JP2016023969A - Sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To relax repetitive stress acting on a bent portion of an electrode lead or a connector lead.SOLUTION: A sensor device has: a circuit package 10 having a sensor unit and an electrode lead 13 connected to the sensor unit; a connection lead 21 joined to the electrode lead 13; a resin housing 20 fixing the circuit package 10; a deformation part 14 which is provided on any one of the electrode lead 13 and the connection lead 21, and is formed by extending any one of the electrode lead 13 and the connection lead 21 in a direction different from that of the lead; and a stress relaxation member 31 which is led out from the circuit package 10, has at least its tip embedded in the housing 20, and relaxes a stress acting on the deformation part 14 formed on one of the electrode lead 13 and the connection lead 21.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a sensor device, and more particularly to a sensor device including a housing for fixing a circuit package having a sensor portion.

  An internal combustion engine such as an automobile includes an electronically controlled fuel injection device for appropriately operating the internal combustion engine by appropriately adjusting the amount of air and fuel flowing into the internal combustion engine. The electronically controlled fuel injection device requires a flow sensor for measuring the flow rate of air flowing into the internal combustion engine.

  As a flow sensor, it has a circuit package in which a flow rate detector and an electrode lead connected to the flow rate detector are sealed with a resin so that the tip of the electrode lead protrudes, and this circuit package is formed integrally with the connector lead Some have a structure fixed by a resin housing. The end of the connector lead of the housing is joined to the tip of the electrode lead of the circuit package by welding or the like.

The intake duct of the internal combustion engine in which the flow sensor is installed becomes high temperature due to the temperature rise in the engine room. For this reason, the flow rate sensor has a high temperature in the vicinity of the duct, and a temperature difference is generated between the flow sensor and a portion corresponding to the central portion of the duct cooled by the intake air. As a result, stress acts on the joint between the electrode lead and the connector lead due to the difference in coefficient of linear expansion between the resin housing and the metal electrode lead and connector lead.
In order to absorb this stress, a flow sensor in which a bent portion is provided in an electrode lead is known (for example, see Patent Document 1).

JP 2014-1990 A

  The structure of Patent Document 1 can absorb the stress acting on the joint between the electrode lead and the connector lead, but the repeated stress accompanying the rise and fall of the temperature acts on the bent portion of the electrode lead. In the above conventional structure, absorption of repeated stress acting on the bent portion of the electrode lead is not sufficient.

A sensor device according to the present invention includes a sensor unit and a circuit package having an electrode lead connected to the sensor unit, a resin housing having a connection lead bonded to the electrode lead, and fixing the circuit package, and an electrode lead. A deformed portion provided on any one of the connection leads and extending from one of the electrode lead and the connection lead in a direction different from the extending direction thereof, and is derived from the circuit package, and at least the tip is a housing And a stress relieving member that relieves stress acting on the deformed portion formed in one of the electrode lead and the connection lead.
In addition, a sensor device according to the present invention includes a sensor unit and a circuit package having an electrode lead connected to the sensor unit, a resin housing having a connection lead bonded to the electrode lead, and fixing the circuit package, and an electrode A deformed portion provided on one of the lead and the connecting lead, and extending from one of the electrode lead and the connecting lead in a direction different from the extending direction, and is derived from the circuit package, and at least the tip is a housing And a stress relaxation member having a linear expansion coefficient that is the same as or smaller than the linear expansion coefficient of one of the leads embedded in the deformed portion.

  According to the present invention, the stress acting on the deformed portion of the electrode lead or the connector lead can be relaxed by the stress relaxation member.

Shows a flow sensor as an embodiment of the sensor apparatus according to the present invention, (A) is a plan view, (B) is, _I B -I _B line cross-sectional view of (A). FIG. 1 (A), the is a diagram for explaining the manufacturing method of the flow sensor shown in (B), (A) is a plan view of the flow sensor, _II B -II (B) in, (A) _B line sectional drawing. FIG. 3 is a diagram for explaining a process following FIG. 2, and is a cross-sectional view of a state in which a flow sensor is accommodated in a mold. Are diagrams for explaining a process subsequent to FIG. 3, (A) is a plan view of the flow sensor, (B) is, _IV B -IV _B line cross-sectional view of (A). Are diagrams for explaining a process subsequent to FIG. 4, (A) is a plan view of the flow sensor, (B) is, _V B -V _B line cross-sectional view of (A). FIG. 6 is a diagram for explaining a process following FIG. 5 and is a cross-sectional view showing a state before processing the electrode lead of the flow sensor. It is a figure for demonstrating the process following FIG. 6, and sectional drawing which shows the state which processes the electrode lead of a flow sensor. Sectional drawing for demonstrating the process following FIG. It is a figure for demonstrating the process following FIG. 8, and sectional drawing of the state which accommodated the flow sensor in the metal mold | die. Are diagrams for explaining a process subsequent to FIG. 9, (A) is a plan view of the flow sensor, (B) is, _X B -X _B line cross-sectional view of (A). Shows a flow sensor as an embodiment 2 of the sensor device according to the present invention, (A) is a plan view of the flow sensor, (B) is, _XI B -XI _B line cross-sectional view of (A). Are views for explaining a manufacturing method of the flow sensor shown in FIG. 11, (A) is a plan view of the flow sensor, (B) is, _XII B XII _B line cross-sectional view of (A). Are diagrams for explaining a process subsequent to FIG. 12, (A) is a plan view of the flow sensor, (B) is, XIII _B -XIII _B line cross-sectional view of (A). Are diagrams for explaining a process subsequent to FIG. 13, (A) is a plan view of the flow sensor, (B) is, _XIV B XIV _B line cross-sectional view of (A). Are diagrams for explaining a process subsequent to FIG. 14, (A) is a plan view of the flow sensor, (B) is, _XV B -XV _B line cross-sectional view of (A). Sectional drawing which shows the flow sensor as Embodiment 3 of the sensor apparatus by this invention.

Embodiment 1
[Overall structure of sensor device]
Hereinafter, an embodiment of a sensor device of the present invention will be described with reference to the drawings.
FIG. 1 shows a flow rate sensor as one embodiment of a sensor device according to the present invention, FIG. 1 (A) is a plan view thereof, and FIG. 1 (B) is an illustration of I _B -I in FIG. 1 (A). _{It is B} line sectional drawing. In FIG. 1A, the upper cover 27 is transparent to clearly show the internal structure.
The sensor device 100 is installed, for example, in an intake duct of an internal combustion engine of a vehicle. The sensor device 100 is a thermal air flow sensor, and includes a circuit package 10 and a housing 20 that fixes the circuit package 10.

The circuit package 10 includes a lead frame 1 shown in FIG. 2A, a plurality of electrode leads 13, a first semiconductor chip 3 and a second semiconductor chip 4 mounted on the lead frame 1, and a plurality of stress relaxations. A member 31 and a sealing resin 11 are provided. The sealing resin 11 is in a state where a part of the electrode lead 13 and the stress relaxation member 31 and a part of the first semiconductor chip 3 are exposed, and the electrode lead 13, the stress relaxation member 31, the first semiconductor chip 3, and the second semiconductor chip 3. And a sealing resin 11 for sealing the semiconductor chip 4.
The first semiconductor chip 3 and the second semiconductor chip 4 are bonded to the lead frame 1 with adhesives 5 and 6, respectively.

The lead frame 1 is formed of, for example, a metal member such as copper or aluminum, and includes a first semiconductor chip mounting portion 1a (see FIG. 2A) and a second semiconductor chip 4 on which the first semiconductor chip 3 is mounted. It has the 2nd semiconductor chip mounting part 1b (refer FIG. 2 (A)) mounted.
A thin diaphragm 2 is formed on the upper surface side of the first semiconductor chip 3. The diaphragm 2 is formed, for example, by removing the back side of the first semiconductor chip 3 by anisotropic etching or the like. Although not shown, a heating resistor, a heater control bridge, a temperature sensor bridge, and the like that form a flow rate detection unit (sensor unit) are formed on the diaphragm 2. The temperature difference generated in the heater control bridge heated by the heating resistor changes according to the flow rate. The flow rate is measured by detecting the change in resistance value associated with this temperature change. The diaphragm 2 has a function of reducing the heat capacity and improving the responsiveness of each resistor to temperature changes.

Although not shown, the second semiconductor chip 4 has a CPU, an input circuit, an output circuit, a memory, and the like, and also has a control circuit unit for controlling the above-described flow rate detection unit and measuring the flow rate. Yes.
A wiring pattern 3a (see FIG. 2A) is formed on the upper surface of the first semiconductor chip 3, and the wiring pattern 3a and the input terminal of the second semiconductor chip 4 are connected by a wire 7a made of gold or copper. Has been.

The plurality of electrode leads 13 have a rectangular frame-shaped dam bar 12, and the first and second semiconductor chip mounting portions 1a and 1b and the plurality of leads 13 are connected to the dam bar 12 by a connecting portion 12a. As will be described later, each lead 13 is formed integrally with the lead frame 1, cut off the lead frame 1 at the connecting portion 12 a, separated from the other leads 13, and cut off the dam bar 12. . Each electrode lead 13 extends in the X direction from one end side, and a bent portion 14 is formed in the vicinity of the other end side. The bent portion 14 is formed in a convex shape protruding upward (Z direction) in FIG. Accordingly, the portion of the electrode lead 13 where the bent portion 14 is formed has a smaller rigidity in the extending direction (X direction) of the electrode lead 13 than the other portions.
As shown in the figure, the extending direction of the electrode leads 13 is the X direction, the arrangement direction of the electrode leads 13 is the Y direction, and the vertical direction is the Z direction.
One end side of each electrode lead 13 is connected to the output terminal of the second semiconductor chip 4 by a wire 7b.

  The first semiconductor chip 3, the second semiconductor chip 4, and the wires 7a and 7b are sealed with a sealing resin 11 except for the diaphragm 2 of the first semiconductor chip 3 and its peripheral region. Each electrode lead 13 is exposed from the sealing resin 11 with respect to the connecting portion with the wire 7b and led out in the X direction.

  A number of connector leads (connection leads) 21 corresponding to the electrode leads 13 are integrally formed in the housing 20 by insert molding or the like. The housing 20 fixes the sealing resin 11 so that the diaphragm 2 of the circuit package 10 and its peripheral region are exposed. A rectangular opening 20a is formed in the housing 20, and the tip end side of the electrode lead 13 and one end side of the connector lead 21 are exposed from the opening 20a. The housing 20 and the circuit package 10 are preferably fixed integrally by molding, but may be fixed by a fastening member.

  One end side and the other end side of the connector lead 21 are led out from the housing 20. One end of the connector lead 21 led out to the circuit package 10 side is joined to the electrode lead 13 by a joint portion 25. The connector lead 21 and the electrode lead 13 are preferably joined by welding such as spot welding or laser welding. The connector lead 21 is preferably formed of the same material as the electrode lead 13 such as copper or aluminum.

[Stress relief member]
As shown in FIG. 1A, a pair of stress relaxation members 31 are provided on both sides in the arrangement direction (Y direction) of the plurality of electrode leads 13. The stress relaxation member 31 is a flat member that extends in the extending direction (X direction) parallel to the electrode lead 13 and does not have a deformed portion such as a bent portion. As shown in FIG. 2B, one end of each stress relaxation member 31 is sealed with the sealing resin 11 of the circuit package 10 in a state where the stress relaxation member 31 is bonded to the lead frame 1 with an adhesive 32. Embedded in the housing 20. An intermediate portion between one end and the distal end portion 33 of each stress relaxation member 31 is exposed from the opening 20 a of the housing 20.

The sealing resin 11 and the housing 20 are formed of, for example, a thermosetting resin such as an epoxy resin or a phenol resin, or a thermoplastic resin such as polycarbonate or polyethylene terephthalate. Moreover, fillers, such as glass and mica, can be mixed in resin.
The opening 20 a of the housing 20 is sealed by the upper cover 27 and the lower cover 28. Attachment of the upper cover 27 and the lower cover 28 to the housing 20 can be performed by adhesion or laser welding.

  The stress relaxation member 31 is made of a material having a smaller linear expansion coefficient than the electrode lead 13 and the connector lead 21. For example, when the electrode lead 13 and the connector lead 21 are formed of copper, aluminum, or the like, the stress relaxation member 31 can be formed of iron, stainless steel, chromium, or the like.

  When the temperature of the environment in which the sensor device 100 is installed changes, the electrode lead 13, the connector lead 21, and the housing 20 respectively expand and contract in the extending direction (X direction) corresponding to the temperature change. Since the resin housing 20 has a larger linear expansion coefficient than the electrode lead 13 and the connector lead 21, stress acts on the joint portion 25 between the electrode lead 13 and the connector lead 21. A bent portion 14 is formed in the electrode lead 13, and the bent portion 14 has rigidity in the extending direction (X direction) smaller than other portions of the electrode lead 13. For this reason, the stress which acts on the junction part 25 when the bending part 14 deform | transforms can be absorbed. Since the electrode lead 13 is usually thinner than the connector lead 21, the bent portion 14 is formed in the electrode lead 13. However, the bent portion may be formed in the connector lead 21.

However, when the temperature change is repeated, stress is repeatedly generated in the bent portion 14 of the electrode lead 13. Conventionally, there is no means for relaxing the repeated stress acting on the bent portion 14.
On the other hand, in the sensor device 100 shown in the above embodiment, the stress relaxation member 31 that connects the sealing resin 11 and the housing 20 has one end and the other end embedded in the sealing resin 11 or the housing 20. Is provided. The stress relaxation member 31 extends in the X-axis direction in parallel with the electrode lead 13 and the connector lead 21, and has a smaller linear expansion coefficient than the electrode lead 13 and the connector lead 21. Therefore, the stress relaxation member 31 functions to suppress the expansion and contraction of the housing 20 in the X direction, and the root portion L ₁ exposed from the sealing resin 11 of the electrode lead 13 (see FIG. 10B) and the connector The change Δl in the distance L between the root portions L ₂ exposed from the housing 20 of the lead 21 (see FIG. 10B) becomes small. As a result, the repeated stress acting on the bent portion 14 of the electrode lead 13 can be relaxed.

The rigidity in the extending direction (X-axis direction) of the stress relaxation member 31 is preferably higher than the rigidity in the extending direction (X-axis direction) of the electrode lead 13 in which the bent portion 14 is formed. A member having high rigidity indicates a member having a smaller deformation amount when the electrode lead 13 having the bent portion 14 and the stress relaxation member 31 are each pulled or compressed in the X-axis direction. In terms of the elastic coefficient, the elastic coefficient in the extending direction (X direction) of the stress relaxation member 31 is preferably higher than the elastic coefficient in the extending direction (X direction) of the electrode lead 13.
If such a condition is satisfied, the material of the stress relaxation member 31 is not limited to a metal material, but ceramics such as alumina nitride and alumina, or fine particles such as glass and mica in a thermosetting resin or a thermoplastic resin. Mixed materials can be used.

  The rigidity increases as the cross-sectional area in the direction perpendicular to the extending direction (X direction) of the stress relaxation member 31 increases. For this reason, it is preferable to make the cross-sectional area perpendicular to the extending direction (X direction) of the stress relaxation member 31 larger than the cross-sectional area perpendicular to the extending direction (X direction) of the electrode lead 13.

In addition, the linear expansion coefficient of the stress relaxation member 31 is not necessarily smaller than the linear expansion coefficient of the electrode lead 13. In short, the stress relaxation member 31 has a linear expansion coefficient smaller than that of the housing 20, and the root portion L ₁ exposed from the sealing resin 11 of the electrode lead 13 and the root portion exposed from the housing 20 of the connector lead 21. The change Δl of the distance L between L ₂ may be any as long as it can be made smaller than when the stress relaxation member 31 is not provided.
The number and arrangement of the stress relaxation members 31 can be arbitrarily set.

[Method for Manufacturing Sensor Device]
With reference to FIGS. 2-10, an example of the manufacturing method of the sensor apparatus 100 illustrated by FIG. 1 (A), (B) is demonstrated.
The lead frame 1 shown in FIGS. 2A and 2B is formed, and the first semiconductor chip 3, the second semiconductor chip 4 and the stress relaxation member 31 are mounted on the lead frame 1.
The first semiconductor chip 3 and the second semiconductor chip 4 are bonded to the lead frame 1 with adhesives 5 and 6, respectively. Wire bonding is performed, and the wiring pattern 3a of the first semiconductor chip 3 and the input terminal of the second semiconductor chip 4 are connected by the wire 7a. Similarly, wire bonding is performed, and the output terminal of the second semiconductor chip 4 and the electrode lead 13 are connected by the wire 7b.
The stress relaxation member 31 is bonded onto the predetermined connecting portion 12 a of the lead frame 1 with the adhesive 32. The stress relaxation member 31 is disposed so as to extend in the X direction in parallel with the electrode lead 13. As the adhesives 5 and 6, for example, thermosetting resins such as epoxy resins and polyurethane resins, and thermoplastic resins such as polyimide and acrylic resins can be used.

As illustrated in FIG. 3, the first intermediate body illustrated in FIGS. 2A and 2B is accommodated in the lower mold 9 and the upper mold 8 is closed. A cavity 61 corresponding to the shape of the sealing resin 11 illustrated in FIG. 1 is formed by the lower mold 9 and the upper mold 8.
When resin is injected into the cavity 61 and molding is performed, the circuit package 10 is formed as shown in FIGS. 4 (A) and 4 (B). However, at this time, the electrode lead 13 is connected to the dam bar 12 and the connecting portion 12 a of the lead frame 1, and the bent portion 14 is not formed in the electrode lead 13.

  A second intermediate body in which the connecting portion 12a for connecting the electrode lead 13 is cut, and the dam bar 12 is separated and the electrode leads 13 are separated from each other as shown in FIGS. Form.

As shown in FIG. 6, the second intermediate is set in the lower mold 16. A recess 16 a is formed in the lower mold 16 at a position where the bent portion 14 of the electrode lead 13 is formed. In this state, the stress relaxation member 31 is disposed outside the lower mold 16.
When the upper die 15 having a convex portion 15a formed at a position corresponding to the concave portion 16a of the lower die 16 is used and the electrode lead 13 is pressed, the bent portion 14 is formed on the electrode lead 13 as shown in FIG. Are formed, and the circuit package 10 is formed. FIG. 8 is a cross-sectional view of the circuit package 10 taken out of the mold after opening the mold. Since the bending portion is not formed in the stress relaxation member 31, in this state, the tip of the stress relaxation member 31 is disposed at a position farther in the extending direction (X direction) from the sealing resin 11 than the tip of the electrode lead 13. Is done.

As shown in FIG. 9, the circuit package 10 is set in the lower mold 19. A cavity 62 formed by the upper mold 18 and the lower mold 19 has a shape corresponding to the housing 20. In addition, each connector lead 21 is set in a recess (not shown) formed in the lower mold 19. At this time, the region 24 at one end of each connector lead 21 is overlapped with the tip of the electrode lead 13. Thereafter, the upper mold 18 is closed.
When the resin is injected into the cavity 62 and molding is performed, the housing 20 in which the circuit package 10 is integrated is formed as shown in FIGS. 10 (A) and 10 (B). In this state, the distal end portion 33 of the stress relaxation member 31 is embedded in the housing 20.

  The tip of the electrode lead 13 and the tip of the connector lead 21 are joined by spot welding, laser welding, or the like. When the opening 20a of the housing 20 is sealed with the upper cover 27 and the lower cover 28, the sensor device 100 illustrated in FIG. 1 is obtained.

According to the sensor device 100 of the above-described embodiment, the following effects can be obtained.
(1) In the sensor device 100 in which the bent portion 14 is formed in the electrode lead 13 led out from the circuit package 10 and the connector lead 21 provided in the housing 20 that fixes the circuit package 10 is joined to the tip of the electrode lead 13. The stress relaxation member 31 was provided. The stress relieving member 31 has a function of relieving repeated stress acting on the electrode lead 13 due to a temperature change in the environment where the sensor device 100 is installed. Thereby, the safety | security and reliability of the sensor apparatus 100 can be improved further.

(2) One end side of the stress relaxation member 31 is embedded in the sealing resin 11 at the same time as the step of forming the sealing resin 11 by molding, and the tip 33 is formed at the same time as the step of forming the housing 20 by the molding. Buried inside. For this reason, the stress relaxation member 31 can be provided efficiently.

Embodiment 2
FIG. 11 shows a flow sensor as a second embodiment of the sensor device according to the present invention, FIG. 11 (A) is a plan view of the flow sensor, and FIG. 11 (B) is XI _B − of FIG. 11 (A). a XI _B line cross-sectional view.
The second embodiment shows an aspect in which the stress relaxation member is formed separately from the lead frame 1 together with the electrode lead 13. Hereinafter, this point will be mainly described, and in the same configuration as in the first embodiment, the same reference numerals are assigned to the corresponding members, and the description will be omitted.

As illustrated in FIG. 11A, the sensor device 100A according to the second embodiment includes a pair of dummy leads 34 having a function as a stress relieving member on both sides in the arrangement direction (Y direction) of the plurality of electrode leads 13. It has.
As will be described later, the dummy lead 34 is a member that is formed integrally with the lead frame 1 together with the electrode lead 13, and is formed by cutting the lead frame 1 at the connecting portion 12a and separating it.
Therefore, as shown in FIG. 11B, the dummy lead 34 is disposed at the same height position as the electrode lead 13, and the material and plate thickness of the dummy lead 34 are the same as those of the electrode lead 13. However, the dummy lead 34 is a flat plate-like member extending linearly in the extending direction (X direction) and does not have the bent portion 14.

With reference to FIGS. 12-15, an example of the manufacturing method of 100 A of sensor apparatuses of Embodiment 2 is demonstrated.
The lead frame 1 shown in FIGS. 12A and 12B is formed, and the first semiconductor chip 3 and the second semiconductor chip 4 are mounted on the lead frame 1. The wiring pattern 3a of the first semiconductor chip 3 and the input terminal of the second semiconductor chip 4 are connected by a wire 7a, and the output terminal of the second semiconductor chip 4 and the electrode lead 13 are connected by a wire 7b.
However, dummy leads 34 are integrally formed with the lead frame 1 along with the electrode leads 13 in the lead frame 1. The dummy lead 34 is formed in the same outer shape as the electrode lead 13. The dummy lead 34 and the electrode lead 13 are connected to each other by the connecting portion 12a on one end side and the other end side, and extend parallel to the extending direction (X direction).

As in the case of the first embodiment, the sealing resin 11 is formed by molding, and the circuit package 10A illustrated in FIGS. 13A and 13B is manufactured.
Then, as in the case of the first embodiment, the electrode lead 13 is pressed to form the bent portion 14 in the electrode lead 13 illustrated in FIGS. 14 (A) and 14 (B). Since the bent portion 14 is formed only on the electrode lead 13 and not on the dummy lead 34, the length of the electrode lead 13 led out from the sealing resin 11 in the X direction is shorter than the length of the dummy lead 34. . In other words, the tip portion 35 of the dummy lead 34 is disposed at a position farther in the X direction, which is the extending direction from the sealing resin 11, than the tip of the electrode lead 13.

Further, as in the case of the first embodiment, the housing 20 in which the circuit package 10A is integrated is formed by molding. As shown in FIGS. 15A and 15B, in this state, the tip portion 35 of the dummy lead 34 is embedded in the housing 20.
Thereafter, the tip of the electrode lead 13 and the tip of the connector lead 21 are joined, and the opening 20a of the housing 20 is sealed with the upper cover 27 and the lower cover 28, whereby the sensor device 100A shown in FIG. 11 is obtained. It is done.

  In the second embodiment, the dummy lead 34 and the electrode lead 13 are made of the same material, and the linear expansion coefficient and the elastic coefficient are the same. Further, since the number of dummy leads 34 is smaller than that of the electrode leads 13, the sectional area in the direction perpendicular to the extending direction (X direction) is smaller for the dummy leads 34 than for the electrode leads 13. However, the provision of the dummy lead 34 can relieve the repeated stress of the bent portion 14 of the electrode lead 13.

  The rigidity of the dummy lead 34 in the X-axis direction is preferably higher than the rigidity of the electrode lead 13 in which the bent portion 14 is formed in the X-axis direction. In this regard, further explaining, the dummy lead 34 is smaller than the electrode lead 13 in the total cross-sectional area in the direction perpendicular to the extending direction (X direction). However, since the bent portion 14 is formed in the electrode lead 13, the rigidity in the extending direction (X direction) of one electrode lead 13 is smaller than that of one dummy lead in which the bent portion 14 is not formed. Considering this, if the cross-sectional area of each lead 34, 13 is set so that the rigidity in the extending direction (X direction) is higher than that of the electrode lead 13 in the dummy lead 34, the reliability is further improved. Can be improved. The number and arrangement of the dummy leads 34 can be arbitrarily set. Further, the dummy lead 34 may be bent at one end or both ends vertically in order to improve the bonding force with the sealing resin 11 or the housing 20.

In the second embodiment, the change Δl in the distance L between the root portion L ₁ exposed from the sealing resin 11 of the electrode lead 13 and the root portion L ₂ exposed from the housing 20 of the connector lead 21 can be reduced.
For this reason, also in Embodiment 2, there exists an effect similar to Embodiment 1. FIG.
In particular, in the second embodiment, since the stress relaxation member is formed separately from the lead frame 1 together with the electrode lead 13, the production efficiency can be further improved.

Embodiment 3
FIG. 16: is sectional drawing which shows the flow sensor as Embodiment 3 of the sensor apparatus by this invention.
The sensor device 100B of the third embodiment illustrated in FIG. 16 is different from the sensor device 100 of the first embodiment in that a bent portion is formed on the connector lead.
In FIG. 16, a bent portion 22 is formed at an end portion of the connector lead 21A led out to the circuit package 10, and the bent portion is not formed in the electrode lead 13A. The bent portion 22 is formed in a convex shape protruding downward (-Z direction) in FIG. Therefore, the portion of the connector lead 21A where the bent portion 22 is formed has a smaller rigidity in the extending direction (X direction) of the connector lead 21A than the other portions. As in the first embodiment, the stress relaxation member 31 has one end and a tip portion 33 embedded in the sealing resin 11 and the housing 20 of the circuit package 10, respectively.

In the third embodiment, it is preferable that the rigidity in the extending direction (X-axis direction) of the stress relaxation member 31 is higher than the rigidity in the extending direction (X-axis direction) of the connector lead 21A in which the bent portion 22 is formed. Also in the third embodiment, the change Δl in the distance L between the root portion L ₁ exposed from the sealing resin 11 of the electrode lead 13 and the root portion L ₂ exposed from the housing 20 of the connector lead 21 can be reduced.

Other configurations of the third embodiment are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
The stress relieving member 31 in the third embodiment relieves repeated stress that acts on the bent portion 22 of the connector lead 21A.
Note that the stress relieving member 31 in the third embodiment may be formed integrally with the lead frame 1 as in the second embodiment and may be the dummy lead 34 cut at the connecting portion 12a.

The bent portion 14 formed on the electrode lead 13 and the bent portion 22 formed on the connector lead 21A can be variously modified as shown below as an example.
The bent portions 14 and 22 are not a tapered shape but a substantially rectangular shape.
The bent portions 14 and 22 are not shaped to protrude only on one side of the upper side (Z direction) or the lower side (−Z direction), but have an uneven shape protruding to both the upper and lower sides.
The bent portions 14 and 22 are not stepped symmetrically, but are stepped or stepped.
The bent portions 14 and 22 are provided on both the electrode lead 13 and the connector lead 21 to join both members.
The bent portions 14 and 22 are not bent in the vertical direction, but are bent in parallel to the arrangement direction (Y direction). In short, the bent portions 14 and 22 may be deformed portions extending in a direction different from the extending direction (X direction).

  Although the stress relaxation member 31 is a flat plate member having a uniform cross-sectional area, the stress relaxation member 31 may have different thicknesses and widths in the extending direction (X direction).

In the said embodiment, sensor device 100,100A, 100B illustrated as a flow sensor provided with the 1st semiconductor chip 3 and the 2nd semiconductor chip 4. FIG. However, a flow rate sensor including a single semiconductor chip having a flow rate detection unit and a control unit that controls the flow rate detection unit may be used.
The present invention is not limited to the flow rate sensor, and can be applied to other sensor devices such as a pressure sensor.

  In addition, the present invention can be variously modified within the scope of the invention. In short, the circuit package having the sensor part and the electrode lead connected to the sensor part, and the connection joined to the electrode lead. A resin housing that has leads and is fixed to the resin housing that fixes the circuit package, and either the electrode lead or the connection lead, and one of the electrode lead and the connection lead extends in a direction different from the extending direction. A deformed portion formed from the circuit package, at least a tip portion embedded in the housing, and a stress relieving member that relieves stress acting on the deformed portion formed on one of the electrode lead and the connection lead; What is necessary is just to have.

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Diaphragm 3 1st semiconductor chip 4 2nd semiconductor chip 5, 6, 32 Adhesive 7a, 7b Wire 10, 10A Circuit package 11 Sealing resin 12 Dam bar 12a Connection part 13, 13A Electrode lead 14, 22 Bending part (Deformation part)
15 Upper mold 15a Convex 16 Lower mold 16a Concave 20 Housing 20a Opening 21, 21A Connector lead (connection lead)
25 Joint 27 Upper Cover 28 Lower Cover 31 Stress Relieving Member 34 Dummy Lead (Stress Relieving Member)
33, 35 Tip portion 61, 62 Cavity 100, 100A, 100B Sensor device Root portion exposed from sealing resin 11 of L ₁ electrode lead 13 L ₂ Root portion exposed from housing 20 of connector lead 21 L L ₁ and L ₂ Distance between

Claims (9)

A circuit package having a sensor part and an electrode lead connected to the sensor part;
A resin housing having a connection lead joined to the electrode lead and fixing the circuit package;
A deformed portion provided on one of the electrode lead and the connection lead, and the one of the electrode lead and the connection lead extending in a direction different from the extending direction;
A stress relieving member that is derived from the circuit package, has at least a tip embedded in the housing, and relieves stress acting on the deformed portion formed on the one of the electrode lead and the connection lead. , Sensor device. The sensor device according to claim 1,
The sensor device, wherein a linear expansion coefficient of the stress relaxation member is smaller than a linear expansion coefficient of the one lead on which the deformed portion is formed. The sensor device according to claim 1,
The sensor device, wherein a rigidity of the stress relaxation member in an extending direction is higher than a rigidity of the one lead in which the deformed portion is formed. The sensor device according to claim 1,
The sensor device, wherein the stress relaxation member is a flat member. The sensor device according to claim 1,
The sensor device, wherein the stress relaxation member is formed of the same material as the electrode lead. The sensor device according to claim 1,
The sensor device, wherein an elastic coefficient of the stress relaxation member is higher than an elastic coefficient of the one lead on which the deformed portion is formed. The sensor device according to claim 1,
The stress relieving member is a sensor in which a cross-sectional area in a direction perpendicular to the extending direction of the stress relieving member is larger than a cross-sectional area in a direction perpendicular to the extending direction of the one lead on which the deformed portion is formed. apparatus. A circuit package having a sensor part and an electrode lead connected to the sensor part;
A resin housing having a connection lead joined to the electrode lead and fixing the circuit package;
A deformed portion provided on one of the electrode lead and the connection lead, and formed by extending the one of the electrode lead and the connection lead in a direction different from the extending direction;
A stress relaxation member that is derived from the circuit package and has a linear expansion coefficient that is equal to or smaller than a linear expansion coefficient of the one lead in which at least a tip portion is embedded in the housing and the deformed portion is formed; A sensor device. The sensor device according to claim 8, wherein
The stress relaxation member is a sensor device in which rigidity in an extending direction is higher than at least rigidity in an extending direction of the one lead on which the deformed portion is formed.

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