CN101500751A - Method and apparatus for polishing diamond and diamond composites - Google Patents
Method and apparatus for polishing diamond and diamond composites Download PDFInfo
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- CN101500751A CN101500751A CNA2007800294287A CN200780029428A CN101500751A CN 101500751 A CN101500751 A CN 101500751A CN A2007800294287 A CNA2007800294287 A CN A2007800294287A CN 200780029428 A CN200780029428 A CN 200780029428A CN 101500751 A CN101500751 A CN 101500751A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
A method and apparatus for polishing a diamond material is disclosed. The method comprises the steps of positioning a sample of the diamond material in relation to a movable metallic surface, and bringing the diamond material sample into contact with the movable metallic surface with simultaneous movement of the metallic surface and rotation of the diamond material sample. Two or more samples of the diamond material can be evenly spaced around a circumference of an imaginary circle centred on an axis of movement of the metallic surface, to be brought into contact with the movable metallic surface whilst moving the metallic surface on its axis. The apparatus can comprise a drive arranged to effect such movements, as well as a lift and place mechanism to constrain sample movements.
Description
Technical field
The present invention discloses a kind of method and apparatus that is used for polishing diamond and diamond complex (diamond composites).
Background technology
Polycrystalline diamond (PCD) composite sheet (compact) is applied to cutting element and many other application of wear surface/friction surface of (being used for processing multiple metal and nonmetallic materials).PCD has good performance, such as high hardness, thermal conductivity, intensity with for the chemical inertness of most of corrosive environments.In many these classes are used (for example in fine finishining), PCD must have good surface smoothness and edge sharpness (edge sharpness).Yet,, the PCD composite sheet is polished to such fineness and acutance has become a difficult problem because diamond has high hardness and chemical inertness.
The polishing speed of known some mechanical lapping polishing technology is extremely low, and its polishing speed is in the magnitude of 10 nanometers per hour, and is therefore consuming time and with high costs.Recently, explored multiple physics and chemical means in order to polishing PCD and diamond film.These means comprise machine glazed finish, the polishing of chemical Aided Machine, heat chemistry/thermometal plate polishing, laser beam/beam-plasma/ion beam polishing and dynamic friction polishing.Report thinks that the dynamic friction method is most economical up to now otherwise effective technique.
In dynamic friction polishing (DFP) method, the polishing diamond composite sheet is not utilized abrasive material, but by diamond compact is pressed in predetermined pressure on the metal dish that rotates at a high speed to produce dynamic friction.This technology schematically is shown among Fig. 1.This technology can carry out under atmospheric conditions and utilize by the caused thermal chemical reaction of the dynamic friction between diamond and the metal dish.This technology aims to provide for example efficient polishing without abrasive of single-crystal diamond and PCD.
Under the polishing condition of DFP, the temperature at polishing interface can suddenly rise, and chemical reaction at elevated temperatures plays an important role in the polishing of PCD.This polishing mechanism is described to: (a) contact by the friction heating and with catalytic metal, diamond phase carbon is converted into non-diamond phase carbon (non-diamond carbon), and machinery is removed described non-diamond phase carbon subsequently; (b) carbon atom is diffused in the pairing metal (counterpart metal), and produces chemical reaction to form carbide with this metal; And (c) make oxidation of coal, and with CO or CO
2The form volatilization of gas.The chemical reaction that it should be understood that carbon plays an important role aspect the material removal in the PCD polishing process, and wherein carbon reacts or oxidation with metal at elevated temperatures.
In addition, chemical reaction also can take place and be converted into amorphous silicon oxide and/or carborundum such as carborundum (SiC) and silicon (Si) in other components among the PCD, and described amorphous silicon oxide and/or carborundum also are removed in polishing process.
Recently the research to DFP technology relates to polishing efficiency, polishing mechanism and the final PCD surface smoothness that forms.In some cases, on the milling drum (milling machine) that metal dish is installed on the machine tool chief axis (machine spindle), test.At US 6,585,565 and US 6,592,436 in, multiple intermetallic compound (for example zirconium-nickel, titanium-aluminium, titanium-nickel) is disclosed in the dynamic friction of PCD, single-crystal diamond and diamond film and the application in the thermo-chemical polishing.Yet required test is carried out on known milling drum and/or known surface grinding machine/lap grinder.Found to use this equipment can not carry out glossing effectively, and be difficult to control such as technological parameters such as applied pressures.The also untapped up to now economically viable method and apparatus that goes out to be used for DFP technology.
Here to quoting of prior art be not admit these formerly technology constitute a part in Australia and other local those skilled in the art's common practise.
Summary of the invention
In first scheme, a kind of method that is used for the polishing diamond material is disclosed, this method may further comprise the steps:
The diamond sample is positioned with respect to movable (movable) metal surface; And
The diamond sample is contacted with movable metal surface, and carry out the motion of metal surface and the rotation of diamond sample simultaneously.
Find, rotate the level that metal surface and diamond sample can make the efficient of glossing improve significantly to make DFP become economically viable polishing technology simultaneously.
In the common form of implementation of the method for this first scheme, the metal surface is rotatable, thus, two or more diamond samples can be positioned with respect to the rotatable metal surface, thus make two or more samples around with the rotation of metal surface be the center of circle imaginary circle circumference and arrange at interval equably.
In alternative plan, a kind of method that is used for the polishing diamond material is provided, this method may further comprise the steps:
Two or more diamond samples are positioned with respect to movable metal surface, thus with described two or more diamond samples around with the axis of movement of metal surface be the center of circle imaginary circle circumference and arrange at interval equably; And
Described two or more diamond sample is contacted with the rotatable metal surface, make the axial-movement of this metal surface simultaneously with respect to this metal surface.
Find, with two or more samples around with the rotation of this metal surface be the center of circle imaginary circle circumference and arrange at interval uniformly, can control better such as technological parameters such as applied pressures, and then can improve the efficient of glossing.And, arrange at interval uniformly the deflection (deflection) of metal surface is minimized.In addition, these factors further help to make DFP to become economically viable polishing technology.
In the common form of implementation of the method for this alternative plan, the metal surface can be rotated around a rotation, when contacting with rotating metal surface with the two or more diamond samples of box lunch, this metal surface and described diamond sample are all rotatable.In addition, arrange the efficient that can improve glossing with rotation simultaneously to a great extent by uniform interval.
Terminology used here " imaginary circle " is to be used to limit by two or more samples with respect to the rotation of metal surface and the geometric figure of supposing.Here, this term and not meaning that is limited with the entity circle on the metal surface, do not mean that also metal surface self is circular.For example, the metal surface can be defined as or form the part of plate with various outer shape or dish etc., and still, this metal surface is around axis rotation, and two or more sample is arranged equably at interval with respect to this axis.
Terminology used here " diamond " comprises natural diamond and diamond, thick/thin diamond film, polycrystalline diamond and diamond complex.Therefore, method and apparatus disclosed herein can be applicable to any this diamond-like materials.
" sample (sample) " of the diamond of being mentioned comprises one and a plurality of diamond samples (specimen), and this point will offer some clarification on hereinafter.In other words, one " diamond sample " can comprise the independent sample of the diamond of one or more various sizes.
That terminology used here " metal surface " comprises metal and contain metallic surface, such as various alloys of steel and various alloy, especially stainless steel, iron, nickel, chromium, cobalt, titanium, zirconium and these metals etc.Therefore, term " metal surface " is intended to contain any material of the metal of the reaction that includes catalysis and diamond.
In the method for first scheme and alternative plan, being somebody's turn to do (or each is described) diamond sample can be in the scope of 5 to 60m/s (more typically being 15 to 30m/s) with respect to the average sliding speed of metal surface.For example, average sliding speed is proved to be effective for about 21m/s.The scope that has been found that this sliding speed can promote the DFP technology to greatest extent.The scope of described average sliding speed can change along with the variation that is applied to the pressure on the sample, and along with the variation of the hot property of the surface roughness of diamond and diamond and change.
In the method for first scheme and alternative plan, should (or each is described) diamond sample can comprise at least two diamond samples, described diamond sample do not align (non-aligned) with the rotation of this sample.Therefore, because sample can rotate around its rotation,, sample rotates so also centering on this axis.For example, two or more samples also can arrange on sample equably at interval around the circumference of imaginary circle, but this moment, this imaginary circle was that rotation with this sample is the center of circle.This unjustified layout of diamond sample helps lend some impetus to even (for example smooth) polishing of each sample equally and prevents to produce on the metal surface groove.
In the method for first scheme and alternative plan, the rotation that is somebody's turn to do (or each is described) sample can be parallel to the rotation of this metal surface.This set of axis makes that the geometric setting of this method is more easy.
In the method for first scheme and alternative plan, this (or each is described) diamond sample is pressed into this metal surface and contacts usually.For example, found that the effective pressure that is applied on this (or each is described) diamond sample can promote the DFP technology best in the scope of 2-25MPa, when for example being approximately 3.5MPa.Institute's applied pressure size can be with average sliding speed, become with pressure oppositely to change with preferred selected velocity for polished diamond type.In this, when pressure increased, average sliding speed can reduce (vice versa).
The method of first scheme and alternative plan all can comprise dynamic friction polishing stage and grinding and polishing stage subsequently, wherein the duration in this dynamic friction polishing stage can be 1-5 minutes (for example about 3 minutes), and the duration in this grinding and polishing stage can be 1-20 minutes (for example about 15 minutes).This grinding and polishing stage can directly carry out on the lapped face of this metal surface.
In third party's case, a kind of equipment that is used for the polishing diamond material is provided, this equipment comprises:
Retainer is used for the diamond sample is positioned with respect to movable metal surface; And
Drive unit is used to make described diamond sample to contact with movable metal surface, and is used to make the motion of this metal surface and the rotation of described diamond sample to carry out simultaneously.
When utilizing the method for first scheme, rotate the efficient that has significantly improved glossing in the time of this metal surface and this diamond sample.
In the common form of implementation of the equipment of this third party's case, this drive unit can be set to by retainer is rotated the diamond sample be rotated, but this drive unit also can be set to make the metal surface to rotate.
The equipment of this third party's case can comprise two or more retainers, in order to keeping two or more corresponding (respective) diamond samples, described retainer can be configured such that two or more diamond samples around rotation be with the metal surface center of circle imaginary circle circumference and arrange at interval equably.
In cubic case, a kind of equipment that is used for the polishing diamond material is provided, this equipment comprises:
Two or more retainers, be used to keep two or more corresponding diamond samples, described retainer is configured such that described sample positions with respect to movable metal surface, thus make two or more diamond samples around with the axis of movement of this metal surface be the center of circle imaginary circle circumference and arrange at interval equably; And
Drive unit is used to make two or more diamond samples to contact with the metal surface, makes the axial-movement of metal surface with respect to this metal surface simultaneously.
When utilizing the method for alternative plan, make two or more samples around with the rotation of this metal surface be the center of circle imaginary circle circumference and arrange at interval uniformly, can control institute's applied pressure better and the deflection of metal surface is minimized, thereby can improve polishing efficiency.
In the common form of implementation of the equipment of this cubic case, this metal surface can be rotated around rotation, and this drive unit can be configured such that this metal surface and each diamond sample rotate simultaneously thus.In addition, this driver can make each described diamond sample rotate by each described retainer is rotated.
In the equipment of third and fourth scheme, this driver can comprise the motor that is respectively applied for each diamond sample retainer of driving and this metal surface, and each motor can be set to drive described retainer or rotate around corresponding rotation on the surface.Use corresponding motor to drive the rotating speed that to control (a plurality of) sample retainer and metal surface independently.
The equipment of third and fourth scheme can be configured to, and makes the rotation of this (or each is described) sample retainer be parallel to the rotation of this metal surface.When utilizing the method for first and second schemes, this set of axis makes that the geometric setting of this equipment is more easy.Yet, as mentioned below, also can select to use multiaxis equipment.
In the equipment of third party's case and cubic case, should can comprise at least two sample installation sites by (or each is described) sample retainer, each described sample installation site is used to install corresponding diamond sample, and this sample rotation setting is departed from described installation site.Described sample installation site can be that the circumference of the imaginary circle in the center of circle is arranged equably at interval around the rotation with this sample.And the sample installation site is arranged uniformly at interval around the circumference of imaginary circle, can polish control better and apply more uniform pressure, and the deflection of metal surface is minimized.So just make that polishing is more even and improved polishing efficiency.
In the equipment of third party's case and cubic case, this drive unit also can comprise power cylinder (ram), and this power cylinder is used for pushing (a plurality of) sample retainer to this metal surface, and should shift onto on this metal surface by (or each is described) diamond sample.This power cylinder can be pneumatic, and this power cylinder can be by being installed to (a plurality of) sample retainer on the movable link and operate between the fixed component of this equipment and movable link.The Pneumatic pressure power cylinder provides simple but sufficiently stable (robust) to obtain the method for the required pressure of DFP.
Can come the alternate power cylinder with mass (weight), described weight can be added on this equipment or remove the pressure that is applied to described sample with change from this equipment.
This movable link can form and promote and the part of placement mechanism, be used for described sample with the mode of deflection not be placed on this movable metal surface (for example, this mechanism prevented thus change and remove described sample during lateral drift).
In a form of implementation of this lifting and placement mechanism, the opposed end of this movable link all can be installed on separately the linear bearings part (bearing) slidably, described linear bearings part limits this movable link by this power cylinder motion for towards or away from the linear movement of this metal surface.The linear bearings part be limit this movable link laterally and other very effective modes of easy motion not, thereby also help more uniform polishing and raising polishing efficiency.
In this form of implementation of this lifting and placement mechanism, this fixed component can be limited by (in-use) upper beam in using, and the opposed end of this upper beam is by the shore supports of this equipment, and described pillar extends from the cabinet of this equipment.This movable link can be limited by the bottom sliding beam in using, and this bottom sliding beam can move up and down with respect to the cabinet of this equipment.This linear bearings part can be installed on each pillar to improve the rigidity of this equipment.Described fixed component and movable link and pillar all can be made by structural element, to guarantee the strength and stiffness of this equipment.
In another form of implementation of this lifting and placement mechanism, one end of this movable link is pivotally mounted on the hinge, and this hinge can also be suitable for motion with this movable link and be restricted to arcuate movement around this hinge, so that this metal surface is shifted to or moved apart to described sample.Under other embodiment, this fixed component can be limited on this hinge or by this hinge and limit.This hinge can be installed on the cabinet of this equipment or the frame or be attached in the cabinet or frame of this equipment.This arcuate movement also may be subjected to the effect of the drive unit (for example power cylinder, mass etc.) operated on this movable link.In addition, this hinge can provide limit this movable link laterally and other not easy motion, simply and effective and efficient manner.
In the equipment of third and fourth scheme, this metal surface can form the part of metal dish, and the central axis around this dish rotates this metal dish by the part driving of drive unit.This dish can be ringwise, and this annular limits the dynamic friction polished surface.
Can limit the grinding and polishing surface that is arranged on this ring-shaped inner part thus.In the equipment of third and fourth scheme, this drive unit can be suitable for moving this (or each is described) sample retainer, thereby should move to this grinding and polishing surface from this dynamic friction polished surface by (or each is described) sample.
The material that is used to form the grinding and polishing surface can comprise diamond complex, cubic boron nitride (cubicboron nitride), boron carbide etc.
In the 5th scheme, a kind of equipment that is used for the polishing diamond material is provided, this equipment comprises:
Retainer is used to make the diamond sample to position with respect to movable metal surface;
Promote and placement mechanism, its be set in order to described retainer or this metal surface co-operating so that this sample is positioned on this metal surface in the mode of deflection not.
Promote and placement mechanism is not very effective mode of easy motion of the transverse movement of the described sample of restriction and other, thereby help more uniform polishing and improve polishing efficiency.
Although this lifting and placement mechanism are set to and the retainer co-operating usually, so that this metal surface is shifted to or moved apart to described retainer, but this lifting and placement mechanism also can be set to and this metal surface co-operating, so that this retainer is shifted to or moved apart in this metal surface.In another modification, this lifting and placement mechanism can be set to not only with this retainer co-operating but also with this metal surface co-operating so that both shift to each other or move apart each other.
In the 5th scheme, this lifting and placement mechanism can comprise a member, and described retainer or this metal surface are with respect to this member and supported.Subsequently, the drive unit of operating in order on this member can be set, so that this sample is placed on the movable metal surface in the mode of deflection not.This drive unit can be limited by air pressure or fluid power cylinder, or is limited by mass etc.
In a form of implementation of the 5th scheme, described retainer can be installed with respect to this member, and the opposed end of this member all can be installed to accordingly slidably in order to limit on the linear bearings part that this member moves, and makes described retainer shift to or move apart this metal surface with linear mode thus.
Though install so that along with this member moves with respect to this member at retainer described in this form of implementation, but alternatively or additionally, this metal surface can be installed with respect to same member or another member, so that move in the mode that is supported and limit by this linear bearings part this metal surface.
In this form of implementation, this member can be with respect to fixed component motion, and this fixed component is to be limited by the upper beam in using, and the opposed end of this upper beam is by the shore supports of this equipment, and described pillar extends from the cabinet of this equipment.This movable link then can be limited by the bottom sliding beam in using, and this bottom sliding beam can move up and down with respect to the cabinet of this equipment.This linear bearings part can be installed on each pillar, to improve the rigidity of this equipment.This fixed component, this movable link and described pillar all can be made by structural element, to guarantee the strength and stiffness of this equipment.
In another form of implementation of the 5th scheme, one end of this member can be pivotally mounted on the hinge, this hinge can be suitable for motion with this member equally and be restricted to arcuate movement around this hinge, thereby this metal surface is shifted to or moved apart to described sample.In another form of implementation, this member can move with respect to being limited on this hinge or by the fixed component that this hinge limited.This drive unit can also be operated between this fixed component and this movable link.In addition, this hinge can be installed on the cabinet of this equipment or the frame or be attached in the cabinet or frame of this equipment.In addition, this hinge can be provided for limiting this movable link laterally and other not easy motion, simply but effective and efficient manner.
The equipment of the 5th scheme can also be different with the equipment defined in third and fourth scheme.
Description of drawings
Although other form of implementation can be contained by the method and apparatus disclosed in summary of the invention, now will be only with reference to accompanying drawing the certain embodiments of described method and apparatus be described in the mode that exemplifies, in the accompanying drawings:
Fig. 1 shows the schematic diagram of dynamic friction polishing;
Fig. 2 has described the model machine of dynamic friction polissoir disclosed herein with three dimensional constitution;
Fig. 3 shows the forward sight partial cutaway schematic of dynamic friction polissoir disclosed herein;
Fig. 4 shows and shows that sliding speed is to two plots (a) of the influence of polishing rate and (b):
Illustrated in the plot (a) first kind of PCD (contain have an appointment 65%, granularity is 6 microns diamond particles);
Illustrated in the plot (b) second kind of PCD (contain have an appointment 75%, granularity is 25 microns diamond particles); And
Fig. 5 has described the surface of PCD sample three-dimensionally: (a) utilize the polishing of dynamic friction technology; And (b) (polishing before) obtains.
The specific embodiment
Fig. 1 schematically shows dynamic friction polishing DFP technology.As shown in the figure, polycrystalline diamond composite sheet (PCD) sample is installed in the sample retainer (holder).This retainer be pressed (loading) be pressed on the special-purpose metal dish of high speed rotating with a predetermined pressure to force this sample, and then produce dynamic friction.DFP technology is carried out under atmospheric conditions usually, and produces (being caused by dynamic friction) thermal chemical reaction between PCD and metal dish.This technology can also be carried out in oxygen-enriched atmosphere to quicken this technical process (promptly quickening this technical process by the oxidation that promotes carbon).DFP technology can be carried out polishing without abrasive (abrasive-free polishing) to for example single-crystal diamond or PCD.
Now with reference to Fig. 2 and Fig. 3 the method and apparatus that is used for carrying out in effective and controllable mode DFP is described.
Thus, the equipment that is used for the polishing diamond material illustrates with the form of polishing machine 10.Illustrated polishing machine 10 comprises two sample retainers 12, and each sample retainer all is used for a plurality of (for example four) PCD sample 14 is positioned at rotatable metal dish 16.Certainly, this polishing machine can easily be suitable for being provided with the sample retainer more than two, and each sample retainer all can be suitable for keeping few to one or far more than four sample.
A plurality of sample retainers 12 be set to around with machine tool chief axis line A be the center of circle imaginary circle circumference and arrange at interval that equably and this rotatable metal dish 16 is the center with this axis equally.A plurality of sample retainers 12 arrange uniformly at interval around the circumference of imaginary circle, can control institute's applied pressure better and make the deflection minimum of dish 16, thereby improve polishing efficiency.
A plurality of PCD samples 14 are fixed on a plurality of installation collets (mounting collet) that can be arranged in a plurality of sample retainers 12.The axis B of these collet bias sample retainers is provided with, and around axis B be with the sample retainer center of circle imaginary circle circumference and arrange at interval equably.Described that depart from setting and uniform spaced apart collet can make on the polished surface of each sample and obtain more smooth surface, prevents from simultaneously to form groove in metal dish 16.This departing from can also make polishing more stable, and makes applying of pressure more even, and this has improved polishing efficiency again.
Axis B is parallel to main shaft A usually.This set of axis makes the setting of physical dimension of lathe more easy.Yet in multiaxis (for example 5) lathe (as described below), employed axis can be with respect to the physical dimension of polished sample and wittingly, tilt controllably.
This lathe also comprises drive unit, and it is used to make the PCD sample to contact with rotatable metal dish 16, and is used to make this metal surface dish and sample retainer 12 to rotate simultaneously.
The first, this driver comprises corresponding numerical control motor 18, and to be used for driving each sample retainer 12 rotatably, each motor 18 is connected to sample retainer separately via driving shaft 20.The axis B that each motor 18 centers on separately retainer 12 separately rotates.
In order to obtain the best average sliding speed between each sample 14 and the dish 16, use the motor of rated power as 370W, this power utilizes the sample of estimation and the coefficient of friction (COF) between the dish to calculate.In polishing machine 10, each retainer arrives in the scope of 50rpm 25 around the rotating speed of its axis B, optimally is about 30rpm.For different sample pressure, and for different sample surface roughness, hot property and physical dimension, this range of speeds will change to some extent.
The second, this drive unit comprises numerical control master motor 22, is used for driving rotatably metal dish 16, and this motor 22 is connected to the driving wheel 24 of metal dish via rotating band (belt drive) 25, belt pulley 26 and main motor output shaft 28.As shown in the figure, each parts of metal dish and main motor are contained in the cabinet 30.
And in order to obtain best average sliding speed, the rated power that utilizes the COF that estimates to calculate main motor is 18kW.In polishing machine 10, dish 16 arrives in the scope of 1350rpm 1000 around the rotating speed of axis A, optimally is about 1300rpm.For different lathe specifications, and for different sample surface roughness, hot property and physical dimension, this range of speeds will change to some extent.
Motor 18 and 22 can make sample retainer 12 and metal dish 16 rotate simultaneously.Find that this while energy of rotation improves the efficient of glossing significantly and helps lend some impetus to the machine-processed (a) and (b) described in the background technology and (c).Use a plurality of independent motors can also carry out specific to the rotating speed of sample retainer and metal dish and independently control, to take different materials and polishing demand into account.
The 3rd, this drive unit comprises Pneumatic pressure power cylinder 32, in order to pushing sample retainer 12 to metal dish 16, and then each PCD sample 14 is pushed in the metal dish 16.This Pneumatic pressure power cylinder provides realizes the simple of the required pressure of DFP but stable manner.In bigger lathe, can use fluid power cylinder, and in better simply modification, can use removable mass to replace power cylinder.
Power cylinder 32 is installed on the fixed component that is top crossbeam 34 forms, and the drive rod 36 of this power cylinder 32 extends and is connected on the movable link that is sliding beam 38 forms.As shown in the figure, each motor 18 is installed on the sliding beam 38 via separately supporting structure 40 respectively, and thus, sample retainer 12 and each PCD sample 14 all are installed as indirectly with sliding beam 38 and move.
The opposed end of sliding beam 38 all is installed on separately the linear bearings part 42 slidably, and linear bearings part 42 then is installed on separately the pillar 44, and described pillar 44 extends upward supporting upper beam 34 from cabinet 30, thereby keeps the rigidity of lathe.Described linear bearings part 42 can have close tolerance (close tolerance) with the motion of the sliding beam that will drive by power cylinder 32 be restricted to very to heavens towards or away from the rectilinear motion of metal dish 16.Find, the linear bearings part provide the limit slippage crossbeam laterally and other very effective methods of easy motion not, from and help the raising of more uniform polishing and polishing efficiency.
The linear bearings part only is to be used to limit liftings that laterally reach the steady motion of other injustice of sample and wherein a type of placement mechanism when sample is positioned on the dish 16.The mechanism of alternative linear bearings part is based on the mechanism of hinge (hinge-based), and wherein this hinge forms the part of cabinet 30 or is installed on the cabinet 30, and an end of beam 38 is installed on this hinge to pivot around this hinge.In addition, as shown in the figure, retainer 12 can be fixing with respect to beam 38, and can pivot or upwards pivot away from dish 16 towards dish 16 downwards.
Crossbeam 34 and 38 and pillar 44 constitute by structure member usually so that provide intensity, rigidity and stable operation (robust operation) for polishing machine 10.
Metal dish can be circular slab or the annular element that limits the dynamic friction polished surface.This dish can be made by metal or the material that contains metal, and only comprise usually make by this class material, be installed in the top working surface on the cheaper substrate of price.The material of suitable manufacturing dish comprises the various alloys of steel and multiple alloy, especially stainless steel, iron, nickel, chromium, cobalt, titanium, zirconium and these metals.In fact, the working surface of this metal dish can comprise any can catalysis and the metal of the reaction of diamond.
Subsequently, can and the grinding and polishing surface be set in the inner qualification of this annular element.The used material in this grinding and polishing surface can comprise diamond complex, cubic boron nitride, boron carbide etc.
In addition, after beginning dynamic friction polishing, this drive unit can be suitable for will being somebody's turn to do immediately (or each is described) sample retainer 12 and PCD sample 14 and move to the grinding and polishing surface from the dynamic friction polished surface of metal dish.
Can realize that by the retainer of two or any amount sample retainer 12 arranges at interval equably that around the imaginary circle circumference quantity of retainer only is subjected to the restriction (promptly this diameter of a circle and retainer size will limit the quantity of the sample retainer that can be arranged in the lathe) of the physical dimension of this lathe.Similarly, uniform ring will be subjected to around the restriction of the imaginary diameter of a circle of axis B around the spacing of the PCD of sample retainer 12 sample, and this interval also is subjected to the restriction of the size of each retainer, and is subjected to the restriction of the size and the quantity of each sample.
For example, in illustrated equipment, the diameter of sample is 12mm.In commerce was used, this radius can change between 5 to 75mm, therefore can correspondingly change the physical dimension of this lathe.
Though the method and apparatus of describing among Fig. 2 and Fig. 3 shows the polishing of PCD diamond sample, it should be understood that this method and apparatus is equally applicable to comprise any diamond of the virtually any size of size disclosed herein.
In addition, be used for the setting that in the vertical direction is operated though the method and apparatus of describing among Fig. 2 and Fig. 3 shows, this method and apparatus also can be configured in the horizontal direction (or on other incline direction) and operate.Selectively, this equipment can be inverted (that is dish rotation above sample).
Example
The limiting examples of DFP technology will be described now.
Example 1
The lathe of application drawing 2 to be to be polished to specific surface roughness (for example Ra is 0.06 micron) with one group of PCD sample in about 18 minutes, that is, and and the grinding and polishing of 3 minutes DFP and 15 minutes.Notice that technical process such in traditional grinding and polishing needs about 3 hours.Thereby the lathe of Fig. 2 has been saved a large amount of time and cost.
In polishing process, the uniform polish of PCD has been guaranteed in the rotation of using sample retainer drive system to control the PCD sample.
The lathe of Fig. 2 is provided with permission and polishes two samples simultaneously on each retainer.Described sample retainer can easily be modified as the sample that polishes quantity such as 3,4,5,6,7,8,9,10 simultaneously.
Because polycrystalline diamond composite sheet, monocrystal diamond and diamond film have high hardness, and in the lathe of Fig. 2, use the DFP method can obtain good surface smoothness, therefore can make the various diamond parts of extensive use with low cost.Notice that these application comprise and are used for accurately machined cutting element, electronic unit, biomedical implants (implant) and device, jewelry, optics, mould, heat abstractor and wear parts.
Example 2
Under atmospheric conditions, on the polishing machine of Fig. 2, carry out the dynamic friction polishing (DFP) of PCD.The polishing of PCD sample is when sample retainer during with the rotation of the rotating speed of 30rpm, with the pressure of 3.5MPa sample is pressed in and realizes on the metal dish with the high rotating speed rotation of 1300rpm.PCD sample average sliding speed with 21m/s on this metal dish is slided.The rotation of the rotation of sample retainer and the PCD sample that causes thus makes that PCD is polished equably.Control polishing speed (or material removal rate) by the pressure that changes the metal dish rotating speed and/or be applied on the PCD sample.
Use stainless steel SUS304 as the polishing disk material, the reasons are as follows:
(i) elemental composition among the SUS304, particularly Fe, Cr, Ni and Mn are the main alloy compositions that is used under high pressure commercially producing the catalyst of diamond, and can carry out catalysis to diamond to the conversion of graphite under low pressure and the temperature conditions more than 700 ℃;
(ii) low carbon content (＜0.06%), it helps making the carbon diffusion by thermal chemical reaction;
(iii) low heat conductivity, it helps to keep the high temperature of diamond sample, and can not discharge the heat that is produced by dynamic friction;
The (iv) austenitic structure of SUS304, it helps the diffusion of carbon equally.
The parts of the polishing machine of Fig. 2 and/or its function are as follows:
(1) metal (stainless steel) polishing disk is that 400mm, thickness are that the SUS304 dish of 20mm is that 400mm, thickness are on the low-carbon (LC) steel disk of 80mm with bolting to diameter with diameter, thereby obtains to be used for the rigid disk instrument of polishing diamond.
(2) driven unit of medal polish dish, this assembly comprises main alternating current generator, belt pulley and cingulum.The rated power of main alternating current generator is 18kW, and its speed can change in the scope of 0-2800rpm continuously.
(3) a plurality of sample retainers, it keeps four PCD samples.For this reason, use the collet of steel.
(4) a plurality of sample retainer driven units, this assembly comprises alternating current motor, coupling and the retainer driving shaft of a plurality of 370W.
(5) sliding beam, the driven unit of its two sample retainers of carrying and described two sample retainers.This sliding beam slides up and down being installed on two linear bearings parts on the pillar, and described pillar is fixed on the flat surfaces that is formed on the cabinet.
(6) upper beam, it prevents any distortion of pillar under loaded-up condition.The Pneumatic pressure power cylinder is installed on this crossbeam.
(7) Pneumatic pressure power cylinder, it controls the load/pressure on moving of this sliding beam and the sample.
(8) cabinet, it is used for ccontaining metal dish and driven unit thereof, and this cabinet is made by the thick steel plate of 12.5mm, to guarantee rigidity, stability and operating personnel's safety.
Example 3
In shown in Figure 2 the setting, lathe can polish four PCD samples simultaneously.Use independent numerical control unit respectively for the speed of controlling main motor and two 370W motors.Based on the predetermined sliding speed of PCD sample, utilize the digitial controller of main motor that metal dish is rotated with proper speed (for example 1300-1350rpm).The digitial controller that utilization is used for the 370W motor makes the sample retainer also with desired speed (for example 30rpm) rotation, and sample is reduced on this dish gradually.Within a second, sample is sliding on this dish under the full and down state.Obtain required load by the air pressure of regulating pneumatic cylinder.
Typical burnishing parameters is as follows:
Average sliding speed: about 21.2m/s (main motor drives metal dish with the rotating speed of 1350rmp, and the PCD sample is in the diameter place rotation between 300-400mm on this dish simultaneously).
Pressure: the pressure on the sample is approximately 3.5MPa.
Polishing time: 1-3 minutes.This time is depended on the initial surface roughness of average sliding speed, pressure, PCD sample etc.
Lathe shown in Figure 2 can be carried out the dynamic friction glossing effectively, so that the PCD composite sheet is polished to required surface smoothness.
Example 4
Fig. 4 shows the influence of burnishing parameters (pressure and speed) to the material removing rate of two kinds of PCD, and wherein each symbology experimental result, and lines is corresponding linear regression fit (linear regressionfit).It is 6 microns diamond particles (all the other are SiC and Si) that first kind of PCD contains 65% the granularity of having an appointment, and the PCD surface roughness Ra before its polishing is about 0.7 micron.It is 25 microns diamond particles (all the other are SiC and Si) that second kind of PCD contains 75% the granularity of having an appointment, and the PCD surface roughness Ra before its polishing is about 1.6 microns.
When speed lower (for example 10m/s), only can partially polished PCD (or polishing).This is because temperature also is not high enough to excite phase transformation and chemical reaction at the interface in polishing.Under higher sliding speed (for example being higher than 12m/s), can observe polishing speed and almost increase linearly along with the increase of sliding speed.In addition, under given polishing velocity, higher pressure can cause higher polishing speed.Yet, be noted that under servere condition (severe condition), may produce and break that for example those are arranged in the situation of the dotted line top of Fig. 4.
For realizing gratifying polishing, select suitable burnishing parameters (such as pressure, sliding speed etc.) on the PCD metal interface, to produce required temperature.The determined effectively pressure-velocity composition of polishing that is suitable for has been shown among Fig. 4.As mentioned above, the dotted line among Fig. 4 is represented the approximate bounds of safe polishing area, can polish and not produce to break below this border.
In the condition of being tested, the suitable burnishing parameters of first kind of PCD (Fig. 4 (a)) is: (1) pressure=2.7MPa, and sliding speed=20 are to 25m/s; (2) pressure=3.1MPa, sliding speed=16 are to 25m/s; And (3) pressure=3.8MPa, sliding speed=16m/s.The polishing time of above-mentioned pressure/velocity composition is 2 minutes.The suitable burnishing parameters of second kind of PCD (Fig. 4 (b)) is: (1) pressure=2.7MPa, sliding speed=25m/s; (2) pressure=3.1MPa, sliding speed=18 are to 25m/s; (3) pressure=3.8MPa, sliding speed=16m/s; And (4) pressure=5MPa, sliding speed=12m/s.The polishing time of above-mentioned pressure/velocity composition is 3 minutes.
Example 5
In some cases, discovery need mechanically be removed attached to thin steel of the one deck on the PCD sample surface after the polishing and/or metal oxide.Taken up to study to determine not take place the polishing condition that steel and/or metal oxide adhere to.As described below, will be attached in the polishing machine in order to the mechanical means of removing steel and/or metal oxide form with the grinding and polishing step.In addition, find that also this grinding and polishing can improve the final surface roughness of PCD.
In order to obtain the surface roughness Ra (the normally commercial PCD cutting element of this roughness is desired) of the PCD after 0.06 micron the polishing, after DFP, on another lathe, use skive to carry out grinding and polishing.In the time of in building lathe for example shown in Figure 2 in the abrasive polishing process in, abrasive wheel is set, has so just omitted second step is set, and can on a lathe, finish whole PCD glossing efficiently in steel disk (be circular this moment) inside.
In addition, begun to study, the parts of burnishing machine equipment have been attached to multi-axis numerical control (CNC) machining center.For example can use 5 (as above all/down/laterally/front/rear/dish oblique) machining centers to carry out the Free Surface polishing.Notice and utilize the digital control of gang tool to carry out some very senior polishing (for example Free Surface polishing) the geometry of complicated sample more.
Comparison example
Compare test, with the surface roughness and the polishing time of the sample after dynamic friction polishing (DFP) polishing that technology was obtained of relatively using known Ginding process and use equipment shown in Figure 2.Comparing result is listed in the table 1.
Table 1. uses the surface roughness and the polishing time of the PCD composite sheet that grinding and polishing and DFP obtained.
aSurface roughness testing equipment: three rich (Mitutoyo) surfagauge (Surftest) 402 and Surftest analyzers
The PCD sample surface of using apparatus/method of the present invention polishing has been shown among Fig. 5 (a), with obtain (as-received) sample (Fig. 5 (b)) compare, use apparatus/method of the present invention to obtain optical surface fineness with 18 minutes polishing.
Above result clearly show that polissoir of the present invention can shorten the diamond polishing time significantly.
Though above described a plurality of embodiment of the method and apparatus of polishing diamond material, it should be understood that described method and apparatus can implement under multiple other form.
In appending claims and aforesaid explanation, unless because the hint of language performance or necessity is required, term " comprises " or the implication of its variant such as " having comprised ", " including " is the meaning that comprises (promptly show described feature to occur, occur among the different embodiment or add additional features but be not precluded within).
Claims (46)
1. method that is used for the polishing diamond material, this method may further comprise the steps:
The diamond sample is positioned with respect to movable metal surface; And
This diamond sample is contacted with movable this metal surface, and the motion of this metal surface and the rotation of this diamond sample are carried out simultaneously.
2. method according to claim 1, wherein this metal surface is rotatable, thus two or more diamond samples are positioned with respect to rotatable this metal surface, and thus with described two or more diamond samples around with the rotation of this metal surface be the center of circle imaginary circle circumference and arrange at interval equably.
3. method that is used for the polishing diamond material, this method may further comprise the steps:
Two or more diamond samples are positioned with respect to movable metal surface, thus with described two or more diamond samples around with the axis of movement of this metal surface be the center of circle imaginary circle circumference and arrange at interval equably; And
Described two or more diamond sample is contacted with rotatable this metal surface, make the axial-movement of this metal surface simultaneously with respect to this metal surface.
4. method according to claim 3, wherein this metal surface can be around rotation rotation, and when described two or more diamond samples contacted with this metal surface of rotation, this metal surface and described diamond sample all rotated.
5. according to claim 2 or 4 described methods, wherein said diamond sample or each described diamond sample are around the rotation rotation of this sample.
6. method according to claim 5, wherein said diamond sample or each described diamond sample comprise at least two diamond samples, described diamond sample does not align with the rotation of described sample, so that make described sample around this rotation rotation.
7. method according to claim 6, wherein two or more samples around with the rotation of described sample be the center of circle imaginary circle circumference and on this sample, arrange at interval equably.
8. according to each described method in the claim 5 to 7, the rotation of wherein said sample or the rotation of each described sample are parallel to the rotation of this metal surface.
9. according to each described method in the aforementioned claim, wherein said diamond sample or each described diamond sample arrive in the scope of 60m/s 5 with respect to the average sliding speed of this metal surface.
10. method according to claim 9, wherein this average sliding speed is about 21m/s.
11. according to each described method in the aforementioned claim, wherein said diamond sample or each described diamond sample are crushed on this metal surface.
12. method according to claim 11, the pressure on wherein said diamond sample or each the described diamond sample is in 2.5 to 25MPa scope.
13. method according to claim 12, wherein this pressure is approximately 3.5MPa.
14. according to each described method in the aforementioned claim, wherein this method comprises dynamic friction polishing stage and grinding and polishing stage subsequently.
15. method according to claim 14, wherein the duration in this dynamic friction polishing stage is 1-5 minutes.
16. according to claim 14 or 17 described methods, wherein the duration in this grinding and polishing stage is 1-20 minutes.
17. according to each described method in the claim 14 to 16, wherein this grinding and polishing stage is directly to implement on the lapped face of this metal surface.
18. one kind as at this with reference to example and the described method that is used for the polishing diamond material of accompanying drawing.
19. an equipment that is used for the polishing diamond material, this equipment comprises:
Retainer is used to make the diamond sample to position with respect to movable metal surface;
Drive unit is used to make this diamond sample to contact with movable this metal surface, and is used to make the motion of this metal surface and the rotation of this diamond sample to carry out simultaneously.
20. equipment according to claim 19, wherein this drive unit is set to make this diamond sample rotation by this retainer is rotated, and this drive unit also is arranged so that this metal surface rotation.
21. equipment according to claim 20, wherein this equipment comprises two or more sample retainers, be used for two or more corresponding diamond samples, described retainer be configured such that two or more diamond samples around with the rotation of this metal surface be the center of circle imaginary circle circumference and arrange at interval equably.
22. an equipment that is used for the polishing diamond material, this equipment comprises:
Two or more sample retainers, be used for two or more corresponding diamond samples, described retainer is arranged so that described sample positions with respect to movable metal surface, thus make two or more diamond samples around with the axis of movement of this metal surface be the center of circle imaginary circle circumference and arrange at interval equably; And
Drive unit is used to make described two or more diamond sample to contact with this metal surface, makes the axial-movement of this metal surface with respect to this metal surface simultaneously.
23. equipment according to claim 22, wherein this metal surface can be around rotation rotation, and this drive unit is arranged so that this metal surface and each described diamond sample rotate simultaneously thus.
24. equipment according to claim 23, wherein this drive unit makes each described diamond sample rotate by making each described retainer rotation.
25. according to claim 20,21,23 or 24 described equipment, wherein this drive unit comprises the corresponding motor that is used for each described sample retainer and this metal surface, and each described motor is configured such that described retainer or this metal surface are around corresponding rotation rotation.
26. equipment according to claim 25, wherein this equipment is configured to make the rotation of the rotation of described sample or each described sample to be parallel to the axis of this metal surface.
27. according to claim 25 or 26 described equipment, wherein said sample retainer or each described sample retainer comprise at least two sample installation sites, each described sample installation site is respectively applied for installs corresponding diamond sample, and described sample installation site is with respect to the rotation biasing of described sample.
28. being the circumference of the imaginary circle in the center of circle around the rotation with described sample, equipment according to claim 27, wherein said sample installation site arranges at interval equably.
29. according to each described equipment in the claim 19 to 28, wherein this drive unit also comprises power cylinder, be used for pushing described sample retainer to this metal surface, and then described diamond sample or each described diamond sample are shifted onto in this metal surface.
30. equipment according to claim 29, wherein this power cylinder is pneumatic and operates between the fixed component of this equipment and movable link, and described sample retainer is installed with respect to this movable link simultaneously.
31. equipment according to claim 30, wherein this movable link forms and promotes and the part of placement mechanism, and this lifting and placement mechanism are used for described sample is placed on this metal surface in the mode of deflection not.
32. equipment according to claim 31, wherein the opposed end of this movable link is installed on the corresponding linear supporting member respectively slidably, this movable link that the restriction of described linear bearings part is caused by this power cylinder towards or away from the linear movement of this metal surface, this fixed component is limited by the upper beam in using simultaneously, the opposed end of this upper beam is by the shore supports of this equipment, described pillar extends from the cabinet of this equipment, and this movable link is limited by the bottom sliding beam in using, and this bottom sliding beam can move up and down with respect to the cabinet of this equipment.
33. equipment according to claim 32, wherein said linear bearings part is installed on each described pillar.
34. equipment according to claim 31, wherein an end of this movable link is pivotally mounted on the hinge, this hinge is suitable for motion with described movable link and is restricted to arcuate movement around this hinge, thereby this metal surface is shifted to or moved apart to this sample, this fixed component is limited on this hinge or by this hinge and limits simultaneously, and this hinge is installed on the cabinet of this equipment or the frame or is attached in the cabinet or frame of this equipment.
35. according to each described equipment in the claim 19 to 34, wherein this metal surface forms the part of a metal dish, this metal dish is driven to rotating around disk center's axis by the part of drive unit.
36. equipment according to claim 35, wherein this metal dish is an annular element, and this annular element limits the dynamic friction polished surface, limits and be provided with the grinding and polishing surface in the inside of this annular element simultaneously.
37. equipment according to claim 36, wherein this drive unit is suitable for moving described sample retainer or each described sample retainer, thus described sample or each described sample is moved to this grinding and polishing surface from this dynamic friction polished surface.
38. an equipment that is used for the polishing diamond material, this equipment comprises:
Retainer is used to make the diamond sample to position with respect to movable metal surface;
Promote and placement mechanism, its be set in order to this retainer or this metal surface co-operating so that this sample is positioned on this movable metal surface in the mode of deflection not.
39. according to the described equipment of claim 38, wherein this lifting and placement mechanism comprise a member, this retainer or this metal surface are with respect to this member supports.
40. according to the described equipment of claim 39, also comprise drive unit, this drive unit is set at the enterprising line operate of this member, so that this sample is positioned on this movable metal surface in the mode of deflection not.
41. according to each described equipment in the claim 38 to 40, wherein this retainer is installed with respect to this member, and the opposed end of this member is installed on the corresponding linear supporting member respectively slidably, described linear bearings part limits the motion of this member, makes this retainer shift to or move apart this metal surface with linear mode thus.
42. according to the described equipment of claim 41, wherein this member moves with respect to a fixed component, this fixed component is limited by the upper beam in using, the opposed end of this upper beam is by the shore supports of this equipment, described pillar extends from the cabinet of this equipment, and movable link is limited by the bottom sliding beam in using, and this bottom sliding beam can move up and down by the cabinet with respect to this equipment on the linear bearings part that is installed on each described pillar.
43. according to each described equipment in the claim 38 to 40, wherein an end of this member is pivotally mounted on the hinge, this hinge is suitable for motion with this member and is restricted to arcuate movement around this hinge, thereby this metal surface is shifted to or moved apart to this sample.
44. according to the described equipment of claim 43, wherein this hinge is installed on the cabinet of this equipment or the frame or is attached in the cabinet or frame of this equipment.
45. according to each described equipment in the claim 38 to 44, wherein this equipment is in addition by each is limited in the claim 19 to 37.
46. one kind as at this with reference to the described equipment that is used for the polishing diamond material of accompanying drawing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2006903375A AU2006903375A0 (en) | 2006-06-22 | Method and apparatus for polishing diamond and diamond composities | |
| AU2006903375 | 2006-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101500751A true CN101500751A (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007800294287A Pending CN101500751A (en) | 2006-06-22 | 2007-06-22 | Method and apparatus for polishing diamond and diamond composites |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2040879A1 (en) |
| CN (1) | CN101500751A (en) |
| IL (1) | IL196050A0 (en) |
| WO (1) | WO2007147214A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774153A (en) * | 2019-10-23 | 2020-02-11 | 华侨大学 | Polishing method of large-size single crystal diamond |
| CN111595644A (en) * | 2020-05-26 | 2020-08-28 | 中国地质科学院矿产资源研究所 | Rock sample grinding and polishing loading device, sample preparation system and sample preparation method |
| CN113418904A (en) * | 2021-06-21 | 2021-09-21 | 北京大学 | Surface-enhanced Raman scattering substrate and preparation method and application thereof |
| CN115846651A (en) * | 2022-12-16 | 2023-03-28 | 广东工业大学 | Metal polishing disk and preparation method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103826735B (en) | 2011-09-21 | 2017-08-08 | 戴蒙得创新股份有限公司 | Polycrystalline diamond compact and its manufacture method with improved wearing character |
| DE102013005573B3 (en) * | 2013-04-03 | 2014-07-17 | Universität Bremen | Method for manufacturing abrasive body e.g. grinding disk, for ductile grinding, involves arranging diamond grains coaxial with rotation axis, and rotating metal friction surface about another axis, where axes are arranged in same plane |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8727303D0 (en) * | 1987-11-20 | 1987-12-23 | Gersan Ets | Polishing machine |
| BE1003373A6 (en) * | 1989-10-31 | 1992-03-10 | Hakoune Maurice | Method for sizing or polishing of a diamond or gem and device forimplementing the method |
| KR100559438B1 (en) * | 2003-08-27 | 2006-03-10 | 장경호 | Apparatus for polishing gemstones automatically |
-
2007
- 2007-06-22 EP EP07719112A patent/EP2040879A1/en not_active Withdrawn
- 2007-06-22 CN CNA2007800294287A patent/CN101500751A/en active Pending
- 2007-06-22 WO PCT/AU2007/000873 patent/WO2007147214A1/en active Application Filing
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2008
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110774153A (en) * | 2019-10-23 | 2020-02-11 | 华侨大学 | Polishing method of large-size single crystal diamond |
| CN110774153B (en) * | 2019-10-23 | 2022-02-08 | 华侨大学 | Polishing method of large-size single crystal diamond |
| CN111595644A (en) * | 2020-05-26 | 2020-08-28 | 中国地质科学院矿产资源研究所 | Rock sample grinding and polishing loading device, sample preparation system and sample preparation method |
| CN111595644B (en) * | 2020-05-26 | 2021-03-19 | 中国地质科学院矿产资源研究所 | Rock sample grinding and polishing loading device, sample preparation system and sample preparation method |
| CN113418904A (en) * | 2021-06-21 | 2021-09-21 | 北京大学 | Surface-enhanced Raman scattering substrate and preparation method and application thereof |
| CN113418904B (en) * | 2021-06-21 | 2023-05-16 | 北京大学 | Surface-enhanced Raman scattering substrate and preparation method and application thereof |
| CN115846651A (en) * | 2022-12-16 | 2023-03-28 | 广东工业大学 | Metal polishing disk and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| IL196050A0 (en) | 2009-09-01 |
| EP2040879A1 (en) | 2009-04-01 |
| WO2007147214A1 (en) | 2007-12-27 |
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