CN101527008A - Radio frequency identifying device and manufacturing method therefor - Google Patents
Radio frequency identifying device and manufacturing method therefor Download PDFInfo
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- CN101527008A CN101527008A CN200910082539A CN200910082539A CN101527008A CN 101527008 A CN101527008 A CN 101527008A CN 200910082539 A CN200910082539 A CN 200910082539A CN 200910082539 A CN200910082539 A CN 200910082539A CN 101527008 A CN101527008 A CN 101527008A
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Abstract
The invention discloses a radio frequency identifying device and a manufacturing method therefor, relating to a card with an integrated circuit chip. The target of the invention is to provide a radio frequency identifying device with simple structure, smooth surface and simple processing method, and a manufacturing method therefor. The radio frequency identifying device of the invention consists of an intelligent label, an antenna levelling layer, an upper protection layer and a lower loading layer. The intelligent label comprises an antenna, a chip and an antenna loading base plate; the antenna is attached on the antenna loading base plate, wherein, the antenna levelling layer is provided with a hole a therein and the hole a matches the antenna loading base plate in size and position; the antenna loading base plate is arranged in the hole a; the upper end surface of the antenna levelling layer is provided with an upper protection layer; and lower end surface of the antenna levelling layer is provided with a lower loading layer. The difference between the manufacturing method of the radio frequency identifying device of the invention and prior art is that a hole with matched size and position is provided in the card layer for placing antenna. The antenna loading base plate is arranged in the hole, thereby avoiding damage to the antenna caused by layer pressing process while providing a smoother card surface.
Description
Technical field
The present invention relates to a kind of card that has integrated circuit (IC) chip, particularly relate to a kind of rfid device and manufacture method thereof.
Background technology
At present, traditional rfid device that has integrated circuit (IC) chip and aerial coil all is that chip and antenna are directly placed leveling up in the layer of card, because chip and antenna all have certain thickness, in the lamination process of card, pressure controling precision to laminating apparatus requires very high, also might cause damage to chip or antenna, a certain amount of substandard products appear in batch production process, lamination is finished and is formed after the card, the position of corresponding chip of card face and antenna has some outside projectioies, make card face smooth inadequately, influence product quality.And present technology is difficult to accomplish to allow intelligent label good bonding and location in card, through after the crooked distortion test repeatedly, occurs layering through regular meeting between intelligent label and outer sheet, is difficult to test by crooked distortion.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of simple in structure, surfacing, the simple rfid device of process and manufacture method thereof.
Rfid device of the present invention; comprise that intelligent label, antenna level up layer, go up protective seam and following bearing bed; described intelligent label comprises antenna, chip and antenna carrying substrates; wherein antenna is attached on the antenna carrying substrates; wherein said antenna is leveled up and is provided with the hole a that is complementary with antenna carrying substrates size, position in the layer; described antenna carrying substrates places hole a, and the upper surface that described antenna is leveled up layer is provided with protective seam, and the lower surface that antenna is leveled up layer is provided with down bearing bed.
Rfid device of the present invention, wherein said antenna are leveled up between layer and the last protective seam and also are provided with the chip mat flat bed, also are provided with the hole b that is complementary with die size, position in the described chip mat flat bed, and described chip places hole b.
Rfid device of the present invention also is provided with hole c on the wherein said antenna carrying substrates, and described bearing bed down sees through hole c with the chip mat flat bed and is connected.
Rfid device of the present invention, wherein said outer face of going up protective seam and following bearing bed also is provided with external protection.
Rfid device of the present invention also is provided with printed layers on the wherein said external protection inside surface, and external protection is a transparent material.
The manufacture method of rfid device of the present invention, comprising following steps:
I prepares whole respectively, and upward protective seam, following bearing bed, whole antenna are leveled up layer;
Ii levels up on the layer at whole antenna and beats some hole a according to desired location, whole antenna is leveled up be placed on whole the following bearing bed;
Iii prepares some intelligent labels, and the antenna carrying substrates on the intelligent label is placed hole a;
Iv goes up protective seam with whole and places whole antenna to level up on the layer;
V implements a laminating technology with the material alignment bookbinding that above-mentioned steps places to a whole set of material;
The a whole set of rfid device that vi finishes lamination carries out cutting, forms individual rfid device.
The manufacture method of rfid device of the present invention, wherein said step I v also is included in whole last protective seam and whole antenna leveled up whole chip mat flat bed of adding between the layer.
The manufacture method of rfid device of the present invention, wherein said step I v also is included in the position of mark knockout sheet on whole the chip mat flat bed, at the position of mark punching b, place whole antenna to level up on the layer whole chip mat flat bed then, chip is placed in the b of hole.
The manufacture method of rfid device of the present invention, wherein said step v also comprises and prepares two whole external protections, two whole external protections is placed on the outside of protective seam and following bearing bed respectively, then to laminating technology of a whole set of material execution.
The manufacture method of rfid device of the present invention; wherein said step v also comprises two whole external protections of preparation; after finishing laminating technology, two whole external protections are placed on the outside of protective seam and following bearing bed respectively, then to a whole set of material execution quadratic-layer compression technology.
The manufacture method of rfid device of the present invention, wherein said step I ii also is included in the c that punches on the antenna carrying substrates.
The manufacture method of rfid device of the present invention, wherein said step v also comprises and prepares two whole printed layers, places whole to go up between protective seam, whole following bearing bed and two whole external protections respectively two whole printed layers.
The manufacture method of rfid device of the present invention, wherein said laminating technology adopt at the material two ends mode of heating and pressurizing simultaneously.
The manufacture method of rfid device of the present invention, wherein said hole a, b, c open the die-cut or manually digging hole of process using mould.
Rfid device of the present invention and manufacture method difference from prior art thereof are, the manufacture method of rfid device of the present invention is that hole big or small and that the position is complementary is set in the card layer of placing antenna and chip, antenna and chip are placed in the hole, in laminating technology, can suitably relax the pressure controling precision of pressurized equipment, and be difficult for antenna and chip are caused damage, after lamination is finished, the card face also can be quite smooth, improved the total quality of product.
Rfid device of the present invention also has the hole on the antenna carrying substrates, be for the hole that chip mat flat bed and following bearing bed can be seen through on the antenna carrying substrates mutually bonding, thereby the position of fixed antenna carrying substrates; Printed layers is set in protective clear layer, can makes the card face seem more attractive in appearance.
The structure at all levels material can be placed in the manufacture method of rfid device of the present invention, adopt one time laminating technology; Also the material of leveling up layer can be placed, carry out laminating technology earlier one time, and then other aspect materials are placed carry out the quadratic-layer compression technology, the number of times of lamination can be selected according to the thickness and the number of plies of card.
Below in conjunction with accompanying drawing rfid device of the present invention and manufacture method thereof are described further.
Description of drawings
Fig. 1 is the structural representation of rfid device of the present invention;
Fig. 2 is the A-A direction cut-open view of Fig. 1.
Embodiment
As depicted in figs. 1 and 2; a kind of rfid device; comprise intelligent label; antenna is leveled up layer 5; last protective seam 7 and following bearing bed 8; intelligent label comprises antenna 1; chip 2 and antenna carrying substrates 3; wherein antenna 1 is attached on the antenna carrying substrates 3; antenna is leveled up in the layer 5 and is had and antenna carrying substrates 3 sizes; the hole a that the position is complementary; antenna carrying substrates 3 places hole a; the lower surface that antenna is leveled up layer 5 is connected with down bearing bed 8; antenna is leveled up layer 5 upper surface and also is connected with chip mat flat bed 6; have in the chip mat flat bed 6 and chip 2 sizes; the hole b that the position is complementary; chip 2 places hole b; the upper surface of chip mat flat bed 6 is connected with protective seam 7; also have hole c on the antenna carrying substrates 3, following bearing bed 8 is mutually bonding through hole c with chip mat flat bed 6, is connected with external protection 4 respectively on the outer face of last protective seam 7 and following bearing bed 8; also be connected with printed layers 9 on external protection 4 inside surfaces, external protection 4 is a transparent material.
The manufacture method of above-mentioned rfid device comprises the steps:
I prepares whole respectively, and upward protective seam 7, following bearing bed 8 and antenna are leveled up layer 5;
Ii levels up on the layer 5 at whole antenna and punches out some hole a according to desired location with mould, whole antenna is leveled up layer 5 place on whole the following bearing bed 8 positioned in alignment;
Iii prepares some intelligent labels, punches out hole c on the antenna carrying substrates 3 of intelligent label, and antenna carrying substrates 3 is placed hole a, and its spot gluing is being descended on the bearing bed 8;
Iv prepares whole chip mat flat bed 6, earlier whole chip mat flat bed 6 placed whole antenna to level up on the layer 5, the location alignment, the position of mark knockout sheet 2 on whole chip mat flat bed 6, open then whole chip mat flat bed 6 in the position of mark die-cut some hole b, again whole chip mat flat bed 6 placed whole antenna to level up on the layer 5, make chip 2 place hole b;
V goes up protective seam 7 with whole and places on whole the chip mat flat bed 6, the laminating technology of a whole set of material being implemented a heating and pressurizing makes the whole series level up bonding being integral of layer, wherein chip mat flat bed 6 is mutually bonding through hole c with following bearing bed 8, again ready two whole printed layers 9 and two whole external protections 4 are placed the outer face of protective seam 7 and following bearing bed 8 respectively, a whole set of material is carried out post bake pressure level compression technology;
The a whole set of rfid device that vi finishes lamination carries out cutting, forms individual rfid device.
Above-described embodiment is described preferred implementation of the present invention; be not that scope of the present invention is limited; design under the prerequisite of spirit not breaking away from the present invention; various distortion and improvement that those of ordinary skills make technical scheme of the present invention all should fall in the definite protection domain of claims of the present invention.
Claims (14)
1; a kind of rfid device; comprise intelligent label; antenna is leveled up layer (5); last protective seam (7) and following bearing bed (8); described intelligent label comprises antenna (1); chip (2) and antenna carrying substrates (3); wherein antenna (1) is attached on the antenna carrying substrates (3); it is characterized in that: described antenna is leveled up in the layer (5) and is provided with and antenna carrying substrates (3) size; the hole a that the position is complementary; described antenna carrying substrates (3) places hole a; the upper surface that described antenna is leveled up layer (5) is provided with protective seam (7), and the lower surface that antenna is leveled up layer (5) is provided with down bearing bed (8).
2, rfid device according to claim 1; it is characterized in that: described antenna is leveled up between layer (5) and the last protective seam (7) and also is provided with chip mat flat bed (6); also be provided with the hole b that is complementary with chip (2) size, position in the described chip mat flat bed (6), described chip (2) places hole b.
3, rfid device according to claim 2 is characterized in that: also be provided with hole c on the described antenna carrying substrates (3), described bearing bed (8) down sees through hole c with chip mat flat bed (6) and is connected.
4, rfid device according to claim 3 is characterized in that: described outer face of going up protective seam (7) and following bearing bed (8) also is provided with external protection (4).
5, rfid device according to claim 4 is characterized in that: also be provided with printed layers (9) on described external protection (4) inside surface, external protection (4) is a transparent material.
6, the manufacture method of the rfid device of described claim 1 is characterized in that comprising the steps:
I prepares whole respectively, and upward protective seam (7), following bearing bed (8), whole antenna are leveled up layer (5);
Ii levels up layer (5) at whole antenna and upward beats some hole a according to desired location, whole antenna is leveled up layer (5) place on whole the following bearing bed (8);
Iii prepares some intelligent labels, and the antenna carrying substrates (3) on the intelligent label is placed hole a;
Iv goes up protective seam (7) with whole and places whole antenna to level up on the layer (5);
V implements a laminating technology with the material alignment bookbinding that above-mentioned steps places to a whole set of material;
The a whole set of rfid device that vi finishes lamination carries out cutting, forms individual rfid device.
7, the manufacture method of rfid device according to claim 6 is characterized in that: described step I v also is included in whole last protective seam (7) and whole antenna leveled up adding whole chip mat flat bed (6) between the layer (5).
8, the manufacture method of rfid device according to claim 7, it is characterized in that: described step I v also is included in the position that whole chip mat flat bed (6) gone up mark knockout sheet (2), then at the position of mark punching b, place whole antenna to level up on the layer (5) whole chip mat flat bed (6), chip (2) is placed in the b of hole.
9, the manufacture method of rfid device according to claim 8; it is characterized in that: described step v also comprises preparation two whole external protection (4); two whole external protection (4) is placed on the outside of protective seam (7) and following bearing bed (8) respectively, then a whole set of material implemented a laminating technology.
10, the manufacture method of rfid device according to claim 8; it is characterized in that: described step v also comprises preparation two whole external protection (4); after finishing laminating technology, two whole external protection (4) is placed on the outside of protective seam (7) and following bearing bed (8) respectively, then a whole set of material implemented the quadratic-layer compression technology.
11, according to the manufacture method of claim 9 or 10 described rfid devices, it is characterized in that: described step I ii also is included in antenna carrying substrates (3) and goes up punching c.
12, the manufacture method of rfid device according to claim 11; it is characterized in that: described step v also comprises preparation two whole printed layers (9), places whole to go up between protective seam (7), whole following bearing bed (8) and two whole the external protection (4) respectively two whole printed layers (9).
13, the manufacture method of rfid device according to claim 12 is characterized in that: described laminating technology adopts at the material two ends mode of heating and pressurizing simultaneously.
14, the manufacture method of rfid device according to claim 13 is characterized in that: described hole a, b, c open the die-cut or manually digging hole of process using mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910082539A CN101527008A (en) | 2009-04-24 | 2009-04-24 | Radio frequency identifying device and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910082539A CN101527008A (en) | 2009-04-24 | 2009-04-24 | Radio frequency identifying device and manufacturing method therefor |
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| Publication Number | Publication Date |
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| CN101527008A true CN101527008A (en) | 2009-09-09 |
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| CN200910082539A Pending CN101527008A (en) | 2009-04-24 | 2009-04-24 | Radio frequency identifying device and manufacturing method therefor |
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| CN (1) | CN101527008A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102426659A (en) * | 2011-11-03 | 2012-04-25 | 北京德鑫泉物联网科技股份有限公司 | Intelligent card with two read-write matrixes and production method thereof |
| CN102496054A (en) * | 2011-12-16 | 2012-06-13 | 北京华大智宝电子系统有限公司 | Magnetic-steel-containing intelligent card and manufacturing method thereof |
-
2009
- 2009-04-24 CN CN200910082539A patent/CN101527008A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102426659A (en) * | 2011-11-03 | 2012-04-25 | 北京德鑫泉物联网科技股份有限公司 | Intelligent card with two read-write matrixes and production method thereof |
| WO2013063870A1 (en) * | 2011-11-03 | 2013-05-10 | 北京德鑫泉物联网科技股份有限公司 | Smart card simultaneously having two read/write mode matrixes and method for producing same |
| CN102426659B (en) * | 2011-11-03 | 2014-12-10 | 北京德鑫泉物联网科技股份有限公司 | Intelligent card with two read-write matrixes and production method thereof |
| US9342779B2 (en) | 2011-11-03 | 2016-05-17 | Golden Spring Internet Of Things Inc. | Smart card simultaneously having two read/write mode matrixes and method for producing same |
| CN102496054A (en) * | 2011-12-16 | 2012-06-13 | 北京华大智宝电子系统有限公司 | Magnetic-steel-containing intelligent card and manufacturing method thereof |
| CN102496054B (en) * | 2011-12-16 | 2014-05-07 | 北京华大智宝电子系统有限公司 | Magnetic-steel-containing intelligent card and manufacturing method thereof |
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Application publication date: 20090909 |