CN101510527B - Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof - Google Patents
Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof Download PDFInfo
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- CN101510527B CN101510527B CN2009100215178A CN200910021517A CN101510527B CN 101510527 B CN101510527 B CN 101510527B CN 2009100215178 A CN2009100215178 A CN 2009100215178A CN 200910021517 A CN200910021517 A CN 200910021517A CN 101510527 B CN101510527 B CN 101510527B
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Abstract
The invention discloses a thin metal base diamond composite material cutting disk in order to meet the requirement of cutting a BGA encapsulation body of an organic laminated board of a semiconductor chip in a sawing manner. Detailed description is made in the invention with respect of composition design, preparation technology, forming technology, precision work and the like of the cutting disk. According to the technical proposal provided by the invention and the manufacture process designed by the invention, a diamond is selected for cutting. Centering on a holding mechanism that combines the construction and particle firmness thereof, selections of different composition formulas of tire carcasses are respectively given. The cutting disk is prepared under the conditions of hot pressed sintering or braze welding technology, which not only improves the combination form of metal tire carcasses and diamond particles so as to enhance the holding force and the continuous self-sharpening capacity, but also establishes matching wear relation between the radial direction and both sides so as to form a approximately flat cutting appearance at a blade end, thereby ensuring that the cutting length is greatly improved on the basis of guaranteeing the high-precision cutting quality of the chips, and being beneficial to the significant reduction of production cost.
Description
Technical field
The invention belongs to new material technology field, be used for superhard material goods or instrument manufacturing, a kind of super thin metal base diamond cutting blade and the manufacture method thereof used when particularly the chip singulation is cut apart.
Background technology
Ball grid array BGA (Ball Grid Array) encapsulation is as the mainstream technology in the current high-end packaging and testing of the semiconductor field, generally be used for FBGA (Fine Pitch BGA), FCBGA (Flip Chip BGA), PBGA (Plactic BGA), SiP (System in Package), MCM/MCP (Multi Chip Module/Multi Chip Package), road encapsulation behind the IC chip of CSP forms such as (Chip Scale/Size Package), its essence is to be made into the I/O terminal of the soldering ball of matrix form arrangement as circuit in the bottom of base plate for packaging, and printed substrate easy and terminal equipment carries out the surface mount interconnection.
The basic comprising of BGA packaging body is organic layer pressing plate and resinous polymer, and the former is many to be composited thick about 0.2-0.5mm by layer 2-4 or more multi-layered FR4 plexiglas fiber board; The latter often doses ceramic phase particles hot curing moulding for epoxy resin, thick about 0.4-0.8mm.General thickness is about the 0.6-1.2mm scope, in it embedding one or more to pile up or the bare chip and the associated interconnect thereof of the discharging of tile go between.
The IC chip obtains to use on terminal equipment for making it after the encapsulation of different B GA form, must carry out the singulation processing of each standalone feature chip, and this is an impassable so far important flow chart of semiconductor packages industry.Saw formula cutting technique is current predominant methods of carrying out this operation both at home and abroad, and the diamond particles cutting blade is being brought into play subjective role therein.
The cutting blade service condition is very harsh, very thin thickness own, and usually in 0.2-0.4mm, very easily embrittlement or brittle failure; Working speed high (30-40Krpm), linear velocity reaches 120-140m/s, bears very big impulsive force and centrifugal force; The more important thing is, workpiece is to implement cutting with the condition of roughing feed speed (120-200mm/s) and the amount of making deep cuts into (0.8-1.5mm), also bear big service load and high heat in metal cutting, must force cooling from multi-faceted imposing greater than the deionized water of 1L/min flow.The normal inefficacy of cutting blade is too fast for radially consuming, and causes the deficiency in useful life, or causes the both sides excessive wear too slowly for radially consuming, and causes sword end shape anomaly to change and causes the chip cutting degradation; It is broken etc. that improper inefficacy comprises distortion, tipping, ftractures even collapses, and makes it lose the cutting function too early.
Cutting blade is to rely on self continuous attrition to support the lasting continuity of cutting process under the normal online operating position when carrying out the chip cutting operation, objectively is a kind of industrial consumptive material, and the existing market location also is like this.With regard to the processing of chip packing-body large-scale industrial; the cutting blade that actual production is used needs to change repeatedly; the cycle of changing depends under the prerequisite that satisfies the chip cutting quality requirement that the Cutting Length criterion to being set up after its online evaluation identification also is called safe operating life.Safe life is on the basis of a large amount of retests, and the maximum Cutting Length that different samples are obtained carries out statistical disposition and multiply by coefficient of safety (less than 1) and determine.Coefficient of safety is artificially set according to the online cut quality control of chip index, is used for preventing that the defect ware in the chip on-line machining process from occurring.Therefore safe life had both influenced the processing yield as weighing a very crucial quality index of cutting blade, also influenced production cost, so extremely industry is paid much attention to.Working (machining) efficiency is to describe another important parameter of cutting blade quality, is understood that the Cutting Length in the unit interval usually.
But under the situation about setting in advance for chip cutting-up technological parameter, especially along with the on-line setup of the speed of mainshaft and the workpiece amount of feeding, the cutting efficiency value of traditional sense will no longer change, the substitute is the variation of cutting blade live load size, be reflected in the continuous change of operating current during actual the cutting.The relative variation of transient current, the variation of sharpness when intuitively showing the cutting blade operation, cutting blade bears the size of cutting resistance thereby characterize out this moment.If the cutting resistance increases, illustrate that cutting blade is because of sharpness decline rust, the tendency of existing increase chip disqualification rate, change safe life also has the possibility that increases the weight of the cutting equipment burden, reduces stability under working conditions, thereby the sharpness of cutting blade also is subjected to very to pay close attention in the industry.
Semiconductor packages industry is so valued the importance of cutting blade quality, mainly comes from its occupied terminal operation of back road processing in entire I C chip processing procedure.In case the cutting blade inherent quality occurs repeatedly, be difficult to keep consistent and stable, will cause the direct losses that can't remedy, light then only the yield of tens thousand of chips is queried, though investigation a kind of remedial measure of can yet be regarded as has one by one exceeded the industrialization intension of making in batches and has not been accepted by the processing procedure standard; Heavy then scrap because of the chip manufacture quality is out of control, comprise before this such as series of process such as manufacturing of preceding road and back road encapsulation and implement and will be thrown into the eastward flowing stream that performance test after this and terminal applies also will vanish like soap bubbles.As seen the sawing of chip processing has the central action of taking over from the past and setting a new course for the future in whole semiconductor industry chain, and the behavior performance of cutting blade in cutting process will determine the continuity of every chips processing procedure production and the feasibility that function realizes.For giving with good performance, also it keeps consistency and stability to improve internal performance, and this is particularly important for the cutting blade that uses as consumptive material.
From use angle, the preceding main quality index of having addressed Cutting Length and sharpness as the cutting blade online evaluation has directive significance for formulating chip cutting technology and control chip crudy; From making angle, explore carcass matrix (carcass) brute force of diamond particles is controlled mechanism, guarantee its constantly exposure and keep sufficiently high exposure amount from carcass, the corresponding relation of foundation and Cutting Length and sharpness, be the key point that promotes the cutting blade class, become the current focus of research both at home and abroad for this reason.
At the serial BGA packing forms that with the organic layer pressing plate is the chip core carrier, based on the cutting demand of packaging body, the cutting blade that successively adopts is pressed the carcass type classification so far, and mainly containing three kinds is the heat reactive resin base, electroforming is Ni-based and the sintering metal base.Wherein undertake cutting function by diamond particles.
The resin-based cutting piece made from diamond realizes the controlling of diamond particles by the resin that is heating and curing, but is limited to the material behavior of forming carcass, and it is very limited to control intensity, attrition very easily, the Cutting Length wretched insufficiency is at most about the km, not enough at least half is helpless to reduce production costs.Often increase the service life, cutting the use of having faded out aspect organic laminated sheet packaging body because of poor effect eventually to increase diamond concentration (〉=80%) and to increase particle size (45-75 μ m).But such cutting blade also has its very significantly advantage, is in particular in can keep well being close to the sword end pattern of straight transitions and having superpower diamond particles from sharp ability, helps guaranteeing the crudy of chip excellence.
The current chip that is mainly used in is the QFN base plate for packaging cutting-up of carrier with the thin copper of nickel plating, also still has using value for the processing of doing one's utmost to avoid the bottom side to produce hemisection (non-cut-out), fluting and the adhesive film type cutting-up specific (special) requirements such as (few in the cutting edge incision film) of knuckle (lip effect).Electroforming class cutting blade is because of the densification of Ni-based carcass matrix, hard partially and diamond concentration too high (〉=120%), limit the diamond (≤15 μ m) that can only plate fixed fine particle because of technology again, multifactor impact has comprehensively improved the resistance to wear of such cutting blade, radially consume when being reflected in cutting slowly, two lateral wearings are fast slightly, pattern is cut in the sword end-grain cutting that occurs the dagger shape easily, causes the chip size out-of-size to be asked, and produces lip effect when serious.
Aggregate performance goes out passive state, and the cutting resistance obviously increases, and causes that the chip stress surface distorts, overall offset happens occasionally until breaking away from fixing situation, can't guarantee its shape standard and dimensional accuracy.Adverse effect to sum up, on-line testing safety Cutting Length are difficult to surpass 2km, differ greatly with the market demand, though between having at present or use, be not the main flow of cutting chip bga.
Perhaps still indispensable when class hard brittle material substrates such as cutting-up Silicon Wafer, coated glass, quartz wafer, low-temp ceramics, so to its THICKNESS CONTROL strictness, generally about 0.1mm.Metal sintering type cutting blade mainly adopts metal-powder and diamond sintered combined and be aided with die forming and make through high-temperature liquid-phase, from using the deficiency that has remedied above-mentioned two class cutting blades, almost in occupation of the leading position of chip organic layer pressing plate packaging body cutting.From current market supply situation, cutting blade comes from different manufacturers to be used same user, or comes from using at different user of same manufacturer and all show very big-difference, and effective cutting length weak point person is below 3km, and the elder reaches more than the 5km; Can approach when cut quality is excellent control index lower limit, when bad then near the upper limit; Unusually the rate that breaks is hanged down less than 1%, Gao Keda 7%, illustrate that cut quality is subjected to packing forms, specification of workpieces and cutting condition effect, such cutting blade exists great different on material selection, the design of carcass formation and manufacturing process, disclose the necessity that to make the various split requirements of reply, different quality class product because of need, indicating that the core technology of preparing still has great development space.Around adapting to the needs of market development to such cutting blade, the emphasis of research will mainly concentrate on: how (1) is the liquid phase activated sintering technology of core by exploitation with soldering/hot pressed sintering, setting up metal matrix combines with effective interface between the diamond particles, guarantee diamond particles in the cutting process keep all the time high go out the sword degree and with plate carcass and form brute force and control, and in the decline of self cutting function with plating tyre body abrasion when coming off, can constantly expose again the diamond particles that makes new advances and and carcass between form harmonious wear mechanism, to satisfy the high performance requirements of safe life and cutting efficiency; (2) how by composition regulation and control, structure optimization and tyre-e/or performance control, radially having with side direction of its blade mated moderate rate of depreciation after guaranteeing cutting blade incision encapsulation matrix, remain and be close to smooth end pattern, to satisfy high-precision crudy requirement.Industry is being attempted unremitting effort for this reason.
Current sawing production mainly concentrates on the flourishing relatively country of semiconductor manufacturing industry, representational ITI, the Ukam that the U.S. is arranged, Disco, Mitsubishi and the ASAHI of Japan, the Ehwa of Korea S, Kodis, companies such as the ADT of Israel, especially have the bigger occupation rate in world market with Disco, ITI, Ehwa and ADT company, its manufacture method is many based on sintering technology, between or adopt electroplating technology, product has covered wholely cuts apart relevant high-end encapsulation industry with semiconducter IC chip and discrete device, at present domestic this series products dependence on import almost completely.As traditional manufacturing industry, the manufacturing basis of China's diamond tool is quite rich, research also has much level, be no lack of large-scale state-run assets enterprise and professional scientific research institution are arranged, but recognize that really its high added value to the influence of IC industry and product is after entering this century, the Electronic Packaging industry is fast-developing and become the manufacturing chief component of China IC gradually in the Yangtze River Delta and area, Pearl River Delta.The domestic scientific research institutions and the manufacturing enterprise that set foot in this field at present are very few, and how from electroplating the starting of base and resin-based cutting blade.
From present development trend, high-performance metal base diamond cutting tools is just becoming the leading products of serving the IC packaging industry.This external series products develops towards high-performance, ultraprecise, low-cost direction, and no matter domestic be that the exploratory stage is still located in research and development or production.We also have strong impression from Continuous Tracking investigation international semiconductor SEMICON in 2005 meeting to this.
Make a general survey of the evolution and the development of slim cutting blade, the power that promotes its upgrading is beyond doubt from the actual demand of chip on-line machining.Survey such industry that has competitiveness for semiconductor package, be accompanied by the continuous fusion of functions such as calculating, communications and entertainment, and the sustainable growth of numeral such as wireless, portable, portable and photoelectricity class consumption electronic product, Chip Packaging miniaturization of size, integrated densification and the diversified requirement of function will be important development directions that promotes the power of participating in market competition.The new packing forms that adapts therewith continues to bring out, the chip substrate type increases, its complex structure and specification are changeable, the cutting difficulty increases, cutting blade is required not only to have high crudy and quantity, and have high-performance and a low price, also require fully capable technical support and supply channel quickly and easily.The high speed development of surveying industry with high-end envelope in the world forms sharp contrast, China's overall state lags behind, still locate the early stage of development, the whole tendency that presents is that global large-scale envelope is surveyed enterprise's successive transfer domestic investment and founded the factory, and at the relative industrial colony of concentrating of the Yangtze River Delta with the formation of area, Pearl River Delta, become the main body of China's packaging industry, with drive self and with the starting of its supporting industries concerned development.Based on such situation, realize the localization manufacturing of the slim cutting blade of high accuracy, and give with high performance-price ratio, especially the enhancing of the prolongation in useful life and sharpness, it is significant to seal the development of survey industry to support semiconductor, and particularly the high-end encapsulation industry that China is still located to start to walk has impetus.
Summary of the invention
The present invention is towards the high-end encapsulation field of semiconductor, at main flow BGA encapsulation technology generally with the packaging body of organic layer pressing plate as the IC chip carrier, needs around its saw formula cutting, in order to overcome the shortcoming and defect of prior art, develop a kind of semiconductor chip BGA encapsulation body in saw formula cutting thin metal-based diamond cutting blade.Setting under diamond concentration 40-70% and the granularity 35-65 μ m condition, and be aided with grades such as intensity, crystalline form, thermostability and the transparency assurance that adapts, be achieved by the following technical solutions.
1, carcass is formed design
Adopt the composition configuration of orthogonal experiment design carcass material, promptly to form (containing or do not contain diamond particles) be factor and be horizontal experiment arrangement with sintering process parameter with matrix formula.Ratio between design carcass metal dust (containing bonding phase and skeleton phase), prealloy solder and property-modifying additive (organic or inorganic filler) powder; and batching, mixing, stirring make its homogenizing in advance, carry out soldering/Thermocompressed sintering and forming after will forming carcass powder and diamond particles mixes again.Investigate microstructure and the macro property of respectively organizing sample by conventional analysis and research technique, select suitable relatively prescription and form.Through optimizing and plan to be used for the carcass composition of actual production, forming with Cu and Fe by the high-load element is two assembly side's series of base, and concrete chemical composition and weight ratio are as follows:
(1) Cu base carcass is formed
Skeleton is selected Cu, Co, CuSn mutually for use
20, proportioning is respectively the CuSn of 0-40 weight portion
20, the Cu of 33-87 weight portion and the Co of 0-13 weight portion.Particle mean size is no more than 45 μ m (300 order);
Bonding selecting for use mutually based on Sn, proportioning is 13-23%, particle mean size is no more than 45 μ m (300 order); With Cu is auxilliary, has been included among the skeleton phase;
SiC, Al are selected in inorganic filler for use
2O
3And graphite, proportioning should be the SiC of 0-15 weight portion, the Al of 0-10 weight portion mutually
2O
3, the 0-3 weight portion graphite, granularity is controlled between the 5-10 μ m; Resinoids such as phenolic aldehyde, epoxy or polyimides are selected in the organic filler of 0-3 weight portion, organic filler for use.
(2) Fe base carcass is formed
Mainly be made up of Fe, Cu, Ni, Sn etc., proportioning is respectively the Cu, the Ni of 6-12 weight portion, the Sn of 5-10 weight portion, the Ag and an amount of modified filler of 2-8 weight portion of Fe, the 10-15 weight portion of 45-75 weight portion.
When formulating testing program, the basic ideas that carcass constitutes are to look height that Sn accounts for Cu and Sn total amount to determine whether to adopt non-metallic fillers or what.When setting the Sn amount more than 20%, do not introduce or introduce less additive usually, carcass only is made up of the Metal and Alloy that constitutes skeleton phase, bonding phase, wherein as mixing CuSn
20The prealloy powder, then simple substance Cu and Sn content take the circumstances into consideration to reduce, and its ratio is pressed equivalent conversion; When setting the Sn amount, then must introduce inorganic filler and give the modification enhancing, and sneak into the percentage of bonding total amount mutually mutually by skeleton below 15%.Just because of the difference of Sn content, determined the variation that carcass is formed, each constituent element proportioning occurring bigger range of choice.Different component proportionings will change the structure and the condition of carcass, finally influence the cutting effect of cutting blade.After typical case's application example sees.
Under preparation process condition of the present invention, bending strength, density and hardness that above-mentioned carcass is formed are respectively at 540-640MPa, 7.8-8.5g/cm
3, HRB70-110Kgf/mm
2Can be regulated and control in the scope.
2, metal-base diamond composite material cutting blade preparation method
The main metal-base diamond composite material that adopts hot pressing and sintering technique to prepare different carcass components, also or adopt Vacuum Soldering Technology to prepare metal and diamond sinter that property requires, wherein diamond particles intend or plating Ti, Cr, Ni, Cu etc. to realize the metallurgical binding with carcass.The implementing process system is: programming rate 40-90 ℃/min, sintering temperature 580-780 ℃, insulation 10-90min, cooling rate 20-100 ℃/min, thermal stress 20-40MPa.
In process practice, the hot pressed sintering of metal-base diamond composite material and cutting blade slug press carries out simultaneously, is a relatively independent core preparation process.The pressed compact that is about to cold-press moulding and is design shape is inserted to have in the identical shaped hot pressing die, whole again the immigration in the sintering furnace, sintering process parameter is set and mould exerted pressure after heat to design temperature, insulation impels powder particle to be together with each other in good time under this temperature, makes the cutting blade sintering blank of basic shaping.
Consist of example with the carcass that contains more than the Sn20%, energy spectrum analysis tests as shown in Figure 1 that the result shows, surveys the very approaching of the content of each constituent element and design; The phase composition of XRD analysis carcass therefrom finds under process conditions of the present invention shown in Fig. 2 (a)-(d), and sintering temperature changes almost not influence of phase composition, mainly is (a) and the Cu that (b) illustrates
39Sn
11, Cu
10Sn
3And Cu
5.6Sn is wherein with Cu
39Sn
11Diffracted intensity is higher, shows that shared volume ratio is relatively large; But extend to 60min with temperature retention time by 10min, also have (c) and (d) shown in cenotype Cu
6Sn
5Form, and diffraction peak is stronger, also shows that shared volume ratio is higher; Judge that from diffraction maximum width its grain size is than Cu in addition
39Sn
11Tiny, can play the effect of dispersion-strengtherning.Just because of existing or the hard crisp phase that these have complicated lattice structure occurring, the configuration and the condition of carcass just change, and have influence on the serviceability of cutting blade then, and relevant deep research is still underway.Prolong temperature retention time when constant keeping pressure, observe as Fig. 3 (a) and the microstructure (b) is found out substantially from SEM, follow composite material sintered body interior porosity to reduce, pore-size reduces and pore shape changes, its densification degree improves, carcass also is tending towards tight to plating of diamond particles abrasive particle, thereby the enhancing hold helps to prolong useful life of cutting blade.
In carcass, introduce the CuMnTi solder and prepare the sintering blank with method for welding, can form the transition zone of 3-5 μ m shown in Fig. 4 (a) between diamond particles and the carcass, Ti element significant enrichment in layer particularly, apparently higher than the both sides, interface as Fig. 4 (b), XRD analysis shows that the TiC that existing Fig. 4 (c) illustrates forms mutually, constituted chemical bonding as Fig. 4 (d) between indication carcass and the diamond particles) shown in, the interface bonding state between visible carcass and the diamond particles abrasive particle be improved significantly.
With regard to ultra-thin cutting slice was shaped, hot pressing die can be made of high purity graphite or high refractory steel.The former widely uses in the diamond composition sintering, but material feeding is limit, should under no restrained condition, suppress with pressurization methods, the only suitable cutting blade pressed compact of making the above thickness of 0.45mm and admitting of big amount of grinding is not less than 0.30mm thickness and meets flatness and the end product of depth of parallelism requirement to guarantee to make.As suppressing in the constant volume mode, scratch and fit clearance increase etc. causes and ceases to be in force automatically and the pressed compact down is gone into the inside and outside round flange of mold etc. and caused that demoulding situation of difficult takes place frequently such as mould spalling, inwall, had a strong impact on the feasibility of technological operation; The latter rarely has use, and the present invention uses it for the cutting blade pressed compact and is shaped, and the main structure condition of having set up already for protection is made every effort to the requirement near final products of the flatness of pressed compact and the depth of parallelism simultaneously.Steel die with the compacting of level pressure and constant volume dual mode all can, particularly very favourable to the making of the following cutting blade of thickness 0.20mm.
3, cutting blade thinning technique
Can disposablely be made into form height precision cutting blade with aforementioned hot pressed sintering or vacuum brazing method in theory, its internal performance will be able to undamaged reservation, this beyond doubt exploitation expected with using.In fact according to existing state of arts, also be difficult for reaching this high level of accuracy, the way that gears to actual circumstances at present is that the cutting blade pressed compact is carried out post-production, comprises especially thickness grinding of straightening, inside and outside circle grinding, also will change its inherent quality to some extent.The present invention requires from polishing for avoid influencing the quality of final products as far as possible, based on the mechanical reduction technology, stresses the exploration of free abrasive two-sided lapping technology, sets up the process system of complete relatively attenuate, realizes the precision and the microfabrication of this series products.
Attenuate carries out on the private use plane grinder, concrete operations are that the cutting blade intermediate products are put into erratic star wheel one by one, be placed on again on the lower millstone and and mesh respectively with inside and outside gear ring, exert pressure behind the capping upper millstone and in the 0.12-0.18MPa scope, at sand pump uniform from its upper end injection SiC or Al
2O
3In the time of (granularity is 10-40 μ m) oil or aqueous polishing liquid (concentration is 0.25-0.35Kg/ml), open solar shaft (main shaft) and drive the mutually reverse circular motion of upper and lower mill with the 20-50rpm rotating speed, erratic star wheel therebetween rotates thereupon and drives workpiece and revolves round the sun and rotation in lapping liquid, the effect upper and lower surface that is stressed promptly is subjected to sand grains friction grinding, up to size and required precision.
The attenuate operation is exposed on the carcass to some extent in view of will make the top layer diamond particles, in aggravation rough surface, increase cutting resistance, also might weaken the hold of carcass, cause that abrasive particle comes off too early, be unfavorable for keeping the good cutting pattern of sword end.Based on the consideration that strengthens top layer carcass resistance to wear and abrasive particle hold, intend adopting surface treatment measures such as PVD vapour deposition, chemical plating and plating to be improved or strengthen targetedly.
Cutting blade specification and shape processing method are according to present industry behaviour in service, and cutting blade versatility specification is external diameter OD74-78 * thickness T 0.20-0.70 * inner diameter, ID 40 and OD56-58 * T0.15-0.65 * ID40mm.Wherein external diameter OD roughly has two grades promptly to be called for short 3 cun and 2 cun cuttves in the industry, and adaptive corresponding scribing machine is determined by spindle power respectively; Thickness T changes in 0.15-0.70mm, depends on chip distribution density, mutual spacing and external form size, specifically answers the user to require to determine; Inner diameter, ID 40 still belongs to standard size and then remains unchanged.Above dimensioned precision is ± 2-5 μ m that the endoporus axiality is ± 2-5 μ m that the flatness and the depth of parallelism are ± 10-20 μ m.
The cutting blade shape then depends primarily on the cutting mode of chip, and is also relevant with packaging body material and cutting technique.How to present continuous shape, fluting shape, pinnacle shape and hypotenuse shape from circumference and distinguished, wherein shape is almost the industry common shape continuously, and all the other then are used for special occasions.
The present invention finishes inside and outside circle processing by following approach after making the cutting blade pressed compact: (1) consider for precision, and utilizing numerical control to be careful under the frock clamping, a cutting off machine is disposable finishes cutting, has also comprised the circumference fluting; (2) under the big situation of allowance, on the ordinary lines cutting equipment, cut earlier, relend and help special purpose grinder to repair in right amount, to improve dimensional accuracy; (3) also can under the little situation of allowance, directly on grinding machine, finish.Desire selects which kind of processing approach will look the concrete situation of sintering pressed compact and the final products instructions for use is determined.The attenuate processing of cutting blade after inside and outside circle processing sees that upward joint is described, and abnormity carries out on optical projection form grind usually as processing such as pinnacle shape, hypotenuse shapes.
The object of the present invention is to provide a kind of thin metal-based diamond cutting blade that can effectively keep the chip cut quality, this cutting blade cutting accuracy height and long service life.
The thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting, is made up of Metal Substrate carcass and diamond particles, and by weight percentage, diamond concentration is that 40-70%, granularity are 35-65 μ m in this cutting blade.
Described Metal Substrate carcass is made up of the metal dust of 70-100 weight portion, the inorganic filler of 0-25 weight portion and the organic filler of 0-5 weight portion.
Described Metal Substrate carcass is by Cu, the Sn of 13-23 weight portion, the CuSn of 0-40 weight portion of 33-87 weight portion
20, the Co of 0-13 weight portion and 0-10 weight portion Ni form.
Described Metal Substrate carcass is made up of the Fe of 45-75 weight portion, Cu, the Sn of 1-5 weight portion, the Ag of 2-8 weight portion and the Ni of 6-12 weight portion of 10-15 weight portion.
Described inorganic filler is by the Al of 0-10 weight portion
2O
3, the SiC of 0-10 weight portion and 0-3 weight portion graphite form.
Described organic filler is a kind of in phenolic resins, polyimide resin or the epoxy resin.
The preparation method that the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting, carry out according to following steps:
(1) gets the raw materials ready: according to the metal dust of 70-100 weight portion, the inorganic filler of 0-25 weight portion and the organic filler preparing metal base carcass raw material of 0-5 weight portion.After at first wet mixing is stirred 4-6 hour in the eddy current batch mixer with Metal Substrate carcass raw material, secondly add diamond particles, stir again more than 1 hour and obtain compound, after this can make the granular convered structure of profile by granulation process less than 1mm through the screening scale removal.Diamond concentration is that 40-70%, granularity are 35-65 μ m;
(2) preforming of colding pressing: compound or the material of granulating are uniformly distributed among the punching block, are put in after the capping on the press lower platen, and exert pressure 3.92 * 10
3-5.88 * 10
3MPa makes the shaping pressed compact, after check, the shaping pressed compact is inserted in graphite or the steel hot pressing die;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, and sintering makes blank under mold pressing stress 20-40MPa, programming rate 40-90 ℃/min, sintering temperature 580-780 ℃, temperature retention time 10-90min, cooling rate 20-100 ℃/min condition;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, make cutting blade;
(5) surface-coated: surface Hardening Treatment is carried out on the cutting blade surface, obtain the thin metal-based diamond cutting blade.
Described a kind of semiconductor chip BGA encapsulation body in saw formula cutting is used for the saw formula cutting of semiconductor chip organic layer pressing plate BGA packaging body with the thin metal-based diamond cutting blade.
A kind of semiconductor chip BGA encapsulation body in saw formula cutting disclosed by the invention can be good at keeping cutting edge cutting pattern with the thin metal-based diamond cutting blade, under the prerequisite that satisfies the chip manufacture quality, have hold strong, go out characteristics such as sword degree height and long service life.
Description of drawings
Fig. 1 is carcass composition EDAX results figure of the present invention;
Fig. 2-a is that sintering process of the present invention influences figure to what the carcass phase structure was formed when being 600 ℃ of sintering temperatures, temperature retention time 10min;
Fig. 2-b is that sintering process of the present invention influences figure to what the carcass phase structure was formed when being 650 ℃ of sintering temperatures, temperature retention time 10min;
Fig. 2-c is that sintering process of the present invention influences figure to what the carcass phase structure was formed when being 600 ℃ of sintering temperatures, temperature retention time 60min;
Fig. 2-d is that sintering process of the present invention influences figure to what the carcass phase structure was formed when being 650 ℃ of sintering temperatures, temperature retention time 60min;
Diamond particles combined state diagram with the interface of metal matrix when Fig. 3-a was 650 ℃ of sintering temperatures of the present invention, temperature retention time 10min.
Diamond particles combined state diagram with the interface of metal matrix when Fig. 3-b was 650 ℃ of sintering temperatures of the present invention, temperature retention time 45min.
Form TiC transition zone figure between diamond that Fig. 4-a diamond and carcass interface junction are fashionable and carcass.
The transition zone both sides chemical composition change figure that Fig. 4-b diamond and carcass interface junction are fashionable.
The diamond surface XRD analysis figure that Fig. 4-c diamond and carcass interface junction are fashionable.
The TiC distribution shape appearance figure of the diamond surface that Fig. 4-d diamond and carcass interface junction are fashionable.
Embodiment
Embodiment 1:
(1) gets the raw materials ready: according to following weight portion ratio preparing metal base carcass, i.e. 35 weight portion Cu, 5 weight portion Sn, 35 weight portion CuSn
20, 5 weight portion Co, 5 weight portion Ni, 5 weight portion Al
2O
3, 10 weight portion SiC, 1 weight portion graphite.After at first wet mixing is stirred 4-6 hour in the eddy current batch mixer with each constituent element material, secondly add the diamond particles through the screening scale removal, stir about obtained even compound in 1 hour, also compound can be made the granular convered structure of profile less than 1mm by granulation process.Diamond grit is that 40 μ m, concentration are 70%;
(2) preforming of colding pressing: compound or the material of granulating are aided with an amount of binder or lubricant are uniformly distributed among the punching block space, be put in after the capping on the press lower platen, slowly be promoted to and contact with top board and exert pressure
3.92 * 10
3-5.88 * 10
3MPa and pressurize in good time make the shaping pressed compact, through check comprise density, thickness and uniformity thereof layering, crackle, fall defectives such as limit and hole after, assembling is inserted in graphite or the steel hot pressing die again;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, behind the 25MPa that exerts pressure, hot pressed sintering is set and produces blank according to the technological parameter of 80 ℃/min of programming rate, 700 ℃ of sintering temperatures, temperature retention time 15min, 80 ℃/min of cooling rate.This example adopts the graphite grinding tool compacting;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, specifically make the cutting blade of OD58 * T0.26 * ID40 by methods such as aforementioned relevant inside and outside circle cutting, reduced thickness.So far after check, mark and packing etc., can directly use, also can carry out follow-up surface treatment selectively, depend primarily on to have or not and improve surface appearance and the necessity that strengthens the side resistance to wear for the user.
(5) surface-coated: utilize class PVD low-temperature surface reinforcement techniques such as vapour deposition, magnetron sputtering and vacuum evaporation, and technology plating hard coat such as chemical plating, plating, when strengthening the carcass hold and reducing surface roughness, improve cutting blade side antiwear property.This example had not been carried out this processing.
This cutting blade is the PBGA packaging body of 0.8mm with speed of mainshaft 30Krpm, amount of feeding 100mm/s cutting thickness on Disco EAD6340K scribing machine, under the control index of cutting blade diameter wear extent less than 2mm, its on-line testing effective cutting length average out to 4.2Km, corresponding radial wear is 1.5mm, wear rate average out to 0.36 μ m/m.
Embodiment 2:
(1) gets the raw materials ready: according to 78 weight portion Cu, 22 weight portion Sn, add 1 weight portion Al in addition
2O
3, 1 weight portion SiC, 1 weight portion graphite preparing metal carcass raw material.After at first above-mentioned raw materials being stirred 4-6 hour in the eddy current batch mixer, add the diamond particles through the screening scale removal, stir about obtained even compound in 1 hour, by granulation process compound was made the granular convered structure of profile less than 1mm again.Diamond grit is that 50 μ m, concentration are 55%;
(2) preforming of colding pressing: compound or the material of granulating are aided with an amount of binder or lubricant are uniformly distributed among the punching block space, be put in after the capping on the press lower platen, slowly be promoted to and contact with top board and exert pressure
3.92 * 10
3-5.88 * 10
3MPa and pressurize in good time make the shaping pressed compact, through check comprise density, thickness and uniformity thereof layering, crackle, fall defectives such as limit and hole after, assembling is inserted in graphite or the steel hot pressing die again;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, behind the 22MPa that exerts pressure, sintering is set and produces blank according to the technological parameter of 50 ℃/min of programming rate, 650 ℃ of sintering temperatures, temperature retention time 10min, 100 ℃/min of cooling rate.This example adopts the graphite grinding tool compacting;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, specifically undertaken, finally make the cutting blade of OD58 * T0.37 * ID40-Slot2 * 1 by methods such as aforementioned relevant inside and outside circle cutting, reduced thickness.So far after operations such as check, mark and packing, can directly supply with the user and use, also can carry out follow-up surface treatment selectively, depend primarily on to have or not and improve surface appearance and the necessity that strengthens the side resistance to wear.
(5) surface-coated: utilize class PVD low-temperature surface reinforcement techniques such as vapour deposition, magnetron sputtering and vacuum evaporation, and technology plating hard coat such as chemical plating, plating, when strengthening the carcass hold and reducing surface roughness, improve cutting blade side antiwear property.This example had not been carried out this processing.
On Disco EAD6430K, be the MCP packaging body of 1.0mm with 40Krpm rotating speed, 130mm/s amount of feeding cutting thickness, under of the requirement of cutting blade diameter wear extent less than 1.5mm, its on-line testing effective cutting length average out to 4.9Km, corresponding radial wear is 1.2mm, gauge wear rate average out to 0.24 μ m/m.
On Disco EAD6430K, be the FBGA packaging body of 0.8mm with rotating speed 40Krpm, amount of feeding 110mm/s cutting thickness, under the condition of control cutting blade diameter wear extent less than 2.1mm, its on-line testing effective cutting length average out to 6.5Km, corresponding radial wear 2mm, wear rate average out to 0.30 μ m/m.
Carcass constitutes with above-mentioned two test cases identical, but change diamond grit and concentration are respectively 65 μ m and 60%, and it is 45min that sintering process only changes temperature retention time, and all the other remain unchanged.The cutting blade of made same size and shape is the FBGA packaging body of 0.8mm with speed of mainshaft 40Krpm, amount of feeding 110mm/s cutting thickness on EAD6430K, under of the requirement of saw cutter diameter wear extent less than 2.1mm, the long 7.4Km that is is effectively cut in its on-line testing, corresponding radial wear 1.8mm, wear rate average out to 0.24 μ m/m.
Embodiment 3:
(1) gets the raw materials ready: according to 50 weight portion CuSn
20, 38 weight portion Cu, 12 weight portion Sn preparing metal base carcasses.Above-mentioned raw materials stirred 4-6 hour in the eddy current batch mixer after, add the diamond particles through the screening scale removal, stir about obtained even compound in 1 hour, again compound was made the granular convered structure of profile less than 1mm by granulation process.Diamond grit is that 55 μ m, concentration are 55%;
(2) preforming of colding pressing: compound or the material of granulating are aided with an amount of binder or lubricant are uniformly distributed among the punching block, be put in after the capping on the press lower platen, slowly be promoted to and contact with top board and exert pressure 3.92 * 10
3-5.88 * 10
3MPa and pressurize in good time make the shaping pressed compact, through check comprise density, thickness and uniformity thereof layering, crackle, fall defectives such as limit and hole after, assembling is inserted in graphite or the steel hot pressing die again;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, behind the 22MPa that exerts pressure, hot pressed sintering is set and produces blank according to the technological parameter of 50 ℃/min of programming rate, 650 ℃ of sintering temperatures, temperature retention time 15min, 100 ℃/min of cooling rate.This example adopts the graphite grinding tool compacting;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, specifically undertaken, finally make the cutting blade of OD58 * T0.37 * ID40-Slot2 * 1 by methods such as aforementioned relevant inside and outside circle cutting, reduced thickness.So far after operations such as check, mark and packing, can directly supply with the user and use, also can carry out follow-up surface treatment selectively, depend primarily on to have or not and improve surface appearance and the necessity that strengthens the side resistance to wear.
(5) surface-coated: utilize class PVD low-temperature surface reinforcement techniques such as vapour deposition, magnetron sputtering and vacuum evaporation, and technology plating hard coat such as chemical plating, plating, when strengthening the carcass hold and reducing surface roughness, improve cutting blade side antiwear property.This example had not been carried out this processing.
On Disco EAD6430K, be the MCP packaging body of 1.0mm with 40Krpm rotating speed, 130mm/s amount of feeding cutting thickness, under of the requirement of diameter wear extent less than 1.3mm, the long 3.5Km that is is effectively cut in its on-line testing, and corresponding radial wear is 0.68mm, and wear rate is 0.20 μ m/m.
Embodiment 4:
(1) gets the raw materials ready: according to 35 weight portion CuSn
20, 35 weight portion Cu, 5 weight portion Sn, 10 weight portion Co, 10 weight portion SiC, 5 weight portion Al
2O
3Preparing metal base carcass.Above-mentioned raw materials stirred 4-6 hour in the eddy current batch mixer after, secondly add the diamond particles through the screening scale removal, stir about obtained even compound in 1 hour, by granulation process compound was made the granular convered structure of profile less than 1mm again.Diamond grit is that 50 μ m, concentration are 60%;
(2) preforming of colding pressing: compound or the material of granulating are aided with an amount of binder or lubricant are uniformly distributed among the punching block, be put in after the capping on the press lower platen, slowly be promoted to and contact with top board and exert pressure 3.92 * 10
3-5.88 * 10
3MPa and pressurize in good time make the shaping pressed compact, through check comprise density, thickness and uniformity thereof layering, crackle, fall defectives such as limit and hole after, assembling is inserted in graphite or the steel hot pressing die again;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, behind the 25MPa that exerts pressure, hot pressed sintering is set and produces blank according to the technological parameter of 50 ℃/min of programming rate, 650 ℃ of sintering temperatures, temperature retention time 5min, 100 ℃/min of cooling rate.This example adopts the graphite grinding tool compacting;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, specifically make the cutting blade of OD 76.2 * T0.30 * ID40 by methods such as aforementioned relevant inside and outside circle cutting, reduced thickness.
So far after operations such as check, mark and packing, can directly supply with the user and use, also can carry out follow-up surface treatment selectively, depend primarily on to have or not and improve surface appearance and the necessity that strengthens the side resistance to wear.
(5) surface-coated: utilize class PVD low-temperature surface reinforcement techniques such as vapour deposition, magnetron sputtering and vacuum evaporation, and technology plating hard coat such as chemical plating, plating, when strengthening the carcass hold and reducing surface roughness, improve cutting blade side antiwear property.This example adopts chemical plating to handle.
On Fico Miss II, be the SiP packaging body of 1.45mm with 23Krpm rotating speed, 150mm/s amount of feeding cutting thickness, under of the requirement of diameter wear extent less than 2.4mm, its on-line testing effective cutting length is 4.7Km, and corresponding radial wear is 2.2mm, and average wear rate is 0.46 μ m/m.
Embodiment 5:
(1) gets the raw materials ready: according to 25 weight portion CuSn
20, 58 weight portion Cu, 17 weight portion Sn preparing metal base carcasses.Above-mentioned raw materials stirred 4-6 hour in the eddy current batch mixer after, add the diamond particles through the screening scale removal, stir about obtained even compound in 1 hour, also can make the granular convered structure of profile less than 1mm by granulation process.Diamond grit is that 40 μ m, concentration are 60%;
(2) preforming of colding pressing: compound or the material of granulating are aided with an amount of binder or lubricant are uniformly distributed among the punching block, be put in after the capping on the press lower platen, slowly be promoted to and contact with top board and exert pressure 3.92 * 10
3-5.88 * 10
3MPa and pressurize in good time make the shaping pressed compact, through check comprise density, thickness and uniformity thereof layering, crackle, fall defectives such as limit and hole after, assembling is inserted in graphite or the steel hot pressing die again;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, behind the 25MPa that exerts pressure, hot pressed sintering is set and produces blank according to the technological parameter of 50 ℃/min of programming rate, 650 ℃ of sintering temperatures, temperature retention time 10min, 100 ℃/min of cooling rate.This example adopts the punching block compacting;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, specifically make the cutting blade of OD76.2 * T0.19 * ID40 by methods such as aforementioned relevant inside and outside circle cutting, reduced thickness.So far after operations such as check, mark and packing, can directly supply with the user and use, also can carry out follow-up surface treatment selectively, depend primarily on to have or not and improve surface appearance and the necessity that strengthens the side resistance to wear.
(5) surface-coated: utilize class PVD low-temperature surface reinforcement techniques such as vapour deposition, magnetron sputtering and vacuum evaporation, and technology plating hard coat such as chemical plating, plating, when strengthening the carcass hold and reducing surface roughness, improve cutting blade side antiwear property.This example had not been carried out this processing.
On Disco EAD6430K, be the FBGA packaging body of 1.4mm with speed of mainshaft 30Krpm, amount of feeding 250mm/s cutting thickness, under of the requirement of cutting blade diameter wear extent less than 2.8mm, its on-line testing effective cutting length average out to 7Km, corresponding radial wear 2.2mm, gauge wear rate average out to 0.32 μ m/m.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that the specific embodiment of the present invention only limits to this.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to the present invention and determine scope of patent protection by claims of being submitted to.
Claims (8)
1. a semiconductor chip BGA encapsulation body in saw formula cutting is used the thin metal-based diamond cutting blade, form by Metal Substrate carcass and diamond particles, it is characterized in that: by weight percentage, diamond concentration is that 40-70%, granularity are 35-65 μ m in this metal-base diamond cutting blade; Described Metal Substrate carcass is Cu base carcass or Fe base carcass.
2. the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 1, and it is characterized in that: described Metal Substrate carcass is made up of the metal dust of 70-100 weight portion, the inorganic filler of 0-25 weight portion and the organic filler of 0-5 weight portion.
3. the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 1, and it is characterized in that: described Metal Substrate carcass is by the Cu of 33-87 weight portion, the CuSn of 0-40 weight portion
20, the Co of Sn, 0-13 weight portion of 13-23 weight portion and the Ni of 0-10 weight portion form.
4. the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 2, and it is characterized in that: described inorganic filler is by the SiC of 0-10 weight portion, the Al of 0-10 weight portion
2O
3And the graphite of 0-3 weight portion is formed.
5. the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 2, it is characterized in that: described organic filler is a kind of in phenolic resins, polyimide resin or the epoxy resin.
6. semiconductor chip BGA encapsulation body in saw formula cutting is characterized in that: carry out according to following steps with the preparation method of thin metal-based diamond cutting blade:
(1) gets the raw materials ready: according to the metal dust of 70-100 weight portion, the inorganic filler of 0-25 weight portion and the organic filler preparing metal base carcass raw material of 0-5 weight portion; Raw material wet mixing in the eddy current batch mixer that at first will constitute each constituent element of Metal Substrate carcass was stirred after 4-6 hour, to add wherein through the diamond particles of screening scale removal again, stir 1 hour acquisition composition and evenly reach the uniform compound of abrasive particle, after this make the granular convered structure of profile less than 1mm by granulation process; Diamond concentration is that 40-70%, granularity are 35-65 μ m;
(2) preforming of colding pressing: compound or convered structure are uniformly distributed among the punching block, are put in after the capping on the press lower platen, and exert pressure 3.92 * 10
3-5.88 * 10
3MPa makes the shaping pressed compact, and the shaping pressed compact is inserted in graphite or the steel hot pressing die;
(3) hot pressed sintering: hot pressing die is moved in the sintering furnace together with whole workpiece, hot pressed sintering obtains the sintering blank, and concrete implementing process is molding pressure 20-40MPa, programming rate 40-90 ℃/min, sintering temperature 580-780 ℃, temperature retention time 10-90min, cooling rate 20-100 ℃/min;
(4) machine-shaping: after the sintering blank is carried out deburring, flange correction and straightening, implement the processing that is shaped, make cutting blade;
(5) surface-coated: surface Hardening Treatment is carried out on the cutting blade surface, obtain the thin metal-based diamond cutting blade.
7. a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 6 preparation method of thin metal-based diamond cutting blade, it is characterized in that: described surface Hardening Treatment is plating, chemical plating or vapour deposition.
8. the thin metal-based diamond cutting blade is used in a kind of semiconductor chip BGA encapsulation body in saw formula cutting according to claim 1, it is characterized in that: described thin metal-based diamond cutting blade is used for the saw formula cutting of IC chip organic layer pressing plate BGA packaging body.
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| CN101870008B (en) * | 2010-06-11 | 2012-01-11 | 西安点石超硬材料发展有限公司 | Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate |
| CN101879597B (en) * | 2010-06-11 | 2011-12-07 | 西安交通大学 | Preparation method of metal sintering-type diamond saw cutter for cutting QFN (Quad Flat Non-Leaded Package) packaging device |
| CN103506964A (en) * | 2013-09-17 | 2014-01-15 | 广东省电力线路器材厂 | Modified diamond abrasive tool and manufacturing method thereof |
| CN104029299B (en) * | 2014-06-05 | 2017-02-01 | 苏州赛尔科技有限公司 | Special ultra thin metal-based diamond cutting sheet for WLCSP packaging chip and preparing method |
| CN105798307B (en) * | 2016-05-03 | 2018-02-13 | 西安点石超硬材料发展有限公司 | Based on the cutting of IC package device laminated metallic base diamond saw blade and manufacture method |
| CN108422334A (en) * | 2018-03-12 | 2018-08-21 | 河南科恩超硬材料技术有限公司 | The manufacturing method of fiber array V-shaped type groove diamond slitting wheel |
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| JP2006245459A (en) * | 2005-03-07 | 2006-09-14 | Matsushita Electric Ind Co Ltd | Manufacturing method of semiconductor device |
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