CN101532327A - Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof - Google Patents
Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof Download PDFInfo
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- CN101532327A CN101532327A CN200910061554A CN200910061554A CN101532327A CN 101532327 A CN101532327 A CN 101532327A CN 200910061554 A CN200910061554 A CN 200910061554A CN 200910061554 A CN200910061554 A CN 200910061554A CN 101532327 A CN101532327 A CN 101532327A
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- board
- chip substrate
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- linking
- decorated
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- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 28
- 238000005187 foaming Methods 0.000 claims abstract description 21
- 239000000835 fiber Substances 0.000 claims abstract description 8
- 238000000465 moulding Methods 0.000 claims abstract description 6
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 5
- 239000010959 steel Substances 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 238000012423 maintenance Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 20
- 239000002002 slurry Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 11
- 239000004568 cement Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 238000005034 decoration Methods 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- IQYKECCCHDLEPX-UHFFFAOYSA-N chloro hypochlorite;magnesium Chemical class [Mg].ClOCl IQYKECCCHDLEPX-UHFFFAOYSA-N 0.000 claims description 4
- 229910021653 sulphate ion Inorganic materials 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 229920005830 Polyurethane Foam Polymers 0.000 claims description 2
- 238000001125 extrusion Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 239000011496 polyurethane foam Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 238000011065 in-situ storage Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 238000002679 ablation Methods 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
- 238000004513 sizing Methods 0.000 abstract 2
- 239000004745 nonwoven fabric Substances 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
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Abstract
The invention relates to a metal faced integral-linking chip substrate insulated and decorated board and a manufacturing method thereof. The uppermost layer of the cast-in-situ molding integral-linking chip substrate board is a decorated surface of metal plate, a button stem is installed between the upper and the lower layers of the integral-linking chip substrate board, foaming insulation boards with holes are between the button stem and the upper and lower layers of the cast-in-situ molding integral-linking chip substrate board, and the holes are used for forming the button stem. The preparation method is as follows: a steel bracket, a template and a mould are displaced on a vibration workbench, sizing agent is applied for the first time and the steel bracket, the template and the mould are put into the foaming insulation boards, the holes for forming the button stem are between the foaming insulation boards, sizing agent is applied for the second time, a cast-in-situ molding internal-linking substrate board is formed, the upper-layer fiber mesh and non-woven fabrics are paved smoothly, static maintenance and white-hard drying are carried out, the metal decorated board is pressed, bonded, and is edge-molded. The insulated decorated board has quick site operation, easy processing and mounting in site, light weight, high integrated intensity, good insulation performance, good weather resistance, good surface decorative performance, and difficult ablation among layers.
Description
Technical field
The present invention relates to a kind of metal faced integral-linking chip substrate insulated and decorated board and manufacture method thereof.
Background technology
There is the construction technology complexity in the current building exterior wall heat preserving system that is using (EPS plate, XPS plate exterior rendering technology and thermal insulation coatings technology), the on-the-spot wet trade that needs, long construction period, insulation layer weight is big, increase building load, decorative surface is bad, disadvantages such as existence is bubbled easily, cracking, infiltration, useful life weak point.Also having a kind of is that panel, polystyrene extruded sheet are that the composite exterior wall heat insulating material of base plate is using with the aluminium alloys, though solved the problem of site operation wet trade, speed of application is higher, decorative surface is good, but fireproof performance extreme difference because polystyrene extruded sheet (XPS) base plate of this material is exposed, the plate rupture strength is low, adopt thicker aluminium alloy plate to make the cost of this material very high for increasing rupture strength, another drawback of this material is the direct and polystyrene board bonding of aluminium alloy panel, thereby adhesion strength is not high.
That now applies for Chinese patent has " a kind of manufacture method of heat insulating decorative board " (application number 200710125314), comprise with thicknessing machine fixed thick to the facing plate, facing plate and air contact surface are carried out external coating, facing plate and warming plate are sticked with glue the agent applying, adopt the heat insulating decorative board pressurization of cold press to posting, surfacing gets product." a kind of heat insulating decorative board " (number of patent application 200710029840), for two-layer, one deck is the rigid polyurethane alveolar layer, another layer is layer of polyurethane or surface plate, this surface plate is metal sheet, inorganic plate or composite plate, and the rigid polyurethane alveolar layer regulates the plug connector of length by pre-buried band inwardly or the stickup putty of blade coating pastes mutually with body of wall or floor." a kind of wall heat preservation decoration plate " (number of patent application 200620173199) is made up of panel, base plate and inner core grid, is filled with heat insulating material between the inner core grid, and total can wholely be pushed from extruding machine.
Summary of the invention
The objective of the invention is at above-mentioned present situation, difficult drop-off is peeled off between a kind of each layer that aims to provide, light-high-strength, heat insulating ability, weather resisteant and good decorative property, metal faced integral-linking chip substrate insulated and decorated board and manufacture method thereof that installation period is short.
The implementation of the object of the invention is, metal faced integral-linking chip substrate insulated and decorated board, on the upper strata of cast-in-place molded integral linking chip substrate plate the metal sheet architectural surface is arranged, between the upper and lower layer of cast-in-place molded integral linking chip substrate plate stem stem is arranged, the upper and lower interlayer of stem stem and cast-in-place molded integral linking chip substrate plate has the foaming insulation board that is installed with hole.
The manufacture method of metal faced integral-linking chip substrate insulated and decorated board, concrete job step is as follows:
1) on the vibrations workbench, place steel carriage, template and mould,
2) lay lower floor fibrous mesh cloth, from the hopper slurry for the first time, slurry adopts the in addition modified formula that strengthens of lightweight and fibre of sulphate aluminium cement raw material or modified magnesium oxychloride cement raw material,
3) put into foaming insulation board, have in the middle of the foaming insulation board for the hole that forms stem stem 3,
4) from the hopper the 2nd slurry, the slurry hole by foaming insulation board up and down two-layer raw material link together, form a cast-in-place molded integral linking chip substrate plate with heat insulating material, lay top fiber grid cloth and nonwoven and leveling,
5) leave standstill maintenance,
6) demoulding drying,
7) pressurization binding metal decoration panel,
8) deburring moulding.
Insulation layer of the present invention main material foaming insulation board and other each layers no longer rely on bonding but by reserving hole formation stem stem insulation layer be fixed between the composite board with the method for integral cast-in-situ, thoroughly solved insulation layer and adjacent layer each material between the bonding ablation problem, because basic unit's sheet material has formed integral body, thereby intensity is largely increased, and can apply big pressure and make adhesion strength also obtain bigger raising when carrying out surface course decorative metal plate bonding.
Behind heat insulation base layer sheet material bonding surface layer metal sheet, have light-high-strength, heat-insulating property and weather resisteant energy and good decorative property, the short characteristics of installation period.Because insulating foam layer is covered by the two-sided parcel of cement material, therefore has better fireproof performance in work progress He after the installation.This heat insulating decorative board also has the excellent decoration effect and with existing curtain wall decoration technology highly compatible is arranged when using with exterior wall heat-preserving system.
According to said method the metal faced integral-linking chip substrate insulated and decorated board of Sheng Chaning is a kind of plate structure, it is quick to have site operation, exempt the situ wet operation, be easy to field machining lightweight is installed, the bulk strength height, good heat insulating, weather resisteant can be good, and decorative surface is good, can use thin aluminium alloy plate to be surface layer, the cost performance height.Because integral cast-in-situ makes foaming insulation board be covered by two-sided parcel, thereby all has better fireproof performance in the construction and installation process He after the installation.
Description of drawings
Fig. 1 is with heat insulating decorative board structural representation of the present invention
Fig. 2 is a heat insulating decorative board core pole hole position arrangement diagram
Fig. 3 be the A-A of Fig. 2 to view,
Fig. 4 is the process chart of preparation heat insulating decorative board.
The specific embodiment
With reference to Fig. 1, on the upper strata 2 of the cast-in-place molded integral linking chip substrate plate of heat insulating decorative board of the present invention metal sheet architectural surface 1 is arranged, between the upper strata 2 of cast-in-place molded integral linking chip substrate plate and the lower floor 5 stem stem 3 is arranged, the upper and lower interlayer of stem stem 3 and cast-in-place molded integral linking chip substrate plate has the foaming insulation board 4 that is installed with hole.The going up of cast-in-place molded integral linking chip substrate plate, layer and stem stem 3, XPS warming plate 4 are combined as cast-in-place molded integral linking chip substrate plate, paste metal sheet architectural surface 1 formation heat insulating decorative board it on.The foaming insulation board 4 that is installed with hole is polyvinyl chloride plastic extrusion heated board, phenolic foam plate, polyurethane foam board, EPS plate or expanded glass microballon forming board.
Heat insulating decorative board thickness of slab 30-80mm, foamed heat insulating thickness of slab 20-70mm has different thickness according to the difference of territory of use.
With reference to Fig. 2,3, the hole of foaming insulation board 4 intermediate arrangement stem stems 3 is lattice distance arrangement clocklike, spacing 80-300mm between the hole, aperture 10-16mm.
With reference to Fig. 4, concrete job step of the present invention is as follows:
1) on vibrations workbench 9, place steel carriage 8, template 7 and mould 6,
2) lay lower floor fibrous mesh cloth, from the hopper slurry for the first time, slurry adopts the in addition modified formula that strengthens of lightweight and fibre of sulphate aluminium cement raw material or modified magnesium oxychloride cement raw material, used sulphate aluminium cement raw material or modified magnesium oxychloride cement the raw material in addition modified formula that strengthens of lightweight and fibre are this area modified formulas commonly used
3) put into foaming insulation board 4, have in the middle of the foaming insulation board for the hole that forms stem stem 3,
4) from the hopper 10 the 2nd slurry, the slurry hole by foaming insulation board up and down two-layer raw material link together, form a cast-in-place molded integral linking chip substrate plate with heat insulating material, lay top fiber grid cloth and nonwoven and leveling,
5) leave standstill maintenance,
6) demoulding drying,
7) pressurization binding metal decoration panel 1,
8) deburring moulding, packing is dispatched from the factory.
Mould 6 adopts rectangle or the square that is complementary with heat insulating decorative board, and has the mould of certain altitude.
Claims (5)
1, metal faced integral-linking chip substrate insulated and decorated board, the superiors that it is characterized in that the cast-in-place molded integral linking chip substrate of metal faced integral-linking chip substrate insulated and decorated board plate are metal sheet architectural surfaces, between the upper and lower layer of cast-in-place molded integral linking chip substrate plate stem stem is arranged, the upper and lower interlayer of stem stem and cast-in-place molded integral linking chip substrate plate is that the foaming insulation board that is installed with hole is arranged.
2, metal faced integral-linking chip substrate insulated and decorated board according to claim 1 is characterized in that heat insulating decorative board thickness of slab 30-80mm, foamed heat insulating thickness of slab 20-70mm.
3, metal faced integral-linking chip substrate insulated and decorated board according to claim 1 is characterized in that the hole of the layout stem stem (3) that foaming insulation board (4) is middle is lattice distance arrangement clocklike, spacing 80-300mm between the hole, aperture 10-16mm.
4, metal faced integral-linking chip substrate insulated and decorated board according to claim 1, the foaming insulation board that it is characterized in that being installed with hole is polyvinyl chloride plastic extrusion heated board, phenolic foam plate, polyurethane foam board, EPS plate or expanded glass microballon forming board.
5, the manufacture method of the described metal faced integral-linking chip substrate insulated and decorated board of claim 1 is characterized in that concrete job step is as follows:
1) on the vibrations workbench, place steel carriage, template and mould,
2) lay lower floor fibrous mesh cloth, from the hopper slurry for the first time, slurry adopts the in addition modified formula that strengthens of lightweight and fibre of sulphate aluminium cement raw material or modified magnesium oxychloride cement raw material,
3) put into foaming insulation board, have in the middle of the foaming insulation board for the hole that forms stem stem 3,
4) from the hopper the 2nd slurry, the slurry hole by foaming insulation board up and down two-layer raw material link together, form a cast-in-place molded integral linking chip substrate plate with heat insulating material, lay top fiber grid cloth and nonwoven and leveling,
5) leave standstill maintenance,
6) demoulding drying,
7) pressurization binding metal decoration panel,
8) deburring moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910061554A CN101532327A (en) | 2009-04-13 | 2009-04-13 | Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910061554A CN101532327A (en) | 2009-04-13 | 2009-04-13 | Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101532327A true CN101532327A (en) | 2009-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910061554A Pending CN101532327A (en) | 2009-04-13 | 2009-04-13 | Metal faced integral-linking chip substrate insulated and decorated board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101532327A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433941A (en) * | 2011-08-31 | 2012-05-02 | 王勇 | Heat insulation composite plate of outer wall and preparation method thereof |
| WO2018133450A1 (en) * | 2017-01-19 | 2018-07-26 | 刘文华 | Production method of sandwich panel |
-
2009
- 2009-04-13 CN CN200910061554A patent/CN101532327A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433941A (en) * | 2011-08-31 | 2012-05-02 | 王勇 | Heat insulation composite plate of outer wall and preparation method thereof |
| WO2018133450A1 (en) * | 2017-01-19 | 2018-07-26 | 刘文华 | Production method of sandwich panel |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| ASS | Succession or assignment of patent right |
Owner name: HUBEI MEIHENGDA NEW INSULATION DECORATIVE MATERIAL Free format text: FORMER OWNER: CAI WENXIONG Effective date: 20091127 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20091127 Address after: No. 51, Yi Yi Road, Hubei, Wuhan Province, China: 430071 Applicant after: Hubei Meiheng Da New Keep Warm Decoration Materials Co., Ltd. Address before: Zip code 5-1, 465 Chang Di street, Wuhan, Hubei. Postal code: 430030 Applicant before: Cai Wen Xiong Co-applicant before: Shu Changqing |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090916 |