CN101497182B - Grinding pad and method for producing the same - Google Patents
Grinding pad and method for producing the same Download PDFInfo
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- CN101497182B CN101497182B CN 200810005784 CN200810005784A CN101497182B CN 101497182 B CN101497182 B CN 101497182B CN 200810005784 CN200810005784 CN 200810005784 CN 200810005784 A CN200810005784 A CN 200810005784A CN 101497182 B CN101497182 B CN 101497182B
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Abstract
The invention discloses a method for manufacturing a grinding pad, wherein the grinding pad is used for grinding an object. The method comprises the steps of providing a semi-finished product of the grinding pad, and forming a motion track on the surface of the semi-finished product of the grinding pad, wherein motion track is basically the same as the grinding track of the object on the grinding pad.
Description
Technical field
The invention relates to a kind of grinding pad and manufacture method thereof, and particularly relevant for a kind of grinding pad and manufacture method thereof that reduces pre-treatment (pre-conditioning) time.
Background technology
Along with the progress of industry, the planarization processing procedure often is adopted to the processing procedure of producing various elements.In the planarization processing procedure, grind processing procedure and often used by industry.In general, grind processing procedure and be the object that is fixed is applied a pressure so that it is pressed on grinding pad, and carry out each other relative motion at object and grinding pad surface.By the friction that this relative motion produces, remove the part object surface, and make its surface smooth gradually.
Generally speaking, before user's grinding pad new with a slice carries out the planarization processing procedure to object, can first utilize surface conditioning device (conditioner) to carry out surface treatment to the surface of grinding pad, separately with sample (dummy) object, the similar actual pre-treatment program that grinds is carried out on the surface of grinding pad, so that the surface of grinding pad reaches stable state.Usually, these pre-treatment programs approximately need 20～60 minutes consuming time, so grinder station just can be occupied the time of 20～60 minutes, and can't carry out the grinding of actual product.This is undoubtedly temporal waste for the user, also affect production efficiency.
Therefore, need a kind of grinding pad that reduces the pre-treatment time.
Summary of the invention
The invention provides a kind of grinding pad and manufacture method thereof, it can reduce the pre-treatment time before using.
The present invention proposes a kind of manufacture method of grinding pad, and this grinding pad is to grind an object.The method comprises provides grinding pad semi-finished product.Form afterwards a motion track on grinding pad half-finished surface, wherein said motion track and the object grinding track on grinding pad is roughly the same.
The another manufacture method that proposes a kind of grinding pad of the present invention, grinding pad is in order to grind an object.The method comprises provides grinding pad semi-finished product.Then form a deformation directionality (deformation orientation) on grinding pad half-finished surface, wherein deformation directionality and the object grinding directionality on grinding pad is roughly the same.
The present invention proposes again a kind of grinding pad, and it is used for grinding an object.This grinding pad comprises a grinding layer, and the surface of this grinding layer has a motion track, and wherein this motion track and the object grinding track on grinding pad is roughly the same.
The present invention proposes again a kind of grinding pad, and it comprises a grinding layer, and the surface of this grinding layer has a deformation directionality, and the set of wherein said deformation directionality is non-parallel distribution.
The present invention is because of in the manufacturing process of grinding pad, just forms special motion track or deformation directionality on grinding pad half-finished surface, and this motion track or deformation directionality and the grinding track of object on grinding pad roughly the same.Therefore, when the user uses before this grinding pad carries out the planarization processing procedure, can reduce the pre-treatment time, to enhance productivity.
Description of drawings
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated, wherein:
Fig. 1 is the schematic diagram of the manufacture method of grinding pad according to an embodiment of the invention.
Fig. 2 forms the schematic diagram of special movement path or deformation directionality according to an embodiment of the invention on grinding pad.
Fig. 3 forms the schematic diagram of groove again on grinding pad shown in Figure 2.
Fig. 4 is the schematic diagram of the manufacture method of grinding pad according to another embodiment of the present invention.
Fig. 5 forms the schematic diagram of special movement path or deformation directionality according to an embodiment of the invention on banded grinding pad.
Fig. 6 forms the schematic diagram of groove again on banded grinding pad shown in Figure 5.
The main element symbol description:
102: the grinding pad semi-finished product
102a, 500a: grinding layer
104: rotatable flush cut instrument
104a: blade part
104b: baseplane section
106: intend object
110: surface treatment step
202,502: motion track or deformation directionality
204,504: groove
206: object
C1, C2: axle center
R1, R2: direction of rotation
The specific embodiment
Use grinding pad to carry out the time of the pre-treatment before the planarization processing procedure in order to reduce, the present invention is in the manufacture process of grinding pad, namely form specific deformation directionality or motion track on the surface of grinding pad, and this deformation directionality or motion track and follow-up grinding track when an object is ground on this grinding pad roughly the same.Following examples are to describe the manufacture method of grinding pad of the present invention in detail and with the formed grinding pad of the method, so that those skilled in the art in the invention understand the present invention, but are not to limit scope of the present invention.
Fig. 1 is a kind of manufacture method of grinding pad according to an embodiment of the invention.Please refer to Fig. 1, at first grinding pad semi-finished product 102 are provided.these grinding pad semi-finished product 102 are for example to utilize mode molded or spool (rolling) formula continuous process to form, and it is made of polymeric substrate, polymeric substrate can be polyester (polyester), polyethers (polyether), Polyurethane (polyurethane), Merlon (polycarbonate), polyacrylate (polyacrylate), polybutadiene (polybutadiene), epoxy resin (epoxy), unsaturated polyester (UP) (unsaturated polyester) or polymeric substrate that all the other are synthesized via suitable thermosetting resin (thermosetting resin) or thermoplastic resin (thermoplastic resin) etc.In another embodiment, grinding pad semi-finished product 102 separately can comprise conductive material, abrasive grains, microsphere (micro-sphere) or solubilized additive in this polymeric substrate except polymeric substrate.
After grinding pad semi-finished product 102, then form a motion track 202 on the surface of grinding pad semi-finished product 102.In one embodiment, this motion track 202 can be to form simultaneously in the process of grinding pad semi-finished product 102 being carried out leveling (leveling) step.More specifically, usually after grinding pad semi-finished product 102 are completed, can carry out the top layer (skin layer) of screed step to remove grinding pad semi-finished product 102.And the present embodiment is to form special motion track 202 in the surface of grinding pad semi-finished product 102 simultaneously in screed step.
In one embodiment, as shown in Figure 1, this screed step is for example to adopt rotatable flush cut instrument 104 to carry out.The size of this rotatable flush cut instrument 104 is for example roughly the same with the size of object to be ground.This rotatable flush cut instrument 104 comprises at least one blade part 104a and at least one baseplane 104b of section, as shown in Fig. 1 right side, it is the schematic diagram after rotatable flush cut instrument 104 flip vertical 180 degree, the length of this blade part 104a and the baseplane 104b of section is approximately respectively the radius size of rotatable flush cut instrument 104, be disposed at the bottom of rotatable flush cut instrument 104, roughly around its center extends to.When utilizing rotatable flush cut instrument 104 to carry out screed step, 102 of rotatable flush cut instrument 104 and grinding pad semi-finished product have a relative motion.Namely, rotatable flush cut instrument 104 can be along axle center C1 along the R1 direction rotation, and simultaneously, rotatable flush cut instrument 104 can be along axle center C2 along the R2 direction rotation.Therefore, when the blade part 104a of rotatable flush cut instrument 104 removes grinding pad semi-finished product 102 top layer, the Surface Contact of the 104b of baseplane section and grinding pad semi-finished product 102 causes the plane friction to produce a shearing force (shear force), makes the surface of grinding pad semi-finished product 102 form special motion track 202.
In addition, when rotatable flush cut instrument 104 carries out screed step, also can bestow a surface treatment step 110 to grinding pad semi-finished product 102 surfaces.This surface treatment step 110 is for example to apply light, heat, microwave, ultrasonic, electromagnetic wave, plasma, electric field, magnetic field or fluid etc.
What is particularly worth mentioning is that, the mobile route of rotatable flush cut instrument 104 when path mobile on grinding pad semi-finished product 102 and follow-up object grind on this grinding pad is roughly the same.That is to say, the movement of rotatable flush cut instrument 104 is simulation object mobile routes when grinding on grinding pad.Therefore, the grinding track of rotatable flush cut instrument 104 when formed motion track on grinding pad semi-finished product 102 and follow-up object grind on this grinding pad is roughly the same.
Detailed explanation is, as a rule, when object ground on grinding pad, grinding pad can rotate and object also can rotation, and therefore, the movement of this object on grinding pad has revolution track and a rotation track.Similarly, because the movement of rotatable flush cut instrument 104 is simulation object mobile routes when grinding on grinding pad, therefore rotatable flush cut instrument 104 formed motion track 202 on grinding pad semi-finished product 102 has a revolution track with respect to a revolution center point (C1), and with respect to a rotation central point (C2), a rotation track is arranged.
As shown in Figure 2, it is with the formed grinding pad of method shown in Figure 1.In Fig. 2, have motion track 202 on grinding layer 102a, this motion track 202 be as shown in 1 rotatable flush cut instrument 104 formation.Therefore, formed motion track 202 is non-parallel distribution.Particularly, this motion track 202 has the revolution track compared to the center (the namely axle center C1 of Fig. 1) of grinding pad, and has the rotation track compared to the axle center C2 of the rotatable flush cut instrument 104 of previous Fig. 1, thereby jointly consists of helical trajectory.More specifically, this motion track 202 is a circular spiral track.This circular spiral track is not limited to closed track as shown in Figure 2, and this circular spiral track can also be non-enclosed track, is for example that self-grind pad center returns back to the non-enclosed track around grinding pad gradually; Perhaps this circular spiral track also can be not limited to as shown in Figure 2 circular, for example 102 tool one relative motions of rotatable flush cut instrument 104 and grinding pad semi-finished product, along axle center C1 along the R1 direction rotation time, rotatable flush cut instrument 104 can carry out in addition relative grinding pad radial direction and swing back and forth, to form the wave ring shape helical trajectory.Special one carry be, shown in Figure 2 only for to be simplified to the track that the unitary rotation radius consists of, in order to explanation.Know those skilled in the art when understanding, comprise through the formed track of said procedure the track that different rotation radiuses consist of.That is to say, the circular spiral track in Fig. 2 is for being dispersed throughout whole circular zone.
Utilize above-mentioned screed step also can cause at the Surface Contact of grinding pad semi-finished product 102 the plane friction to produce a shearing force, make and form a deformation directionality on the surface of grinding pad semi-finished product 102, deformation directionality and the follow-up object grinding directionality on grinding pad is roughly the same, and the set of this deformation directionality and the follow-up object grinding track when grinding on this grinding pad is roughly the same.That is to say, above-mentioned motion track 202 is namely the set of the deformation directionality that forms on the surface of grinding pad semi-finished product 102.The deformation directionality is for example the configuration of surface directionality of microcosmic, can utilize SEM (SEM) to be analyzed; The deformation directionality can be also the feature of microcosmic more, be for example the molecules align directionality (molecular orientation) of the macromolecular material of substrate surface, can utilize AFM (atomic force microscopy) or NFM (near-field optical microscopy) to be analyzed.Surface treatment step 110 as shown in Figure 1 more helps the formation of deformation directionality.
After the motion track 202 that forms as shown in Figure 2, as shown in Figure 3, also can further form groove 204 on grinding layer 102a.In this embodiment, groove 204 is take concentrically ringed distribution of shapes as example, but the invention is not restricted to this, and in fact, groove 204 can be also that radial, point-like, trellis distribute etc.
In another embodiment, above-mentioned groove 204 also can namely first be formed on grinding pad semi-finished product 102 before forming grinding track 202.That is to say, after first forming groove on the grinding pad semi-finished product, recycle 104 pairs of grinding pad semi-finished product of rotatable flush cut instrument 102 shown in Figure 1 and carry out screed step, and simultaneously in the half-finished surface formation of grinding pad motion track 202.
The back side that still can be included in grinding layer 102a as for the follow-up program of completing grinding pad forms the fixed bed can be fixed on grinder station, also can select in addition in grinding layer and fixed bed the another softer supporting layer supervisor that forms to complete grinding pad.
Afterwards, just can utilize this grinding pad to carry out the planarization processing procedure to object 206.Object 206 is for example the object of wafer, base material or other need planarizations.Particularly, when object ground on grinding pad, its grinding track can be roughly the same with motion track 202.In one embodiment, this grinding pad can reduce the pre-treatment time approximately more than 20%, even can reduce 50% the pre-treatment time that reaches.Grinding pad of the present invention can be applicable to as semiconductor, integrated circuit, micro electronmechanical, energy conversion, communication, optics, storage video disc, and the making of the elements such as display in the grinding processing procedure that uses, make object 206 that these elements use and can comprise semiconductor crystal wafer, III V family wafer, storage unit carrier, ceramic bases, high molecular polymer substrate, and substrate of glass etc., but be not to limit scope of the present invention.In addition, more optionally slurry (slurry) or solution are ground in supply in process of lapping, and making this grind processing procedure becomes cmp (chemicalmechanical polishing, CMP) processing procedure.
Above-described embodiment is to form motion track 202 on grinding pad semi-finished product 102 with rotatable flush cut instrument 104.In other embodiment, can also utilize other modes to form motion track 202.As shown in Figure 4, it utilize to be intended object 106 and intends object on grinding pad semi-finished product 102 surfaces and grind, intend the object grinding and cause the plane friction to produce a shearing force, and then at the surperficial formation of grinding pad semi-finished product 102 and Fig. 2 and the corresponding motion track 202 that described same characteristic features is described.This intends object 106 is for example the mimetic crystal circle, intend base material etc.This intends the size of object 106, is for example roughly the same with the size of object to be ground.
Utilize above-mentioned plan object grinding steps also can cause at the Surface Contact of grinding pad semi-finished product 102 the plane friction to produce a shearing force, make to form a deformation directionality on the surface of grinding pad semi-finished product 102, and the set of this deformation directionality and the follow-up object grinding track when grinding on this grinding pad is roughly the same.That is to say, above-mentioned motion track 202 is namely the set of formed deformation directionality on the surface of grinding pad semi-finished product 102.
In a preferred embodiment, utilizing plan object 106 before grinding pad semi-finished product 102 surface formation motion tracks 202, can first carry out screed step to grinding pad semi-finished product 102, remove with the top layer with grinding pad semi-finished product 102.This screed step can adopt rotatable flush cut instrument 104 shown in Figure 1 to carry out.That is to say, can first utilize rotatable flush cut instrument 104 to carry out screed step, with the top layer that removes grinding pad semi-finished product 102 and after forming motion track 202, further utilize again plan object 106 to grind in grinding pad semi-finished product 102, form motion track 202 with the surface that is repeated on grinding pad semi-finished product 102.
Similarly, when forming motion track 202 with plan object 106 in grinding pad semi-finished product 102 are surperficial, also can bestow a surface treatment step 110 to grinding pad semi-finished product 102 surfaces.This surface treatment step 110 is for example to apply light, heat, microwave, ultrasonic, electromagnetic wave, plasma, electric field, magnetic field or fluid etc., to assist the formation of deformation directionality.In addition, after forming motion track 202, more can further form groove 204 (as shown in Figure 3) on grinding layer 102a.In this embodiment, groove 204 is take concentrically ringed distribution of shapes as example, but the invention is not restricted to this, and in fact groove 204 can be also that radial, point-like, trellis distribute etc.Similarly, above-mentioned groove 204 also can namely first be formed on the grinding pad semi-finished product before forming motion track 202.That is to say, after first forming groove on the grinding pad semi-finished product, utilizing plan object 106 shown in Figure 4 in grinding pad semi-finished product 102 surface formation motion tracks 202.
Above-mentioned Fig. 1 illustrates as an example of circular grinding pad example to embodiment shown in Figure 4, and in fact method of the present invention also can be applied to banded grinding pad.As shown in Figure 5, can utilize rotatable flush cut instrument or intend object in the upper motion track 502 that forms of grinding layer 500a, be for example the ribbon spiral track, and this motion track 502 is roughly the same with follow-up object grinding track on grinding pad.Similarly, utilize rotatable flush cut instrument or intend object when forming motion track 502 in the grinding layer 500a of grinding pad is upper, can also further carry out a surface treatment step, for example to apply light, heat, microwave, ultrasonic, electromagnetic wave, plasma, electric field, magnetic field or fluid etc., to assist the formation of deformation directionality.As shown in Figure 6, before forming motion track 502 or afterwards, more can further form groove 504 on grinding layer 500a.
The grinding pad that proposes in the embodiment of the present invention and manufacture method thereof can be formed with special motion track or deformation directionality by shearing force on grinding layer; the invention is not restricted to use rotatable flush cut instrument or intend the object grinding and cause shearing force; also can be by other any modes that applies shearing force; for example comprise contact or the contactless shearing force that applies, form this motion track or deformation directionality.The set of this motion track or deformation directionality, the grinding track with object on grinding pad is roughly the same.Therefore, the user can reduce the pre-treatment time, to enhance productivity before using this grinding pad.
Although the present invention discloses as above with preferred embodiment; so it is not to limit the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; when can do a little modification and perfect, so protection scope of the present invention is when with being as the criterion that claims were defined.
Claims (45)
1. the manufacture method of a grinding pad, this grinding pad is in order to grind an object, and this manufacture method comprises:
One grinding pad semi-finished product are provided; And
Form a motion track on this grinding pad half-finished surface, wherein this motion track and the grinding track of this object on this grinding pad are roughly the same, and this motion track has a revolution track with respect to a revolution center point, with respect to a rotation central point, one rotation track is arranged.
2. the manufacture method of grinding pad as claimed in claim 1, is characterized in that, when forming this motion track step, also comprises these grinding pad semi-finished product are carried out a screed step.
3. the manufacture method of grinding pad as claimed in claim 2, is characterized in that, forms this screed step, comprises the rotatable flush cut instrument of use.
4. the manufacture method of grinding pad as claimed in claim 3, is characterized in that, the size of this rotatable flush cut instrument and the size of this object are roughly the same.
5. the manufacture method of grinding pad as claimed in claim 3, is characterized in that, this rotatable flush cut instrument comprises at least one blade part and at least one baseplane section.
6. the manufacture method of grinding pad as claimed in claim 1, is characterized in that, forms the step of this motion track, is included in this grinding pad surface of semi-finished and carries out a plan object grinding.
7. the manufacture method of grinding pad as claimed in claim 6, is characterized in that, before carrying out this plan object grinding steps, also comprises these grinding pad semi-finished product are carried out a screed step.
8. the manufacture method of grinding pad as claimed in claim 1, is characterized in that, after forming this motion track step, also comprises forming at least one groove on these grinding pad semi-finished product.
9. the manufacture method of grinding pad as claimed in claim 1, is characterized in that, before forming this motion track step, also comprises forming at least one groove on these grinding pad semi-finished product.
10. the manufacture method of grinding pad as claimed in claim 1, is characterized in that, when forming this motion track step, also comprises this grinding pad surface of semi-finished is bestowed a surface treatment step.
11. the manufacture method of grinding pad as claimed in claim 10 is characterized in that, this surface treatment step comprises and applies light, heat, microwave, ultrasonic, electromagnetic wave, plasma, electric field, magnetic field or fluid.
12. the manufacture method of grinding pad as claimed in claim 1 is characterized in that, this motion track is non-parallel distribution.
13. the manufacture method of grinding pad as claimed in claim 1 is characterized in that, this motion track is a helical trajectory.
14. the manufacture method of grinding pad as claimed in claim 13 is characterized in that, this helical trajectory is a ribbon spiral track or a circular spiral track.
15. the manufacture method of grinding pad as claimed in claim 1 is characterized in that, by applying a shearing force to form this motion track on this grinding pad half-finished surface.
16. the manufacture method of grinding pad as claimed in claim 15 is characterized in that, applies the mode of this shearing force, comprises contact or contactless.
17. the manufacture method of a grinding pad, this grinding pad is in order to grind an object, and this manufacture method comprises:
One grinding pad semi-finished product are provided;
Form a deformation directionality on this grinding pad half-finished surface, wherein this deformation directionality is microcosmic surface form directionality or the molecules align directionality of the macromolecular material of microcosmic substrate surface more, and the set of this deformation directionality and the grinding directionality of this object on this grinding pad roughly the same.
18. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, when forming this deformation directionality step, also comprises these grinding pad semi-finished product are carried out a screed step.
19. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, by a rotatable flush cut instrument to carry out a screed step.
20. the manufacture method of grinding pad as claimed in claim 19 is characterized in that, the size of this rotatable flush cut instrument and the size of this object are roughly the same.
21. the manufacture method of grinding pad as claimed in claim 19 is characterized in that, this rotatable flush cut instrument comprises at least one blade part and at least one baseplane section.
22. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, forms the step of this deformation directionality, is included in this grinding pad surface of semi-finished and carries out a plan object grinding.
23. the manufacture method of grinding pad as claimed in claim 22 is characterized in that, before carrying out this plan object grinding steps, also comprises these grinding pad semi-finished product are carried out a screed step.
24. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, after forming this deformation directionality step, also comprises forming at least one groove on these grinding pad semi-finished product.
25. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, before forming this deformation directionality step, also comprises forming at least one groove on these grinding pad semi-finished product.
26. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, when forming this deformation directionality step, also comprises this grinding pad surface of semi-finished is bestowed a surface treatment step.
27. the manufacture method of grinding pad as claimed in claim 26 is characterized in that, this surface treatment step comprises and applies light, heat, microwave, ultrasonic, electromagnetic wave, plasma, electric field, magnetic field or fluid.
28. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, the set of this deformation directionality is non-parallel distribution.
29. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, the set of this deformation directionality has a rotation track with respect to a rotation central point.
30. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, the set of this deformation directionality has a revolution track with respect to a revolution center point.
31. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, the set of this deformation directionality is a helical trajectory.
32. the manufacture method of grinding pad as claimed in claim 31 is characterized in that, this helical trajectory is a ribbon spiral track or a circular spiral track.
33. the manufacture method of grinding pad as claimed in claim 17 is characterized in that, by applying a shearing force to form this deformation directionality on this grinding pad half-finished surface.
34. the manufacture method of grinding pad as claimed in claim 33 is characterized in that, applies the mode of this shearing force, comprises contact or contactless.
35. a grinding pad, it is used for grinding an object, comprising:
One grinding layer, the surface of this grinding layer has a motion track, wherein this motion track and the grinding track of this object on this grinding pad are roughly the same, and this motion track with respect to a revolution center point have one the revolution track, with respect to a rotation central point, one rotation track is arranged.
36. grinding pad as claimed in claim 35 is characterized in that, also comprises at least one groove, is arranged in this grinding layer.
37. grinding pad as claimed in claim 35 is characterized in that, this motion track is non-parallel distribution.
38. grinding pad as claimed in claim 35 is characterized in that, this motion track is a helical trajectory.
39. grinding pad as claimed in claim 38 is characterized in that, this helical trajectory is a ribbon spiral track or a circular spiral track.
40. a grinding pad comprises:
One grinding layer, the surface of this grinding layer has a deformation directionality, it is characterized in that, this deformation directionality is microcosmic surface form directionality or the molecules align directionality of the macromolecular material of microcosmic substrate surface more, and the set of this deformation directionality is non-parallel distribution.
41. grinding pad as claimed in claim 40 is characterized in that, also comprises a plurality of grooves, is arranged in this grinding layer.
42. grinding pad as claimed in claim 40 is characterized in that, the set of this deformation directionality has a rotation track with respect to a rotation central point.
43. grinding pad as claimed in claim 40 is characterized in that, the set of this deformation directionality has a revolution track with respect to a revolution center point.
44. grinding pad as claimed in claim 40 is characterized in that, the set of this deformation directionality is a helical trajectory.
45. grinding pad as claimed in claim 44 is characterized in that, this helical trajectory is a ribbon spiral track or a circular spiral track.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200810005784 CN101497182B (en) | 2008-01-31 | 2008-01-31 | Grinding pad and method for producing the same |
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| CN 200810005784 CN101497182B (en) | 2008-01-31 | 2008-01-31 | Grinding pad and method for producing the same |
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| CN101497182A CN101497182A (en) | 2009-08-05 |
| CN101497182B true CN101497182B (en) | 2013-05-08 |
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| JP7113626B2 (en) * | 2018-01-12 | 2022-08-05 | ニッタ・デュポン株式会社 | polishing pad |
| CN111098218A (en) * | 2019-12-31 | 2020-05-05 | 杭州中欣晶圆半导体股份有限公司 | Activation method for middle and fine polishing cloth of silicon wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165904A (en) * | 1998-10-07 | 2000-12-26 | Samsung Electronics Co., Ltd. | Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad |
| CN1790625A (en) * | 2004-12-14 | 2006-06-21 | 罗门哈斯电子材料Cmp控股股份有限公司 | Cmp polishing pad having grooves arranged to improve polishing medium utilization |
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2008
- 2008-01-31 CN CN 200810005784 patent/CN101497182B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6165904A (en) * | 1998-10-07 | 2000-12-26 | Samsung Electronics Co., Ltd. | Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad |
| CN1790625A (en) * | 2004-12-14 | 2006-06-21 | 罗门哈斯电子材料Cmp控股股份有限公司 | Cmp polishing pad having grooves arranged to improve polishing medium utilization |
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