numerals
100: the surface-mounting LED chip module
110,210: light-emitting diode chip for backlight unit
112,214,214a, 214b, 312,312a, 312b: light beam
120: lead frame 130,230: molded structure
132,232: opening 140,240,240d, 240e, 240f: printing opacity sealing
200,200a, 200b, 200c, 200d, 200e, 200f: LED chip module
212,324,324c: exiting surface 220,380: carrier
250,250a, 250b, 250g, 350,350a, 350b: brightness enhancement film
251,251g, 253: polygonal tapering
256,256a, 256b, 356,356a, 356b: first surface
258,258a, 258b, 358,358a, 358b: second surface
259: drift angle 260: fluorescence coating
272a: the first electrode 272b: second electrode
274: semiconductor substrate 276a: first semiconductor layer
276b: second semiconductor layer 300,300a, 300b, 300c: light source module
310: light-emitting component 320,320c: light element
322,322c: incidence surface 326: surface
330: 351: the first strip lug bosses of reflector element
353: the second strip lug bosses 359: tip
D1, d1 ': first direction d2, d2 ': second direction
D3 ': third direction d4 ': the four directions to
θ 1, θ 1 ': the angle of divergence
The specific embodiment
First embodiment
Fig. 2 A is the generalized section of the LED chip module of first embodiment of the invention, Fig. 2 B is the thin portion generalized section of the light-emitting diode chip for backlight unit among Fig. 2 A, Fig. 2 C be brightness enhancement film among Fig. 2 A with its first surface stereogram up, and Fig. 2 D is the following view of the brightness enhancement film among Fig. 2 A.Please refer to Fig. 2 A to Fig. 2 D, the LED chip module 200 of present embodiment comprises light-emitting diode chip for backlight unit 210, brightness enhancement film 250 and fluorescence coating 260.Light-emitting diode chip for backlight unit 210 has exiting surface 212.Brightness enhancement film 250 is disposed on the exiting surface 212.Fluorescence coating 260 is disposed on the brightness enhancement film 250.Light-emitting diode chip for backlight unit 210 is suitable for sending light beam 214.After light beam 214 penetrates from exiting surface 212, can be in regular turn by brightness enhancement film 250 and fluorescence coating 260.
In the present embodiment, light-emitting diode chip for backlight unit 210 comprises electrode 272a, is disposed at semiconductor substrate 274 on the first electrode layer 272a, is disposed at the first semiconductor layer 276a on the semiconductor substrate 274, is disposed at the second semiconductor layer 276b on the first semiconductor layer 276a and is disposed at the second electrode 272b on the second semiconductor layer 276b.The second electrode 272b exposes the part second semiconductor layer 276b, and the surface of the first semiconductor layer 276a dorsad of the second semiconductor layer 276b of this part is exiting surface 212.The first semiconductor layer 276a and the second semiconductor layer 276b for example are respectively p type semiconductor layer (p-type semiconductor layer) and n type semiconductor layer (n-type semiconductor layer), perhaps are respectively n type semiconductor layer and p type semiconductor layer.The light beam 214 that P-N knot (p-n junction) between the first semiconductor layer 276a and the second semiconductor layer 276b is sent can penetrate the second semiconductor layer 276b, and leaves light-emitting diode chip for backlight unit 210 via exiting surface 212.
It should be noted that the light-emitting diode chip for backlight unit 210 that Fig. 2 B illustrates is surface-emitting type (surface emitting type) light-emitting diode chip for backlight unit, its structure only is used for for example, but not in order to restriction the present invention.In the embodiment that other do not illustrate, light-emitting diode chip for backlight unit can also be lateral emitting type (edge emitting type) light-emitting diode chip for backlight unit, and brightness enhancement film is disposed on the exiting surface of led of side view type chip.Perhaps, light-emitting diode chip for backlight unit can also be the light-emitting diode chip for backlight unit that is other structures.
In the present embodiment, brightness enhancement film 250 has towards the first surface 256 of light-emitting diode chip for backlight unit 210 and the second surface 258 of backward luminous diode chip for backlight unit 210.In addition, brightness enhancement film 250 has a plurality of polygonal taperings 251, and these polygonal taperings 251 are positioned at first surface 256, and are the polygon arrayed.Polygonal tapering 251 for example is N pyramid portion, wherein N 〉=3.In the present embodiment, polygonal tapering 251 is a quadrangular pyramid portion for example, and these quadrangular pyramid portions are the quadrangle arrayed.Moreover in the present embodiment, the drift angle 259 in these polygonal taperings 251 points to light-emitting diode chip for backlight unit 210, that is polygonal tapering 251 is towards light-emitting diode chip for backlight unit 210 projectioies.In addition, second surface 258 for example is the plane.
Polygonal tapering 251 for example is a positive N pyramid portion, and each interior angle of the bottom surface of its phase vertical angles 259 all equals 180 (N-2)/N degree, wherein N 〉=3.In the present embodiment, N=4, so each interior angle of bottom surface all equals 90 degree.Yet in other embodiments, polygonal tapering can also be the N pyramid portion that each length of side not exclusively equates.
In the present embodiment, fluorescence coating 260 is for being mixed with the rete of fluorescent material.Fluorescent material for example be yttrium-aluminium-garnet (Yttrium Aluminum Garnet, YAG) or other suitable fluorescent materials.
In the present embodiment, light-emitting diode chip for backlight unit 210 is configurable on carrier 220, and is electrically connected to carrier 220.Particularly, carrier 220 for example is a lead frame.Yet in other embodiments, carrier can also be line carrier plate (circuit board) or other suitable carriers.In addition, in the present embodiment, LED chip module 200 also comprises printing opacity sealing 240, to coat light-emitting diode chip for backlight unit 210 and brightness enhancement film 250.
In addition, in the present embodiment, the part of carrier 220 is optionally by 230 coatings of molded structure (molding member).Molded structure 230 has opening 232, and exposing light-emitting diode chip for backlight unit 210, brightness enhancement film 250 and fluorescence coating 260, and printing opacity sealing 240 is to be filled in the opening 232.Moreover molded structure 230 is made of lighttight material.
In the present embodiment, LED chip module 200 has brightness enhancement film 250, and the light beam 214 that light-emitting diode chip for backlight unit 210 is sent is after passing through bright enhancement film 250, light beam 214 can dwindle because of the refraction action in polygonal tapering 251 at the angle of divergence θ on the first direction d1 1 and the angle of divergence (not illustrating) on the second direction d2 vertical with first direction d1, so LED chip module 200 can provide comparatively integrated light beam 214.Thus, the pharosage of light beam 214 (luminous fluxdensity) just can be higher, and can also make LED chip module 200 need be applied to the occasion of higher collimation light source.
Second embodiment
Fig. 3 A is the generalized section of the LED chip module of second embodiment of the invention, and Fig. 3 B is that brightness enhancement film among Fig. 3 A is with its second surface stereogram up.Please refer to Fig. 3 A and Fig. 3 B, the LED chip module 200a of present embodiment and above-mentioned LED chip module 200 (please refer to Fig. 2 A) are similar, and both difference is as described below.In LED chip module 200a, the first surface 256a of brightness enhancement film 250a for example is the plane.In addition, the polygonal tapering 253 of brightness enhancement film 250a is to be positioned at second surface 258a.Polygonal tapering 253 for example is N pyramid portion, wherein N 〉=3.The direction that the drift angle 259 in polygonal tapering 253 points to away from light-emitting diode chip for backlight unit 210, that is polygonal tapering 253 is towards the direction projection away from light-emitting diode chip for backlight unit 210.In the present embodiment, polygonal tapering 253 is similar to above-mentioned polygonal tapering 251 (illustrating as Fig. 2 C).Yet, in other embodiments, the polygonal tapering that is positioned at second surface can also be the polygonal tapering that is positioned at the other types of first surface similar in appearance to above-mentioned, is that with the difference that is positioned at the polygonal tapering of second surface its drift angle points to different directions respectively and be positioned at first surface.
In LED chip module 200a, and the light beam 214a that light-emitting diode chip for backlight unit 210 is sent is after passing through bright enhancement film 250, the angle of divergence of light beam 214a on first direction d1 and second direction d2 can be dwindled because of the refraction action in polygonal tapering 253, so LED chip module 200a can provide comparatively integrated light beam 214a.Thus, the pharosage of light beam 214a just can be higher, and can also make LED chip module 200a need be applied to the occasion of higher collimation light source.
The 3rd embodiment
Fig. 4 A is the generalized section of the LED chip module of third embodiment of the invention, and Fig. 4 B is the stereogram of the brightness enhancement film among Fig. 4 A.Please refer to Fig. 4 A and Fig. 4 B, the LED chip module 200b of present embodiment and above-mentioned LED chip module 200 (please refer to Fig. 2 A) are similar, and both difference is as described below.In LED chip module 200b, brightness enhancement film 250b has above-mentioned these polygonal taperings 251 (asking simultaneously with reference to Fig. 2 C and Fig. 4 B) and above-mentioned these polygonal taperings 253 (asking simultaneously with reference to Fig. 3 B and Fig. 4 B) simultaneously, wherein polygonal tapering 251 is the first surface 256b that are positioned at brightness enhancement film 250b, and polygonal tapering 253 is the second surface 258b that are positioned at brightness enhancement film 250b.
In the LED chip module 200b of present embodiment, because brightness enhancement film 250b has polygonal tapering 251 and polygonal tapering 253 simultaneously, therefore the light beam 214b that sent of light-emitting diode chip for backlight unit 210 is by behind the brightness enhancement film 250b, and the pharosage of light beam 214b and collimation can further be promoted.
The 4th embodiment
Fig. 5 is the generalized section of the LED chip module of fourth embodiment of the invention.Please refer to Fig. 5, the LED chip module 200c of present embodiment and above-mentioned LED chip module 200 (please refer to Fig. 2 A) are similar, and both difference is that brightness enhancement film 250 is different with the relative allocation position of fluorescence coating 260.In LED chip module 200c, fluorescence coating 260 is to be disposed on the exiting surface 212 of light-emitting diode chip for backlight unit 210, and brightness enhancement film 250 is to be disposed on the fluorescence coating 260.The advantage and the effect of the advantage of LED chip module 200c and effect and above-mentioned LED chip module 200 (please refer to Fig. 2 A) are similar, no longer repeat at this.
It should be noted that the brightness enhancement film 250 among the LED chip module 200c can also replace with above-mentioned brightness enhancement film 250a (please refer to Fig. 3 B) or above-mentioned brightness enhancement film 250b (please refer to Fig. 4 B), and form other two kinds of LED chip modules.
The 5th embodiment
Fig. 6 is the generalized section of the LED chip module of fifth embodiment of the invention.Please refer to Fig. 6, the LED chip module 200d of present embodiment and above-mentioned LED chip module 200 (please refer to Fig. 2 A) are similar, and both difference is as described below.LED chip module 200d does not have above-mentioned fluorescence coating 260, and printing opacity sealing 240d coats light-emitting diode chip for backlight unit 210 and brightness enhancement film 250.In the present embodiment, printing opacity sealing 240d is mixed with fluorescent material.Yet, in other embodiments, can also replace printing opacity sealing 240d with the printing opacity sealing that is not mixed with fluorescent material.
It should be noted that the brightness enhancement film 250 among the LED chip module 200d can also replace with above-mentioned brightness enhancement film 250a (please refer to Fig. 3 B) or above-mentioned brightness enhancement film 250b (please refer to Fig. 4 B), and form other two kinds of LED chip modules.
The 6th embodiment
Fig. 7 is the generalized section of the LED chip module of sixth embodiment of the invention.Please refer to Fig. 7, the LED chip module 200e of present embodiment and above-mentioned LED chip module 200c (please refer to Fig. 5) are similar, and both difference is as described below.In LED chip module 200e, brightness enhancement film 250 is to be disposed at printing opacity sealing 240e outside, and is not coated by it.Particularly, printing opacity sealing 240e coats light-emitting diode chip for backlight unit 210 and fluorescence coating 260, and has exiting surface 242.Brightness enhancement film 250 is to be disposed on the exiting surface 242 of printing opacity sealing 240e, and wherein exiting surface 242 is between brightness enhancement film 250 and fluorescence coating 260.In addition, the drift angle 259 in the polygonal tapering 251 of brightness enhancement film 250 points to printing opacity sealing 240e.
In addition, brightness enhancement film 250 among the LED chip module 200e can also replace with above-mentioned brightness enhancement film 250a (please refer to Fig. 3 B), and form another kind of LED chip module, wherein drift angle 259 sensings in the polygonal tapering 253 of brightness enhancement film 250a are away from the direction of printing opacity sealing 240e.In addition, brightness enhancement film 250 among the LED chip module 200e can also replace with above-mentioned brightness enhancement film 250b (please refer to Fig. 4 B), and form another LED chip module, wherein the drift angle 259 in the polygonal tapering 251 of brightness enhancement film 250b points to printing opacity sealing 240e, and the direction that the drift angle 259 in polygonal tapering 253 points to away from printing opacity sealing 240e.
The 7th embodiment
Fig. 8 is the generalized section of the LED chip module of seventh embodiment of the invention.Please refer to Fig. 8, the LED chip module 200f of present embodiment and above-mentioned LED chip module 200e (please refer to Fig. 7) are similar, and both difference is as described below.LED chip module 200f does not have above-mentioned fluorescence coating 260 (please refer to Fig. 7), and printing opacity sealing 240f coats light-emitting diode chip for backlight unit 210.In the present embodiment, printing opacity sealing 240f is mixed with fluorescent material.Yet, in other embodiments, can also replace printing opacity sealing 240f with the printing opacity sealing of the fluorescent material that undopes.
In addition, the brightness enhancement film 250 among the LED chip module 200f can also replace with above-mentioned brightness enhancement film 250a (please refer to Fig. 3 B) or above-mentioned brightness enhancement film 250b (please refer to Fig. 4 B), and forms other two kinds of LED chip modules.
The 8th embodiment
Fig. 9 is the following view of brightness enhancement film of the LED chip module of eighth embodiment of the invention.Please refer to Fig. 9, the brightness enhancement film 250g of the LED chip module of present embodiment and above-mentioned brightness enhancement film 250 (illustrating as Fig. 2 D) are similar, both difference is that the polygonal tapering 251g of brightness enhancement film 250g is the triangle tapering, and polygonal tapering 251g arrayed triangular in shape.
The 9th embodiment
Figure 10 A is the structural representation of the light source module of ninth embodiment of the invention, and Figure 10 B is the stereogram of the brightness enhancement film among Figure 10 A.Please refer to Figure 10 A and Figure 10 B, the light source module 300 of present embodiment comprises light-emitting component 310, light element 320 and brightness enhancement film 350.Light-emitting component 310 is suitable for sending light beam 312.In the present embodiment, light-emitting component 310 for example is light emitting diode or other suitable light-emitting components.Light element 320 is disposed on the bang path of light beam 312, and has incidence surface 322 and exiting surface 324.In the present embodiment, light element 320 is the leaded light post for example, and incidence surface 322 is the end face of leaded light post.In addition, light element 320 can have more and exiting surface 324 facing surfaces 326, and incidence surface 322 is connected between exiting surface 324 and the surface 326.Yet in other embodiments, light element can also be a LGP.
In the present embodiment, brightness enhancement film 350 has towards the first surface 356 of incidence surface 322 and the second surface 358 of incidence surface 322 dorsad.Brightness enhancement film 350 can have a plurality of first strip lug bosses 351 that are positioned at first surface 356.These first strip lug bosses 351 are arranged along first direction d1 ', and each first strip lug boss 351 is along extending with the vertical in fact second direction d2 ' of first direction d1 '.Particularly, the first strip lug boss 351 for example is the triangle column, and the triangle section of the first strip lug boss 351 has tip 359, and most advanced and sophisticated 359 point to incidence surfaces 322.Yet it is to be the triangle column that the present invention does not limit the first strip lug boss.In the embodiment that other do not illustrate, the first strip lug boss can also be the strip that is other forms.For example, in the embodiment that another does not illustrate, the cross section of the first strip lug boss can also have the arc convex end to replace above-mentioned most advanced and sophisticated 359.Moreover second surface 358 for example is the plane.
In the present embodiment, light source module 300 has brightness enhancement film 350, and the light beam 312 that light-emitting component 310 is sent is after passing through brightness enhancement film 350, the angle of divergence θ 1 ' of light beam 312 on first direction d1 ' can dwindle because of the refraction action of the first strip lug boss 351, therefore the ratio by the light beam 312 of exiting surface 324 outgoing just can increase, and then the brightness of the light source that light source module 300 provided is increased.
It should be noted that the quantity that the present invention does not limit the light-emitting component 310 that light source module 300 had is one, in other embodiments, light source module can also have a plurality of light-emitting components, and these light-emitting components are configurable by the incidence surface of light element.In addition, the present invention does not also limit first direction d1 ' and is perpendicular to exiting surface 324, and does not limit second direction d2 ' and be parallel to exiting surface.In other embodiments, can also be second direction d2 ' perpendicular to exiting surface 324, and first direction d1 ' is parallel to exiting surface 324.Perhaps, first direction d1 ' can also be that relative exiting surface 324 tilts with second direction d2 '.
The tenth embodiment
Figure 11 A is the structural representation of the light source module of tenth embodiment of the invention, and Figure 11 B is the stereogram of the brightness enhancement film among Figure 11 A.Please refer to Figure 11 A and Figure 11 B, the light source module 300a of present embodiment and above-mentioned light source module 300 (please refer to Figure 10 A) are similar, and both difference is as described below.In light source module 300a, the first surface 356a of brightness enhancement film 350a is the plane.In addition, brightness enhancement film 350a has a plurality of second strip lug bosses 353 that are positioned at second surface 358a.In the present embodiment, the shape of the second strip lug boss 353 is identical with the above-mentioned first strip lug boss 351 (please refer to Figure 10 B), and the direction that the tip 359 of the triangle section of the second strip lug boss 353 is pointed to away from incidence surface 322.Yet in the embodiment that other do not illustrate, the second strip lug boss 353 can also be the strip of other forms.These second strip lug bosses 353 are arranged along third direction d3 ', and each second strip lug boss 353 is along extending to d4 ' with the vertical in fact four directions of third direction d3 '.
In light source module 300a, and the light beam 312a that light-emitting component 310 is sent is after passing through brightness enhancement film 350, the angle of divergence of light beam 312a on third direction d3 ' can be dwindled because of the refraction action of the second strip lug boss 353, therefore the ratio regular meeting by the light beam 312a of exiting surface 324 outgoing increases, and then promotes the brightness of the light source that light source module 300a can provide.
It should be noted that the present invention does not also limit the four directions and is perpendicular to exiting surface 324 to d4 ', and do not limit third direction d3 ' and be parallel to exiting surface.In other embodiments, can also be third direction d3 ' perpendicular to exiting surface 324, and the four directions is parallel to exiting surface 324 to d4 '.Perhaps, third direction d3 ' can also be that relative exiting surface 324 tilts with the four directions to d4 '.
The 11 embodiment
Figure 12 A is the structural representation of the light source module of eleventh embodiment of the invention, and Figure 12 B is the stereogram of the brightness enhancement film among Figure 12 A.Please refer to Figure 12 A and Figure 12 B, the light source module 300b of present embodiment and above-mentioned light source module 300 (please refer to Figure 10 A) are similar, and both difference is as described below.In light source module 300b, brightness enhancement film 350b has above-mentioned these first strip lug bosses 351 (asking simultaneously with reference to Figure 10 B and Figure 12 B) and above-mentioned these second strip lug bosses 353 (asking simultaneously with reference to Figure 11 B and Figure 12 B) simultaneously, wherein these first strip lug bosses 351 are the first surface 356b that are positioned at brightness enhancement film 350b, and these second strip lug bosses 353 are the second surface 358b that are positioned at brightness enhancement film 350b.In addition, the four directions is spent greater than 0 with the angle of second direction d2 ' (i.e. the bearing of trend of the first strip lug boss 351) to d4 ' (i.e. the bearing of trend of the second strip lug boss 353).In the present embodiment, the four directions to d4 ' and second direction d2 ' for example for orthogonal in fact.
In the light source module 300b of present embodiment, because brightness enhancement film 350b has the first different strip lug boss 351 of bearing of trend and the second strip lug boss 353 simultaneously, so the light beam 312b that light-emitting component 310 is sent is after passing through brightness enhancement film 350b, light beam 312b all can dwindle with the angle of divergence on the third direction d3 ' at first direction d1 ', and makes the brightness of the light source that light source module 300b can provide further promote.
It should be noted that, the present invention does not also limit first direction d1 ' and is perpendicular to exiting surface 324, and not limiting second direction d2 ' is to be parallel to exiting surface, and also not limiting third direction d3 ' is to be parallel to exiting surface, does not more limit the four directions and is perpendicular to exiting surface 324 to d4 '.In other embodiments, can also be second direction d2 ' perpendicular to exiting surface 324, first direction d1 ' is parallel to exiting surface 324 third direction d3 ' perpendicular to exiting surface 324, and the four directions is parallel to exiting surface 324 to d4 '.Perhaps, first direction d1 ', second direction d2 ', third direction d3 ' can also be that relative exiting surface 324 tilts with the four directions to d4 '.
The 12 embodiment
Figure 13 is the structural representation of the light source module of twelveth embodiment of the invention.Please refer to Figure 13, the light source module 300c of present embodiment and above-mentioned light source module 300 (illustrating as Figure 10 A) are similar, and both difference is as described below.In light source module 300c, the incidence surface 322c of light element 320c and exiting surface 324c toward each other, a plurality of light-emitting components 310 then are disposed at by the incidence surface 322c.
It should be noted that, in the embodiment that other do not illustrate, light source module 300, brightness enhancement film 350 among 300a～300c, 350a, 350b can also replace with the brightness enhancement film among first to the 8th embodiment, for example be with brightness enhancement film 250,250a, 250b, 250g replaces, wherein first surface 256,256a, 256b is towards incidence surface 322,322c, second surface 258,258a, 258b is incidence surface 322 dorsad, 322c, the drift angle 259 in polygonal tapering 251 points to incidence surface 322,322c, and the drift angle 259 in polygonal tapering 253 points to away from incidence surface 322, the direction of 322c.
In sum, in an embodiment of the present invention, because the light beam that light-emitting diode chip for backlight unit sent can be transmitted to the external world through after the brightness enhancement film earlier again, so LED chip module can provide comparatively concentrated and the higher light beam of pharosage.Thus, just can make LED chip module need be applied to the occasion of higher collimation light source.In addition, in the light source module of embodiments of the invention, because the light beam that light-emitting component sent can pass through brightness enhancement film earlier, so the brightness of the light source that light source module provided is higher by before the light element.
Though the present invention discloses as above with a plurality of embodiment; right its is not in order to limit the present invention; technical field technical staff under any; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when looking being as the criterion that accompanying Claim defines.
Claims (25)
1. a LED chip module is characterized in that, comprising:
Light-emitting diode chip for backlight unit has exiting surface; And
Brightness enhancement film, be disposed on the described exiting surface, and have towards the first surface of described light-emitting diode chip for backlight unit and the second surface of described light-emitting diode chip for backlight unit dorsad, and described brightness enhancement film has a plurality of polygonal taperings, described polygonal tapering is positioned at described first surface and/or described second surface, and is the polygon arrayed.
2. LED chip module as claimed in claim 1 is characterized in that described polygonal tapering is to be positioned at described first surface, and the drift angle in described polygonal tapering points to described light-emitting diode chip for backlight unit, and described second surface is the plane.
3. LED chip module as claimed in claim 1 is characterized in that described polygonal tapering is to be positioned at described second surface, and the drift angle in described polygonal tapering points to the direction away from described light-emitting diode chip for backlight unit, and described first surface is the plane.
4. LED chip module as claimed in claim 1, it is characterized in that described polygonal tapering is to be positioned at described first surface and described second surface, the drift angle that is positioned at the described polygonal tapering of described first surface points to described light-emitting diode chip for backlight unit, and the drift angle that is positioned at the described polygonal tapering of described second surface points to the direction away from described light-emitting diode chip for backlight unit.
5. LED chip module as claimed in claim 1 is characterized in that, also comprises fluorescence coating, is disposed on the described brightness enhancement film.
6. LED chip module as claimed in claim 5 is characterized in that, also comprises:
Carrier, wherein said light-emitting diode chip for backlight unit are to be disposed on the described carrier; And
The printing opacity sealing coats described light-emitting diode chip for backlight unit, described brightness enhancement film and described fluorescence coating.
7. LED chip module as claimed in claim 1 is characterized in that, also comprises:
Carrier, wherein said light-emitting diode chip for backlight unit are to be disposed on the described carrier; And
The printing opacity sealing coats described light-emitting diode chip for backlight unit and described brightness enhancement film.
8. a LED chip module is characterized in that, comprising:
Light-emitting diode chip for backlight unit has exiting surface;
Fluorescence coating is disposed on the described exiting surface; And
Brightness enhancement film, be disposed on the described fluorescence coating, and have towards the first surface of described light-emitting diode chip for backlight unit and the second surface of described light-emitting diode chip for backlight unit dorsad, and described brightness enhancement film has a plurality of polygonal taperings, described polygonal tapering is positioned at described first surface and/or described second surface, and is the polygon arrayed.
9. LED chip module as claimed in claim 8 is characterized in that described polygonal tapering is to be positioned at described first surface, and the drift angle in described polygonal tapering points to described light-emitting diode chip for backlight unit, and described second surface is the plane.
10. LED chip module as claimed in claim 8 is characterized in that described polygonal tapering is to be positioned at described second surface, and the drift angle in described polygonal tapering points to the direction away from described light-emitting diode chip for backlight unit, and described first surface is the plane.
11. LED chip module as claimed in claim 8, it is characterized in that described polygonal tapering is to be positioned at described first surface and described second surface, the drift angle that is positioned at the described polygonal tapering of described first surface points to described light-emitting diode chip for backlight unit, and the drift angle that is positioned at the described polygonal tapering of described second surface points to the direction away from described light-emitting diode chip for backlight unit.
12. LED chip module as claimed in claim 8 is characterized in that, also comprises:
Carrier, wherein said light-emitting diode chip for backlight unit are to be disposed on the described carrier; And
The printing opacity sealing coats described light-emitting diode chip for backlight unit, described fluorescence coating and described brightness enhancement film.
13. a LED chip module is characterized in that, comprising:
Carrier;
Light-emitting diode chip for backlight unit is disposed on the described carrier, and has first exiting surface;
The printing opacity sealing coats described light-emitting diode chip for backlight unit, and has second exiting surface; And
Brightness enhancement film, be disposed on described second exiting surface, wherein said second exiting surface is between described brightness enhancement film and described first exiting surface, described brightness enhancement film has towards the first surface of described printing opacity sealing and the second surface of described printing opacity sealing dorsad, and have a plurality of polygonal taperings, described polygonal tapering is positioned at described first surface and/or described second surface, and is the polygon arrayed.
14. LED chip module as claimed in claim 13 is characterized in that described polygonal tapering is to be positioned at described first surface, the drift angle in described polygonal tapering points to described printing opacity sealing, and described second surface is the plane.
15. LED chip module as claimed in claim 13 is characterized in that described polygonal tapering is to be positioned at described second surface, the drift angle in described polygonal tapering points to the direction away from described printing opacity sealing, and described first surface is the plane.
16. LED chip module as claimed in claim 13, it is characterized in that described polygonal tapering is to be positioned at described first surface and described second surface, the drift angle that is positioned at the described polygonal tapering of described first surface points to described printing opacity sealing, and the drift angle that is positioned at the described polygonal tapering of described second surface points to the direction away from described printing opacity sealing.
17. LED chip module as claimed in claim 13 is characterized in that described first exiting surface and described second exiting surface are in fact towards same direction.
18. LED chip module as claimed in claim 13, it is characterized in that, also comprise fluorescence coating, be disposed on described first exiting surface, wherein said printing opacity sealing also coats described fluorescence coating, and described second exiting surface is between described brightness enhancement film and described fluorescence coating.
19. a light source module is characterized in that, comprising:
At least one light-emitting component is suitable for sending light beam;
Light element is disposed on the bang path of described light beam, and has incidence surface and exiting surface; And
Brightness enhancement film is disposed on the described incidence surface, wherein can penetrate described brightness enhancement film and described incidence surface in regular turn from the described light beam of described light-emitting component and enters in the described light element, and be passed to outside the described light element by described exiting surface.
20. light source module as claimed in claim 19, it is characterized in that described brightness enhancement film has towards the first surface of described incidence surface and the second surface of described incidence surface dorsad, and described brightness enhancement film has a plurality of polygonal taperings, described polygonal tapering is positioned at described first surface and/or described second surface, and is the polygon arrayed.
21. light source module as claimed in claim 20, the drift angle that it is characterized in that described polygonal tapering point to described incidence surface or point to direction away from described incidence surface.
22. light source module as claimed in claim 19, it is characterized in that described brightness enhancement film has towards the first surface of described incidence surface and the second surface of described incidence surface dorsad, and described brightness enhancement film has a plurality of first strip lug bosses that are positioned at described first surface, the described first strip lug boss is arranged along first direction, and each described first strip lug boss is along extending with the vertical in fact second direction of described first direction.
23. light source module as claimed in claim 22, it is characterized in that described brightness enhancement film also has a plurality of second strip lug bosses that are positioned at described second surface, the described second strip lug boss is arranged along third direction, and each described second strip lug boss along with the vertical in fact four directions of described third direction to extension, described four directions to the angle of described second direction greater than 0 degree.
24. light source module as claimed in claim 23 is characterized in that described four directions is to vertical in fact with described second direction.
25. light source module as claimed in claim 19, it is characterized in that described brightness enhancement film has towards the first surface of described incidence surface and the second surface of described incidence surface dorsad, and described brightness enhancement film has a plurality of second strip lug bosses that are positioned at described second surface, the described second strip lug boss is arranged along third direction, and each described second strip lug boss along with the vertical in fact four directions of described third direction to extension.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810085353A CN101532636A (en) | 2008-03-14 | 2008-03-14 | Light-emitting diode (LED) chip module and light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810085353A CN101532636A (en) | 2008-03-14 | 2008-03-14 | Light-emitting diode (LED) chip module and light source module |
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| Publication Number | Publication Date |
|---|---|
| CN101532636A true CN101532636A (en) | 2009-09-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810085353A Pending CN101532636A (en) | 2008-03-14 | 2008-03-14 | Light-emitting diode (LED) chip module and light source module |
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| Country | Link |
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| CN (1) | CN101532636A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130247A (en) * | 2010-01-14 | 2011-07-20 | Lg伊诺特有限公司 | Light emitting diode chip and package incorporating the same |
| CN114704788A (en) * | 2021-12-30 | 2022-07-05 | 上海通领汽车科技股份有限公司 | Luminous interior trim part assembly |
-
2008
- 2008-03-14 CN CN200810085353A patent/CN101532636A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130247A (en) * | 2010-01-14 | 2011-07-20 | Lg伊诺特有限公司 | Light emitting diode chip and package incorporating the same |
| CN102130247B (en) * | 2010-01-14 | 2014-09-24 | Lg伊诺特有限公司 | Light emitting diode chip and package incorporating the same |
| US9136445B2 (en) | 2010-01-14 | 2015-09-15 | Lg Innotek Co., Ltd. | Light emitting device chip, light emitting device package |
| CN114704788A (en) * | 2021-12-30 | 2022-07-05 | 上海通领汽车科技股份有限公司 | Luminous interior trim part assembly |
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Application publication date: 20090916 |