CN101527275A - Wafer back positioning system - Google Patents
Wafer back positioning system Download PDFInfo
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- CN101527275A CN101527275A CN 200810008081 CN200810008081A CN101527275A CN 101527275 A CN101527275 A CN 101527275A CN 200810008081 CN200810008081 CN 200810008081 CN 200810008081 A CN200810008081 A CN 200810008081A CN 101527275 A CN101527275 A CN 101527275A
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- optical microscope
- wafer
- positioning system
- microscope system
- back positioning
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Abstract
The invention proposes a wafer back positioning system. The wafer back positioning system comprises at least two groups of optical microscopic systems. The at least two groups of the optical microscopic systems are arranged on the front and the back of an object to be observed respectively. The optical microscopic systems on the front and the back of the wafer are aligned with each other and move with corresponding optical microscopic systems. The wafer back positioning system has the advantages that: as the positioning can be carried out both on the front and the back of the wafer, the position of abnormal Emission/OBIRCH can be found more accurately for more convenient analysis.
Description
Technical field
The present invention relates to a kind of navigation system, particularly, relate to a kind of wafer back positioning system.
Background technology
Along with integrated circuit (IC) processing procedure constantly develops at many levels to small size, at (the Failure Analysis that lost efficacy, abbreviation FA) low-light microscopic analysis technology (photo emission microscope in the analysis, be called for short PEM) or light beam boot-strap resistor variation (Optical beam induced resistance change, be called for short OBIRCH) when locating, more and more need utilize chip back surface (Backside) detection mode to locate.
As shown in Figure 1, existing system has only a cover optical microscope system (Optical microscope, being called for short OM) system is used for image collection and signal collection, positioning analysis when doing chip back surface has no idea directly to utilize laser (Laser Marker) mark on test piece to launch the position of Emission or change in resistance maximum (Emission/OBIRCH) unusually.Surely the point that arrives, because of seeing the image of polysilicon (Poly) layer and active (Active) layer in the back side, at present can only with reference to around pattern, at front manufacturing mark.When not having special pattern around sometimes, perhaps the layout difference of front metal layer image and polysilicon (Poly) layer and active (Active) layer is too big, and analysis can only be gone in a general position in the accurately location of just having no idea, and causes analytically difficult.
Summary of the invention
For addressing the above problem, the present invention propose a kind of can pinpoint measurement mechanism, be used for accurately locating, thereby improve the failure analysis success rate at the front and back of wafer.
For reaching above-mentioned purpose, the present invention proposes a kind of wafer back positioning system, comprise at least two group optical microscope systems, above-mentioned at least two group optical microscope systems place the front and back for the treatment of observed object respectively, the optical microscope system that is positioned at the front wafer surface and the back side moves with the optical microscope system of correspondence and moves, and is aligned with each other in moving process.
As preferably, the optical microscope system at the above-mentioned front wafer surface and the back side is in the same coordinate system, thereby moves the optical microscope system of chip back surface in moving according to optical microscope system present position in coordinate system of front wafer surface, and it is aligned with each other.
As preferably, detect when unusual at the optical microscope system of front wafer surface, the optical microscope system of chip back surface just moves to the position at the optical microscope system place of front wafer surface.
As preferably, the above-mentioned optical microscope system that is arranged in chip back surface comprises the laser scaling system, when moving to the position of aiming at the optical microscope system of front wafer surface in order to the optical microscope system at chip back surface, makes mark on wafer.
As preferably, above-mentioned at least two group optical microscope systems are controlled by control device.
As preferably, control device is a computer.
Beneficial effect of the present invention is, owing to can all position at the front wafer surface and the back side, so can find out the position of unusual Emission/OBIRCH more accurately, can be more convenient for analyzing.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.For the person of ordinary skill in the field, from detailed description of the invention, above-mentioned and other purposes of the present invention, feature and advantage will be apparent.
Description of drawings
Fig. 1 represents the schematic diagram of a kind of wafer back positioning system of the prior art.
Fig. 2 represents the schematic diagram of a kind of wafer back positioning system of a preferred embodiment of the present invention.
A kind of wafer back positioning system that Fig. 3 represents a preferred embodiment of the present invention is to punctual schematic diagram.
Fig. 4 a and 4b represent the schematic diagram of a preferred embodiment of the present invention wafer orientation position.
Embodiment
Below in conjunction with the drawings and specific embodiments a kind of wafer back positioning system of the present invention is described in further detail.
As shown in Figure 2, the wafer back positioning system of a preferred embodiment of the present invention comprises following components, optical microphotograph camera lens 21, optical microphotograph detector 22, the positive millet cake pin 23 of upper mounting plate, lower platform back side point pin 24, needle stand 25, test piece 26, the back side (backside) optical microphotograph detector 27, objective table 28.
The optical microphotograph detector 22 of being furnished with optical microphotograph camera lens 21 places the top of the objective table 28 that is used to place wafer to be measured, be used for wafer is carried out failure detection, back side optical microphotograph detector 27 is positioned at chip back surface, and just the below of objective table 28 is corresponding with optical microphotograph detector 22.Back side optical microphotograph detector 27 can be controlled by control device, for example is controller and/or computer, carries out moving of position.Optical microphotograph detector 22 is set to central point with back side optical microphotograph detector 27 and overlaps, as shown in Figure 3, and to realize accurate location between the two.
Can have the laser orientation system (not shown) on the back side optical microphotograph detector 27, be used in this system, making telltale mark, help wafer orientation.
In the use, at first chip back surface to be measured is up placed on the objective table 28, utilize the positive millet cake pin 23 of upper mounting plate or 24 pairs of wafers of lower platform back side point pin on the needle stand 25 to carry out the PEM/OBIRCH analysis, in the analytic process, optical microphotograph detector 22 is by controller and computer control, on wafer, move, search the defective of wafer by optical microphotograph camera lens 21, wherein, controller and computer are determined the shift position of optical microphotograph detector 22 with the form of coordinate, for example the location positioning when static is the origin of coordinates of x-y reference axis with optical microphotograph detector 22, during detection, the coordinate of residing location point in micro-detector 22 motions of calculating optical is for use in the location in the subsequent step.When optical microphotograph detector 22 finds that abnormal conditions appear in the somewhere of wafer to be measured, 22 pairs of wafers of optical microphotograph detector carry out the accurate location under these abnormal conditions, record coordinate points herein, find correct defective locations, so that carrying out FA analyzes, shown in Fig. 4 a, then controller and computer control back side optical microphotograph detector 27 move to the coordinate points that the abnormal conditions of above-mentioned record are done, promptly corresponding position with optical microphotograph detector 22, the position of the central point of two optical microphotograph detectors 27 coincidence herein, then utilize laser orientation system to lay mark, so that the exact position of defective accurately takes place in the positions wafer, shown in Fig. 4 b.
The optical microphotograph camera lens that optical microphotograph camera lens 21 of the present invention can be an any appropriate, optical microphotograph detector 22 can be identical with back side optical microphotograph detector 27.
The above is preferred embodiment of the present invention only, is not to be used for limiting practical range of the present invention; If do not break away from the spirit and scope of the present invention, the present invention is made amendment or is equal to replacement, all should be encompassed in the middle of the protection range of claim of the present invention.
Claims (6)
1. a wafer back positioning system is characterized in that,
Comprise at least two group optical microscope systems, above-mentioned at least two group optical microscope systems place the front and back for the treatment of observed object respectively, the optical microscope system that is positioned at the front wafer surface and the back side moves with the optical microscope system of correspondence and moves, and is aligned with each other in moving process.
2. wafer back positioning system according to claim 1, the optical microscope system that it is characterized in that the above-mentioned front wafer surface and the back side is in the same coordinate system, thereby in moving, move the optical microscope system of chip back surface, it is aligned with each other according to optical microscope system present position in coordinate system of front wafer surface.
3. wafer back positioning system according to claim 2 is characterized in that optical microscope system at front wafer surface detects when unusual, and the optical microscope system of chip back surface just moves to the position at the optical microscope system place of front wafer surface.
4. wafer back positioning system according to claim 1, it is characterized in that the above-mentioned optical microscope system that is arranged in chip back surface comprises the laser scaling system, when moving to the position of aiming at the optical microscope system of front wafer surface, on wafer, make mark in order to optical microscope system at chip back surface.
5. wafer back positioning system according to claim 1 is characterized in that above-mentioned at least two group optical microscope systems are controlled by control device.
6. wafer back positioning system according to claim 5 is characterized in that control device is a computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810008081 CN101527275A (en) | 2008-03-06 | 2008-03-06 | Wafer back positioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810008081 CN101527275A (en) | 2008-03-06 | 2008-03-06 | Wafer back positioning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101527275A true CN101527275A (en) | 2009-09-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810008081 Pending CN101527275A (en) | 2008-03-06 | 2008-03-06 | Wafer back positioning system |
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| CN (1) | CN101527275A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104316856A (en) * | 2014-10-29 | 2015-01-28 | 上海华力微电子有限公司 | Back face detection type photon radiation microscope device and testing method thereof |
| CN105575867A (en) * | 2014-10-11 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Hotspot positioning method |
| CN106298563A (en) * | 2015-05-14 | 2017-01-04 | 比亚迪股份有限公司 | For the apparatus and method that wafer is detected and the method preparing silicon wafer |
| CN109633418A (en) * | 2018-12-29 | 2019-04-16 | 上海华力集成电路制造有限公司 | Photon radiation microscope example seat, test method and microscopie unit |
| CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
| CN112345336A (en) * | 2020-10-12 | 2021-02-09 | 上海华力集成电路制造有限公司 | Method for polishing back of ultra-small sample |
-
2008
- 2008-03-06 CN CN 200810008081 patent/CN101527275A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575867A (en) * | 2014-10-11 | 2016-05-11 | 中芯国际集成电路制造(上海)有限公司 | Hotspot positioning method |
| CN105575867B (en) * | 2014-10-11 | 2018-03-23 | 中芯国际集成电路制造(上海)有限公司 | Focus localization method |
| CN104316856A (en) * | 2014-10-29 | 2015-01-28 | 上海华力微电子有限公司 | Back face detection type photon radiation microscope device and testing method thereof |
| CN104316856B (en) * | 2014-10-29 | 2017-06-23 | 上海华力微电子有限公司 | Back side detection type photon radiation microscopie unit and method of testing |
| CN106298563A (en) * | 2015-05-14 | 2017-01-04 | 比亚迪股份有限公司 | For the apparatus and method that wafer is detected and the method preparing silicon wafer |
| CN106298563B (en) * | 2015-05-14 | 2019-12-20 | 比亚迪股份有限公司 | Apparatus and method for inspecting wafer and method for manufacturing silicon wafer |
| CN109633418A (en) * | 2018-12-29 | 2019-04-16 | 上海华力集成电路制造有限公司 | Photon radiation microscope example seat, test method and microscopie unit |
| CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
| CN112345336A (en) * | 2020-10-12 | 2021-02-09 | 上海华力集成电路制造有限公司 | Method for polishing back of ultra-small sample |
| CN112345336B (en) * | 2020-10-12 | 2023-02-03 | 上海华力集成电路制造有限公司 | Method for polishing back of ultra-small sample |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090909 |