CN101499467A - Thermoelectric module - Google Patents
Thermoelectric module Download PDFInfo
- Publication number
- CN101499467A CN101499467A CN 200910009740 CN200910009740A CN101499467A CN 101499467 A CN101499467 A CN 101499467A CN 200910009740 CN200910009740 CN 200910009740 CN 200910009740 A CN200910009740 A CN 200910009740A CN 101499467 A CN101499467 A CN 101499467A
- Authority
- CN
- China
- Prior art keywords
- substrate
- electrode
- type thermoelectric
- electrothermal module
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A thermoelectric module for improving the moisture resistance has a first substrate, a second substrate spaced from the first substrate, a plurality of P type thermoelectric elements and N type thermoelectric elements arranged in the space between the first and second substrates, and a plurality of electrodes which connect the P type and N type thermoelectric elements in series. Each electrode is connected to a respective one of the plurality of P type thermoelectric elements at a first connection and a respective one of the plurality of N type thermoelectric elements in the space, and a sealant is located at an edge portion of the space. Each one of a series of first or outer electrodes closest to the edge portion of the space has a concave portion that is concaved in a direction departing from the edge portion of the space and is at a position between the first connection and the second connection.
Description
Technical field
The present invention relates to electrothermal module.More specifically, relate to employed electrothermal module in the adjustment of for example air conditioner, both cooling and heating storehouse, semiconductor-fabricating device, optical detection device, laser diode etc.
Background technology
As electrothermal module in the past, the electrothermal module of record in the patent documentation 1 is for example arranged.Described deterioration, applied the electrothermal module that periphery that the electrothermal module of encapsulant and the element between substrate set portion has been filled encapsulant in the outside of element in order to prevent that humidity from causing.
[patent documentation 1] spy opens the 2000-286460 communique
Described electrothermal module in the past is because have encapsulant, so moisture resistance properties than more excellent, still requires the further raising of performance.
Summary of the invention
Electrothermal module of the present invention has: first substrate; Second substrate that separates predetermined distance with this first substrate and dispose; Steric a plurality of P type thermoelectric elements between described first substrate and described second substrate; At described steric a plurality of N type thermoelectric elements; In described space, be connected respectively with of described a plurality of P type thermoelectric elements and of described a plurality of N type thermoelectric elements, and a plurality of electrodes of the electricity described a plurality of P type thermoelectric elements of series connection and described a plurality of N type thermoelectric elements; Encapsulant with the periphery that is configured in described space, described a plurality of electrode has first electrode of periphery one side that is configured in described space, this first electrode and the connecting portion of described P type thermoelectric element and and the connecting portion of described N type thermoelectric element between the position have to from the periphery in described space away from the recess of direction depression.
In addition, electrothermal module of the present invention is characterized in that in described structure: described encapsulant its part at least is present in the inboard of described recess.
In addition, electrothermal module of the present invention is characterized in that in described structure: described first electrode and the connecting portion of described P type thermoelectric element and and the connecting portion of described N type thermoelectric element between the position have to from the periphery in described space away from the outstanding protuberance of direction.
In addition, electrothermal module of the present invention is characterized in that in described structure: described first substrate and described second substrate are polygons, one side described first electrode be configured to its vertically among described polygon with approaching paralleling.
In addition, electrothermal module of the present invention is characterized in that in described structure: described first electrode is a curve in the described outer rim of periphery one side in described space.
Electrothermal module of the present invention has first substrate; Second substrate that separates predetermined distance with this first substrate and dispose; Steric a plurality of P type thermoelectric elements between first substrate and second substrate; At steric a plurality of N type thermoelectric elements; In the space, be connected respectively with of a plurality of P type thermoelectric elements and of a plurality of N type thermoelectric elements, and a plurality of electrodes of the electricity a plurality of P type thermoelectric elements of series connection and a plurality of N type thermoelectric elements; Encapsulant with the periphery that is configured in the space, a plurality of electrodes have first electrode of periphery one side that is configured in the space, first electrode and the connecting portion of P type thermoelectric element and and the connecting portion of N type thermoelectric element between the position have to from the periphery in space away from the recess of direction depression, thereby first electrode that is configured in periphery one side in space has described recess, exposes outside encapsulant so can suppress first electrode.Thus, the effect that has the moisture resistance properties that improves electrothermal module.
In addition, electrothermal module of the present invention is in described structure, and when encapsulant when its part is present in recess inboard at least, the bonding area of encapsulant and substrate increases, so sealing further improves.
In addition, electrothermal module of the present invention is in described structure, when first electrode and the connecting portion of P type thermoelectric element and and the connecting portion of N type thermoelectric element between the position have to from the periphery in space away from the outstanding protuberance of direction the time, the area that can suppress first electrode reduces, and descends so can suppress the rigidity of electrode.In view of the above, can keep all rigidity of electrothermal module with high level.
In addition, electrothermal module of the present invention is in described structure, when first substrate and second substrate are polygons, first electrode be configured to its vertically among polygon with approaching one side when paralleling, first electrode is difficult to expose to the outside from encapsulant on complete cycle, so the moisture resistance properties of electrothermal module and insulation property further improve.
In addition, electrothermal module of the present invention, in described structure, when first electrode when the outer rim of periphery one side in space is curve, when the use of electrothermal module, the mode that becomes high temperature, the opposing party and become low temperature with a side of substrate produces variations in temperature and makes substrate distortion, so to the stress of the first electrode effect from substrate desquamation, but can relax this stress, so the durability of first electrode improves, its result, the durability of electrothermal module improves.
Description of drawings
Fig. 1 is the stereogram of the electrothermal module of expression embodiments of the invention 1.
Fig. 2 is illustrated in the stereogram of having removed the state of encapsulant in the electrothermal module shown in Figure 1.
Fig. 3 is the vertical view of the ordered state of the electrode in the expression electrothermal module shown in Figure 1.
Fig. 4 is based on the cross-sectional view of the A-A line of Fig. 1.
Fig. 5 is the vertical view of the ordered state of the electrode in the expression electrothermal module shown in Figure 1.
Fig. 6 is the vertical view of ordered state of the electrode in the electrothermal module of expression embodiments of the invention 2.
Fig. 7 is the vertical view of ordered state of the electrode in the electrothermal module of expression embodiments of the invention 3.
Fig. 8 is the vertical view of ordered state of the electrode in the electrothermal module of expression embodiments of the invention 4.
Fig. 9 is the vertical view of the ordered state of the electrode in other examples of electrothermal module of expression embodiments of the invention 1.
The explanation of symbol
11-the first substrate; 11a-periphery; 13-the second substrate; 15-P type thermoelectric element; 17-N type thermoelectric element; 19-electrode; 19a, 19b, 19c, 19d-first electrode; 21-encapsulant; 23-recess; 27-protuberance.
Embodiment
Below, with reference to accompanying drawing, the electrothermal module of the embodiment of the invention is described.
＜embodiment 1 〉
Fig. 1～Fig. 5 represents the electrothermal module of the embodiment of the invention 1.
As depicted in figs. 1 and 2, the electrothermal module of present embodiment has: a pair of substrate 11,13 of arranged opposite (first substrate 11, second substrate 13); A plurality of P type thermoelectric elements 15 of being arranged in the space between the opposed faces of a pair of substrate 11,13 and a plurality of N type thermoelectric element 17; With a plurality of electrodes 19 of arranging respectively with N type thermoelectric element 17 and in the opposed faces of a pair of substrate 11,13 for electricity series connection P type thermoelectric element 15.The periphery in the space of this electrothermal module between a pair of substrate 11,13 has disposed encapsulant 21.In view of the above, the space that exists between a pair of substrate 11,13 becomes the state of sealing by encapsulant 21 encirclements, so can improve the moisture resistance properties of electrothermal module.
As shown in Figure 3 and Figure 4, in a plurality of electrodes 19 along the first electrode 19a that periphery disposed of substrate 11 (13), the part of the outer rim of the periphery 11a of substrate 11 side have to from the periphery 11a of first substrate 11 away from the recess 23 of direction depression.This recess 23 and is positioned at periphery 11a one side of first substrate 11 between the coupling part of the coupling part of P type thermoelectric element 15 and N type thermoelectric element 17.By forming recess 23, can suppress the first electrode 19a and expose to the outside, so can suppress the deterioration of the first electrode 19a from encapsulant 21 in the part of the first electrode 19a.Its result, the moisture resistance properties of electrothermal module further improves, and insulation property also improve.
A preferred part that constitutes the outer rim that is arranged on the recess 23 on the first electrode 19a is made of curve.When the use of electrothermal module, a side of first substrate 11 and second substrate 13 becomes high temperature, and the opposing party becomes low temperature.By generation variations in temperature like this, the distortion of first substrate 11 is so the stress that the first electrode 19a effect is peeled off from first substrate 11.By as the first electrode 19a of present embodiment, forming the recess 23 that outer cause curve constitutes, can relax described stress, thus can improve the durability of the first electrode 19a, its result, the durability of electrothermal module improves.
At this moment, a preferred part (curve part) that constitutes the outer rim that is arranged on the recess 23 on the first electrode 19a is made of circular-arc curve, and can relax stress easily.As other shape, also can be curve of oval arcuation etc.
In addition, as shown in Figure 9, bight at first substrate 11, it is big that stress becomes easily, thus be preferably formed for the curve part of the recess 23 of the first electrode 19a at the size of the curve part of the recess 23 of the first electrode 19a in the bight that constitutes first substrate 11 or other position that depth ratio constitutes first substrate 11 bigger or darker.At this moment, can relax the bigger stress that the bight produced at first substrate 11.
In addition, the curve part that constitutes the recess 23 of the first electrode 19a can be a plurality of in one first electrode 19a.At this moment, recess 23 becomes the shape of waveform etc.
The outer rim at the both ends of the preferred first electrode 19a also is made of circular-arc curve.At this moment, also can relax stress at the both ends of the first electrode 19a.
In addition, as shown in Figure 3 and Figure 4, preferred encapsulant 21 enters recess 23.In view of the above, the bonding area of the encapsulant 21 and first substrate 11 increases, so sealing further improves.
As shown in Figure 5, when the opposed faces of first substrate 11 is polygon such as quadrangle, the first electrode 19a that is disposed along the periphery 11a of first substrate 11 with its vertically and the one side near opposed faces dispose with paralleling.In view of the above, the first electrode 19a is difficult to expose to the outside from encapsulant 21 on complete cycle, so the moisture resistance properties of electrothermal module and insulation property further improve.In addition, compare during with vertically all the disposing in the same direction of electrode 19, can reduce the intensity difference of first substrate 11 that causes by bending position, so the intensity of substrate further improves.
In the embodiment 1 of Fig. 3～shown in Figure 5, the first electrode 19a along the periphery 11a of first substrate 11 configuration only forms recess 23 in the periphery 11a of first substrate 11 side, with the outer rim of the opposite side of periphery 11a one side of first substrate 11 are linearities, but also can be the forms of describing later shown in Figure 6.
＜embodiment 2 〉
Fig. 6 represents the electrothermal module of the embodiment of the invention 2.In addition, in the present embodiment, only the different point of explanation and described embodiment 1 about same inscape, uses identical reference marks, and the repetitive description thereof will be omitted.
In the electrothermal module of present embodiment, the first electrode 19b that is disposed along the periphery 11a of first substrate 11, except the part in the outer rim of the periphery 11a of first substrate 11 side have to from the periphery 11a of first substrate 11 away from the recess 25 of direction depression, be positioned at the part of the outer rim of the opposite side of periphery 11a of first substrate 11 have to from the periphery 11a of first substrate 11 away from the outstanding protuberance 27 of direction.This protuberance 27 is between the coupling part of the coupling part of P type thermoelectric element 15 and N type thermoelectric element 17.In view of the above, compare with embodiment 1 shown in Figure 4 with Fig. 3, the area that can suppress the first electrode 19b reduces, and descends so can suppress the rigidity of electrode.In view of the above, can keep the rigidity of thermoelectric module whole with high level.
At this moment, a preferred part (curve part) that constitutes the outer rim that is arranged on the protuberance 25 on the first electrode 19b is made of circular-arc curve, and can relax stress easily.As other shape, also can be curve of oval arcuation etc.
In addition, bight at first substrate 11, stress increases easily, is bigger or longer than the protuberance 27 of the first electrode 19b at other position that constitutes first substrate 11 of the size of the curve part of the protuberance 27 of the first electrode 19b in the bight that constitutes first substrate 11 or outstanding length so be preferably formed.At this moment, can relax the bigger stress that the bight produced at first substrate 11.
In addition, the curve part that constitutes the protuberance 27 of the first electrode 19b can be a plurality of in one first electrode 19b.
And the outer rim at the both ends of the preferred first electrode 19b also is made of circular-arc curve.At this moment, also can relax stress at the both ends of the first electrode 19b.
＜embodiment 3 〉
Fig. 7 represents the electrothermal module of the embodiment of the invention 3.In addition, in the present embodiment, only the different point of explanation and described embodiment 1 about same inscape, uses identical reference marks, and the repetitive description thereof will be omitted.
In the electrothermal module of present embodiment, the outer rim of the first electrode 19c that is disposed along the periphery 11a of first substrate 11 between the coupling part of the coupling part of P type thermoelectric element 15 and N type thermoelectric element 17 has 2 recesses 29,31 of depression to the inside.During such structure, can suppress the first electrode 19c and expose to the outside, so can suppress the deterioration of the first electrode 19c from encapsulant 21.In addition, as shown in Figure 7, when disposing encapsulant 21 in the mode of the outer rim integral body that covers the first electrode 19c that is disposed along the periphery 11a of first substrate 11, by having 2 recesses 29,31, the bonding area of the encapsulant 21 and first substrate 11 further increases, so sealing further improves.
At this moment, the recess opposite each other 29,31 that preferably is arranged on the first electrode 19c is made of circular-arc curve, and relaxes stress easily.As other shape, also can be curve of oval arcuation etc.
In addition, bight at first substrate 11, stress increases easily, is that the recess 29,31 of the first electrode 19c at other position of the size of recess 29,31 of the first electrode 19c in bight of first substrate 11 or depth ratio first substrate 11 is bigger or darker so be preferably formed.At this moment, can relax the bigger stress that the bight produced at first substrate 11.
In addition, how right a pair of recess 29,31 of the first electrode 19c can be in one first electrode 19c.
And the outer rim at the both ends of the preferred first electrode 19c also is made of circular-arc curve.At this moment, also can relax stress at the both ends of the first electrode 19c.
＜embodiment 4 〉
Fig. 8 represents the electrothermal module of the embodiment of the invention 4.In addition, in the present embodiment, only the different point of explanation and described embodiment 1 about same inscape, uses identical reference marks, and the repetitive description thereof will be omitted.
In the electrothermal module of present embodiment, the first electrode 19d that is disposed along the periphery 11a of first substrate 11, the outer rim between the coupling part of the coupling part of P type thermoelectric element 15 and N type thermoelectric element 17 has two recesses 29,31 of depression to the inside.It is mutually opposed with the periphery 11a of substrate that the part of these first electrodes 19d is configured to recess 29, and it is mutually opposed with the periphery 11b adjacent with the periphery 11 of first substrate 11 that other the first electrode 19d is configured to end longitudinally.When such structure, encapsulant 21 enters the recess 29,31 of the first electrode 19d of the periphery 11b arranged opposite of end and first substrate 11 longitudinally, thereby obtains fixed effect.In view of the above, encapsulant 21 improves with the bond strength of substrate 11, and moisture resistance properties further improves.
Encapsulant 21 also can be filled in the integral body between a pair of substrate 11,13, but because following reason, and is preferred only in the periphery configuration of first substrate 11 and second substrate 13.Promptly between a pair of substrate 11,13, have configuration filling part of encapsulant 21 and space part in addition, so can reduce because the influence that the formation filling part causes to the cooling heat dissipation characteristic of electrothermal module.The integral body between a pair of substrate 11,13 for example, if filled encapsulant 21, though can improve moisture resistance properties of electrothermal module etc., the cooling heat dissipation characteristic can descend.In electrothermal module, one side of substrate 11,13 becomes the heating side, the opposing party becomes heat absorbing side (cold side), if so whole resin materials of having filled between a plurality of thermoelectric elements, will pass through the resin material of being filled, between first substrate 11 and second substrate 13, transmit heat, and refrigeration and heat generation characteristic are descended.On the other hand, when only at the periphery 11a of first substrate 11 configuration encapsulant 21, can suppress the heat transferred between first substrate 11 and second substrate 13, and can reduce influence the cooling heat dissipation characteristic.
As encapsulant 21, for example, can use silicones, epoxy resin etc., but be not limited thereto.As first substrate 11 and second substrate 13, also can use ceramic substrate such as aluminium oxide, but by using the substrate of epoxy resin, polyimide resin substrate etc., the substrate easy deformation that becomes is so can improve the intensity of being close to of electrode.
In addition, in the present embodiment, shape and the configuration of first electrode 19a～19d of first substrate 11 have been described, still,, have preferably similarly disposed first electrode 19a～19d with first substrate 11 about the opposing party's second substrate 13.In addition, in described each embodiment, be that example describes when being circle, but the cross sectional shape of thermoelectric element also can be for example polygon beyond circular etc. with the cross section of thermoelectric element., each embodiment is such as described, when the part of outer rim is the recess that is made of curve, preferably along this recess cross section of the circle of configuration easily.In view of the above, thermoelectric element is difficult to stretch out from electrode.
In addition, the electrothermal module of described each embodiment can be used as generator unit and carries in Blast Furnace Top Gas Recovery Turbine Unit (TRT) or as thermostat unit and carry in temperature-adjusting device.As temperature-adjusting device, heater that for example can enumerate cooling device that electrothermal module is used as cooling unit, electrothermal module is used as heating unit etc.
Claims (5)
1. electrothermal module has:
First substrate;
Second substrate, itself and this first substrate separates predetermined distance and disposes;
A plurality of P type thermoelectric elements are arranged in the space between described first substrate and described second substrate;
A plurality of N type thermoelectric elements are arranged in described space;
A plurality of electrodes are connected with of described a plurality of P type thermoelectric elements and of described a plurality of N type thermoelectric elements in described space respectively, and the electricity described a plurality of P type thermoelectric elements of series connection and described a plurality of N type thermoelectric element; With
Encapsulant, it is configured in the periphery in described space,
Described a plurality of electrode has first electrode of periphery one side that is configured in described space,
This first electrode, and the connecting portion of described P type thermoelectric element and and the connecting portion of described N type thermoelectric element between the position, have to from the periphery in described space away from the recess of direction depression.
2. electrothermal module according to claim 1 is characterized in that:
Described encapsulant its part at least is present in the inboard of described recess.
3. electrothermal module according to claim 1 is characterized in that:
Described first electrode, and the connecting portion of described P type thermoelectric element and and the connecting portion of described N type thermoelectric element between the position, have to from the periphery in described space away from the outstanding protuberance of direction.
4. electrothermal module according to claim 1 is characterized in that:
Described first substrate and described second substrate are polygons,
Described first electrode, one side be configured to its vertically among described polygon with approaching paralleling.
5. electrothermal module according to claim 1 is characterized in that:
Described first electrode is a curve in the described outer rim of periphery one side in described space.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008018208 | 2008-01-29 | ||
| JP2008018208 | 2008-01-29 | ||
| JP2008326974 | 2008-12-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101499467A true CN101499467A (en) | 2009-08-05 |
Family
ID=40946447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910009740 Pending CN101499467A (en) | 2008-01-29 | 2009-01-23 | Thermoelectric module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101499467A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014084363A1 (en) * | 2012-11-29 | 2014-06-05 | 京セラ株式会社 | Thermoelectric module |
| CN105122486A (en) * | 2013-03-15 | 2015-12-02 | 日本恒温装置株式会社 | Thermoelectric conversion module |
-
2009
- 2009-01-23 CN CN 200910009740 patent/CN101499467A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014084363A1 (en) * | 2012-11-29 | 2014-06-05 | 京セラ株式会社 | Thermoelectric module |
| CN105122486A (en) * | 2013-03-15 | 2015-12-02 | 日本恒温装置株式会社 | Thermoelectric conversion module |
| CN105122486B (en) * | 2013-03-15 | 2017-07-18 | 日本恒温装置株式会社 | Thermo-electric conversion module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100595909C (en) | Semiconductor device | |
| US20060049477A1 (en) | Optoelectronic component | |
| EP2622653B1 (en) | Interconnect for an optoelectronic device | |
| JP5225056B2 (en) | Thermoelectric module | |
| CN101868867A (en) | Thermoelectric module | |
| CN109786336A (en) | Encapsulating structure and electronic device | |
| CN104221484B (en) | The manufacture method of LED mesh devices and LED mesh devices | |
| CN101499467A (en) | Thermoelectric module | |
| CN101835639A (en) | Member defining a holder for a device and tyre including such member | |
| CN102473696A (en) | Heat sink | |
| CN107849983A (en) | Turbine engine exhaust housing with improved service life | |
| JP2008124176A (en) | Power semiconductor device | |
| US20050161951A1 (en) | Method and apparatus for producing energy using air pressure differential | |
| CN104882535A (en) | Piezoelectric element unit and driving device | |
| CN102163580B (en) | Thin encapsulation body and manufacturing method thereof | |
| US9835512B2 (en) | Header assembly for a pressure sensor | |
| JP2013026226A (en) | Electrochemical device, method and assembly | |
| CN106784242A (en) | The method of LED component, LED and processing LED component conduction bonding wire | |
| CN108996467A (en) | Sensor-packaging structure and method | |
| ES2851385T3 (en) | Cover for a component and procedure for the manufacture of a cover for a component | |
| TW201041099A (en) | Package assembly and method of tuning a natural resonant frequency of a package | |
| JP5273265B2 (en) | Power semiconductor device | |
| CN107849967A (en) | Heat exchanger and manufacture method | |
| JP2016023969A (en) | Sensor device | |
| CN206806334U (en) | A kind of more leg station integrated circuits applied to high power device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090805 |